CN114836813B - In-situ multifunctional electroplating bath device and working method - Google Patents
In-situ multifunctional electroplating bath device and working method Download PDFInfo
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- 238000011065 in-situ storage Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title abstract description 50
- 238000009713 electroplating Methods 0.000 title abstract description 41
- 238000007747 plating Methods 0.000 claims abstract description 176
- 239000007788 liquid Substances 0.000 claims abstract description 84
- 230000003287 optical effect Effects 0.000 claims abstract description 42
- 239000013307 optical fiber Substances 0.000 claims abstract description 38
- 239000000523 sample Substances 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims abstract description 6
- 230000001502 supplementing effect Effects 0.000 claims description 11
- 239000012530 fluid Substances 0.000 claims description 9
- 238000012544 monitoring process Methods 0.000 abstract description 13
- 238000001228 spectrum Methods 0.000 description 24
- 230000008569 process Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 230000009466 transformation Effects 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
- 230000001960 triggered effect Effects 0.000 description 6
- 230000003020 moisturizing effect Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000001066 destructive effect Effects 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 238000001802 infusion Methods 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 3
- 239000013589 supplement Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001831 conversion spectrum Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002637 fluid replacement therapy Methods 0.000 description 1
- 238000002795 fluorescence method Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000003325 tomography Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention provides an in-situ multifunctional electroplating bath device and a working method, which belong to the field of electroplating bath equipment. When the device disclosed by the invention is used for working, the liquid level meter is used for measuring the liquid level of the plating solution contained in the plating bath, light emitted by the light source sequentially enters the optical fiber coupler and the optical probe and then is injected into the liquid level of the plating solution to be transmitted and reflected, the light of the transmission part further penetrates through the plating solution and then is injected into the surface of a plating part to be reflected again, and the spectrometer is used for collecting various reflected lights in different time periods to obtain plating solution concentration information and plating layer thickness information. The device and the method can realize in-situ monitoring of the thickness of the plating piece and do not damage the plating piece.
Description
Technical Field
The invention belongs to the field of electroplating bath equipment, and particularly relates to an in-situ multifunctional electroplating bath device and a working method thereof, which can monitor and measure the thickness of an electroplating layer and the quality of the electroplating layer in situ, and can automatically measure the concentration of electroplating liquid and automatically supplement the electroplating liquid to the electroplating bath.
Background
One of the important parameters characterizing the plating quality of a plated article is the plating thickness, and in order to ensure good plating quality, the plating needs to be monitored in real time and the concentration of the plating solution needs to be adjusted in time. The existing electroplating process is to control the electroplating liquid in a manual dosing mode, and the manual mode has the defects of large workload, inaccurate dosage control and the like; the detection of the plating piece is also carried out by a destructive or nondestructive method after the plating is finished, and the problem that the plating layer is damaged and the plating layer cannot be improved by continuously plating the workpiece with a thinner plating layer exists.
The plating thickness of the plated part is an important parameter for determining the plating quality in the plating process, and the plating process is carried out in electrolyte, so that the main flow sensor is not suitable for detecting the thickness in the electrolyte, and therefore, the traditional plating detection is to detect the thickness of the plating by adopting a method (such as a coulomb method, a magnetic method, a beta back scattering method, a metallographic method, an X fluorescence method and the like) for damaging or not damaging the plated part after the plating is finished.
The magnetic method can only detect magnetic materials or magnetic plating layers and has certain limitation on plating pieces; metallographic and coulombic methods are destructive methods, which can damage the plating layer; x-fluorescence is non-destructive but costly. In addition, the above method cannot detect in real time, and thus the thickness of the plating layer cannot be precisely controlled.
In order to accurately control the plating layer, the real-time change condition of the thickness of the plating layer needs to be known in real time, so that the material is not wasted due to the fact that the plating layer is too thick, and waste caused by the fact that the plating layer is too thin is avoided. Therefore, there is a need to develop a multifunctional plating bath and method of operation that can monitor the thickness and quality of the plating in situ.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide an in-situ multifunctional plating bath device and a working method, which are used for skillfully combining an optical device with a plating bath, measuring the thickness of a plating layer, the quality of the surface and the concentration of plating solution in situ, realizing automatic fluid replacement and realizing the full-scale and multifunctional plating bath for monitoring the thickness of the in-situ plating layer.
