CN114841950A - Printed circuit board element tracking system and method based on dynamic detection - Google Patents
Printed circuit board element tracking system and method based on dynamic detection Download PDFInfo
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- CN114841950A CN114841950A CN202210458622.3A CN202210458622A CN114841950A CN 114841950 A CN114841950 A CN 114841950A CN 202210458622 A CN202210458622 A CN 202210458622A CN 114841950 A CN114841950 A CN 114841950A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T5/00—Image enhancement or restoration
- G06T5/20—Image enhancement or restoration by the use of local operators
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/11—Region-based segmentation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/20—Analysis of motion
- G06T7/246—Analysis of motion using feature-based methods, e.g. the tracking of corners or segments
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
- G06T7/33—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
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- G—PHYSICS
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- G06T2207/00—Indexing scheme for image analysis or image enhancement
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- G06T2207/20112—Image segmentation details
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- G—PHYSICS
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- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The invention provides a tracking system and a tracking method of a printed circuit board element based on dynamic detection, which relate to the field of printed circuit board element assembly and comprise an image acquisition module, an image preprocessing module, an element position calibration module, an element position dynamic adjustment module and a tracking assembly mechanism, wherein the invention does not need to spend huge resources to change a transmission line body, only needs to acquire and analyze dynamic images of the printed circuit board transmitted by the conventional transmission line body, the element position dynamic adjustment module acquires an element position offset distance and an offset angle of the printed circuit board through comparison, and the tracking assembly mechanism can determine an assembly position and an assembly angle of an element according to the element position offset distance and the offset angle so as to realize the element assembly of a non-standard type printed circuit board and solve the problem of pain points in the industry; the invention can fully utilize the existing electronic surface mounting equipment, reduce the labor cost and improve the enterprise efficiency.
Description
Technical Field
The invention relates to the field of printed circuit board element assembly, in particular to a printed circuit board element tracking system and a tracking method based on dynamic detection.
Background
The printed circuit board is called PVB board for short, the printed circuit board is a substrate for assembling electronic parts, and is a printed board for forming point-to-point connection and printing elements on a general base material according to a preset design; the main function of the connector is to connect various electronic components to form a predetermined circuit, which plays a role of relay transmission, and is a key electronic interconnection of electronic products, called as "the mother of the electronic products". The PCB serves as a substrate for electronic component mounting and as a critical interconnect, which any electronic device or product needs to be equipped with.
In the printed circuit board industry, a component assembly process is an indispensable key technology, and the main tasks thereof are to mount electronic components that realize various specific functions on a printed circuit board, to realize assembly and integration of the electronic components, and to produce a final electronic product. At present, electronic mounting equipment can realize automatic assembly on electronic elements, and the realization premise is high-precision positioning of a printed circuit board, but for circuit board assembly enterprises, customized printed circuit boards are more in the operation and collection, the shapes and specifications of the customized printed circuit boards are often greatly different, and in order to match with non-standard customized printed circuit boards, huge capital expenditure is required to change a transmission line body.
Therefore, how to improve the assembly of the off-standard printed circuit board is a problem to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a printed circuit board element tracking system and a tracking method based on dynamic detection.
The invention is realized by the following technical scheme: a printed circuit board element tracking system based on dynamic detection comprises an image acquisition module, an image preprocessing module, an element position calibration module, an element position dynamic adjustment module and a tracking and assembling mechanism, wherein,
the image acquisition module shoots and acquires image information of the printed circuit board;
the image preprocessing module is used for denoising the image information and enhancing image characteristics to obtain a denoised image;
the component position calibration module cuts and limits the installation area of the component to be installed based on the noise reduction image, and calibrates to obtain front image information;
the component position dynamic adjusting module dynamically acquires a component position offset distance and an offset angle of the printed circuit board based on the front image information;
the tracking assembly mechanism dynamically determines the assembly position and the assembly angle of the element based on the element position offset distance and the offset angle of the element position dynamic adjustment module.
