CN114822941A - Lead assembly, preparation method thereof, display panel assembly and electronic equipment - Google Patents

Lead assembly, preparation method thereof, display panel assembly and electronic equipment Download PDF

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Publication number
CN114822941A
CN114822941A CN202110081759.7A CN202110081759A CN114822941A CN 114822941 A CN114822941 A CN 114822941A CN 202110081759 A CN202110081759 A CN 202110081759A CN 114822941 A CN114822941 A CN 114822941A
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China
Prior art keywords
flexible substrate
wire
wire assembly
stress
body portion
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CN202110081759.7A
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Chinese (zh)
Inventor
周黎斌
毛学
任竹运
台冰雨
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Priority to CN202110081759.7A priority Critical patent/CN114822941A/en
Publication of CN114822941A publication Critical patent/CN114822941A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application provides a lead assembly, a preparation method thereof, a display panel assembly and an electronic device. The wire assembly of the embodiment of the application comprises: a flexible substrate; the stress release parts are arranged on one side of the flexible substrate at intervals; and the conducting wire covers the surfaces and the side faces of the stress release parts, which are far away from the flexible substrate, and gaps between the adjacent stress release parts. The wire assembly of the embodiment of the application has better bending resistance and can better prevent stress concentration in the bending process.

Description

Lead assembly, preparation method thereof, display panel assembly and electronic equipment
Technical Field
The application relates to the field of electronics, in particular to a lead assembly, a preparation method of the lead assembly, a display panel assembly and electronic equipment.
Background
In the conventional display panel, in order to realize full-screen display of a screen, a display area occupies the surface of the whole device as much as possible, a circuit board of the display panel is usually arranged on a non-display surface of the display area, and the display area is electrically connected with the circuit board through a wire.
Disclosure of Invention
To the above problem, the present application provides a wire assembly, which has better bending resistance and can better prevent stress concentration during bending.
The embodiment of the application provides a wire assembly, it includes:
a flexible substrate;
the stress release parts are arranged on one side of the flexible substrate at intervals; and
and the conducting wire covers the surface and the side surface of the stress release parts, which are far away from the flexible substrate, and gaps between the adjacent stress release parts.
Optionally, the stress relief portion includes a body portion and a protrusion portion disposed on the body portion away from the flexible substrate, and the body portion is disposed closer to the flexible substrate than the protrusion portion.
Optionally, the width of the body portion is larger than the width of the protrusion portion in the arrangement direction of the stress relief portions.
Optionally, the body portion and the protrusion portion are of a unitary structure.
Optionally, the stress relief portion further comprises an isolation portion between the body portion and the flexible substrate.
Optionally, in the arrangement direction of the stress relief portions, the width of the isolation portion near the main body portion is equal to the width of the main body portion near the isolation portion.
Optionally, the conductive wire is patterned to release stress generated when the conductive wire is bent.
Optionally, the wire assembly further comprises:
and the planarization layer is arranged on the surface of the lead wire, which is far away from the flexible substrate.
Optionally, the planarization layer, the body portion and the protrusion portion each comprise an organic material.
Optionally, when the wire assembly is bent, the stress release portion is configured to release stress generated by bending the wire assembly.
Based on the same inventive concept, the embodiment of the present application further provides a method for manufacturing a wire assembly, which includes:
forming a stress release layer on a flexible substrate;
etching the stress release layer to form a plurality of stress release parts which are arranged on the surface of one side of the flexible substrate at intervals;
covering a lead layer on the surface of the flexible substrate corresponding to the gaps between the adjacent stress release parts on the surface and the side surfaces of the stress release parts, which are away from the flexible substrate; and
and etching the lead layer to form a plurality of leads arranged at intervals, wherein the extending direction of the leads is intersected with the extending direction of the stress release parts, and the leads are patterned.
Based on the same inventive concept, embodiments of the present application further provide a display panel assembly, which includes: display panel, circuit board and this application the wire assembly, the wire assembly buckles respectively the electricity connect in display panel and circuit board.
