CN114828417A - Coarsening process for mold forming, three-dimensional circuit and electronic equipment - Google Patents
Coarsening process for mold forming, three-dimensional circuit and electronic equipment Download PDFInfo
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- CN114828417A CN114828417A CN202210436313.6A CN202210436313A CN114828417A CN 114828417 A CN114828417 A CN 114828417A CN 202210436313 A CN202210436313 A CN 202210436313A CN 114828417 A CN114828417 A CN 114828417A
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- 238000000034 method Methods 0.000 title claims abstract description 98
- 230000008569 process Effects 0.000 title claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 113
- 239000000463 material Substances 0.000 claims abstract description 80
- 238000001746 injection moulding Methods 0.000 claims abstract description 30
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 3
- 238000007788 roughening Methods 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 239000011521 glass Substances 0.000 claims description 30
- 239000000243 solution Substances 0.000 claims description 23
- 230000004913 activation Effects 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 18
- 239000004033 plastic Substances 0.000 claims description 18
- 229920003023 plastic Polymers 0.000 claims description 18
- 229910021645 metal ion Inorganic materials 0.000 claims description 17
- 229910010293 ceramic material Inorganic materials 0.000 claims description 11
- 238000007772 electroless plating Methods 0.000 claims description 11
- 206010070834 Sensitisation Diseases 0.000 claims description 9
- 230000003197 catalytic effect Effects 0.000 claims description 9
- 230000006378 damage Effects 0.000 claims description 9
- 239000002923 metal particle Substances 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 9
- 230000008313 sensitization Effects 0.000 claims description 9
- 230000001235 sensitizing effect Effects 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 5
- 230000009467 reduction Effects 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 23
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 22
- 229910052763 palladium Inorganic materials 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000001994 activation Methods 0.000 description 16
- 239000000126 substance Substances 0.000 description 16
- 230000003213 activating effect Effects 0.000 description 10
- 238000000465 moulding Methods 0.000 description 9
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 230000001976 improved effect Effects 0.000 description 8
- 230000006870 function Effects 0.000 description 7
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000008093 supporting effect Effects 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical compound [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the technical field of circuit board manufacturing processes, in particular to a coarsening process for mold forming, a three-dimensional circuit manufactured by using the coarsening process for mold forming and electronic equipment comprising the three-dimensional circuit. The coarsening process for the mold forming comprises the following steps: preparing a circuit pattern area on the mold, wherein the circuit pattern area is a rough structure etched with a circuit pattern on the surface of the mold; and (4) adopting the mould in the S1 to carry out injection molding to form a base material, and forming a drawing strain on the circuit pattern area on the base material in the drawing process to form a rough circuit pattern area on the base material. The surface of the base material prepared by the method is simultaneously provided with the circuit pattern area, and the circuit pattern area is simultaneously coarsened so as to enhance the bonding capability of the plating layer on the base material. For example, one situation is to make the surface of the substrate and the colloidal palladium have a larger contact surface, so as to facilitate the formation of the subsequent plating layer and improve the adhesion of the plating layer.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing processes, in particular to a coarsening process for mold forming, a three-dimensional circuit manufactured by the coarsening process for mold forming and electronic equipment comprising the three-dimensional circuit.
Background
Along with mobile communication equipment and intelligent wearing equipment develop towards direction miniaturized, intelligent for the antenna that uses in above-mentioned equipment need integrate a large amount of functions such as WIFI, bluetooth in extremely limited space.
A three-dimensional molded interconnect device (3D-MID) refers to a device that integrates mechanical and electronic functions into an organic whole by directly arranging electronic circuits on the surface of a molded part having a mechanical function as a substrate and connecting discrete electronic components in a three-dimensional space. The 3D-MID technology can integrate the electrical interconnection function of a common circuit board, the function of supporting components and the functions of supporting and protecting a plastic shell on one device to form a three-dimensional circuit carrier integrating electromechanical functions, the application field of the 3D-MID technology relates to automobiles, communication, household appliances and the like, and the 3D-MID technology also has wide development prospect in the medical field.
