CN107342310B - Flexible display device and manufacturing method thereof - Google Patents
Flexible display device and manufacturing method thereof Download PDFInfo
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- CN107342310B CN107342310B CN201710731029.0A CN201710731029A CN107342310B CN 107342310 B CN107342310 B CN 107342310B CN 201710731029 A CN201710731029 A CN 201710731029A CN 107342310 B CN107342310 B CN 107342310B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a flexible display device and a manufacturing method thereof, wherein the device comprises a flexible substrate, wherein the surface of the flexible substrate comprises a display area, a binding area and a fan-out area arranged between the display area and the binding area; a display module is arranged on the display area of the flexible substrate; an integrated circuit is disposed on the bonding region of the flexible substrate. The flexible substrate comprises a first flexible layer, a first buffer layer and a flexible protective layer which are sequentially arranged, wherein a metal connecting layer is arranged between the first buffer layer and the flexible protective layer and between the fan-out area and the display area, and the metal connecting layer is electrically conducted with the display module and the integrated circuit respectively through two through holes penetrating through the flexible protective layer. The flexible display device provided by the invention can be directly bent at the connecting line between the binding region and the display region, so that the metal connecting layer is prevented from being oxidized and the metal connecting layer is prevented from being broken on the basis of realizing frameless display, and the reliability can be improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible display device and a manufacturing method thereof.
Background
Currently, flexible display can be realized by a Liquid Crystal Display (LCD) and an Organic Light Emitting Diode (OLED) display panel. The OLED display prepared on the flexible substrate can easily realize frameless display by benefiting from the self-luminous characteristic, so that the area ratio of a screen display area in a terminal product is improved, and the display effect is improved.
Fig. 1 is a top view of a general flexible display device. Fig. 2 is a cross-sectional view of a flexible display device at a fan-out area. Referring to fig. 1 and fig. 2 together, the flexible display device includes a flexible substrate 1, an inorganic layer 2, a metal layer 3, and an organic layer 4, which are sequentially disposed, wherein the flexible substrate 1 includes a display region 11, a bonding region 12, and a fan-out region 13 therebetween. A display module (not shown) is disposed on the flexible substrate 1 and located in the display area 11, and the display module includes an array substrate, an OLED display device, and an encapsulation layer. An integrated circuit (not shown) is disposed on the flexible substrate 1 and located in the bonding region 12; the metal layer 3 is located in the fan-out area and used for electrically connecting the display module with the integrated circuit. As shown in fig. 2, the flexible display device directly bends the edge of the screen in the fan-out area 13 to realize frameless display.
However, since the inorganic layer 2 has a large thickness and poor flexibility, cracks generated during bending may propagate to the adjacent metal layer 3, which may cause disconnection of the metal layer 3, thereby failing to display, and cracks generated in the inorganic layer 2 may cause insulation failure thereof, thereby causing oxidation of the metal layer 3.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a flexible display device and a manufacturing method thereof.
The flexible display device comprises a flexible substrate, wherein the surface of the flexible substrate comprises a display area, a binding area and a fan-out area arranged between the display area and the binding area; a display module is arranged on the display area of the flexible substrate; an integrated circuit is arranged on the binding region of the flexible substrate, the flexible substrate comprises a first flexible layer, a first buffer layer and a flexible protection layer which are arranged in sequence,
the first buffer layer with between the flexible protective layer, and be located be provided with the metal connecting layer between fan-out district and the display area, the metal connecting layer is through running through two via holes of flexible protective layer respectively with display module assembly with integrated circuit electricity leads to.
Preferably, the flexible protection layer includes a second flexible layer and a second buffer layer disposed on the second flexible layer.
Preferably, the material used for the second flexible layer comprises polyester amide.
Preferably, the material used for the second buffer layer includes an inorganic layer.
Preferably, the metal connection layer includes a metal body, a first connection portion and a second connection portion, wherein,
the metal body is arranged between the first buffer layer and the flexible protection layer and is positioned in the fan-out area;
one end of the first connecting part is electrically connected with the metal body, and the other end of the first connecting part penetrates through the through hole of the flexible protective layer to be electrically connected with the display module;
one end of the second connecting portion is electrically connected with the metal body, and the other end of the second connecting portion penetrates through the via hole of the flexible protective layer to be electrically connected with the integrated circuit.
Preferably, the material used for the first flexible layer comprises polyester amide.
Preferably, the material used for the first buffer layer includes an inorganic layer.
As another technical solution, the present invention further provides a method for manufacturing a flexible display device, including:
forming a flexible substrate, wherein the surface of the flexible substrate comprises a display area, a binding area and a fan-out area arranged between the display area and the binding area; the flexible substrate comprises a first flexible layer, a first buffer layer and a flexible protection layer which are sequentially arranged;
the first buffer layer with between the flexible protective layer, and be located fan-out district with form the metal connecting layer between the display area, the metal connecting layer through running through two via holes of flexible protective layer respectively with display module assembly with integrated circuit electricity leads to.