In order to achieve the above purpose, the invention provides an in-situ multifunctional plating bath device, which comprises a plating bath, a light source and a liquid level meter which are arranged above the plating bath at the same time, a spectrometer connected with the light source, an optical fiber coupler with an input end connected with the light source and the spectrometer at the same time, an optical probe connected with an output end of the optical fiber coupler, and an acquisition control unit, wherein the acquisition control unit is connected with the liquid level meter, the spectrometer and the optical probe at the same time, a station for placing plating parts is arranged in the plating bath, the liquid level meter is used for measuring the liquid level of plating solution contained in the plating bath, light emitted by the light source sequentially enters the optical fiber coupler and the optical probe and then enters the plating solution level, transmission and reflection occur, the light of the transmission part further penetrates the plating solution and then enters the surface of the plating parts, secondary reflection occurs, and multiple reflection lights in different time periods are acquired by the spectrometer, and plating solution concentration information and plating layer thickness information are acquired from multiple reflection lights.
Further, the optical probe comprises a first optical fiber collimator, an X-axis vibrating mirror, a Y-axis vibrating mirror and a scanning lens, wherein the X-axis vibrating mirror is arranged in the emergent light direction of the first optical fiber collimator, the Y-axis vibrating mirror is arranged in the reflecting light direction of the X-axis vibrating mirror, the scanning lens is arranged in the reflecting direction of the Y-axis vibrating mirror, and the emergent light direction of the scanning lens is aligned with the electroplating station of the electroplating bath.
Further, the optical fiber collimator comprises a reference arm, wherein the reference arm comprises a second optical fiber collimator, a focusing lens and a reflecting mirror, the incident light direction of the second optical fiber collimator is connected with the optical fiber coupler, the focusing lens is arranged in the emergent light direction, and the reflecting mirror is arranged in the emergent light direction of the focusing lens.
Further, the light source is a broad spectrum light source, and the wavelength of the light source is 790 nm-890 nm.
Further, it still includes measuring pump and moisturizing groove, and the measuring pump is connected and is gathered the control unit to can be gathered the control unit control switching, the moisturizing groove passes through pipeline intercommunication plating bath, and the measuring pump setting is on the pipeline between intercommunication plating bath and the moisturizing groove, in order to control switching between moisturizing groove and the plating bath, finally realizes that the moisturizing volume is accurate controllable.
According to a second aspect of the present invention, there is also provided a method of operating an in-situ multifunctional plating bath apparatus as described above, comprising a method of automatically replenishing a plating solution, in particular:
Firstly, the liquid level meter collects the current moment Depth/>, of electroplating solutionThe acquisition control unit controls the X-axis vibrating mirror to perform preset fixed deflection angle/>Deflection, namely deflecting a light beam to the tank bottom of the electroplating tank, receiving a spectrum signal acquired by a spectrometer, and knowing the deflection angle/>Optical path difference from total liquid level to bottom of tank/>The current plating solution refractive index is:，
Wherein, the meaning of each parameter is: for a certain moment,/> For/>The height of the liquid level of the electroplating liquid from the bottom of the tank at any time,/>For the angle of deflection of the X-axis galvanometer around the X-axis,/>For the angle of deflection of the Y-axis vibrating mirror around the Y-axis,/>For the beam/>When the deflection angle of the liquid is incident, the optical path difference from the liquid level to the bottom of the groove,/>For/>The refractive index of the plating solution at the moment,
Then, the current concentration of the electroplating solution is obtained by calculation according to the relation between the refractive index and the concentration，
Next, toJudging, if the volume is smaller than a given threshold value, calculating to obtain the volume/>, which needs to be supplemented with liquidAnd output a signal to the metering pump for volume/>Is added with the liquid for supplementing the liquid,
Finally, when the fluid infusion is completed, measuring the current moment againPlating solution concentration/>Pair/>And judging that if the liquid is within the given threshold range, stopping liquid supplementing, and negatively continuing liquid supplementing.