LDS is a technology for controlling the movement of laser light according to the trajectory of a conductive pattern by using a computer, projecting the laser light onto a three-dimensional plastic device molded by molding, and activating a circuit pattern in a short time. However, the materials suitable for the LDS process are special modified materials containing laser-activatable substances, which are activated by laser irradiation to release metal particles, and at present, the LDS process can directly form a metal coating on the laser-irradiated modified plastic. Therefore, in the prior art, the LDS process is adopted for forming the antenna wires on the shell of the electronic device, but the cost of special modified materials applicable to the LDS is high, the parameters of different modified materials are different, and the consistency of surface metallization treatment is difficult to control, so that the LDS process is difficult to popularize on a large scale.
The lap (laser active plating) technology is a technology of selective metal plating after inducing a common plastic substrate by laser, and can manufacture circuits and interconnection devices with electrical functions on any molding surface, so that the lap (laser active plating) technology has obvious advantages in antenna manufacturing.
In the conventional LAP process, the plastic substrate is obtained by the following steps; manufacturing a circuit wiring groove on the surface of a substrate by laser; and plating a metal layer in the circuit wiring groove on the substrate.
When a metal layer is formed on a substrate, the surface energy and the roughness of the substrate are low, so that the bonding strength between the substrate and a metal coating can be weakened when the surface is directly metallized, the problems of coating falling, coating missing and the like are caused, and the practical application of a product is seriously hindered. At present, before the metallization of the substrate surface, a roughening treatment is usually performed to improve the bonding strength between the substrate and the metal plating layer. Common roughening methods include physical polishing, chemical oxidation, low temperature plasma treatment, and the like. Therefore, it is necessary to roughen the circuit wiring grooves on the substrate.
The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.
Disclosure of Invention
The invention mainly aims to provide a roughening process for mold forming, and aims to provide a roughening process for improving the bonding strength of a substrate and a metal coating when the substrate is provided with the metal coating by utilizing a drawing damage of a mold in the mold forming process to enable the substrate formed by an injection molding process to have a rough surface.
In order to achieve the above object, the present invention provides a roughening process for mold forming, which comprises the following steps:
preparing a circuit pattern area on the mold, wherein the circuit pattern area is a rough structure formed on the surface of the mold and etched with a circuit pattern;
and adopting the mould to form a base material by injection molding, and enabling a circuit pattern area on the base material to form a drawing die scratch in the drawing process so as to form the rough circuit pattern area on the base material.
Optionally, the step of preparing a circuit pattern region on the mold includes preparing a circuit wiring groove protrusion on the mold, and disposing the circuit pattern region on the circuit wiring groove protrusion to form a circuit wiring groove on the substrate, the circuit pattern region being formed at a groove bottom of the circuit wiring groove.
Optionally, in the step of preparing a circuit pattern region on the mold, the circuit pattern region is prepared on the mold by using an etching process.
Optionally, in the step of forming the substrate by injection molding using the mold, when a structurally complex portion on the substrate, which cannot be formed by the injection molding process, is formed, the circuit pattern area is formed on the substrate by laser.
Optionally, in the step of forming the substrate by using the mold through injection molding, the raw material for preparing the substrate is a plastic material, a glass material, a silica gel material, a ceramic material or a laser activated material.
Optionally, when the raw material of the substrate is a glass material, melting the glass material for the second time to soften, shaping the softened glass material by the mold to form a glass substrate, and forming a drawing flaw on the glass substrate in the drawing process to form the rough circuit pattern area on the glass substrate;
or, when the raw material of the substrate is a ceramic material, in the process of plasticity of the ceramic material blank, the blank is shaped by using the mold to form a ceramic substrate, in the process of drawing, a drawing die pull is formed on the ceramic substrate, and the rough circuit pattern area is formed on the ceramic substrate.
Optionally, after the substrate is formed by injection molding using the mold and the circuit pattern region on the substrate is subjected to pattern drawing in the pattern drawing process to form the rough circuit pattern region on the substrate, the method further comprises performing first electroless plating on the rough circuit pattern region to attach a conductive metal layer thereto.