Preferably, the first and second liquid crystal materials are,
forming the first flexible layer;
forming the first buffer layer on the first flexible layer;
forming a metal body on the first buffer layer;
forming the flexible protective layer on the first buffer layer and covering the metal body;
forming two through holes penetrating through the flexible protection layer in the flexible protection layer;
forming a first connecting part and a second connecting part in the two via holes respectively, wherein one ends of the first connecting part and the second connecting part are electrically connected with the metal body;
forming a display module on the flexible protective layer and in the display area; the other end of the first connecting part is electrically connected with the display module;
forming an integrated circuit on the flexible protection layer and in the binding region; the other end of the second connecting part is electrically connected with the integrated circuit.
Preferably, the forming of the flexible protection layer includes:
forming a second flexible layer on the first buffer layer and covering the metal body;
a second buffer layer is formed on the second flexible layer.
The invention has the following beneficial effects:
according to the technical scheme of the flexible display device and the manufacturing method thereof, the flexible protective layer is arranged on the first buffer layer of the flexible substrate, the metal connecting layer is arranged between the first buffer layer and the flexible protective layer and positioned between the fan-out area and the display area, and the metal connecting layer is respectively electrically communicated with the display module and the integrated circuit through two through holes penetrating through the flexible protective layer. By means of the flexible protective layer, the connecting line between the binding region and the display region can be directly bent, so that the metal connecting layer is prevented from being oxidized and the metal connecting layer is prevented from being broken on the basis of realizing frameless display, and the reliability can be improved.
Drawings
Fig. 1 is a top view of a general flexible display device;
fig. 2 is a cross-sectional view of a flexible display device at a fan-out area;
fig. 3 is a cross-sectional view of a flexible display device according to an embodiment of the present invention;
FIG. 4 is a block diagram of a metal interconnect layer employed in an embodiment of the present invention;
fig. 5A is a first process diagram of a method for manufacturing a flexible display device according to an embodiment of the present invention;
fig. 5B is a second process diagram of a method for manufacturing a flexible display device according to an embodiment of the invention;
fig. 5C is a third process diagram of a manufacturing method of a flexible display device according to an embodiment of the invention;
fig. 5D is a fourth process diagram of a manufacturing method of a flexible display device according to an embodiment of the invention;
fig. 5E is a fifth process diagram of a manufacturing method of a flexible display device according to an embodiment of the invention;
fig. 5F is a sixth process diagram of a manufacturing method of a flexible display device according to an embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes the flexible display device and the manufacturing method thereof in detail with reference to the accompanying drawings.
Referring to fig. 3, the flexible display device provided in this embodiment includes a flexible substrate, and a surface of the flexible substrate includes a display area 11, a bonding area 12, and a fan-out area 13 disposed between the display area 11 and the bonding area 12. Wherein, a display module 9 is disposed on the display area 11 of the flexible substrate, and the display module 9 may include an array substrate 91, an OLED device 92 and an encapsulation layer 93, which are sequentially disposed. An integrated circuit (not shown) is disposed on the bonding region 12 of the flexible substrate.
The flexible substrate comprises a first flexible layer 5, a first buffer layer 6 and a flexible protection layer 7 which are sequentially arranged, wherein the first flexible layer 5 is used as a flexible substrate and is made of a material with good flexibility, and preferably, the material used for the first flexible layer 5 comprises polyester amide (PI). The material used for the first buffer layer 6 includes an inorganic layer for blocking water and oxygen. The flexible protective layer 7 includes a second flexible layer 71 and a second buffer layer 72 disposed on the second flexible layer 71. Moreover, a metal connecting layer 8 is disposed between the first buffer layer 6 and the flexible protection layer 7 and between the fan-out area 13 and the display area 11, and the metal connecting layer 8 is electrically connected to the display module 9 and the integrated circuit through two via holes penetrating through the flexible protection layer 7 (vertically and upwardly sequentially penetrating through the second flexible layer 71 and the second buffer layer 72) respectively, so as to electrically connect the display module 9 and the integrated circuit.
The second flexible layer 71 and the second buffer layer 72 cover the metal connection layer 8, so that when the display panel is directly bent at the straight line connection position between the fan-out region and the display region, even if the second buffer layer 72 generates cracks, the cracks do not extend to the metal connection layer 8 due to the existence of the second flexible layer 71, and the metal connection layer 8 can be prevented from being broken. Meanwhile, the second buffer layer 72 has a function of blocking water, oxygen and impurity ions, and thus, the metal connection layer 8 can be prevented from being oxidized. The material used for the second flexible layer 71 preferably comprises a polyester amide. The material used for the second buffer layer 72 preferably includes an inorganic layer.