Further, the method comprises the step of monitoring the thickness of the plating layer of the plating piece, and specifically comprises the following steps:
the first step, the light emitted by the wide spectrum light source is divided into two paths by the optical fiber coupler, one path is transmitted into the reference arm, and after being collimated by the second optical fiber collimator and converged by the focusing lens, the light is focused on the reflecting mirror, and the part of the reflected light transmitted into the spectrometer is recorded as ; The other path of reflected light is transmitted into an optical probe, is collimated by a first optical fiber collimator, deflects the light beam by an X-axis vibrating mirror, focuses the light beam by a scanning lens, and the focused light is transmitted through the liquid surface and is incident on the surface of a plating part, and the part of the reflected light transmitted into a spectrometer is recorded as/>，
The second step, the collecting control unit generates periodic driving voltage signals which are respectively transmitted into the controller of the X-axis vibrating mirror and the controller of the spectrometer, in addition, the collecting control unit stores the deflection voltage files in a two-dimensional array mode, and when the controller of the X-axis vibrating mirror is triggered by the driving signals, corresponding voltages are generated according to the deflection voltage filesRespectively deflecting the X axis and the Y axis of the X-axis vibrating mirror by corresponding angles/>At the same time, the controller of the spectrometer is triggered by the driving signal to perform the current spectrum dataCollecting and transmitting the collected data into a collecting control unit,
Third, the control unit collects the spectrum dataPerforming Fourier transform to generate two signal peaks in the transformed spectrum, wherein the first signal peak corresponds to the liquid level of the electroplating liquid, the second signal peak corresponds to the surface of the plated part, and searching for the peak of the second signal peak to obtain the optical path difference/>Further, the optical path difference distribution is obtained,
Fourth, the liquid level meter measures the depth of the electroplating solution at the current timeAcquiring a preset deflection angle control voltage/>, according to a deflection voltage fileTransform spectrum/>, using groove bottom pointsObtaining signal peaks corresponding to the liquid level of the electroplating liquid and the tank bottom, respectively searching the peaks and making differences to obtain the optical path difference/>, from the liquid level of the electroplating liquid to the tank bottomThe current refractive index of the plating solution isBy using the refractive index and the optical path difference distribution/>Calculate the coating height distribution/>，
Fifth, repeating the second step to the fourth step, and acquiring the height distribution of the plated part at each moment by the acquisition control unitAnd plating solution refractive index data/>Let the time when a plating starts to be plated be the initial time/>Then at a certain moment/>Calculated as/>Pair/>And analyzing to obtain the thickness of the plating layer of the plating piece and the surface thickness distribution.
Further, another method for monitoring the thickness of the plating layer of the plating piece specifically comprises the following steps:
the first step, light emitted by a broad spectrum light source is directly transmitted into an optical probe through an optical fiber coupler, collimated by a first optical fiber collimator, deflected by an X-axis vibrating mirror, focused by a scanning lens, and then enters the surface of a plating piece through a liquid level, reflected light of the liquid level of the plating liquid interferes with reflected light of the surface of the plating piece, the interference spectrum carries optical path difference information of the surface of the plating piece relative to the liquid level of the plating liquid,
The second step, the acquisition control unit generates periodic driving voltage signals which are respectively transmitted into the controller of the X-axis vibrating mirror and the controller of the spectrometer, the acquisition control unit stores the deflection voltage files in a two-dimensional array mode, and when the controller of the X-axis vibrating mirror is triggered by the driving signals, corresponding voltages are generated according to the deflection voltage filesThe X-axis vibrating mirror and the Y-axis vibrating mirror deflect around the X-axis and the Y-axis respectively by corresponding angles/>At the same time, the controller of the spectrometer is triggered by the driving signal to perform/>, on the current spectrum dataCollecting and transmitting the collected data into a collecting control unit,
Third, the control unit collects the spectrum dataPerforming Fourier transform to generate a signal peak corresponding to the surface of the plating part, and obtaining the optical path difference/>, corresponding to the liquid level of the plating solution, of the surface of the plating partFurther, the optical path difference distribution is obtained,
Fourth, the liquid level meter measures the depth of the electroplating liquid at the current momentObtaining a preset deflection angle control voltage/> according to a deflection voltage filePeak searching is carried out corresponding to the transformation spectrum of the tank bottom point to obtain the optical path difference/>, from the liquid level of the plating solution to the tank bottomThe refractive index of the plating solution at this time can be obtained/>By using the refractive index and the optical path difference distribution/>Calculate the coating height distribution/>，
Fifth, repeating the second step to the fourth step, and acquiring the height distribution of the plated part at each moment by the acquisition control unitAnd plating solution refractive index data/>Let the time when a plating starts to be plated be the initial time/>Then at a certain moment/>Calculated as/>Pair/>And analyzing to obtain the thickness of the plating layer of the plating piece and the surface thickness distribution.