Optionally, in the step of performing the first electroless plating, the method further includes sensitizing and activating the rough circuit pattern region, the sensitizing uses a sensitizing solution to make a surface of the circuit pattern region adsorb metal ions with strong reducibility, and the activating uses an activating solution to make a layer of metal particles with catalytic activity deposit on the surface of the circuit pattern region, so as to promote the conductive metal ions in the electroless plating to perform a reduction action and rapidly deposit on the surface, wherein the metal ions with reducibility are used for reducing the metal ions in the activating solution to generate the metal particles with catalytic activity.
The application also provides a three-dimensional circuit which is manufactured by the coarsening process method for the die forming.
The application also provides an electronic device, which comprises the stereo circuit.
The technical scheme of the invention relates to a coarsening process for die forming, which comprises the following steps: preparing a circuit pattern area on the mold, wherein the circuit pattern area is a rough structure etched with a circuit pattern on the surface of the mold; and forming a base material by adopting a mould through injection molding, and forming a pattern drawing scratch on the circuit pattern area on the base material in the process of drawing the pattern so as to form a rough circuit pattern area on the base material. The surface of the base material prepared by the method is simultaneously provided with the circuit pattern area, and the circuit pattern area is simultaneously coarsened. The specific principle is that a circuit pattern area is formed on a mold, the circuit pattern area is formed on the surface of a substrate in the process of forming the substrate by injection molding of the mold, and the circuit pattern area is roughened by drawing damage in the drawing process, for example, one case is that the pattern of the circuit pattern area is formed by burrs protruding from the surface of the substrate, and under the condition that the drawing damage exists, the tips of the burrs form barb shapes, so as to achieve the purpose of roughening the surface of the substrate, for example, one case is that the surface of the substrate and colloidal palladium have larger contact surfaces, so that the subsequent plating layer formation is facilitated, the adhesion force of the plating layer is improved, and simultaneously, because the substrate is prepared by adopting the mold forming mode, the roughened circuit pattern area is formed on the substrate while the substrate is formed by demolding, so that the traditional step of obtaining the circuit pattern area by using a laser mode is reduced, and the step of roughening the base material through an additional roughening step is required, so that the process steps are greatly simplified, the processing speed is improved, and the cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a flow chart of a roughening process of the mold molding of the present invention;
FIG. 2 is a schematic structural diagram of an embodiment of a mold pull in a roughening process of mold molding according to the present invention;
FIG. 3 is a schematic structural diagram of a mold of a roughening process for mold molding according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a mold for a roughening process of mold molding according to another embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a mold and a substrate in a roughening process of mold molding according to the present invention;
FIG. 6 is a schematic view of the structure at A in FIG. 5;
FIG. 7 is a schematic view of the structure of the substrate of FIG. 6;
fig. 8 is a schematic structural view of the substrate in fig. 7 after a die pull injury.
The reference numbers illustrate:
| reference numerals | Name(s) | Reference numerals | Name (R) |
| 10 | Die set | 10 | Die set |
| 11 | |
11 | |
| 111 | Groove | 111 | Groove |
| 13 | Circuit |
13 | Circuit wiring groove bulge |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The injection molding process, also called injection molding, is a method in which plastic melted by heat is injected into a mold cavity from high pressure by an injection molding machine, and a molded product is obtained after cooling and solidification. Of course, the ceramic and glass materials can be molded into products by a similar method except for plastic materials.
In the prior art, besides plastic materials, glass materials or ceramic materials are also used to form injection products, for example, when glass is heated to 300 to 500 ℃, the glass is softened and is like an image cluster, and the softened glass is molded by a mold to obtain the required injection products.
The ceramic powder injection moulding process is a new type of manufacturing process combining powder ceramic and plastic injection moulding process. The process technology is suitable for mass production of small, precise and complex ceramic parts with special performance requirements. The basic process of the process is as follows: the ceramic powder and the organic binder are uniformly mixed into a material with heat flow deformation, then the material is injected into a die cavity with a part shape by an injection machine to form a blank, the binder is removed, the blank is sintered at high temperature, the ceramic is highly compact to form a product, and post-treatment can be carried out if necessary.