Based on the same inventive concept, an embodiment of the present application further provides an electronic device, which includes: a wire assembly as described herein.
The wire assembly of this application embodiment is through setting up a plurality of stress release portions, lets the wire cover the surface and the side of a plurality of stress release portions to and the clearance between the adjacent stress release portion, when making the wire buckle, can be better release the stress on the wire, reduce the stress concentration when the wire buckles, reduce the wire and buckle the in-process or be in cracked probability when buckling the state for a long time, improve the life of wire assembly. In addition, when the lead assembly is applied to the electronic equipment, poor contact caused by lead fracture can be better prevented, the service life of the electronic equipment is prolonged, and the repair cost of the electronic equipment is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a wire guide assembly according to an embodiment of the present application.
Figure 2 is a top view of the wire assembly of the embodiment of figure 1 of the present application.
Fig. 3 is a schematic structural diagram of a lead assembly according to yet another embodiment of the present application.
Figure 4 is a schematic view of the lead assembly as it is being straightened.
Figure 5 is a schematic view of the forces applied when the lead assembly is bent.
Fig. 6 is a schematic diagram of the stress of the wire assembly when being bent according to the embodiment of the present application.
Fig. 7 is a schematic structural diagram of a display panel assembly according to an embodiment of the present application.
Fig. 8 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
Detailed Description
In order to make the technical solutions of the present application better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.
It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity.
Referring to fig. 1, the present application provides a wire assembly 100, which includes: a flexible substrate 10; a plurality of stress relief parts 30, wherein the stress relief parts 30 are arranged at intervals on one side of the flexible substrate 10; and the conducting wire 50 covers the surface and the side surface of the stress relieving parts 30, which face away from the flexible substrate 10, and the gaps between the adjacent stress relieving parts 30, wherein the conducting wire 50 covers the surfaces and the side surfaces of the stress relieving parts 30. The stress relief portion 30 is used to relieve stress generated by bending the wire assembly 100 when the wire assembly 100 is bent.
As shown in fig. 1, in an embodiment, a plurality of stress relief portions 30 are disposed at intervals on a side surface of the flexible substrate 10, and a conductive line 50 covers a surface and a side surface of the stress relief portions 30 facing away from the flexible substrate 10 and a surface of the flexible substrate 10 between adjacent stress relief portions 30. In other embodiments, other insulating layers or functional layers may be disposed between the flexible substrate 10 and the stress relief portions 30.
Alternatively, the substrate 10 may be a glass substrate, a substrate in which a polyimide (P I) flexible substrate is deposited on a glass substrate, or the like.
The lead assembly 100 of the embodiment of the application is through setting up a plurality of stress release portions 30, let the surface and the side of a plurality of stress release portions 30 of lead 50 cover, and the clearance between the adjacent stress release portions 30, when making lead 50 buckle, can be better release the stress on lead 50, reduce the stress concentration when lead 50 buckles, reduce the cracked probability when lead 50 buckles in-process or is in the state of buckling for a long time, improve the life of lead assembly 100. In addition, when the lead assembly 100 is applied to an electronic device, poor contact caused by the breakage of the lead 50 can be better prevented, the service life of the electronic device is prolonged, and the repair cost of the electronic device is reduced.
In some embodiments, the stress relief portion 30 includes a body portion 31 and a protrusion portion 33 disposed on the body portion 31 away from the flexible substrate 10, and the body portion 31 is disposed closer to the flexible substrate 10 than the protrusion portion 33.
In some embodiments, the body portion 31 and the protrusion portion 33 are a unitary structure; in other words, the body portion 31 and the protrusion portion 33 are formed in the same process. In other embodiments, the body portion 31 and the protrusion portion 33 are two connected components, that is, the body portion 31 and the protrusion portion 33 can be formed in different processes.