The invention also discloses a printed circuit board element tracking method based on dynamic detection, which comprises the following steps:
s1, arranging an image acquisition module right above the assembly equipment, and when the printed circuit board is conveyed to an assembly position, shooting and acquiring complete image information of the printed circuit board by the image acquisition module;
s2, the image preprocessing module carries out denoising and image feature enhancement on the image information obtained in the step S1 to obtain a denoising image;
s3, the component position calibration module cuts and limits the noise reduction image based on the step S2 to obtain the installation area of the component to be assembled, and the front image information of the installation area is obtained through calibration;
s4, the dynamic adjustment module of the component position presets the standard coordinate and the diagonal direction of the center of the component position, and based on the front image information of the step S3, the standard coordinate and the diagonal direction of the center of the component position are compared to obtain the offset distance and the offset angle of the component position of the printed circuit board;
and S5, the tracking assembly mechanism determines the assembly position and the assembly angle of the element based on the element position offset distance and the offset angle of the element position dynamic adjustment module in the step S4.
According to the above technical solution, preferably, the step S2 specifically includes the following steps:
s2-1, based on the image enhancement algorithm, enhancing the image information obtained in the step S1;
s2-2, based on Gaussian low-pass filtering algorithm, carrying out noise reduction processing on the enhanced image information obtained in the step S2-1 to obtain a noise-reduced image.
According to the above technical solution, preferably, step S3 specifically includes the following sub-steps:
s3-1, recording a standard image of the printed circuit board in the element position calibration module in advance;
s3-2, cutting and limiting the noise reduction image obtained in the step S2 to obtain an installation area image of the element to be assembled;
s3-3, extracting feature points of the installation area image and the standard image based on an ORB algorithm and generating a descriptor with direction information;
s3-4, matching the feature points and the descriptors thereof in the two images extracted in the step S3-3 by using a matching method to obtain a series of matching point pairs;
s3-5, constructing a perspective transformation matrix model;
s3-6, importing the matching point pairs obtained in the step S3-4 into the perspective transformation matrix model in the step S3-5, generating new pixel point coordinates, and obtaining the front image information after registration.
According to the above technical solution, preferably, step S4 specifically includes the following sub-steps:
s4-1, recording the standard coordinate and diagonal direction of the center of the element position in advance in the element position dynamic adjusting module;
s4-2, obtaining the element position center point coordinates and the diagonal direction of the printed circuit board to be assembled based on the front image information of the step S3-6;
s4-3, establishing a comparison model, comparing the standard coordinate and the standard diagonal direction of the step S4-1 with the actual component position center point coordinate and the actual diagonal direction of the step S4-2 respectively, and obtaining the offset distance and the offset angle of the component position of the printed circuit board.
According to the above technical solution, preferably, step S5 specifically includes the following sub-steps:
s5-1, connecting the tracking assembly mechanism with the mechanical arm;
s5-2, the tracking assembly mechanism dynamically adjusts the offset distance and offset angle of the component position of the module based on the component position in step S4-3, determines the assembly position and assembly angle of the component in real time, and finely adjusts the assembly based on the robot in step S5-1.
The invention has the beneficial effects that:
(1) according to the invention, the transfer line body is not required to be changed by spending huge money, only the dynamic image acquisition and analysis are required to be carried out on the printed circuit board transferred by the existing transfer line body, the component position dynamic adjustment module obtains the component offset distance and the offset angle of the printed circuit board through comparison, and the tracking assembly mechanism can determine the assembly position and the assembly angle of the component according to the component offset distance and the offset angle, so that the component assembly of the non-standard type printed circuit board is realized, and the problem of industrial pain points is solved;
(2) the invention can fully utilize the existing electronic mounting equipment, reduce the labor cost and improve the enterprise efficiency.
Drawings
FIG. 1 shows a schematic flow diagram according to an embodiment of the invention;
FIG. 2 shows a schematic flow chart of step S3 according to the present invention;
FIG. 3 shows a schematic flow chart of step S4 according to the present invention;
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
As shown in the drawings, the present invention provides a printed circuit board element tracking system based on dynamic detection, which includes an image acquisition module, an image preprocessing module, an element position calibration module, an element position dynamic adjustment module, and a tracking assembly mechanism, wherein,
the image acquisition module shoots and acquires image information of the printed circuit board;
the image preprocessing module denoises image information and enhances image characteristics to obtain a denoised image;
the component position calibration module cuts and limits the installation area of the component to be installed based on the noise reduction image, and calibrates to obtain front image information;
the element position dynamic adjusting module dynamically acquires an element position offset distance and an offset angle of the printed circuit board based on the front image information;
the tracking assembly mechanism dynamically determines the assembly position and the assembly angle of the component based on the component position offset distance and the offset angle of the component position dynamic adjustment module.