In the process of manufacturing products by using a mold, the phenomenon of mold drawing damage is generally required to be avoided so as to prevent the surface of the product from generating defects. For example, if the side surface of the cavity of the mold for the plastic product is provided with deep texture, but the demoulding inclination of the mold cavity is not large enough, the plastic product will have fuzzy texture after being separated from the cavity, which is called pull damage or dragging (pull damage).
The strain is mainly formed by adhering and wearing the surface of a workpiece and the surfaces of a male die and a female die of a die. The reason for the strain of the plastic part is mainly that the inner side veins of the mold cavity are too deep due to the overlarge injection pressure or holding pressure, and the like, and the specific reasons are as follows: 1. burrs (back-off) are arranged on the inner side edge of the die cavity; 2. excessive injection pressure or holding pressure; 3. the mold cavity has insufficient demolding inclination; 4. the inner side surface of the die cavity is too coarse; 5. excessive mold clamping force (mold cavity deformation); 6. the temperature of the front mold is too high or the cooling time is insufficient; 7. the opening speed of the mould is too high; 8. the injection molding injection speed is higher, the pressure maintaining time is longer, the mold demoulding angle is not enough, the strength of the corner is not enough, and the thimble is not arranged.
The defects of the drawing die pull can be generated by the above mode, and the substrate formed by the injection molding process has a rough surface by utilizing the drawing die pull phenomenon, so that the bonding strength of the substrate and the metal coating is improved when the metal coating is arranged on the substrate.
As shown in fig. 1, the roughening process of the mold forming includes the following steps: s1, preparing a mould 10, and preparing and forming a circuit pattern area 11 on the mould 10, wherein the circuit pattern area 11 is a rough structure formed on the surface of the mould 10 and etched with a circuit pattern; s2, using the injection molding process, using the mold 10 in S1 to form the substrate 30 by injection molding, and in the process of drawing, forming a drawing scratch on the circuit pattern region 11 on the substrate 30, and forming the rough circuit pattern region 11 on the substrate 30. The surface of the substrate 30 manufactured by the above method is simultaneously formed with the circuit pattern region 11, and the circuit pattern region 11 is simultaneously roughened.
As shown in fig. 2, a specific principle is that a circuit pattern region 11 is prepared and formed on a mold 10, the circuit pattern region 11 is formed by a plurality of grooves 111 recessed on the surface of the mold 10, during the injection molding of the mold 10 to form a substrate 30, a plurality of protrusions 31 are formed on the surface of the substrate 30, the plurality of protrusions 31 form the circuit pattern region 11, during the mold drawing process, the protrusions are drawn, as shown in fig. 2, during the mold drawing process, the ends of the protrusions 31 are pressed to form barbs, so that a rough structure is formed, and the barbs are beneficial to holding substances, so that when a metal layer is plated on the circuit pattern region 11 on the substrate 30, the bonding force between the metal layer and the substrate 30 can be improved, and the quality of a product is improved.
For example, in one case, the pattern of the circuit pattern area 11 on the substrate 30 is formed by burrs protruding from the surface of the substrate 30, and under the condition that a drawing die is pulled, tips of the burrs form a barb shape, so as to achieve the purpose of roughening the surface of the substrate 30, for example, in one case, the surface of the substrate 30 and colloidal palladium have a larger contact surface, so that the subsequent plating layer is formed conveniently, and the adhesion force of the plating layer is improved, and meanwhile, because the substrate 30 is prepared by adopting a die 10 molding mode, the rough circuit pattern area 11 is formed on the substrate 30 while the substrate 30 is formed by demolding, so that the traditional step of obtaining the circuit pattern area 11 by using a laser method and the step of roughening the substrate 30 by an additional roughening step are reduced, the process steps are greatly simplified, the processing speed is improved, and the cost is reduced.
In particular, the conventional substrate 30 is required to undergo the following steps in forming the metal plating layer: degreasing, coarsening, sensitizing, activating and chemical plating. The roughening is to make the surface of the base material 30 in a micro-rough state, increase the contact surface between the plating layer and the base material 30, and improve the bonding strength between the substrate and the metal plating layer. This application has realized the alligatoring through the defect of drawing die strain when forming substrate 30, has simplified the process step to the structure of alligatoring forms similar hook, when the sensitization, can firmly grasp colloid palladium, avoids colloid palladium's loss, is favorable to forming abundant active center, plates even metal level.