Alternatively, the body portion 31 and the protrusion portion 33 are formed by coating, etching, or the like on an organic material, in other words, the body portion 31 and the protrusion portion 33 include the organic material. Alternatively, the organic material may be, but is not limited to, polymethyl methacrylate (PMMA, also known as acryl). The organic material has better telescopic performance, and the lead 50 is directly arranged on the organic material, so that the stress concentration of the lead 50 can be better avoided.
In some embodiments, the width of the body portion 31 is greater than the width of the protrusion portion 33 along the arrangement direction of the stress relief portions 30. In other words, the width of the body portion 31 is larger than the width of the protrusion portion 33 along the extending direction of the wire 50. Thus, the main body 31 and the protrusion 33 can form a step, which can better avoid stress concentration when the lead 50 is bent, and better avoid damage to the lead 50 caused by long-term stress concentration.
In some embodiments, the strain relief 30 further comprises a spacer 35, the spacer 35 being located between the body portion 31 and the flexible substrate 10. The partition 35 prevents water and oxygen from entering from the flexible substrate 10 side, so that the lead 50 is corroded by the water and oxygen, and the service life of the lead 50 is reduced.
In some embodiments, the width of the isolation portion 35 near the body portion 31 is equal to the width of the body portion 31 near the isolation portion 35 along the arrangement direction of the stress relief portions 30. In other words, along the extending direction of the lead 50, the width of the isolation portion 35 near the body portion 31 is equal to the width of the body portion 31 near the isolation portion 35. The isolation portion 35 is mostly made of inorganic material, the extension or the telescopic performance of the lead 50 made of inorganic material is poor, when the lead 50 is bent, the part attached to the inorganic material is easy to cause stress concentration, so that the lead 50 is easy to damage and break after being used for a period of time, and poor contact or short circuit is caused. The width of the isolation portion 35 close to the body portion 31 is equal to the width of the isolation portion 35 of the body portion 31, so that the contact area between the wires 50 and the isolation portion 35 can be reduced, the concentration portion can be reduced, and the service life of the wire assembly 100 can be prolonged.
Alternatively, the partition 35 is made of an inorganic material, in other words, the partition 35 includes an inorganic material. The inorganic material may be, but is not limited to, silicon oxide or silicon nitride, etc. The inorganic material can prevent the invasion of water and oxygen better, corrodes wire 50, and in addition, inorganic material has better adhesion property with wire 50, and partial wire 50 bonds with isolation 35, can be better prevent to buckle the in-process, and the phenomenon that dislocation or break away from appears in wire 50.
In some embodiments, the adhesion of the wire 50 on the isolation portion 35 is greater than the adhesion of the wire 50 on the body portion 31 and the protrusion portion 33. This can better prevent the wires 50 from being dislocated or separated during the bending process.
In some embodiments, the number of wires 50 is one or more. When the number of the conductive lines 50 is plural, the plural conductive lines 50 are arranged at intervals, and the extending direction of the conductive lines 50 intersects with the arrangement direction of the conductive lines 50. Optionally, the extending direction of the plurality of wires 50 intersects with the extending direction of the plurality of stress relief portions 30, so that the wires 50 better reduce the stress concentration of the wires 50.
Referring to fig. 2, in some embodiments, the conductive lines 50 are patterned to release stress generated when the conductive lines 50 are bent. In an embodiment, a plurality of through holes 51 are disposed at intervals in the extending direction of the conductive wire 50 to release the stress concentration on the conductive wire 50 when the conductive wire assembly 100 is bent. Alternatively, the shape of the through hole 51 may be one or more of a regular or irregular shape such as a circle, an ellipse, a polygon, a star, and the like.
In some embodiments, the width of the portion of the conductive line 50 where the through hole 51 is provided is greater than the width of the portion of the conductive line 50 where the through hole 51 is not provided, in a direction perpendicular to the extending direction of the conductive line 50, so that the stress concentration of the conductive line 50 can be better released by the portion of the through hole 51.
