CN108133668B - Preparation method of substrate, substrate and terminal - Google Patents
Preparation method of substrate, substrate and terminal Download PDFInfo
- Publication number
- CN108133668B CN108133668B CN201711499499.5A CN201711499499A CN108133668B CN 108133668 B CN108133668 B CN 108133668B CN 201711499499 A CN201711499499 A CN 201711499499A CN 108133668 B CN108133668 B CN 108133668B
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- bending part
- substrate
- bending
- bottom plates
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Structure Of Printed Boards (AREA)
- Telephone Set Structure (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a preparation method of a substrate, the substrate and a terminal, wherein the method comprises the steps of preparing a plurality of bottom plates, and forming a bending area between every two adjacent bottom plates; preparing a first bending part in the bending area; and performing secondary injection molding in the first bending part to form a second bending part. According to the invention, the first bending part and the second bending part are prepared among the plurality of bottom plates, so that the first bending part and the bottom plates are tightly combined, the structure of the substrate is stable, multiple bending can be realized, and the preparation of the electronic equipment with the flexible screen is facilitated.
Description
Technical Field
The invention relates to the technical field of electronic equipment manufacturing, in particular to a substrate preparation method, a substrate and a terminal.
Background
With the development of flexible screen technology, flexible screens are applied to more and more electronic devices. However, the conventional terminal generally uses a metal substrate as a housing, which is not easy to bend and limits the application of the flexible screen. And an insulating region is required to be arranged on the metal substrate of the terminal to be used as a separation strip of the antenna signal.
The inventor of the present application has found, for a long time, that the soft plastic is easily bent and can be used as a bent portion of the terminal metal substrate. The soft plastic and the metal can not be directly combined, so that the soft plastic is not easy to be used as the bending part of the golden book substrate.
Disclosure of Invention
The invention provides a preparation method of a substrate, the substrate and a terminal, and aims to solve the technical problem that a bent part of a metal substrate is difficult to prepare in the prior art.
In order to solve the above technical problems, one technical solution adopted by the present invention is to provide a method for manufacturing a substrate, including:
preparing a plurality of bottom plates, wherein a bending area is formed between every two adjacent bottom plates;
preparing a first bending part in the bending area;
and performing secondary injection molding in the first bending part to form a second bending part.
The method for preparing the base plate specifically comprises the steps of cutting, etching and polishing a metal plate to form the base plate.
The etching of the substrate further comprises etching of one side edge of the bottom plate adjacent to the other bottom plate to form a first limiting structure. .
The method for preparing the first bending part specifically comprises the steps of injecting hard plastic into the bending area to form the first bending part, and forming second limiting structures on two sides of the first bending part.
Wherein the hard plastic comprises 55-65 parts by weight of PBT and 35-45 parts by weight of glass fiber.
The method for preparing the second bending part specifically comprises the step of performing secondary injection molding on soft plastic in the first bending part to form the second bending part.
Wherein the soft plastic is silicon rubber.
In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a substrate, including:
a plurality of bottom plates, wherein a bending area is formed between every two adjacent bottom plates;
the first bending part is arranged in the bending area;
a second bending part disposed in the first bending part;
the first bending part and the second bending part are connected through secondary injection molding.
And a first limiting structure is arranged at the edge of one side of the bottom plate adjacent to the other bottom plate, and second limiting structures corresponding to the first limiting structures are arranged on two sides of the second bending part.
In order to solve the technical problem, another technical scheme adopted by the invention is to provide a terminal, which comprises a substrate, a flexible circuit board and a flexible screen, wherein the substrate is prepared by the method, the flexible circuit board is arranged on the substrate, and the flexible screen is arranged on the flexible circuit board and is electrically connected with the flexible circuit board.
According to the invention, the first bending part and the second bending part are prepared among the plurality of bottom plates, so that the first bending part and the bottom plates are tightly combined, the structure of the substrate is stable, multiple bending can be realized, and the preparation of the electronic equipment with the flexible screen is facilitated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic flow chart illustrating a method for fabricating a substrate according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a method of fabricating a substrate according to another embodiment of the present invention;
FIG. 3 is a schematic process flow diagram of another embodiment of a method for fabricating a substrate according to the present invention;
FIG. 4 is a schematic process flow diagram of another embodiment of a method for fabricating a substrate according to the present invention;
FIG. 5 is a schematic process flow diagram of another embodiment of a method for fabricating a substrate according to the present invention;
FIG. 6 is an enlarged schematic view of a spacing structure between a bottom plate and a first bending portion in another embodiment of the method for manufacturing a substrate of the present invention;
fig. 7 is a schematic structural diagram of an embodiment of the terminal of the present invention;
fig. 8 is an exploded view of an embodiment of the terminal of the present invention;
fig. 9 is a schematic structural view of a terminal according to an embodiment of the present invention in a bent state.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1, an embodiment of a method for manufacturing a substrate according to the present invention includes:
s101, preparing a plurality of bottom plates, wherein a bending area is formed between every two adjacent bottom plates;
in this embodiment, the bottom plate is a metal bottom plate, such as a bottom plate made of magnesium aluminum alloy, titanium aluminum alloy, or the like. In other embodiments, the substrate may also be a glass substrate, a ceramic substrate, or a plastic substrate.