As shown in fig. 3, which is a schematic view of a mold 10, a circuit pattern region 11 is formed by a plurality of grooves 111 recessed on a surface of the mold 10, and the plurality of grooves 111 are disposed according to a predetermined routing path, so as to form the circuit pattern region 11.
Further, as shown in fig. 4 to 8, the step of preparing the circuit pattern region 11 on the mold 10 includes preparing the circuit wiring groove protrusion 13 on the mold 10 and disposing the circuit pattern region 11 on the circuit wiring groove protrusion 13 to form the circuit wiring groove 33 on the base material 30, the circuit pattern region 11 being formed on the bottom of the circuit wiring groove 33.
That is, the mold 10 is formed with the circuit wiring groove protrusion 13, and the circuit pattern region 11 is disposed on the circuit wiring groove protrusion 13 such that the circuit wiring groove 33 is formed on the base material 30 injection-molded by the mold 10, and the circuit pattern region 11 is formed at the bottom of the circuit wiring groove 33. Thus, the circuit wiring grooves 33 are simultaneously formed on the surface of the substrate 30, and the roughening is simultaneously realized in the circuit wiring grooves 33. The specific principle is that in the process of injection molding the mold 10 to form the substrate 30, the circuit wiring groove protrusions 13 on the mold 10 form the circuit wiring grooves 33 on the surface of the substrate 30, as shown in fig. 7 and 8, a plurality of protrusions 31 at the bottom of the circuit wiring grooves 33 are pulled by a drawing die to form a barb shape in the drawing process, and the barb shape is bent towards the bottom direction of the circuit wiring grooves 33 to achieve the purpose of coarsening, so that colloidal palladium filled in the circuit wiring grooves 33 is fixed conveniently in the sensitization stage, the circuit wiring grooves 33 on the substrate 30 and the colloidal palladium have larger contact surfaces, subsequent plating layers are formed conveniently, and the adhesion force of the plating layers is improved. Meanwhile, the substrate 30 is prepared in a mold forming mode, the circuit wiring groove 33 is formed, and the circuit wiring groove 33 has a certain depth, so that the thickness of the metal layer can be controlled more accurately.
As shown in fig. 2, the circuit wiring groove 33 has a narrow groove bottom and a wide groove opening, and one operation of generating the die pull is: in the process of drawing the die, firstly, the die 10 is lifted vertically upwards, then the die 10 is moved in the horizontal direction, one side edge of the protrusion 13 of the circuit wiring groove is close to one groove wall of the circuit wiring groove 33, the die 10 is moved along the groove wall of the circuit wiring groove 33, so that the die 10 is drawn out, the protrusion 31 of the groove bottom is extruded at the moment, when the die 10 is translated along the horizontal direction, the top end part of the die can be extruded to form a barb shape as shown in the figure, the included angle range between the groove side wall of the circuit wiring groove 33 and the vertical direction is a, and a is more than or equal to 2 degrees and less than or equal to 90 degrees, so that under the condition of a certain inclined angle, when the side edge of the protrusion 13 of the circuit wiring groove of the die 10 is drawn out along the groove side wall, the protrusion 31 of the groove bottom can form the barb shape structure.
Further, in the step of preparing the circuit pattern region 11 on the mold 10, the circuit pattern region 11 is prepared on the mold 10 by using an etching process.
The method for forming the circuit pattern region 11 on the mold 10 includes laser engraving, chemical etching, and the like. For example, by adopting the etching process, the etching method is to shield the part which does not need to be etched on the die 10, and then coat a chemical reagent to etch, so as to etch the circuit pattern area 11. As shown in fig. 3 and 4, the grooves 111 on the mold 10 are etched out by a texturing process.
Further, the step of injection molding the substrate 30 by using the mold 10 further includes forming the circuit pattern region 11 on the substrate 30 by using a laser method when a structurally complicated portion, which cannot form the circuit pattern region 11 by an injection molding process, is formed on the substrate 30.
Further, in the step of forming the substrate 30 by injection molding using the mold 10, the raw material for preparing the substrate 30 is a plastic material, a glass material, a silica gel material, a ceramic material, or a laser-activated material.