Referring to fig. 3, in some embodiments, the wire assembly 100 of the present application further includes: a planarization layer 70, wherein the planarization layer 70 is disposed on a surface of the conductive line 50 facing away from the flexible substrate 10.
In some embodiments, the planarization layer 70 is made of an organic material, in other words, the planarization layer 70 includes an organic material or the planarization layer 70 is an organic layer. When wire 50 both sides all are the organic layer, the stress difference that can be better avoid causing because of the material difference at wire 50 both sides to make wire 50 fracture easily, simultaneously, when wire 50 both sides were the organic layer, planarization layer 70 was better with stress relief portion 30's compatibility, and bonding that can be better is in the same place, prevents that wire 50 from buckling the in-process and appearing the dislocation.
Referring to fig. 4 to 6, fig. 4 is a schematic structural view of the current wire assembly 100 when being straightened, fig. 5 is a schematic view of a stress when the current wire assembly 100 is bent, and fig. 6 is a schematic view of a stress when the wire assembly 100 according to the embodiment of the present disclosure is bent. The following theoretical derivation proves that the wire assembly 100 of the embodiment of the present application can better reduce the stress concentration and release the stress.
Referring to fig. 5, when the lead assembly 100 is bent, the tensile stress F is generated 1 ＝f 0 ×(2πR 1 X δ -L), wherein f 0 Tensile stress per unit distance; r 1 Is the radius at which the wire 50 in the wire assembly 100 is bent; δ is the degree of bending of the wire 50, δ is 0 to 1, the greater the degree of bending, δ being greater, δ being 0.25 when bent by 90 °, δ being 1 when bent by 360 °; l is the length of the bent wire 50. Referring to fig. 6, when the wire assembly 100 of the present embodiment is bent, the tensile stress F thereof is shown 2 ＝f 0 ×[2π(R 2 +a)×δ-(L+na)]Thus R 1 ≈R 2 Thus, F 2 ＝F 1 A + (2 π δ -n) a, wherein f 0 Tensile stress per unit distance; r 2 Is the radius at which the wire 50 in the wire assembly 100 is bent; δ is the degree of bending of the wire 50, δ is 0 to 1, the greater the degree of bending, δ being greater, δ being 0.25 when bent by 90 °, δ being 1 when bent by 360 °; l is the length of the bent wire 50; a is the total thickness of the main body 31 and the protrusion 33; n is the number of stress relief portions 30. When bent by 90 deg., i.e. delta 0.25, make F 1 Greater than F 2 That is, when 2 pi δ -n < 0, n > 2 pi δ is 0.5 pi, and therefore, when the wire assembly 100 is bent by 90 °, the number of the stress relief portions 30 is only required to be 2 or more, which can reduce the stress concentration of the wire assembly 100 and improve the service life of the wire assembly 100.
Referring to fig. 5, when the lead assembly 100 is bent, the shear stress τ is generated 1 ＝F 3 /(πR 1 t 1 ) Wherein, τ 1 Shear stress at the center of the wire 50 during bending, F 3 Is the vertical stress of the conductor of FIG. 5, R 1 Is the radius, t, of the wire 50 in the wire assembly 100 when bent 1 Is the thickness of the wire 50 in the wire assembly 100. Referring to fig. 6, when the lead assembly 100 of the present embodiment is bent, the shear stress τ is generated 2 ＝F 4 /(πR 2 t 2 ) Wherein, τ 2 Shear stress at the center of the wire 50 during bending, F 4 Is the vertical stress of the conductive line of FIG. 6, R 2 Is the radius, t, of the wire 50 in the wire assembly 100 when bent 2 The thickness of the body 31, the boss 33 and the lead 50 is the same. F 3 ≈F 4 ，R 1 ≈R 2 ，t 1 Much less than t 2 Thus, τ 1 >τ 2 The shear stress experienced by the wire 50 in the wire assembly 100 of the present embodiment is much lower than that experienced by the wire 50 of the current design.