It should be noted that, in the present embodiment, the flexible protection layer 7 is composed of the second flexible layer 71 and the second buffer layer 72, but the present invention is not limited to this, and in practical applications, the flexible protection layer 7 may also be a single functional layer or another functional layer may be added on the basis of the second flexible layer 71 and the second buffer layer 72, as long as the metal connection layer can be prevented from being oxidized and the metal connection layer can be prevented from being broken.
In this embodiment, as shown in fig. 4, the specific structure of the metal connection layer 8 is: the fan-out area comprises a metal body 81, a first connecting part 82 and a second connecting part 83, wherein the metal body 81 is arranged between the first buffer layer 6 and the second flexible layer 71 and is positioned in the fan-out area 13; one end of the first connecting portion 82 is electrically connected to the metal body 81, and the other end of the first connecting portion 82 penetrates through via holes (vertically and upwardly penetrating through the second flexible layer 71 and the second buffer layer 72 in sequence) of the flexible protection layer 7 to be electrically connected to the display module 9; one end of the second connecting portion 83 is electrically connected to the metal body 81, and the other end of the second connecting portion 83 penetrates through the via hole of the flexible protection layer 7 to be electrically connected to the integrated circuit. From this, metal connecting layer 8 can be electrically conducted with display module assembly 9 and integrated circuit respectively to realize the electrically conducting of display module assembly 9 and integrated circuit.
In summary, with the flexible protection layer 7, the straight line connection between the fan-out region 13 and the display region 11 can be directly bent to realize frameless display, and the metal connection layer 8 is prevented from being oxidized and the metal connection layer 8 is prevented from being broken, so that reliability can be improved. Furthermore, since the total thickness of the film layer under the metal connection layer 8 is small, a smaller bending radius can be achieved, and the length required for the metal connection layer for connection is small, so that the glass utilization rate can be improved.
As another technical solution, the present invention further provides a method for manufacturing a flexible display device, including: a flexible substrate is formed, a surface of the flexible substrate including a display area, a bonding area, and a fan-out area disposed between the display area and the bonding area. The flexible substrate comprises a first flexible layer, a first buffer layer and a flexible protection layer which are sequentially arranged; and a metal connecting layer is formed between the first buffer layer and the flexible protective layer and positioned in the fan-out area, and the metal connecting layer is electrically conducted with the display module and the integrated circuit respectively through two via holes penetrating through the flexible protective layer.
With the help of the flexible protective layer, the fan-out area can be directly bent, so that the metal connecting layer is prevented from being oxidized and the metal connecting layer is prevented from being broken on the basis of frameless display.
In this embodiment, referring to fig. 5A to 5F, the method for manufacturing the flexible display device includes the following steps:
step 2, forming a first buffer layer 16 on the first flexible layer 15;
step 3, a metal film layer 17 is arranged on the first buffer layer 16;
step 4, exposing and etching the metal film layer 17 to form a metal body 17 a;
step 5, forming a flexible protective layer 18 on the first buffer layer 16 and covering the metal body 17 a;
forming the above-mentioned flexible protective layer and flexible protective layer 18, further includes:
forming a second flexible layer 181 on the first buffer layer 16 and covering the metal body 17 a;
a second buffer layer 182 is formed on the second flexible layer 181.
Step 6, forming two through holes 19 penetrating through the flexible protection layer 18 in the flexible protection layer 18;
step 7, forming a first connecting part 17b and a second connecting part 17c in the two via holes 19 respectively, wherein one ends of the first connecting part and the second connecting part are electrically connected with the metal body 17 a;
and 8, forming a display module on the flexible protective layer 18 and in the display area, wherein the display module comprises an array substrate 21, an OLED device 22 and an encapsulation layer 23 which are sequentially formed. And a protective layer 20 is arranged on the flexible protective layer 18 and in the fan-out area.
The other end of the first connecting part 17b is electrically connected with the display module; forming an integrated circuit on the flexible protective layer 18 and in the bonding region; the other end of the second connection portion 17c is electrically connected to the integrated circuit.
Therefore, the manufacturing method only needs to add one-time exposure etching process when the metal connecting layer is manufactured, and compared with the prior art, the production efficiency can be improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A flexible display device includes a flexible substrate, a surface of the flexible substrate including a display area, a bonding area, and a fan-out area disposed between the display area and the bonding area; a display module is arranged on the display area of the flexible substrate; the integrated circuit is arranged on the binding region of the flexible substrate, and is characterized in that the flexible substrate comprises a first flexible layer, a first buffer layer and a flexible protection layer which are arranged in sequence,
the first buffer layer with between the flexible protective layer, and be located be provided with the metal connecting layer between fan-out district and the display area, the metal connecting layer is through running through two via holes of flexible protective layer respectively with display module assembly with integrated circuit electricity leads to.