For example, a plastic material, which may be a thermoplastic or a thermoset. The thermoplastic plastic may be at least one of polyvinyl chloride (PVC), polyethylene terephthalate (PET), acrylonitrile-styrene-butadiene copolymer (ABS), Polycarbonate (PC), Polyimide (PI), Liquid Crystal Polymer (LCP), Polyetherimide (PEI), polyphenylene sulfide (PPS), Polystyrene (PS), glycol-modified polyester, and polypropylene (PP); the thermosetting plastic may be any of epoxy resin, phenol resin (PF), thermosetting Polyurethane (PU), and silicone resin. In some embodiments, the substrate may be preferably selected from Polycarbonate (PC), acrylonitrile-styrene-butadiene copolymer (ABS), or an alloy mixture of Polycarbonate (PC) and acrylonitrile-styrene-butadiene copolymer (ABS) (PC + ABS).
The specific substrate material in this application is not limited, as long as the material that can form the substrate by mold molding is within the scope of this application.
Further, when the raw material of the substrate is a glass material, the glass material is melted and softened for the second time, the softened glass material is shaped by the mold 10 to form a glass substrate, and a drawing flaw is formed on the glass substrate in the process of drawing, so that a rough circuit pattern region 11 is formed on the glass substrate. That is, the glass material is used as the substrate material, the mold 10 is prepared by the above method, and the mold 10 is used to form a draw on the glass substrate, so that the rough circuit pattern region 11 is formed on the glass substrate, and the metal layer is formed on the rough circuit pattern region 11, so that the glass substrate and the metal layer have good bonding force.
Further, when the raw material of the substrate is a ceramic material, in the process of plasticity of the ceramic material blank, the blank is shaped by using the mold 10 to form a ceramic substrate, and in the process of drawing, a drawing scratch is formed on the ceramic substrate, so that a rough circuit pattern area 11 is formed on the ceramic substrate. That is, the ceramic material is used as the substrate material, the mold 10 is prepared by the above method, and the mold 10 is used to form the pattern drawing damage on the ceramic substrate, so that the rough circuit pattern region 11 is formed on the ceramic substrate, and the metal layer is formed on the rough circuit pattern region 11, so that the ceramic substrate and the metal layer have good bonding force.
Further, after the step of injection-molding the base material 30 using the mold 10 and forming the pattern drawing scratches on the circuit pattern regions 11 on the base material 30 during the pattern drawing process to form the rough circuit pattern regions 11 on the base material 30, the base material 30 after the pattern drawing scratches may be subjected to the roughening treatment. .
That is, the roughening is to make the surface of the base material 30 to be in a micro-rough state, increase the contact surface between the plating layer and the base material 30, and improve the bonding strength between the base material 30 and the metal plating layer; the substrate 30 is again roughened to further improve the subsequent bonding capability of the colloidal palladium.
Further, after the base material 30 is formed by injection molding using the mold 10 and the circuit pattern region 11 on the base material 30 is subjected to pattern drawing in the process of pattern drawing to form the rough circuit pattern region 11 on the base material 30, the method further comprises performing a first electroless plating on the rough circuit pattern region 11 to attach a conductive metal layer thereto.
For example, the rough circuit pattern region 11 is subjected to degreasing and roughening treatment before the first electroless plating, wherein the degreasing is performed using an alkaline or acidic degreasing liquid, and the roughening is performed using an acidic strong oxidizer roughening liquid.
In the case of ABS, the formula of the roughening solution comprises: 800-1000 g-dm -3 Concentrated H 2 SO 4 、10-30g·dm -3 CrO of (2) 3 And 200- -3 H of (A) to (B) 2 O; in the case that the plastic is polyethylene plastic, the formula of the roughening solution comprises: 800-1000 g-dm -3 Concentrated H of 2 SO 4 、35-60g·dm -3 CrO of (2) 3 And 200- -3 H of (A) to (B) 2 O。
The roughening method may be physical roughening and chemical roughening or a comprehensive method. The specific manner is not limited.