The embodiment of the present application further provides a method for manufacturing a wire assembly 100, which includes:
s201, forming a stress release layer on the flexible substrate 10;
specifically, an inorganic layer is formed on the surface of the flexible substrate 10; and forming an organic layer on the surface of the inorganic layer, which faces away from the flexible substrate 10, wherein the stress release layer comprises the inorganic layer and the organic layer which are arranged in a stacked manner.
S202, etching the stress release layer to form a plurality of stress release parts 30 which are arranged on one side surface of the flexible substrate 10 at intervals;
specifically, the organic layer and the inorganic layer are etched, so that the inorganic layer forms a plurality of spaced apart portions, the organic layer forms a plurality of spaced apart body portions 31 and protruding portions 33, and the stress relief layer forms a plurality of stress relief portions 30, wherein the stress relief portions 30 include the spaced apart portions, the body portions 31 and the protruding portions 33 which are stacked.
S203, covering a layer of conducting wires 50 on the surface of the flexible substrate 10 corresponding to the gaps between the adjacent stress relief portions 30 on the surface and the side surfaces of the stress relief portions 30 away from the flexible substrate 10; and
specifically, a conductive metal, a metal alloy, or the like is adopted to plate a lead 50 layer on the surface and the side surface of the flexible substrate 10 corresponding to the gap between the adjacent stress relief portions 30 on the surface and the side surface of the flexible substrate 10 away from the stress relief portions 30, so that the conductive layer covers the flexible substrate 10 corresponding to the gap between the main body portion 31 and the protrusion portion 33 away from the surface and the side surface of the flexible substrate 10, the side surface of the isolation portion 35, and the isolation portion 35.
S204, etching the layer of wires 50 to form a plurality of wires 50 arranged at intervals, wherein the extending direction of the plurality of wires 50 intersects with the extending direction of the plurality of stress relief portions 30, and the wires 50 are patterned.
In some embodiments, the method of making the wire assembly 100 of the embodiments of the present application further includes: a full-thickness planarization layer 70 is formed on the surface of the conductive lines 50 facing away from the flexible substrate 10.
Referring to fig. 7, an embodiment of the present invention further provides a display panel assembly 300, which includes: the display device includes a display panel 310, a circuit board 330, and a lead assembly 100 according to an embodiment of the present disclosure, wherein the lead assembly 100 is respectively bent and electrically connected to the display panel 310 and the circuit board 330.
The display panel 310 of the embodiment of the present application includes, but is not limited to, components having a display function, such as an organic light emitting diode display (OLED display), a light emitting diode display (LED display), a sub-millimeter light emitting diode display (Mi croLED display), a micro light emitting diode display (Mi i LED display), a liquid crystal display (LCD display), and a touch display panel.
Referring to fig. 8, an embodiment of the present application further provides an electronic device 400, which includes: the wire assembly 100 of the present embodiment.
The electronic device 400 of the present application includes, but is not limited to, devices with display function, such as a display, a computer, a television, a tablet computer, a mobile phone, an e-reader, a smart watch with a display screen, a smart band, and a player with a display screen.
Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims (13)

1. A wire assembly, comprising:
a flexible substrate;
the stress release parts are arranged on one side of the flexible substrate at intervals; and
and the conducting wire covers the surface and the side surface of the stress release parts, which are far away from the flexible substrate, and gaps between the adjacent stress release parts.
2. The wire assembly of claim 1, wherein the strain relief portion comprises a body portion and a protrusion portion disposed on the body portion away from the flexible substrate, the body portion being disposed closer to the flexible substrate than the protrusion portion.
3. The wire assembly according to claim 2, wherein the body portion has a width greater than a width of the protrusion portion in an arrangement direction of the stress relief portions.
4. The wire assembly of claim 2, wherein the body portion and the protrusion are of a unitary construction.
5. The wire assembly of claim 2, wherein the strain relief further comprises a spacer portion between the body portion and the flexible substrate.