In general, the above technical solutions conceived by the present invention have the following beneficial effects compared with the prior art:
1. The plating thickness can be detected in a nondestructive on-line manner and in-situ manner and monitored, and the plating solution can be penetrated to image a plating piece, so that the plating thickness can be detected in real time in the electroplating process. Most of the existing plating thickness detection schemes are detection after electroplating is finished, and other technical schemes have destructive characteristics such as metallographic method, coulomb method and the like, so that the plating part can be damaged, and the method has the advantages of high timeliness and nondestructive detection.
2. The invention judges whether the plating solution is needed to be replenished by monitoring the concentration of the plating solution in real time, and can calculate the volume of replenishing solution and control the metering pump to accurately replenish the solution. Most of the existing liquid replenishing schemes are manually added, and the problems of large workload and inaccurate liquid replenishing amount exist.
3. The invention can monitor the thickness of the plating piece and the concentration information of the plating solution in real time, the acquisition control unit judges to continue plating or to carry out the plating of the next plating piece according to the information, and judges whether the plating solution is needed to be supplemented, thereby effectively avoiding the problem that the plating layer of the plating piece is too thick or too thin and greatly improving the yield. The electroplating process and the detection process of the prior art are carried out separately, so that the workpiece with poor electroplating quality cannot be intervened and remedied in time, and the yield is lower than that of the method.
4. When the method is used for detecting the thickness of the plating layer, the plating piece and the surface morphology information of the plating layer are obtained, the thickness condition of the plating layer can be analyzed for each region of the plating piece collected in the view field, the plating quality of the plating piece is estimated more comprehensively and accurately, and the monitoring of the surface quality of the plating piece is realized. In the prior art, for example, metallographic methods can only evaluate the thickness of a plating layer of a certain section of a plated part, and the evaluation area is limited.
Drawings
FIG. 1 is a schematic view of an in-situ multifunctional plating bath apparatus according to an embodiment of the present invention;
Fig. 2 is a schematic diagram of two different methods for monitoring the thickness of a plating layer and monitoring the surface quality of an in-situ multifunctional plating tank device according to the present invention, wherein (a) in fig. 2 is a schematic diagram of a reference arm, and (b) in fig. 2 is a schematic diagram of a reference arm closing mechanism.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In order to solve the problems that the existing plating thickness measuring method cannot detect in real time and damage to the plating is caused, the invention provides an online plating thickness detecting device which is used for detecting the electroplating process online and simultaneously completing the analysis of the concentration of electrolyte so as to timely supplement the electrolyte.
The device is non-contact measurement, does not damage a plating piece, has the characteristic of tomography, can penetrate solution with a certain depth, and can monitor and measure the thickness of the plating piece in the solution.
Fig. 1 is a schematic structural diagram of an in-situ multifunctional plating bath device according to an embodiment of the present invention, where it can be known that a plating bath device capable of monitoring plating quality on line and automatically replenishing plating solution includes a broad spectrum light source 1, a spectrometer 2, an optical fiber coupler 3, a reference arm 4, an acquisition control unit 5, a bracket 6, a liquid level meter 7, an optical probe 8, a metering pump 9, a plating bath 10, and a replenishment tank 12; the optical probe 8 and the liquid level meter 7 are fixed on the bracket 6 and are positioned above the plating bath 10 and are prevented from being contacted with the plating bath and the liquid supplementing bath, so that the influence of mechanical vibration in the plating process on measurement is reduced, a plating layer monitoring module consisting of the broad spectrum light source 1, the spectrometer 2, the optical fiber coupler 3, the reference arm 4, the liquid level meter 7 and the optical probe 8 can monitor the surface thickness of a plated part 11 and the surface quality of the plated part 11 in real time, data acquired by the spectrometer 2 are transmitted into the acquisition control unit 5 to obtain plating layer thickness distribution through data processing, and when the plating layer thickness distribution is in a proper range, the acquisition control unit 5 moves out of the control transmission assembly from the current plated part 11 and places the next plated part 11 into the plating bath. The signal output end of the liquid level meter 7 is connected with the signal input end of the acquisition control unit 5, the liquid level depth signal is transmitted into the acquisition control unit 5, the concentration information of the electroplating liquid can be obtained through data processing, and when the concentration of the electroplating liquid in the electroplating bath 10 is lower, the acquisition control unit 5 controls the metering pump 9 to supplement the electroplating bath.