Further, in the step of performing the first electroless plating, the method further comprises sensitizing and activating the rough circuit pattern region 11, wherein the sensitizing uses a sensitizing solution to make the surface of the circuit pattern region 11 adsorb metal ions with strong reducibility, and the activating uses an activating solution to make the surface of the circuit pattern region 11 deposit a layer of metal particles with catalytic activity, so as to promote the conductive metal ions in the electroless plating to perform reduction action and rapidly deposit the conductive metal ions on the surface, wherein the metal ions with reducibility are used for reducing the metal ions in the activating solution to generate the metal particles with catalytic activity.
Sensitization treatment (acidic stannous oxide solution can be used) can make the roughened surface of the circuit pattern region 11 adsorb a metal ion (such as Sn) with stronger reducibility 2+ ) For reducing metal ions (e.g., Ag +) in an activation solution. The activation process is to deposit a layer of metal particles with catalytic activity on the surface of the circuit pattern region 11 to form catalytic centers, which promote the conductive metal ions (such as Cu) in the electroless plating 2+ ) Reduction takes place at this catalytic center.
The purpose of the chemical sensitization step is to form an adsorption film layer on the surface of the rough circuit pattern region 11 to increase adsorbability on the surface of the substrate 30, thereby ensuring uniform chemical activation of the surface of the substrate 30.
Before the step of chemical activation, the method further comprises the step of washing the substrate 30 formed by drawing with water to remove stains on the surface of the substrate 30, so as to increase the hydrophilicity of the surface of the substrate 30, thereby ensuring that the surface of the substrate 30 can be uniformly chemically activated. Specifically, the substrate 30 may be placed in pure water, and then subjected to an oscillation treatment by an ultrasonic technique for a predetermined time to meet the production standard.
Specifically, the step of chemically sensitizing the extracted substrate 30 is provided after the step of washing the extracted substrate 30 with water. In addition, after the steps of chemical sensitization and chemical activation, a water washing step should be performed. When water washing is performed after chemical sensitization, as shown in fig. 2, since the rough circuit pattern region 11 has a barb-like structure, the adsorption film layer formed by sensitization is caught by the barb-like structure to avoid being washed away in the water washing process, thereby increasing the content of the adsorption film layer and facilitating the subsequent activation step.
In the step of performing the activation treatment, a first metal layer is formed in the rough circuit pattern region 11 by the activation step.
Further, the activation step is a chemical activation method to perform chemical activation on the rough circuit pattern region 11 to form a first metal layer on the surface of the rough circuit pattern region 11.
For example, the substrate 30 having the rough circuit pattern region 11 formed thereon is put into a chemical activation solution to chemically activate and form a first metal layer on the surface of the rough circuit pattern region 11, so as to deposit a second metal layer on the surface of the first metal layer. In one embodiment, the first metal layer may be, but is not limited to, a palladium-containing metal adsorption layer, and correspondingly, the chemical activation solution is a palladium-containing activation solution to chemically form a colloidal palladium-containing metal adsorption layer adsorbed on the surface of the rough circuit pattern region 11.
Furthermore, the electroplating has the advantages of higher speed, better selectivity and the like compared with chemical plating, and the trouble of beneficial plating is avoided; however, electroplating also has many environmental requirements, such as the need for the body to be plated to be conductive. When the first metal layer is a tin layer, the activated material has metal characteristics but has high resistance between conducting and non-conducting, and firstly, the ohmic contact is introduced, so that the voltage can only be increased when the electroplating current is kept unchanged, and the specific voltage is determined according to the resistance and can be adjusted within the range from 12v to 15 kv.
Or, when the raw material of the base material 30 is a laser activated material, the activation step is a laser activation method, and the laser-activated material is activated to release metal particles after laser irradiation, so as to form the first metal layer.
The three-dimensional circuit manufactured by the process not only simplifies the process steps, but also has a more stable plating layer structure.
The application further provides a three-dimensional circuit which is manufactured by the coarsening process method of the mold forming, and as the coarsening process of the mold forming adopts all the technical schemes of all the embodiments, all the beneficial effects brought by the technical schemes of the embodiments are at least achieved, and are not repeated one by one.