6. The wire assembly according to claim 5, wherein a width of the isolation portion near the body portion is equal to a width of the body portion near the isolation portion in an arrangement direction of the stress relief portions.
7. The wire assembly of claim 1, wherein the wire is patterned to relieve stress generated when the wire is bent.
8. The wire assembly of claim 2, further comprising:
and the planarization layer is arranged on the surface of the lead wire, which is far away from the flexible substrate.
9. The wire assembly of claim 8, wherein the planarization layer, the body portion, and the raised portion each comprise an organic material.
10. The wire assembly according to claim 1, wherein the stress relief portion is configured to relieve stress generated by bending of the wire assembly when the wire assembly is bent.
11. A method of making a wire assembly, comprising:
forming a stress release layer on a flexible substrate;
etching the stress release layer to form a plurality of stress release parts which are arranged on the surface of one side of the flexible substrate at intervals;
covering a lead layer on the surface of the flexible substrate corresponding to the gaps between the adjacent stress release parts on the surface and the side surfaces of the stress release parts, which are away from the flexible substrate; and
and etching the lead layer to form a plurality of leads arranged at intervals, wherein the extending direction of the leads is intersected with the extending direction of the stress release parts, and the leads are patterned.
12. A display panel assembly, comprising: a display panel, a circuit board, and the wire assembly of any one of claims 1-9, wherein the wire assembly is respectively bent and electrically connected to the display panel and the circuit board.
13. An electronic device, comprising: the wire assembly of any one of claims 1-9.
CN202110081759.7A 2021-01-21 2021-01-21 Lead assembly, preparation method thereof, display panel assembly and electronic equipment Pending CN114822941A (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016031499A (en) * 2014-07-30 2016-03-07 株式会社ジャパンディスプレイ Display device
CN108231800A (en) * 2018-02-02 2018-06-29 京东方科技集团股份有限公司 A kind of flexible display panels and preparation method thereof, display device
CN108281386A (en) * 2018-01-19 2018-07-13 昆山国显光电有限公司 Flexible display screen and preparation method thereof
CN109216410A (en) * 2017-06-30 2019-01-15 昆山工研院新型平板显示技术中心有限公司 OLED display panel and preparation method thereof
CN208766968U (en) * 2018-09-29 2019-04-19 昆山国显光电有限公司 A kind of flexible display panels and flexible display apparatus
CN109671718A (en) * 2018-12-04 2019-04-23 武汉华星光电半导体显示技术有限公司 Flexible display panels and preparation method thereof
CN209150099U (en) * 2019-01-09 2019-07-23 昆山工研院新型平板显示技术中心有限公司 A kind of display panel and display device
CN110536542A (en) * 2019-08-28 2019-12-03 Oppo（重庆）智能科技有限公司 Flexible circuit board and preparation method thereof, display device, mobile terminal

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016031499A (en) * 2014-07-30 2016-03-07 株式会社ジャパンディスプレイ Display device
CN109216410A (en) * 2017-06-30 2019-01-15 昆山工研院新型平板显示技术中心有限公司 OLED display panel and preparation method thereof
CN108281386A (en) * 2018-01-19 2018-07-13 昆山国显光电有限公司 Flexible display screen and preparation method thereof
CN108231800A (en) * 2018-02-02 2018-06-29 京东方科技集团股份有限公司 A kind of flexible display panels and preparation method thereof, display device
CN208766968U (en) * 2018-09-29 2019-04-19 昆山国显光电有限公司 A kind of flexible display panels and flexible display apparatus
CN109671718A (en) * 2018-12-04 2019-04-23 武汉华星光电半导体显示技术有限公司 Flexible display panels and preparation method thereof
CN209150099U (en) * 2019-01-09 2019-07-23 昆山工研院新型平板显示技术中心有限公司 A kind of display panel and display device
CN110536542A (en) * 2019-08-28 2019-12-03 Oppo（重庆）智能科技有限公司 Flexible circuit board and preparation method thereof, display device, mobile terminal

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Application publication date: 20220729