The substrate at least comprises two bottom plates and at least comprises a bending area.
S102, preparing a first bending part in the bending area;
and S102, performing secondary injection molding in the first bending part to form a second bending part.
In this embodiment, the first bending portion is made of hard plastic, and the second bending portion is made of soft plastic.
According to the embodiment of the invention, the first bending part and the second bending part are prepared among the plurality of bottom plates, so that the first bending part and the bottom plates are tightly combined, the structure of the substrate is stable, multiple bending can be realized, and the preparation of the electronic equipment with the flexible screen is facilitated.
Referring to fig. 2 to 6, another embodiment of the method for manufacturing a substrate of the present invention includes:
s201, cutting, etching and polishing a metal plate to form a plurality of bottom plates 10, wherein a bending area is formed between every two adjacent bottom plates 10;
in the present embodiment, the base plate 10 may be formed by a dry etching or wet etching method.
S202, etching the edge of one side of the bottom plate 10 adjacent to the other bottom plate to form a first limiting structure 101;
in this embodiment, referring to fig. 3 and 6, three bottom plates are formed by cutting, etching and polishing a metal plate, and the three bottom plates together form a recessed area, where the recessed area corresponds to a display surface of a terminal for accommodating a flexible circuit board and a flexible screen. Two bending areas are formed among the three bottom plates. The three bottom plates are etched on the edge of one side of the corresponding bending area, the first limiting structure 101 is a groove, and a plurality of limiting holes are formed in one side, corresponding to the concave area, of the groove.
S203, injecting hard plastic into the bending area to form a first bending part 20, and forming second limiting structures 201 on two sides of the first bending part 20;
in the present embodiment, referring to fig. 4 and 6, the second position-limiting structure 201 is a protrusion corresponding to the groove, and a position-limiting pillar corresponding to the position-limiting hole is formed on the protrusion, and the position-limiting pillar is fastened in the position-limiting hole to fix the base plate 10 and the first bending portion 20.
In this example, the hard plastic includes 55 to 65 parts by weight of PBT (Polybutylene terephthalate) and 35 to 45 parts by weight of glass fiber. For example 55 parts by weight of PBT and 45 parts by weight of glass fibres, 60 parts by weight of PBT and 40 parts by weight of glass fibres, 65 parts by weight of PBT and 35 parts by weight of glass fibres.
And S204, performing secondary injection molding on the soft plastic in the first bending part 20 to form a second bending part 30.
In this embodiment, the soft plastic is silicon rubber, which has good bonding property with the first bending portion 20, and it is not necessary to provide a connecting structure between the first bending portion 20 and the second bending portion 30. In other embodiments, the soft plastic may also be polyethylene, polypropylene, or other materials that are not easily broken.
In the present embodiment, the injection temperature of the second bending portion 30 is lower than that of the first bending portion 20, so that the first bending portion 20 is not affected during the second injection. In the present embodiment, the first bending portion 20 and the second bending portion 30 are both made of insulating materials, so that the bending region can also be used as a blocking strip for an antenna signal of a terminal when the substrate is applied to the terminal.
According to the embodiment of the invention, the first bending part and the second bending part are prepared among the plurality of bottom plates, so that the first bending part and the bottom plates are tightly combined, the structure of the substrate is stable, multiple bending can be realized, and the preparation of the electronic equipment with the flexible screen is facilitated.
Referring to fig. 5, the substrate embodiment of the present invention includes a plurality of base plates 10, a first bending portion 20, and a second bending portion 30, wherein a bending region is formed between each adjacent two base plates 10; the first bending part 20 is arranged in the bending area; the second bending part 30 is disposed in the first bending part 20; wherein, the connection between the first bending portion 20 and the second bending portion 20 is formed by two-time injection molding.
Specifically, the preparation method of the substrate refers to the above method embodiments, and is not described herein again.
According to the embodiment of the invention, the first bending part and the second bending part are prepared among the plurality of bottom plates, so that the first bending part and the bottom plates are tightly combined, the structure of the substrate is stable, multiple bending can be realized, and the preparation of the electronic equipment with the flexible screen is facilitated.