The method specifically comprises the following steps:
s1, arranging the image acquisition module right above the assembly equipment, and when the printed circuit board is transmitted to the assembly position, shooting and acquiring the complete image information of the printed circuit board by the image acquisition module;
s2, the image preprocessing module carries out denoising and image feature enhancement on the image information obtained in the step S1 to obtain a denoising image;
wherein the step S2 specifically includes the following steps:
s2-1, enhancing the image information obtained in the step S1 based on an image enhancement algorithm, wherein the image enhancement algorithm can adopt a histogram equalization method to realize contrast enhancement;
s2-2, carrying out noise reduction processing on the enhanced image information obtained in the step S2-1 based on a Gaussian low-pass filtering algorithm to obtain a noise-reduced image;
s3, the component position calibration module cuts and limits the noise reduction image based on the step S2 to obtain the installation area of the component to be assembled, and the front image information of the installation area is obtained through calibration;
wherein step S3 specifically includes the following sub-steps:
s3-1, recording a standard image of the printed circuit board in the component position calibration module in advance, wherein the standard image can be obtained by positioning and shooting in advance;
s3-2, cutting and limiting the noise reduction image obtained in the step S2 to obtain an image of a mounting area of the component to be assembled, and reducing the image area of the printed circuit board to reduce the calculation amount and improve the processing precision of the image of the mounting area;
s3-3, extracting feature points of the installation area image and the standard image based on an ORB algorithm and generating descriptors with direction information, wherein the installation area image and the standard image can be decomposed based on the ORB algorithm;
s3-4, matching the feature points and the descriptors thereof in the two images extracted in the step S3-3 by using a matching method to obtain a series of matching point pairs (x) 1i ,y 1i ) And (x) 2i ,y 2i ),i＝1,2,3,……；
S3-5, constructing a perspective transformation matrix model, recording the coordinates of any pixel point in the installation area image as (x, y), recording the coordinate point corresponding to the standard image as (x ', y'), and recording the height information as 1, wherein the corresponding relation of the two groups of coordinates can be expressed as:
wherein H is a perspective transformation matrix model to be calculated;
s3-6, importing the matching point pairs obtained in the step S3-4 into the perspective transformation matrix model in the step S3-5 to generate new pixel point coordinates, and obtaining the front image information after registration;
s4, the dynamic adjustment module of the component position presets the standard coordinate and the diagonal direction of the center of the component position, and based on the front image information of the step S3, the standard coordinate and the diagonal direction of the center of the component position are compared to obtain the offset distance and the offset angle of the component position of the printed circuit board;
step S4 specifically includes the following substeps:
s4-1, recording the standard coordinate and diagonal direction of the center of the element position in advance in the element position dynamic adjusting module;
s4-2, obtaining the element position center point coordinates and the diagonal direction of the printed circuit board to be assembled based on the front image information of the step S3-6;
s4-3, establishing a comparison model, comparing the standard coordinate and the standard diagonal direction of the step S4-1 with the actual element position center point coordinate and the actual diagonal direction of the step S4-2 respectively, and obtaining the offset distance and the offset angle of the element position of the printed circuit board;
and S5, the tracking assembly mechanism determines the assembly position and the assembly angle of the element based on the element position offset distance and the offset angle of the element position dynamic adjustment module in the step S4.
Step S5 specifically includes the following substeps:
s5-1, connecting the tracking and assembling mechanism with a mechanical arm, wherein the mechanical arm can adopt the existing electronic mounting equipment;
s5-2, the tracking assembly mechanism determines the assembly position and the assembly angle of the component in real time based on the offset distance and the offset angle of the component position dynamic adjustment module in the step S4-3, and realizes the dynamic positioning assembly of the mechanical arm based on the fine adjustment assembly of the mechanical arm in the step S5-1.
The invention has the beneficial effects that:
(1) the invention does not need to change the conveying line body with huge cost, only needs to acquire and analyze dynamic images of the printed circuit board conveyed by the conventional conveying line body, the dynamic element position adjusting module acquires the element position offset distance and the offset angle of the printed circuit board through comparison, and the tracking and assembling mechanism can determine the assembling position and the assembling angle of the element according to the element position offset distance and the offset angle, so that the element assembly of the non-standard type printed circuit board is realized, and the problem of industrial pain points is solved;
(2) the invention can fully utilize the existing electronic mounting equipment, reduce the labor cost and improve the enterprise efficiency.
