CN112582361A - Enhanced boiling structure and preparation method and application thereof - Google Patents
Enhanced boiling structure and preparation method and application thereof Download PDFInfo
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- CN112582361A CN112582361A CN202011533169.5A CN202011533169A CN112582361A CN 112582361 A CN112582361 A CN 112582361A CN 202011533169 A CN202011533169 A CN 202011533169A CN 112582361 A CN112582361 A CN 112582361A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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Abstract
The invention provides a reinforced boiling structure and a preparation method and application thereof, and relates to the technical field of heat dissipation, wherein the reinforced boiling structure comprises a heat conduction substrate, heat dissipation ribs and a micro-nano concave-convex structure, wherein the heat dissipation ribs are positioned on a first surface of the heat conduction substrate, and the micro-nano concave-convex structure is formed on the first surface and the surfaces of the heat dissipation ribs; the size of the heat dissipation ribs is in the micrometer to millimeter level. The enhanced boiling structure improves the nucleate boiling heat exchange performance and the critical heat flux density of the electronic chip through the heat dissipation ribs and the micro-nano concave-convex structure, so that the heat dissipation effect of the electronic chip is improved.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a reinforced boiling structure and a preparation method and application thereof.
Background
With the rapid advance of 5G, artificial intelligence and big data, data and graphs are matchedThe requirement of the processing efficiency is higher and higher, and the chip is a core component, the faster the data calculation speed is, the more the power of the chip is, the more heat is generated, and the heat dissipation problem will be more and more severe. At present, the heat flux density of a GPU (Graphics Processing Unit) of a super computer reaches 100W/cm2Conventional heat dissipation methods have been unable to solve such high heat flux density.
Common computers mostly rely on cold air (i.e. air cooling) to cool down the machine, and compared with air cooling, liquid cooling (or water cooling) has two major benefits: firstly, the coolant is directly guided to a heat source, rather than being indirectly refrigerated like air cooling; secondly, the heat transmitted per unit volume, namely the heat dissipation efficiency, is as high as 3500 times. Evaporative cooling in liquid cooling takes heat away from the heat, principally by using the latent heat of vaporization when the fluid boils. The cooling effect of evaporative cooling is more pronounced because the latent heat of vaporization of a fluid is much greater than the specific heat of the fluid. In evaporative cooling, direct contact type phase change boiling cooling is to directly soak a heating element in a refrigerant and take away heat by utilizing the evaporative phase change of the refrigerant; immersion phase-change liquid cooling is a typical direct contact type phase-change boiling cooling, and is gradually popularized as an important direction of heat dissipation of electronic chips at present.
However, the electronic chip directly contacts with the refrigerant to make the refrigerant phase change vaporization to obtain low heat flux density, so that the heat dissipation effect of the electronic chip cannot meet the actual requirement.
Disclosure of Invention
The invention aims to provide an enhanced boiling structure, a preparation method and application thereof so as to improve the heat dissipation effect of an electronic chip.
The embodiment of the invention provides a reinforced boiling structure, which comprises a heat conduction substrate, a heat dissipation rib and a micro-nano concave-convex structure, wherein the heat dissipation rib is positioned on a first surface of the heat conduction substrate, and the micro-nano concave-convex structure is formed on the first surface and the surface of the heat dissipation rib; the size of the heat dissipation ribs is in the micrometer-millimeter level.
Further, the heat dissipation ribs include one or more of pin ribs, fin ribs, cylindrical ribs, and square column ribs.
Further, the material of the heat dissipation rib comprises one or more of copper, aluminum, stainless steel, titanium and nickel.
Furthermore, the material of the heat dissipation rib is the same as that of the micro-nano concave-convex structure.
Furthermore, the surface roughness of the micro-nano concave-convex structure is 20-200 μm, and the dimensional accuracy is 20-100 μm.
Further, the material of the heat conducting substrate comprises one or more of copper, aluminum, stainless steel, titanium, nickel, graphite, silicon nitride and silicon carbide; the thickness of the heat conduction substrate is 0.1-5mm, and the surface roughness Ra of a second surface of the heat conduction substrate, which is opposite to the first surface, is 0.2-1.6.
The embodiment of the invention also provides a preparation method of the reinforced boiling structure, which comprises the following steps:
and printing the heat dissipation ribs on the heat conduction substrate by adopting a 3D printing material increase mode, and generating the micro-nano concave-convex structure on the heat conduction substrate and the heat dissipation ribs.
