CN108133668A - A kind of preparation method of substrate, substrate and terminal - Google Patents
A kind of preparation method of substrate, substrate and terminal Download PDFInfo
- Publication number
- CN108133668A CN108133668A CN201711499499.5A CN201711499499A CN108133668A CN 108133668 A CN108133668 A CN 108133668A CN 201711499499 A CN201711499499 A CN 201711499499A CN 108133668 A CN108133668 A CN 108133668A
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- CN
- China
- Prior art keywords
- bending part
- substrate
- preparation
- bottom plate
- flex area
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Structure Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention discloses a kind of preparation method of substrate, substrate and terminals, and the method includes preparing multiple bottom plates, flex area is formed between every two neighboring bottom plate；The first bending part is prepared in flex area；Quadric injection mould forms the second bending part in the first bending part.The present invention between multiple bottom plates by preparing the first bending part and the second bending part so that the first bending part and bottom plate are tightly combined, the stable structure of substrate, and can realize multiple bending, conducive to the preparation of the electronic equipment with flexible screen.
Description
Technical field
The present invention relates to electronic equipment manufacturing technical field, more particularly to a kind of preparation method of substrate, substrate and terminal.
Background technology
With the development of flexible screen technology, flexible screen is applied in more and more electronic equipments.And at present eventually
End generally uses metal substrate as shell, not pliable, limits the application of flexible screen.And it is needed on the metal substrate of terminal
Insulating regions are set, using the partition band as aerial signal.
Present inventor has found that soft plastic is easy to bending in long-term research and development, can be used as terminal metal substrate
Bending part.And soft plastic and metal can not be directly in conjunction with so that be not easy to realize using soft plastic as the bending part of gold book substrate.
Invention content
The present invention provides a kind of preparation method of substrate, substrate and terminal, to solve metal substrate of the prior art
Bending part prepares the technical issues of difficult.
In order to solve the above technical problems, one aspect of the present invention is to provide a kind of preparation method of substrate,
Including：
Multiple bottom plates are prepared, flex area is formed between every two neighboring bottom plate；
The first bending part is prepared in the flex area；
Quadric injection mould forms the second bending part in first bending part.
Wherein, the method for preparing substrate specifically includes and sawing sheet, etching, polishing is carried out to sheet metal, described in formation
Bottom plate.
Wherein, described be etched to the substrate is additionally included in the bottom plate one side edge erosion adjacent with another bottom plate
It carves, forms the first position limiting structure..
Wherein, the method for preparing the first bending part is specifically included in injection hard plastic the flex area in, formation the
One bending part, and form the second position limiting structure in the both sides of first bending part.
Wherein, the hard plastic includes the glass fibre of 55-65 parts by weight PBT and 35-45 parts by weight.
Wherein, the method for preparing the second bending part is specifically included in the soft modeling of quadric injection mould in first bending part
Glue forms the second bending part.
Wherein, the soft plastic is silicon rubber.
In order to solve the above technical problems, another technical solution used in the present invention is to provide a kind of substrate, including：
Multiple bottom plates often form flex area between the two neighboring bottom plate；
First bending part is set in the flex area；
Second bending part is set in first bending part；
Wherein, the connection between first bending part and second bending part is secondary injection molding.
Wherein, the bottom plate one side edge adjacent with another bottom plate is equipped with the first position limiting structure, second bending part
Both sides are equipped with the second position limiting structure of corresponding first position limiting structure.
In order to solve the above technical problems, another technical solution used in the present invention is to provide a kind of terminal, including substrate,
Flexible PCB and flexible screen, the substrate that the substrate is prepared for above-mentioned method, the flexible PCB are set to described
On substrate, the flexible screen is set on the flexible PCB and is electrically connected with the flexible PCB.
The present invention between multiple bottom plates by preparing the first bending part and the second bending part so that the first bending part and bottom
Plate is tightly combined, the stable structure of substrate, and can realize multiple bending, conducive to the system of the electronic equipment with flexible screen
It is standby.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing, wherein：
Fig. 1 is the flow diagram of one embodiment of preparation method of substrate of the present invention；
Fig. 2 is the flow diagram of another embodiment of preparation method of substrate of the present invention；
Fig. 3 is the process flow diagram of another embodiment of preparation method of substrate of the present invention；
Fig. 4 is the process flow diagram of another embodiment of preparation method of substrate of the present invention；
Fig. 5 is the process flow diagram of another embodiment of preparation method of substrate of the present invention；
Fig. 6 is putting for the position limiting structure between another embodiment bottom plate of preparation method of substrate of the present invention and the first bending part
Big schematic diagram；
Fig. 7 is the structure diagram of terminal embodiment of the present invention；
Fig. 8 is the configuration schematic diagram of terminal embodiment of the present invention；
Fig. 9 is the structure diagram of terminal embodiment bending state of the present invention.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment belongs to the scope of protection of the invention.