Referring to fig. 7 to 9, the terminal embodiment of the present invention includes a substrate 401, a flexible circuit board 402, and a flexible screen 403, where the flexible circuit board 402 is disposed on the substrate 401, and the flexible screen 403 is disposed on the flexible circuit board 402 and electrically connected to the flexible circuit board 402. The substrate 401 comprises a first bending portion 4012 and a second bending portion 4013, and the first bending portion 4012 and the second bending portion 4013 form a bending region of the substrate 401; the flexible circuit board 402 is provided with a third bending portion 4021 corresponding to the bending region, so that when the terminal is bent, pressure acts on the bending region and the third bending portion 4013, and other parts of the substrate 401 and the flexible circuit board 402 cannot be affected.
Specifically, the preparation method of the substrate refers to the above method embodiments, and is not described herein again.
According to the embodiment of the invention, the first bending part and the second bending part are prepared among the plurality of bottom plates, so that the first bending part and the bottom plates are tightly combined, the structure of the substrate is stable, multiple bending can be realized, and the preparation of the electronic equipment with the flexible screen is facilitated.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (3)
1. A method of preparing a substrate, comprising:
cutting, etching and polishing a metal plate to form a plurality of bottom plates, wherein a bending area is formed between every two adjacent bottom plates; etching the substrate further comprises: etching the edge of one side of the bottom plate adjacent to the other bottom plate to form a first limiting structure;
injecting hard plastic into the bending region to form a first bending part, and forming second limiting structures on two sides of the first bending part; performing secondary injection molding on soft plastic in the first bending part to form a second bending part;
the hard plastic comprises 55-65 parts by weight of PBT and 35-45 parts by weight of glass fiber;
the soft plastic is silicon rubber.
2. A substrate, comprising:
the bending area is formed between every two adjacent bottom plates, and a first limiting structure is arranged on the edge of one side of each bottom plate adjacent to the other bottom plate;
the first bending part is arranged in the bending area, the first bending part is made of hard plastic, and two sides of the first bending part are provided with second limiting structures corresponding to the first limiting structures;
the second bending part is arranged in the first bending part and is made of soft plastic;
the first bending part and the second bending part are connected through secondary injection molding.
3. A terminal comprising a substrate prepared by the method of claim 1, a flexible circuit board disposed on the substrate, and a flexible screen disposed on and electrically connected to the flexible circuit board.
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CN201711499499.5A CN108133668B (en) | 2017-12-29 | 2017-12-29 | Preparation method of substrate, substrate and terminal |
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CN201711499499.5A CN108133668B (en) | 2017-12-29 | 2017-12-29 | Preparation method of substrate, substrate and terminal |
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CN108133668A CN108133668A (en) | 2018-06-08 |
CN108133668B true CN108133668B (en) | 2021-05-11 |
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CN111261054A (en) * | 2020-01-21 | 2020-06-09 | 惠州中京电子科技有限公司 | Application of black base material in LED spliced screen product |
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CN106304724A (en) * | 2016-08-23 | 2017-01-04 | 东莞华清光学科技有限公司 | A kind of mobile terminal shell and preparation method thereof, mobile terminal |
CN106905607A (en) * | 2017-01-19 | 2017-06-30 | 北京东方雨虹防水技术股份有限公司 | A kind of flexible thermoplastic polyolefin's impervious material and preparation method thereof |
CN206601912U (en) * | 2017-03-28 | 2017-10-31 | 联想(北京)有限公司 | A kind of substrate and display panel, electronic equipment |
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KR102133158B1 (en) * | 2012-08-10 | 2020-07-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method for manufacturing light-emitting device |
CN102969320B (en) * | 2012-12-10 | 2015-10-21 | 京东方科技集团股份有限公司 | Flexible display substrates and preparation method thereof, flexible display apparatus |
KR102201928B1 (en) * | 2014-06-24 | 2021-01-12 | 삼성전자주식회사 | Flexible device and folding unit thereof |
CN205912099U (en) * | 2016-08-28 | 2017-01-25 | 江西合力泰科技有限公司 | Display module assembly that can buckle |
CN107009572B (en) * | 2017-03-30 | 2023-02-10 | 广东格林精密部件股份有限公司 | Intelligent terminal structural part capable of being bent freely and manufacturing method thereof |
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Patent Citations (5)
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CN103972264A (en) * | 2013-01-25 | 2014-08-06 | 财团法人工业技术研究院 | Flexible electronic device |
CN105554192A (en) * | 2015-12-29 | 2016-05-04 | 广东欧珀移动通信有限公司 | Mobile terminal |
CN106304724A (en) * | 2016-08-23 | 2017-01-04 | 东莞华清光学科技有限公司 | A kind of mobile terminal shell and preparation method thereof, mobile terminal |
CN106905607A (en) * | 2017-01-19 | 2017-06-30 | 北京东方雨虹防水技术股份有限公司 | A kind of flexible thermoplastic polyolefin's impervious material and preparation method thereof |
CN206601912U (en) * | 2017-03-28 | 2017-10-31 | 联想(北京)有限公司 | A kind of substrate and display panel, electronic equipment |
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