2. The flexible display device of claim 1, wherein the flexible protective layer comprises a second flexible layer and a second buffer layer disposed on the second flexible layer.
3. A flexible display device according to claim 2, wherein the material used for the second flexible layer comprises a polyester amide.
4. The flexible display device of claim 2, wherein the material used for the second buffer layer comprises an inorganic layer.
5. The flexible display device of claim 1, wherein the metal connection layer comprises a metal body, a first connection portion, and a second connection portion, wherein,
the metal body is arranged between the first buffer layer and the flexible protection layer and is positioned in the fan-out area;
one end of the first connecting part is electrically connected with the metal body, and the other end of the first connecting part penetrates through the through hole of the flexible protective layer to be electrically connected with the display module;
one end of the second connecting portion is electrically connected with the metal body, and the other end of the second connecting portion penetrates through the via hole of the flexible protective layer to be electrically connected with the integrated circuit.
6. The flexible display device of claim 1, wherein the material used for the first flexible layer comprises a polyesteramide.
7. The flexible display device of claim 1, wherein the material used for the first buffer layer comprises an inorganic layer.
8. A method for manufacturing a flexible display device, comprising:
forming a flexible substrate, wherein the surface of the flexible substrate comprises a display area, a binding area and a fan-out area arranged between the display area and the binding area; a display module is arranged on the display area of the flexible substrate; an integrated circuit is arranged on the binding region of the flexible substrate; the flexible substrate comprises a first flexible layer, a first buffer layer and a flexible protection layer which are sequentially arranged;
the first buffer layer with between the flexible protective layer, and be located fan-out district with form the metal connecting layer between the display area, the metal connecting layer through running through two via holes of flexible protective layer respectively with display module assembly with integrated circuit electricity leads to.
9. A method of manufacturing a flexible display device according to claim 8,
forming the first flexible layer;
forming the first buffer layer on the first flexible layer;
forming a metal body on the first buffer layer;
forming the flexible protective layer on the first buffer layer and covering the metal body;
forming two through holes penetrating through the flexible protection layer in the flexible protection layer;
forming a first connecting part and a second connecting part in the two via holes respectively, wherein one ends of the first connecting part and the second connecting part are electrically connected with the metal body;
forming a display module on the flexible protective layer and in the display area; the other end of the first connecting part is electrically connected with the display module;
forming an integrated circuit on the flexible protection layer and in the binding region; the other end of the second connecting part is electrically connected with the integrated circuit.
10. The method of claim 9, wherein forming the flexible protective layer comprises:
forming a second flexible layer on the first buffer layer and covering the metal body;
a second buffer layer is formed on the second flexible layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710731029.0A CN107342310B (en) | 2017-08-23 | 2017-08-23 | Flexible display device and manufacturing method thereof |
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| CN201710731029.0A CN107342310B (en) | 2017-08-23 | 2017-08-23 | Flexible display device and manufacturing method thereof |
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| CN107342310B true CN107342310B (en) | 2020-03-13 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108682303B (en) * | 2018-05-14 | 2020-05-19 | 云谷（固安）科技有限公司 | Flexible display substrate, flexible display screen and electronic terminal equipment |
| CN208848933U (en) * | 2018-08-29 | 2019-05-10 | 昆山国显光电有限公司 | Display panel and display device |
| CN109148541B (en) * | 2018-08-30 | 2021-04-02 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN109148487B (en) * | 2018-08-30 | 2021-02-05 | 上海天马微电子有限公司 | Display panel |
| KR20200042579A (en) | 2018-10-15 | 2020-04-24 | 삼성디스플레이 주식회사 | Display device |
| CN110164879B (en) * | 2019-07-03 | 2022-04-22 | 京东方科技集团股份有限公司 | Array substrate and display device |
| CN112289185B (en) * | 2020-10-26 | 2021-11-23 | 武汉华星光电半导体显示技术有限公司 | Display module |
| CN117280893A (en) * | 2022-04-20 | 2023-12-22 | 京东方科技集团股份有限公司 | Display panel, manufacturing method and display device |
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| CN206040131U (en) * | 2016-09-27 | 2017-03-22 | 上海天马微电子有限公司 | Flexible display and flexible display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102091030B1 (en) * | 2013-10-18 | 2020-03-19 | 삼성디스플레이 주식회사 | Display apparatus |
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| CN1949065A (en) * | 2006-10-12 | 2007-04-18 | 友达光电股份有限公司 | Liquid crystal displaying panel |
| CN103676342A (en) * | 2013-12-27 | 2014-03-26 | 深圳市华星光电技术有限公司 | Fan-out area structure of narrow bezel liquid crystal display |
| CN206040131U (en) * | 2016-09-27 | 2017-03-22 | 上海天马微电子有限公司 | Flexible display and flexible display device |
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