Referring to Fig. 1, one embodiment of preparation method of substrate of the present invention includes：
S101, multiple bottom plates are prepared, flex area is formed between every two neighboring bottom plate；
In the present embodiment, bottom plate is metal base plate, such as bottom plate made of the materials such as magnesium alloy, titanium-aluminium alloy.
In other embodiment, bottom plate can also be glass film plates, ceramic bottom board or plastic cement bottom plate etc..
Two bottom plates are included at least in substrate, including at least a flex area.
S102, the first bending part is prepared in flex area；
S102, quadric injection mould forms the second bending part in the first bending part.
In the present embodiment, the first bending part is hard plastic, and the second bending part is soft plastic, in other embodiments, the
One bending part may be other with soft plastic and metal can be strong bonded material.
The embodiment of the present invention between multiple bottom plates by preparing the first bending part and the second bending part so that the first bending
Portion and bottom plate are tightly combined, the stable structure of substrate, and can realize multiple bending, conducive to the electronic equipment with flexible screen
Preparation.
Referring to Fig. 2 to Fig. 6, another embodiment of preparation method of substrate of the present invention includes：
S201, sheet metal is subjected to sawing sheet, etching, polishing, forms multiple bottom plates 10, between every two neighboring bottom plate 10
Form flex area；
In the present embodiment, can bottom plate 10 be formed by the method for dry ecthing or wet etching.
S202, it is etched in the one side edge adjacent with another bottom plate of bottom plate 10, forms the first position limiting structure 101；
In the present embodiment, referring to Fig. 3 and Fig. 6, by by sheet metal sawing sheet, etching, polishing, forming three bottom plates,
Depressed area, the display surface of depressed area counterpart terminal, for housing flexible PCB and flexible screen is collectively formed in three bottom plates.Three
Two flex areas are formed between a bottom plate.Three bottom plates correspond to flex area one side edge etch the first position limiting structure 101, first
Position limiting structure 101 is groove, and the one side that groove corresponds to depressed area is equipped with multiple limit holes.
S203, hard plastic is molded in flex area, forms the first bending part 20, and formed in the both sides of the first bending part 20
Second position limiting structure 201；
In the present embodiment, referring to Fig. 4 and Fig. 6, the second position limiting structure 201 is the protrusion of respective slot, is formed in protrusion
The limited post of corresponding limit hole, limited post is fastened in limit hole, to fix 10 and first bending part 20 of bottom plate.
In the present embodiment, (Polybutylene terephthalate gather PBT of the hard plastic including 55-65 parts by weight
Four methine ester of terephthalic acid (TPA)) and 35-45 parts by weight glass fibre.Such as 55 parts by weight PBT and 45 parts by weight glass
Glass fiber, the glass fibre of the PBT of 60 parts by weight and 40 parts by weight, the PBT of 65 parts by weight and 35 parts by weight glass fibre.
S204, the quadric injection mould soft plastic in the first bending part 20 form the second bending part 30.
In the present embodiment, soft plastic is silicon rubber, good with 20 associativity of the first bending part, without again in the first bending
Connection structure is set between 20 and second bending part 30 of portion.In other embodiments, soft plastic may be polyethylene, polypropylene
Etc. the material for being not easy to be broken off.
In the present embodiment, the injection temperature of the second bending part 30 is less than the injection temperature of the first bending part 20, so that
During quadric injection mould, the first bending part 20 is unaffected.In the present embodiment, the first bending part 20 and the second bending part 30 be all
For insulating materials, therefore when substrate is applied to terminal, flex area can also be used as the partition band of the aerial signal of terminal.
The embodiment of the present invention between multiple bottom plates by preparing the first bending part and the second bending part so that the first bending
Portion and bottom plate are tightly combined, the stable structure of substrate, and can realize multiple bending, conducive to the electronic equipment with flexible screen
Preparation.
Referring to Fig. 5, substrate embodiment of the present invention includes multiple bottom plates 10, the first bending part 20 and the second bending part 30,
In, form flex area between every two neighboring bottom plate 10；First bending part 20 is set in flex area；Second bending part 30 is set
In in the first bending part 20；Wherein, the connection between the first bending part 20 and the second bending part 20 is secondary injection molding.