Further, the 3D printing additive manner includes one or more of selective laser sintering, selective laser melting, laser metal powder deposition, and electron beam melting.
Further, the 3D printing material adopted by the 3D printing additive mode comprises a spherical powder material, and the D50 particle size of the spherical powder material is 1-100 μm.
The embodiment of the invention also provides an application of the enhanced boiling structure in the field of heat dissipation, and the enhanced boiling structure is applied to heat dissipation of an electronic chip.
In the enhanced boiling structure and the preparation method and application thereof provided by the embodiment of the invention, the enhanced boiling structure comprises a heat conduction substrate, heat dissipation ribs and a micro-nano concave-convex structure, wherein the heat dissipation ribs are positioned on the first surface of the heat conduction substrate, and the micro-nano concave-convex structure is formed on the first surface and the surfaces of the heat dissipation ribs; the size of the heat dissipation ribs is in the micrometer to millimeter level. The enhanced boiling structure improves the nucleate boiling heat exchange performance and the critical heat flux density of the electronic chip through the heat dissipation ribs and the micro-nano concave-convex structure, so that the heat dissipation effect of the electronic chip is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram of an enhanced boiling structure according to an embodiment of the present invention;
FIG. 2 is a perspective view of an enhanced boiling structure using pin fins according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of an enhanced boiling structure with pin ribs taken along a direction perpendicular to a heat-conducting substrate according to an embodiment of the present invention;
FIG. 4 is a top view of an enhanced boiling structure incorporating fin ribs in accordance with an embodiment of the present invention;
fig. 5 is a structure diagram of an enhanced boiling structure and a package structure of an electronic chip according to an embodiment of the invention.
Icon: 101-a thermally conductive substrate; 102-heat dissipating ribs; 103-micro nano concave-convex structure; 104-a thermally conductive interface layer; 105-electronic chip.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The inventor finds that the density of heat flow decomposed by phase change vaporization of the refrigerant is low due to the fact that the electronic chip is directly contacted with the refrigerant, and the main reason is that the surface of the chip is smooth, bubbles are not easy to generate, and the boiling effect is poor; the contact surface between the untreated chip surface and the refrigerant is small, and the working limit temperature of the chip is easily reached. The above reasons make boiling heat exchange unable to take its potential advantage. Based on the above, the enhanced boiling structure, the preparation method and the application thereof provided by the embodiment of the invention can significantly improve the nucleate boiling heat exchange performance and the critical heat flux density of the electronic chip, thereby improving the heat dissipation effect of the electronic chip.
For the understanding of the present embodiment, a detailed description of an enhanced boiling structure disclosed in the present embodiment will be given first.
Referring to a schematic structural diagram of an enhanced boiling structure shown in fig. 1, an embodiment of the present invention provides an enhanced boiling structure, including a heat conduction substrate 101, a heat dissipation rib 102, and a micro-nano concave-convex structure 103, where the heat dissipation rib 102 is located on a first surface of the heat conduction substrate 101 (i.e., an upper surface of the heat conduction substrate 101 in fig. 1), and the micro-nano concave-convex structure 103 is formed on the first surface and a surface of the heat dissipation rib 102; the size of the heat dissipation ribs 102 is in the micrometer to millimeter scale.
The heat conducting substrate 101 is a supporting structure of the heat dissipating ribs 102 and the micro-nano concave-convex structure 103, and a second surface of the heat conducting substrate 101 (i.e., a lower surface of the heat conducting substrate 101 in fig. 1) is used for directly contacting with a device requiring boiling heat dissipation, such as an electronic chip. The micrometer-millimeter-sized heat dissipation ribs 102 serve as a main heat dissipation structure, and can enlarge the contact area with the refrigerant. The micro-nano concave-convex structure 103 plays a role in increasing the number of vaporization cores of the bubbles, and is beneficial to generation and separation of the bubbles. Therefore, the enhanced boiling structure can remarkably improve the nucleate boiling heat exchange performance and the critical heat flux density of the electronic chip through the heat dissipation ribs 102 and the micro-nano concave-convex structure 103, so that the heat dissipation performance of the electronic chip is improved.