Specifically, the plating layer monitoring module comprises a broad spectrum light source 1, a spectrometer 2, an optical fiber coupler 3, a reference arm 4, a liquid level meter 7 and an optical probe 8, wherein the reference arm is input by optical fiber coupling and comprises a first optical fiber collimator, a focusing lens and a reflecting mirror. The optical probe is coupled and input by optical fibers and comprises a second optical fiber collimator, an X-axis galvanometer, a Y-axis galvanometer and a scanning lens. Specifically, an X-axis vibrating mirror is arranged in the emergent light direction of the first optical fiber collimator, a Y-axis vibrating mirror is arranged in the reflecting light direction of the X-axis vibrating mirror, a scanning lens is arranged in the reflecting direction of the Y-axis vibrating mirror, and the emergent light direction of the scanning lens is aligned with an electroplating station of the electroplating bath. In the reference arm, the incident light direction of the second optical fiber collimator is connected with the optical fiber coupler, a focusing lens is arranged in the emergent light direction, and a reflecting mirror is arranged in the emergent light direction of the focusing lens.
Fig. 2 is a schematic diagram of two different methods for monitoring the thickness of a plating layer and monitoring the surface quality of an in-situ multifunctional plating tank device according to the present invention, wherein (a) in fig. 2 is a schematic diagram of a reference arm, and (b) in fig. 2 is a schematic diagram of a reference arm closing mechanism. The following is specifically stated in connection with fig. 2:
The first method is as follows: the method has the advantages that the reference light is strong enough, the experience of weak signals in the liquid level is stronger, and the sensitivity is higher.
The first step, the light emitted by the wide spectrum light source 1 is divided into two paths by the optical fiber coupler 3, one path of the light is transmitted into the reference arm 4, and is focused on the reflector after being collimated by the second optical fiber collimator and converged by the focusing lens, and the part of the reflected light transmitted into the spectrometer 2 is recorded as; The other path of reflected light is transmitted into an optical probe, collimated by a first optical fiber collimator, deflected by an X-axis vibrating mirror, focused by a scanning lens, finally transmitted onto the surface of a plating piece after passing through a liquid level, and the part of the reflected light transmitted into a spectrometer 2 is recorded as，/>And/>Interference will occur on the image plane of the spectrometer, and the interference spectrum will carry the information of the optical path difference of the liquid level and the surface of the plating piece relative to the reflector.
