CN216980992U

CN216980992U - Nano-SIM card connector with stable structure

Info

Publication number: CN216980992U
Application number: CN202123416670.6U
Authority: CN
Inventors: 古仕平; 朱明英
Original assignee: Dongguan Yanzhan Automation Technology Co ltd
Current assignee: Dongguan Yanzhan Automation Technology Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-07-15
Anticipated expiration: 2031-12-31

Abstract

The utility model discloses a Nano-SIM card connector with a stable structure, which comprises an insulating body, a plurality of first terminals and a plurality of second terminals, wherein the insulating body is provided with a plurality of first terminals; the insulation body is provided with a containing groove for containing a Nano-SIM card, a plurality of first terminal grooves and a plurality of second terminal grooves are formed in the bottom surface of the containing groove, each first terminal groove and each second terminal groove penetrate through the bottom surface of the insulation body, the insulation body comprises an inner main body layer and an outer coating layer, the inner main body layer is made of plastic materials, the outer coating layer is made of carbon fiber materials, and the outer coating layer coats the outer surface of the inner main body layer; through constituting insulator design by interior subject layer and outer cladding layer to the subject layer is the plastic material in the cooperation, and outer cladding layer is carbon fiber material, with the holistic structural strength of effective reinforcing product, and the product is not fragile, thereby has prolonged the life of product greatly, offers convenience for the use.

Description

Nano-SIM card connector with stable structure

Technical Field

The utility model relates to the technical field of card connectors, in particular to a Nano-SIM card connector with a stable structure.

Background

The Nano-SIM card is also called as a fourth form factor integrated circuit board, and is a new generation of SIM card for mobile phones. It is smaller and thinner than the micro-SIM cards being used. Apple and nokia have competed for the design standard of Nano-SIM cards and submitted the design solution 3 months 2012, awaiting voting by the european telecommunications standards institute. 13/9/2012, the Nano-SIM card was purchased by the domestic operator and first marketed on 21/9/2012.

The Nano-SIM card is a Micro SIM card of a mobile phone, is smaller than a Micro-SIM card, has an area of 60 percent of that of a first-generation SIM card, has specific dimensions of 12mm x 9mm, and has a thickness reduced by 15 percent. The Nano-SIM card aims to replace the Micro-SIM card installed on an IPhone mobile phone, and its smaller size will release space for increased memory and larger batteries and denser motherboard layout, helping mobile phone manufacturers to produce thinner and lighter products.

The use of the Nano-SIM card needs to be matched with a Nano-SIM card connector, the main structure of the current Nano-SIM card connector mainly comprises an insulating body and a plurality of terminals fixed on the insulating body, the whole insulating body in the prior art is made of plastic materials, the structure is thin, the strength is weak, the connector is easy to damage, and the service life of the product is short. Therefore, there is a need for an improvement of the current Nano-SIM card connector.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention is directed to the defects in the prior art, and the main object of the present invention is to provide a Nano-SIM card connector with a stable structure, which can effectively solve the problem of weak structural strength of the conventional Nano-SIM card connector.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a structure-stable type Nano-SIM card connector comprises an insulating body, a plurality of first terminals and a plurality of second terminals; the insulation body is provided with a containing groove for containing a Nano-SIM card, a plurality of first terminal grooves and a plurality of second terminal grooves are formed in the bottom surface of the containing groove, each first terminal groove and each second terminal groove penetrate through the bottom surface of the insulation body, the insulation body comprises an inner main body layer and an outer coating layer, the inner main body layer is made of plastic materials, the outer coating layer is made of carbon fiber materials, and the outer coating layer coats the outer surface of the inner main body layer; the first terminals and the second terminals are fixed with the insulating body in an embedding forming mode, the contact portions of the first terminals are respectively suspended in the corresponding first terminal grooves and extend into the accommodating groove, and the contact portions of the second terminals are respectively suspended in the corresponding second terminal grooves and extend into the accommodating groove.

Preferably, the first terminal groove and the second terminal groove are three and are arranged side by side at intervals, the second terminal groove is located behind the first terminal groove, and correspondingly, the first terminal and the second terminal are three.

As a preferred scheme, a third terminal groove is formed in the bottom surface of the accommodating groove, the third terminal groove penetrates through the bottom surface of the insulating body, the third terminal groove is located on the rear side edge of the accommodating groove, a switch terminal is fixedly embedded and formed on the insulating body, and a contact portion of the switch terminal is suspended in the third terminal groove and extends into the accommodating groove.