Alternatively, the material of the heat conducting substrate 101 may be one of a metal material of copper, aluminum, stainless steel, titanium and nickel, may be one of a non-metal material of graphite, silicon nitride and silicon carbide, and may be an alloy composed of a plurality of materials of copper, aluminum, stainless steel, titanium, nickel, graphite, silicon nitride and silicon carbide. The heat dissipation ribs 102 and the micro-nano concave-convex structure 103 can be realized through 3D printing, and the 3D printing material can be metal powder; based on this, the heat conducting substrate 101 is preferably made of a metal material, so that the heat conducting substrate is conveniently bonded with 3D printing metal powder, and the bonding force is improved; in addition, the metal material has high heat conductivity coefficient, and can reduce the thermal resistance.
Alternatively, the thickness of the heat conductive substrate 101 may be 0.1 to 5mm, preferably 0.5 to 2mm, which ensures both structural strength and low thermal resistance.
Alternatively, the second surface of the heat conductive substrate 101 (i.e., the lower surface of the heat conductive substrate 101 in fig. 1) opposite to the first surface may have a surface roughness Ra of 0.2 to 1.6.
Alternatively, the heat dissipation ribs 102 may be one or a combination of pin ribs, fin ribs, cylindrical ribs, and square column ribs. As shown in FIGS. 2 and 3, the enhanced boiling structure adopts needle ribs, the diameter of the needle ribs can be 10-500 μm, the spacing between the needle ribs can be 10-500 μm, and the height of the needle ribs can be 50-1000 μm. As shown in FIG. 4, the enhanced boiling structure employs fin ribs, which may have a thickness of 50-500 μm and a height of 50-2000 μm. For the square pillar rib, the length may be 10-500 μm, the width may be 10-500 μm, the height may be 500-3000 μm, and the distance between the square pillar rib and the square pillar rib may be 10-500 μm.
Alternatively, the material of the heat dissipation rib 102 may be one or more of copper, aluminum, stainless steel, titanium and nickel.
Optionally, the micro-nano concave-convex structure 103 may be made of one or more metals selected from copper, aluminum, stainless steel, titanium, and nickel. Preferably, the material of the heat dissipation rib 102 is the same as that of the micro-nano concave-convex structure 103.
Optionally, the micro-nano concave-convex structure 103 has a surface roughness of 20 to 200 μm and a dimensional accuracy of 20 to 100 μm.
The embodiment of the invention also provides a preparation method of the reinforced boiling structure, which comprises the following steps: the method comprises the steps of printing heat dissipation ribs 102 on a heat conduction substrate 101 in a 3D printing additive mode, and meanwhile generating micro-nano concave-convex structures 103 on the heat conduction substrate 101 and the heat dissipation ribs 102. Wherein the 3D printing material may be a metal powder.
Alternatively, the 3D printing additive manner may be one or more of a combination of Selective Laser Sintering (SLS), Selective Laser Melting (SLM), Laser Metal Deposition (LMD), and Electron Beam Melting (EBM).
Further, the 3D printing additive mode adopts selective laser sintering: mixing metal powder and paraffin wax, wherein the mixing mass ratio can be in the range of 100: 1 to 100: 20, the printing temperature can be 100-.
Further, the 3D printing additive mode adopts selective laser melting: the laser wavelength can be 1064nm, the laser power can be 50-500W, the laser printing speed can be 0.01-1m/s, the printing line width can be 10-1000 μm, the printing temperature can be 600-1200 ℃, and the printing thickness of each layer can be 10-100 μm.
Further, the 3D printing additive mode adopts laser metal powder deposition: the laser wavelength can be 1064nm, the laser power can be 100-1000W, the laser printing speed can be 0.01-1m/s, the printing line width can be 10-1000 μm, the printing temperature can be 600-1200 ℃, and nitrogen protection can be performed.
Further, the 3D printing additive method adopts electron beam melting: the laser wavelength can be 1064nm, the laser power can be 300-2000W, the laser printing speed can be 0.01-0.3m/s, the printing line width can be 10-1000 μm, the printing temperature can be 600-1200 ℃, the printing thickness of each layer can be 50-1000 μm, and the printing chamber cavity can be protected by vacuum or helium.
Optionally, the 3D printing material adopted by the 3D printing additive mode may be a spherical powder material; the D50 particle size of the spherical powder material may be 1 to 100. mu.m, preferably 1 to 20 μm.
For convenience of understanding, the embodiment of the present invention also provides four specific embodiments of the above preparation method, as follows:
implementation mode one
In the present embodiment, the heat conductive substrate 101 is made of copper, the thickness of the heat conductive substrate 101 is 1mm, the printing material is a copper spherical powder material (copper powder), and the D50 particle size of the copper spherical powder material is 10 μm. The program was set such that the heat dissipation ribs 102 were square columnar ribs 200 μm long, 200 μm wide, 200 μm center-to-center spacing, and 1000 μm high.