Specifically, the preparation method of substrate, referring to above method embodiment, details are not described herein.
The embodiment of the present invention between multiple bottom plates by preparing the first bending part and the second bending part so that the first bending
Portion and bottom plate are tightly combined, the stable structure of substrate, and can realize multiple bending, conducive to the electronic equipment with flexible screen
Preparation.
Referring to Fig. 7 to Fig. 9, terminal embodiment of the present invention includes substrate 401, flexible PCB 402 and flexible screen 403,
Flexible PCB 402 is set on substrate 401, and flexible screen 403 is set on flexible PCB 402 and and flexible PCB
402 electrical connections.Substrate 401 includes the first bending part 4012 and the second bending part 4013, the first bending part 4012 and the second bending
Portion 4013 forms the flex area of substrate 401；Flexible PCB 402 corresponds to flex area and is equipped with third bending part 4021, so that eventually
End pressure in bending acts on flex area and third bending part 4013, does not interfere with substrate 401 and flexible PCB 402 its
His position.
Specifically, the preparation method of substrate, referring to above method embodiment, details are not described herein.
The embodiment of the present invention between multiple bottom plates by preparing the first bending part and the second bending part so that the first bending
Portion and bottom plate are tightly combined, the stable structure of substrate, and can realize multiple bending, conducive to the electronic equipment with flexible screen
Preparation.
The foregoing is merely embodiments of the present invention, are not intended to limit the scope of the invention, every to utilize this
It is relevant to be directly or indirectly used in other for the equivalent structure or equivalent flow shift that description of the invention and accompanying drawing content are made
Technical field is included within the scope of the present invention.
Claims (10)
1. a kind of preparation method of substrate, which is characterized in that including：
Multiple bottom plates are prepared, flex area is formed between every two neighboring bottom plate；
The first bending part is prepared in the flex area；
Quadric injection mould forms the second bending part in first bending part.
2. preparation method according to claim 1, which is characterized in that the method for preparing substrate specifically includes：
Sheet metal is subjected to sawing sheet, etching, polishing, forms the bottom plate.
3. preparation method according to claim 2, which is characterized in that described be etched to the substrate further includes：
In the bottom plate one side edge etching adjacent with another bottom plate, the first position limiting structure is formed.
4. preparation method according to claim 1, which is characterized in that the method for preparing the first bending part is specifically wrapped
It includes：
Hard plastic is molded in the flex area, forms the first bending part, and second is formed in the both sides of first bending part
Position limiting structure.
5. preparation method according to claim 4, which is characterized in that
The hard plastic includes the glass fibre of 55-65 parts by weight PBT and 35-45 parts by weight.
6. preparation method according to claim 1, which is characterized in that the method for preparing the second bending part is specifically wrapped
It includes：
The quadric injection mould soft plastic in first bending part forms the second bending part.
7. preparation method according to claim 6, which is characterized in that
The soft plastic is silicon rubber.
8. a kind of substrate, which is characterized in that including：
Multiple bottom plates often form flex area between the two neighboring bottom plate；
First bending part is set in the flex area；
Second bending part is set in first bending part；
Wherein, the connection between first bending part and second bending part is secondary injection molding.
9. substrate according to claim 8, which is characterized in that
The bottom plate one side edge adjacent with another bottom plate be equipped with the first position limiting structure, the second bending part both sides be equipped with pair
Answer the second position limiting structure of first position limiting structure.
10. a kind of terminal, which is characterized in that including substrate, flexible PCB and flexible screen, the substrate is claim 1
Substrate prepared by~7 any one of them methods, the flexible PCB are set on the substrate, the flexible screen setting
It is electrically connected on the flexible PCB and with the flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711499499.5A CN108133668B (en) | 2017-12-29 | 2017-12-29 | Preparation method of substrate, substrate and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711499499.5A CN108133668B (en) | 2017-12-29 | 2017-12-29 | Preparation method of substrate, substrate and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108133668A true CN108133668A (en) | 2018-06-08 |
| CN108133668B CN108133668B (en) | 2021-05-11 |
Family
ID=62399413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711499499.5A Active CN108133668B (en) | 2017-12-29 | 2017-12-29 | Preparation method of substrate, substrate and terminal |
Country Status (1)
| Country | Link |
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| CN (1) | CN108133668B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111261054A (en) * | 2020-01-21 | 2020-06-09 | 惠州中京电子科技有限公司 | Application of black base material in LED spliced screen product |
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| Publication number | Publication date |
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| CN108133668B (en) | 2021-05-11 |
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