The application also provides an electronic device, which comprises the stereo circuit. Since the stereo circuit adopts all the technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here.
The above is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the specification and the drawings, or any other related technical fields directly/indirectly using the inventive concept are included in the scope of the present invention.
Claims (10)
1. The coarsening process for the mold forming is characterized by comprising the following steps of:
preparing and forming a circuit pattern area (11) on the mold (10), wherein the circuit pattern area (11) is a rough structure formed on the surface of the mold (10) and etched with a circuit pattern;
and (2) forming a base material (30) by injection molding by using the mold (10), and forming a pattern drawing scratch on the circuit pattern area (11) on the base material (30) in the process of drawing so as to form the rough circuit pattern area (11) on the base material (30).
2. The roughening process for mold forming according to claim 1, wherein the step of preparing a circuit pattern region (11) on said mold (10) comprises preparing a circuit wiring groove protrusion (13) on said mold (10) and disposing said circuit pattern region (11) on said circuit wiring groove protrusion (13) to form a circuit wiring groove (33) on said base material (30), said circuit pattern region (11) being formed at a bottom of said circuit wiring groove (33).
3. The roughening process for mold formation according to claim 1, wherein in the step of forming a circuit pattern region (11) on the mold (10), the circuit pattern region (11) is formed on the mold (10) by an etching process.
4. The roughening process for mold forming according to claim 1, wherein in the step of injection molding the substrate (30) with said mold (10), further comprising forming said circuit pattern region (11) on said substrate (30) by laser when a structurally complicated portion of said substrate (30) which cannot form said circuit pattern region (11) by said injection molding process is formed.
5. The roughening process for mold forming according to claim 1, wherein in the step of injection molding the substrate (30) with the mold (10), the raw material for preparing the substrate (30) is a plastic material, a glass material, a silicone material, a ceramic material or a laser-activated material.
6. The roughening process for mold forming according to claim 5, wherein when the base material is made of a glass material, the glass material is melted and softened for a second time, the mold (10) shapes the softened glass material to form a glass base material, and a draw damage is formed on the glass base material during a drawing process to form the roughened circuit pattern region (11) on the glass base material;
or, when the raw material of the base material is a ceramic material, in the process of plasticity of the ceramic material blank, the blank is shaped by using the die (10) to form a ceramic base material, in the process of drawing, drawing strain is formed on the ceramic base material, and the rough circuit pattern area (11) is formed on the ceramic base material.
7. The roughening process for mold forming according to any one of claims 1 to 6, wherein after injection molding a substrate (30) with said mold (10) and forming a pattern drawing scratch on a circuit pattern region (11) on said substrate (30) during a pattern drawing process to form a roughened circuit pattern region (11) on said substrate (30), a first electroless plating is performed on said roughened circuit pattern region (11) to attach a conductive metal layer thereto.
8. The roughening process for mold forming according to claim 7, further comprising performing a sensitization and an activation treatment on the roughened circuit pattern region (11) in the first electroless plating step, wherein the sensitization treatment uses a sensitizing solution to make the surface of the circuit pattern region (11) adsorb metal ions with strong reducibility, and the activation treatment uses an activation solution to make the surface of the circuit pattern region (11) deposit a layer of metal particles with catalytic activity, so as to promote the reduction of conductive metal ions in the electroless plating to rapidly deposit the conductive metal ions on the surface, wherein the metal ions with reducibility are used for reducing the metal ions in the activation solution to generate the metal particles with catalytic activity.
9. A three-dimensional circuit, wherein the three-dimensional circuit is manufactured by the roughening process of the mold forming according to any one of claims 1 to 8.
10. An electronic device, characterized in that it contains the stereoscopic circuit of claim 9.
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| CN202210436313.6A CN114828417A (en) | 2022-04-22 | 2022-04-22 | Coarsening process for mold forming, three-dimensional circuit and electronic equipment |
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| CN202210436313.6A CN114828417A (en) | 2022-04-22 | 2022-04-22 | Coarsening process for mold forming, three-dimensional circuit and electronic equipment |
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| US4867839A (en) * | 1987-09-04 | 1989-09-19 | Shinko Electric Industries Co., Ltd. | Process for forming a circuit substrate |
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