As a preferred scheme, a plurality of blanking holes are formed in the bottom surface of the accommodating groove, the plurality of blanking holes penetrate through the bottom surface of the insulating body, the plurality of first terminals are connected with the plurality of second terminals in an integrated forming mode through a plurality of connecting portions respectively, and the plurality of connecting portions are located in the corresponding blanking holes respectively, so that the connecting portions can be cut off during production and manufacturing.

Preferably, the soldering portions of the first terminals and the soldering portions of the second terminals are spaced side by side and horizontally extend backward from the rear side of the insulating body.

As a preferable scheme, a Y-shaped through groove is formed on the contact portion of the first terminal, two first contacts and a second contact are formed on the contact portion of the first terminal, the second contact is located between the two first contacts, and the height of the second contact is higher than that of the two first contacts, so that the contact is more stable and reliable.

Compared with the prior art, the utility model has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:

through with insulator design for constitute by interior main part layer and outer cladding layer to main part layer is the plastic material in the cooperation, and outer cladding layer is carbon fiber material, with the holistic structural strength of effective reinforcing product, and the product is not fragile, thereby has prolonged the life of product greatly, offers convenience for the use.

To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

Drawings

FIG. 1 is an assembled perspective view of the preferred embodiment of the present invention;

FIG. 2 is an assembled perspective view of another angle of the preferred embodiment of the present invention;

FIG. 3 is an exploded view of the preferred embodiment of the present invention;

FIG. 4 is a cross-sectional view of a preferred embodiment of the present invention.

The attached drawings indicate the following:

10. insulating body 11, inner body layer

12. Outer cladding 101, receiving groove

102. First terminal groove 103 and second terminal groove

104. Third terminal groove 105, blanking hole

20. First terminal 21, contact part

211. First contact 212, second contact

22. Welding part 201, Y-shaped through groove

30. Second terminal 31, contact portion

32. Welding part 40 and switch terminal

41. A contact part 100 and a material connecting part.

Detailed Description

Referring to fig. 1 to 4, a specific structure of a preferred embodiment of the present invention is shown, which includes an insulating body 10, a plurality of first terminals 20, a plurality of second terminals 30, and a switch terminal 40.

The insulating body 10 is provided with a containing groove 101 for containing a Nano-SIM card, the bottom surface of the containing groove 101 is provided with a plurality of first terminal grooves 102 and a plurality of second terminal grooves 103, each first terminal groove 102 and each second terminal groove 103 penetrate through the bottom surface of the insulating body 10, the insulating body 10 comprises an inner main body layer 11 and an outer coating layer 12, the inner main body layer 11 is made of plastic materials, the outer coating layer 12 is made of carbon fiber materials, so that the structural strength of a product is effectively enhanced, and the outer coating layer 12 coats the outer surface of the inner main body layer 11; in this embodiment, the first terminal slot 102 and the second terminal slot 103 are three slots arranged side by side at intervals, and the second terminal slot 103 is located behind the first terminal slot 102; a third terminal groove 104 is formed in the bottom surface of the accommodating groove 101, the third terminal groove 104 penetrates through the bottom surface of the insulating body 10, and the third terminal groove 104 is located on the rear side edge of the accommodating groove 101; and a plurality of blanking holes 105 are formed in the bottom surface of the accommodating groove 101, the plurality of blanking holes 105 penetrate through the bottom surface of the insulating body 10, and the number of the blanking holes 105 is three, and the three blanking holes are arranged side by side at intervals.

The first terminals 20 and the second terminals 30 are fixed to the insulating body 10 by insert molding, the contact portions 21 of the first terminals 20 are respectively suspended in the corresponding first terminal grooves 102 and extend into the receiving groove 101, and the contact portions 31 of the second terminals 30 are respectively suspended in the corresponding second terminal grooves 103 and extend into the receiving groove 101. In the present embodiment, the first terminals 20 and the second terminals 30 are three; the contact portion 21 of the first terminal 20 is provided with a Y-shaped through slot 201, the contact portion 21 of the first terminal 20 is provided with two first contacts 211 and a second contact 212, the second contact 212 is located between the two first contacts 211, and the height of the second contact 212 is higher than the height of the two first contacts 211, so that the contact is more stable and reliable; the plurality of first terminals 20 are integrally connected to the plurality of second terminals 30 through a plurality of connecting portions 100, and the plurality of connecting portions 100 are respectively located in the corresponding blanking holes 105, so that the connecting portions 100 are cut away during manufacturing. And the soldering portions 22 of the plurality of first terminals 20 and the soldering portions 32 of the plurality of second terminals 30 are horizontally and rearwardly protruded out of the rear side of the insulative housing 10 at a side-by-side interval.