In the second step, the acquisition control unit 5 generates periodic driving voltage signals which are respectively transmitted into the controller of the X-axis galvanometer and the controller of the spectrometer, and the acquisition control unit 5 stores deflection voltage files in a two-dimensional array form, for example. When the X-axis galvanometer controller is triggered by a driving signal, corresponding voltage/> is generated according to a deflection voltage fileRespectively deflecting the X axis and the Y axis of the X-axis vibrating mirror by corresponding angles/>At the same time, the spectrometer controller is triggered by the driving signal, and the current spectrum data/>Acquisition takes place and is passed into an acquisition control unit 5. When the X-axis galvanometer scans a complete field of view, e.g. 500X 500 points, 500X 500 spectral data/>, will be acquired in the acquisition control unit 5。
Third step, the acquisition control unit 5 acquires 500×500 spectrum dataFourier transform, spectral data/>Transform into distance domain data/>Also known as transform spectrum. In the transformation spectrum, the abscissa is the optical path, the origin is the reference plane, and each time the focused light emitted by the optical probe passes through an interface and is reflected, a corresponding signal peak is generated on the transformation spectrum. The first method is adopted to measure, two signal peaks are generated on the conversion spectrum, the first signal peak corresponds to the liquid level of the electroplating liquid, the second signal peak is used for searching the peak, and the optical path difference of the reference surface corresponding to the surface of the plating part can be obtained。
Fourth, the liquid level meter measures the depth of the electroplating solution at the current timeIn the second deflection voltage file, the deflection angle control voltage/>, measured for the groove bottom, is includedCorresponding to the third step, a transformation spectrum of the bottom point of the groove is obtainedThe two signal peaks (corresponding to the liquid surface and the tank bottom respectively) of the data are respectively subjected to peak searching and difference making to obtain the optical path difference/>, from the liquid surface to the tank bottomThe refractive index of the plating solution at this time can be obtained/>. Optical path difference distribution obtained in the third step by using the sub-refractive index/>Calculate height distribution/>。
Fifth, repeating the second to fourth steps, and the collecting control unit 5 will obtain the height distribution of the plated item at each momentAnd plating solution refractive index data/>The time at which plating of a certain plated article was started is referred to as initial time/>Then at a certain moment/>The coating thickness of (2) can be calculated as/>Pair/>Analysis was performed assuming a normal coating thickness of/>If there is/>The plating layer is thin, and the electroplating should be continued; if arbitrary/>All have/>It is indicated that the plating layer has a proper thickness and that the plating can be stopped.
In addition, the refractive index data of the plating solutionA dry system related to the concentration of the plating solution is determined by using a predetermined threshold value, and the determination is made when/>If the plating liquid is smaller than the given threshold value, the plating liquid is considered to be required to be replenished, and the acquisition control unit 5 controls the metering pump 9 to replenish the plating tank.
The second method is as follows: and closing the reference arm, taking the liquid surface reflected light as reference light, and taking the reflected light of the surface of the plating part and the bottom of the plating tank as reference surfaces when the reflected light of the liquid surface is respectively reflected by the liquid surface, wherein the liquid surface is taken as the reference surface as shown in (b) of fig. 2. The method has the advantages that the reference light and the signal light come from the same light path, and when the external environment has mechanical vibration, the reference light and the signal light can be subjected to the same phase disturbance so as to be counteracted, so that the interference signal has stronger anti-interference capability. The method specifically comprises the following steps:
The first step, the light emitted by the broad spectrum light source 1 is directly transmitted into an optical probe through an optical fiber coupler 3, collimated by a first optical fiber collimator, deflected by an X-axis vibrating mirror, focused by a scanning lens, finally beaten on the surface of a plating part after passing through the liquid level, and the reflected light of the liquid level is recorded as The reflected light on the surface of the plating part is recorded as/>，/>And/>Interference will occur at the spectrometer image plane where the liquid level is considered the reference plane and the interference spectrum will carry information about the optical path difference of the surface of the plated article relative to the liquid level.
The second step is the same as the second step of the first method.
The third step is the same as the third step of the first method.
It should be noted that, since the liquid level is regarded as the reference surface, the origin of the transformation spectrum is recorded as the liquid level, and only one signal peak is on the transformation spectrum, corresponding to the surface of the plated part.
Fourth, the liquid level meter measures the depth of the electroplating solution at the current timeIn the second deflection voltage file, the deflection angle control voltage/>, measured for the groove bottom, is includedCorresponding to the third step, a transformation spectrum of the bottom point of the groove is obtainedThe peak finding of the data, namely the optical path difference from the liquid surface to the bottom of the tank/>The refractive index of the plating solution at this time can be obtained. The refractive index is used for obtaining the optical path difference distribution/>, obtained in the third stepCalculate height distribution/>。
The fifth step is the same as the fifth step of the first method.
The principle of the invention is as follows:
the spectrometer receives the interference spectrum signal of the measuring light and the reference light, and can be expressed as:
In the method, in the process of the invention, I.e. wavenumber,/>For the power spectral density of the light source,/>For reference arm reflectance,/>To measure the optical path difference of a point on the arm relative to a reference plane. Order of no hindrance/>The above formula can be written as:
Fourier transform of the above results in:
In the method, in the process of the invention, For the inverse fourier transform of the power spectral density of the light source, the system axial resolution is determined,The signal peak is the optical path difference between the point to be measured and the reference plane.