The 3D printing material increase mode adopts selective laser sintering, wherein the mixing mass ratio of copper powder to paraffin is 100: printing was carried out 10 times at a printing temperature of 300 ℃ and a thickness of 100 μm per layer. And after the primary product is finished, placing the printing structure and the heat conducting substrate 101 into a sintering furnace, wherein the sintering temperature is 1050 ℃, the nitrogen atmosphere is used for protection, and the sintering time is 5 hours, so that the manufacturing of the reinforced boiling structure sample 1 is finished.
Second embodiment
In the present embodiment, the heat conductive substrate 101 is made of copper, the thickness of the heat conductive substrate 101 is 1mm, the printing material is a copper spherical powder material, and the D50 particle size of the copper spherical powder material is 10 μm. The program was set such that the heat dissipation ribs 102 were square columnar ribs 100 μm long, 100 μm wide, 100 μm center-to-center spacing, and 2000 μm high.
The 3D printing material increase mode adopts selective laser sintering, wherein the mixing mass ratio of copper powder to paraffin is 100: printing was carried out 10 times at a printing temperature of 300 ℃ and a thickness of 100 μm per layer. And after the primary product is finished, placing the printing structure and the heat conducting substrate 101 into a sintering furnace, wherein the sintering temperature is 1050 ℃, the nitrogen atmosphere is used for protection, and the sintering time is 5 hours, so that the manufacturing of the reinforced boiling structure sample 2 is finished.
Third embodiment
In the present embodiment, the heat conductive substrate 101 is made of copper, the thickness of the heat conductive substrate 101 is 1mm, the printing material is a copper spherical powder material, and the D50 particle size of the copper spherical powder material is 10 μm. The program was set such that the heat dissipation ribs 102 used were fin ribs having a thickness of 200 μm, a height of 2000 μm, and a pitch of 200 μm.
And 3D printing additive mode adopts selective laser melting, the laser wavelength is 1064nm, the laser power is 300W, the laser printing speed is 0.1m/s, the printing temperature is 1200 ℃, the printing thickness of each layer is 100 μm, and the printing is repeated for 20 cycles to finish the manufacturing of the reinforced boiling structure sample 3.
Embodiment IV
In the present embodiment, the heat conductive substrate 101 is made of copper, the thickness of the heat conductive substrate 101 is 1mm, the printing material is a copper spherical powder material (copper powder), and the D50 particle size of the copper spherical powder material is 10 μm. The program was set such that the heat dissipation ribs 102 used were fin ribs having a thickness of 200 μm, a height of 2000 μm, and a pitch of 200 μm.
The 3D printing material increase mode adopts laser metal powder deposition, the laser wavelength is 1064nm, the laser power is 500W, the laser printing speed is 0.01m/s, the printing temperature is 1200 ℃, the thickness of each layer of printing is 100 mu m, nitrogen is blown for protection, the printing is repeated for 20 cycles, and the manufacturing of the reinforced boiling structure sample 4 is completed.
The embodiment of the invention also provides an application of the enhanced boiling structure in the field of heat dissipation, and the enhanced boiling structure is applied to heat dissipation of an electronic chip.
The embodiment further provides a process for attaching the enhanced boiling structure to the electronic chip, which is shown in fig. 5, and the attachment of the enhanced boiling structure to the electronic chip is completed through the following steps: firstly, performing a back gold treatment on the back surface (e.g., the upper surface in fig. 5) of the electronic chip 105, where the back gold treatment may refer to the related prior art, for example, by using a magnetron sputtering technique, and the chip plating layer is sequentially ti-ni-au, al-ni-au, or al-ti-ni-au, etc.; then, the heat conducting interface layer 104 is placed between the electronic chip 105 and the enhanced boiling structure (the second surface of the heat conducting substrate 101 is in direct contact with the heat conducting interface layer 104), and the surface of the electronic chip 105 is locally heated, wherein the heating temperature can be 150 ℃, so as to weld the electronic chip 105 with the enhanced boiling structure. The material of the thermal interface layer 104 may be, but is not limited to, indium alloy, and the thermal interface layer 104 is used to reduce thermal resistance.