The contact portion 41 of the switch terminal 40 is suspended in the third terminal slot 104 and extends into the receiving slot 101, and the switch terminal 40 is used for detecting whether the Nano-SIM card is inserted in place.

Detailed description the manufacturing process of this embodiment is as follows:

firstly, a plurality of first terminals 20, a plurality of second terminals 30 and a switch terminal 40 are formed by punching, the plurality of first terminals 20 are connected with the plurality of second terminals 30 through a plurality of connecting parts 100 in an integrated forming mode, the switch terminal 40 is connected with one of the connecting parts 100, and thus a metal support is formed; then, placing the metal bracket into an injection mold to form the inner main body layer 11 through injection molding; then, covering the inner main body layer 11 with carbon fiber cloth, and heating and curing to form an outer cladding layer 12, so that the outer cladding layer 12 completely covers the inner main body layer 11 to enhance the overall structural strength of the product; then, the connecting portion 100 is cut off through the blanking hole 105 by a punch of an external punching mechanism, and the rest of the material tape is cut off, and finally, a shell (not shown) is fastened on the insulating body 10 to obtain a finished product.

The design of the utility model is characterized in that: through with insulator design for constitute by interior main part layer and outer cladding layer to main part layer is the plastic material in the cooperation, and outer cladding layer is carbon fiber material, with the holistic structural strength of effective reinforcing product, and the product is not fragile, thereby has prolonged the life of product greatly, offers convenience for the use.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.

Claims

1. The utility model provides a structure firm type Nano-SIM card connector which characterized in that: the circuit comprises an insulating body, a plurality of first terminals and a plurality of second terminals; the insulation body is provided with a containing groove for containing a Nano-SIM card, a plurality of first terminal grooves and a plurality of second terminal grooves are formed in the bottom surface of the containing groove, each first terminal groove and each second terminal groove penetrate through the bottom surface of the insulation body, the insulation body comprises an inner main body layer and an outer coating layer, the inner main body layer is made of plastic materials, the outer coating layer is made of carbon fiber materials, and the outer coating layer coats the outer surface of the inner main body layer; the first terminals and the second terminals are fixed with the insulating body in an embedding forming mode, the contact portions of the first terminals are respectively suspended in the corresponding first terminal grooves and extend into the accommodating groove, and the contact portions of the second terminals are respectively suspended in the corresponding second terminal grooves and extend into the accommodating groove.

2. The structurally sound Nano-SIM card connector of claim 1, wherein: the first terminal groove and the second terminal groove are three and are arranged side by side at intervals, the second terminal groove is located behind the first terminal groove, and correspondingly, the first terminal and the second terminal are three.

3. The structurally sound Nano-SIM card connector of claim 2, wherein: the bottom surface of the accommodating groove is provided with a third terminal groove, the third terminal groove penetrates through the bottom surface of the insulating body, the third terminal groove is positioned on the rear side edge of the accommodating groove, a switch terminal is fixed on the insulating body in an embedding and forming mode, and a contact part of the switch terminal is suspended in the third terminal groove and extends into the accommodating groove.

4. The structurally sound Nano-SIM card connector of claim 1, wherein: the bottom surface of the accommodating groove is provided with a plurality of blanking holes, the plurality of blanking holes penetrate through the bottom surface of the insulating body, the plurality of first terminals are connected with the plurality of second terminals in an integrated forming mode through a plurality of material connecting portions respectively, and the plurality of material connecting portions are located in the corresponding blanking holes respectively.

5. The structurally sound Nano-SIM card connector of claim 1, wherein: the welding parts of the first terminals and the welding parts of the second terminals horizontally and backwards extend out of the rear side of the insulating body at intervals side by side.

6. The structurally sound Nano-SIM card connector of claim 1, wherein: the contact part of the first terminal is provided with a Y-shaped through groove, the contact part of the first terminal is provided with two first contacts and a second contact, the second contact is positioned between the two first contacts, and the height of the second contact is higher than that of the two first contacts.