The automatic fluid infusion principle is specifically as follows:
The automatic liquid supplementing system adopts closed-loop control, and the liquid level meter collects the current moment Depth/>, of electroplating solutionThe acquisition control unit 5 controls the X-axis galvanometer and the Y-axis galvanometer to have a certain fixed deflection angle/>Deflection, the light beam is deflected to the tank bottom of the plating tank, and the spectrum signal acquired by the spectrometer 2 is received, so that the deflection angle/>Optical path difference from total liquid level to bottom of tank/>According to the geometric relationship, the refractive index/>, of the current solution can be obtainedThe concentration/>, of the current electroplating solution can be resolved according to the relation between the refractive index and the concentrationAcquisition control Unit 5 pair/>If the determination is smaller than the given threshold, the volume/>, which is needed to be supplemented, of the liquid is calculatedAnd output a signal to the metering pump for volume/>Is added with the liquid for supplementing. After the fluid infusion is completed, the fluid infusion system can analyze the current moment/>, againPlating solution concentration/>Acquisition control Unit 5 pair/>When the determination is made that the liquid is within the predetermined threshold range, the liquid replenishment is stopped.
It will be readily appreciated by those skilled in the art that the foregoing description is merely a preferred embodiment of the invention and is not intended to limit the invention, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (4)
1. The utility model provides an in-situ multifunctional plating bath device which is characterized in that the device comprises a plating bath (10), a light source (1) and a liquid level meter (7) which are arranged above the plating bath at the same time, a spectrometer (2) connected with the light source, an optical fiber coupler (3) with the input end connected with the light source (1) and the spectrometer (2) at the same time, an optical probe (8) connected with the output end of the optical fiber coupler (3) and an acquisition control unit (5), the acquisition control unit (5) is connected with the liquid level meter (7), the spectrometer (2) and the optical probe (8) at the same time, a station for placing a plating piece (11) is arranged in the plating bath (10),
The optical probe (8) comprises a first optical fiber collimator, an X-axis vibrating mirror, a Y-axis vibrating mirror and a scanning lens, wherein the X-axis vibrating mirror is arranged in the emergent light direction of the first optical fiber collimator, the Y-axis vibrating mirror is arranged in the reflecting light direction of the X-axis vibrating mirror, the scanning lens is arranged in the reflecting direction of the Y-axis vibrating mirror, the emergent light direction of the scanning lens is aligned with a plating part placing station of the plating bath,
During operation, the liquid level meter (7) is used for measuring the liquid level of plating solution contained in the plating bath, light emitted by the light source (1) sequentially enters the optical fiber coupler (3) and the optical probe (8) and then is emitted into the liquid level of the plating solution, transmission and reflection occur, light of the transmission part further penetrates through the plating solution and then is emitted into the surface of a plating part, secondary reflection occurs, multiple reflection light in different time periods is collected by the spectrometer, and plating solution concentration information and plating layer thickness information are obtained from the multiple reflection light.
2. An in-situ multifunctional plating bath device according to claim 1, further comprising a reference arm (4), wherein the reference arm comprises a second optical fiber collimator, a focusing lens and a reflecting mirror, the second optical fiber collimator is connected with the optical fiber coupler in the incident light direction, the focusing lens is arranged in the emergent light direction, and the reflecting mirror is arranged in the emergent light direction of the focusing lens.
3. An in-situ multifunctional plating bath device according to claim 2, characterized in that the light source (1) is a broad spectrum light source with a wavelength of 790 nm-890 nm.
4. A multifunctional in-situ plating tank device according to claim 3, further comprising a metering pump (9) and a fluid supplementing tank (12), wherein the metering pump is connected with the acquisition control unit (5) so as to be controlled to be opened and closed by the acquisition control unit (5), the fluid supplementing tank (12) is communicated with the plating tank (10) through a pipeline, and the metering pump (9) is arranged on the pipeline communicated between the plating tank (10) and the fluid supplementing tank (12) so as to control the opening and closing between the fluid supplementing tank (12) and the plating tank (10), so that the fluid supplementing amount is accurately controllable finally.
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