In order to verify the enhanced boiling effect of the enhanced boiling structure, in this embodiment, the enhanced boiling structure samples 1, 2, 3, and 4 prepared above are respectively attached to a GPU chip (where the heat conducting interface layer 104 is an indium alloy sheet), so as to obtain an enhanced boiling GPU sample A, B, C, D, the four enhanced boiling GPU samples are subjected to boiling tests, a comparison test is performed with a bare GPU chip under the conditions that the highest surface temperature is 85 ℃ and the refrigerant is a non-conductive liquid with a boiling point of 47 ℃ in the operation process of the chip, and the test data are shown in table 1 below.
TABLE 1
| GPU chip | Maximum power (W) | Heat flow density (W/cm)2) |
| A | 100.4 | 36.8 |
| B | 136.8 | 45.6 |
| C | 105.9 | 35.3 |
| D | 90.9 | 30.3 |
| Bare GPU chip | 33.6 | 11.2 |
As can be seen from table 1 above, compared with a bare GPU chip, the enhanced boiling GPU sample with the enhanced boiling structure has the advantages that the heat flux density is increased by several times, and the heat dissipation performance is increased by 3-10 times, which indicates that the enhanced boiling structure has a good heat dissipation effect, and through 3D printing additive processing, the effective heat dissipation surface area is increased (the contact area between the GPU chip and a refrigerant is increased), the micro-nano structure is processed, and the number of vaporization cores in the evaporative cooling process is increased.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In addition, in the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A reinforced boiling structure is characterized by comprising a heat conduction substrate, heat dissipation ribs and a micro-nano concave-convex structure, wherein the heat dissipation ribs are positioned on a first surface of the heat conduction substrate, and the micro-nano concave-convex structure is formed on the first surface and the surfaces of the heat dissipation ribs; the size of the heat dissipation ribs is in the micrometer-millimeter level.
2. The enhanced boiling structure of claim 1 wherein the heat dissipating ribs comprise one or more of pin ribs, fin ribs, cylindrical ribs and square column ribs.
3. The enhanced boiling structure of claim 1 wherein the heat dissipating ribs are made of a material comprising one or more of copper, aluminum, stainless steel, titanium and nickel.
4. The enhanced boiling structure of claim 1, wherein the heat dissipation ribs are made of the same material as the micro-nano concave-convex structure.
5. The enhanced boiling structure of claim 1, wherein the micro-nano concave-convex structure has a surface roughness of 20-200 μm and a dimensional accuracy of 20-100 μm.
6. The enhanced boiling structure of claim 1 wherein the thermally conductive substrate comprises one or more of copper, aluminum, stainless steel, titanium, nickel, graphite, silicon nitride, and silicon carbide; the thickness of the heat conduction substrate is 0.1-5mm, and the surface roughness Ra of a second surface of the heat conduction substrate, which is opposite to the first surface, is 0.2-1.6.
7. A method of producing an enhanced boiling structure according to any one of claims 1 to 6 comprising:
and printing the heat dissipation ribs on the heat conduction substrate by adopting a 3D printing material increase mode, and generating the micro-nano concave-convex structure on the heat conduction substrate and the heat dissipation ribs.
8. The method of manufacturing of claim 7, wherein the 3D printing additive approach includes one or more of selective laser sintering, selective laser melting, laser metal powder deposition, and electron beam melting.
9. The preparation method according to claim 7, wherein the 3D printing material adopted by the 3D printing additive mode comprises a spherical powder material, and the D50 particle size of the spherical powder material is 1-100 μm.
10. Use of the enhanced boiling structure as claimed in any one of claims 1 to 6 in the field of heat dissipation, wherein the enhanced boiling structure is used for heat dissipation of electronic chips.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114096118A (en) * | 2021-11-03 | 2022-02-25 | 武汉华星光电半导体显示技术有限公司 | Heat radiating fin, preparation method thereof and electronic device |
| CN114850490A (en) * | 2022-03-31 | 2022-08-05 | 芯体素(杭州)科技发展有限公司 | Electronic radiator manufacturing method based on 3D printing |
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2020
- 2020-12-22 CN CN202011533169.5A patent/CN112582361A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114096118A (en) * | 2021-11-03 | 2022-02-25 | 武汉华星光电半导体显示技术有限公司 | Heat radiating fin, preparation method thereof and electronic device |
| CN114850490A (en) * | 2022-03-31 | 2022-08-05 | 芯体素(杭州)科技发展有限公司 | Electronic radiator manufacturing method based on 3D printing |
| CN114850490B (en) * | 2022-03-31 | 2024-03-26 | 芯体素(杭州)科技发展有限公司 | Manufacturing method of electronic radiator based on 3D printing |
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