Claims (6)
1. The printed circuit board element tracking system based on dynamic detection is characterized by comprising an image acquisition module, an image preprocessing module, an element position calibration module, an element position dynamic adjustment module and a tracking assembly mechanism, wherein,
the image acquisition module shoots and acquires image information of the printed circuit board;
the image preprocessing module is used for denoising the image information and enhancing image characteristics to obtain a denoised image;
the component position calibration module cuts and limits the installation area of the component to be installed based on the noise reduction image, and calibrates to obtain front image information;
the component position dynamic adjusting module dynamically acquires a component position offset distance and an offset angle of the printed circuit board based on the front image information;
the tracking assembly mechanism dynamically determines the assembly position and the assembly angle of the element based on the element position offset distance and the offset angle of the element position dynamic adjustment module.
2. Printed circuit board element tracking method based on dynamic inspection, characterized in that it comprises a printed circuit board element tracking system based on dynamic inspection according to claim 1, comprising in particular the following steps:
s1, arranging an image acquisition module right above the assembly equipment, and when the printed circuit board is conveyed to an assembly position, shooting and acquiring complete image information of the printed circuit board by the image acquisition module;
s2, the image preprocessing module carries out denoising and image feature enhancement on the image information obtained in the step S1 to obtain a denoising image;
s3, the component position calibration module cuts and limits the noise reduction image based on the step S2 to obtain the installation area of the component to be assembled, and the front image information of the installation area is obtained through calibration;
s4, the dynamic adjustment module of the component position presets the standard coordinate and the diagonal direction of the center of the component position, and based on the front image information of the step S3, the standard coordinate and the diagonal direction of the center of the component position are compared to obtain the offset distance and the offset angle of the component position of the printed circuit board;
and S5, the tracking assembly mechanism determines the assembly position and the assembly angle of the element based on the element position offset distance and the offset angle of the element position dynamic adjustment module in the step S4.
3. The printed circuit board element tracing method based on dynamic detection as claimed in claim 2, wherein step S2 comprises the following steps:
s2-1, based on the image enhancement algorithm, enhancing the image information obtained in the step S1;
s2-2, based on Gaussian low-pass filtering algorithm, carrying out noise reduction processing on the enhanced image information obtained in the step S2-1 to obtain a noise-reduced image.
4. The printed circuit board element tracing method based on dynamic detection as claimed in claim 3, wherein step S3 comprises the following sub-steps:
s3-1, recording a standard image of the printed circuit board in the element position calibration module in advance;
s3-2, cutting and limiting the noise reduction image obtained in the step S2 to obtain an installation area image of the element to be assembled;
s3-3, extracting feature points of the installation area image and the standard image based on an ORB algorithm and generating a descriptor with direction information;
s3-4, matching the feature points and the descriptors thereof in the two images extracted in the step S3-3 by using a matching method to obtain a series of matching point pairs;
s3-5, constructing a perspective transformation matrix model;
s3-6, importing the matching point pairs obtained in the step S3-4 into the perspective transformation matrix model in the step S3-5 to generate new pixel point coordinates, and obtaining the front image information after registration.
5. Printed circuit board element tracking method based on dynamic detection as claimed in claim 4, characterized in that step S4 comprises the following sub-steps:
s4-1, recording the standard coordinate and diagonal direction of the center of the element position in advance in the element position dynamic adjusting module;
s4-2, obtaining the element position center point coordinates and the diagonal direction of the printed circuit board to be assembled based on the front image information of the step S3-6;
s4-3, establishing a comparison model, comparing the standard coordinate and the standard diagonal direction of the step S4-1 with the actual component position center point coordinate and the actual diagonal direction of the step S4-2 respectively, and obtaining the offset distance and the offset angle of the component position of the printed circuit board.
6. The printed circuit board element tracking method and system based on dynamic inspection as claimed in claim 4, wherein step S5 comprises the following sub-steps:
s5-1, connecting the tracking assembly mechanism with the mechanical arm;
s5-2, the tracking assembly mechanism dynamically adjusts the offset distance and offset angle of the component position of the module based on the component position in step S4-3, determines the assembly position and assembly angle of the component in real time, and finely adjusts the assembly based on the robot in step S5-1.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117409261A (en) * | 2023-12-14 | 2024-01-16 | 成都数之联科技股份有限公司 | Element angle classification method and system based on classification model |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117409261A (en) * | 2023-12-14 | 2024-01-16 | 成都数之联科技股份有限公司 | Element angle classification method and system based on classification model |
| CN117409261B (en) * | 2023-12-14 | 2024-02-20 | 成都数之联科技股份有限公司 | Element angle classification method and system based on classification model |
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