CN114812241B - Composite capillary structure applied to thin type temperature equalization plate - Google Patents
Composite capillary structure applied to thin type temperature equalization plate Download PDFInfo
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- CN114812241B CN114812241B CN202110114324.8A CN202110114324A CN114812241B CN 114812241 B CN114812241 B CN 114812241B CN 202110114324 A CN202110114324 A CN 202110114324A CN 114812241 B CN114812241 B CN 114812241B
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- 239000002131 composite material Substances 0.000 title claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 83
- 229910052751 metal Inorganic materials 0.000 claims abstract description 83
- 230000008020 evaporation Effects 0.000 claims abstract description 24
- 238000001704 evaporation Methods 0.000 claims abstract description 24
- 238000009833 condensation Methods 0.000 claims abstract description 15
- 230000005494 condensation Effects 0.000 claims abstract description 15
- 238000009751 slip forming Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 53
- 229910052802 copper Inorganic materials 0.000 claims description 41
- 239000010949 copper Substances 0.000 claims description 41
- 238000005245 sintering Methods 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 238000005336 cracking Methods 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 239000000084 colloidal system Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 5
- 239000005751 Copper oxide Substances 0.000 claims description 3
- 229910000431 copper oxide Inorganic materials 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000012530 fluid Substances 0.000 abstract description 47
- 239000007791 liquid phase Substances 0.000 abstract description 42
- 239000002002 slurry Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000012071 phase Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001754 anti-pyretic effect Effects 0.000 description 1
- 239000002221 antipyretic Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Powder Metallurgy (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a composite capillary structure applied to a thin type temperature equalization plate, which comprises a first metal sheet and a porous metal capillary structure. The first metal sheet has a trench structure with a trench bottom and two trench sidewalls. The porous metal capillary structure is continuously formed within the trench structure. The porous metal capillary structure has an upper surface, a lower surface and two side surfaces. The upper surface has a central concave region and two edge convex regions. The lower surface is attached to the bottom surface of the groove. The side surface is tapered from the upper surface to the lower surface with a sidewall gap between the side surface and the trench sidewall. The invention can effectively improve the capability of liquid phase working fluid in the thin type temperature equalization plate to be conveyed from the condensation area to the evaporation area.
Description
Technical Field
The invention relates to a composite capillary structure applied to a thin type temperature equalization plate, in particular to a composite capillary structure for efficiently conveying liquid phase working fluid, which is formed by forming a gap between a porous metal capillary structure and the side wall of a groove of a metal substrate.
Background
The water absorption capacity of the capillary structure is an important parameter of the design of a common temperature-equalizing plate element, and the capillary structure with high permeability has higher transmission capacity for liquid phase working fluid, is favorable for evaporation and condensation reflux of the liquid phase working fluid, and further improves the heat transfer performance of the temperature-equalizing plate element. When the thickness of the temperature equalizing plate element is thinner, the accommodating space of the upper and lower cover plates becomes smaller, and the thickness of the capillary structure is also limited in order to maintain a sufficient flowing space of the gas-phase working fluid.
As the thickness of the capillary structure is thinner, the amount of liquid phase working fluid carried by the capillary structure is smaller, and the capillary limit is reduced. The liquid phase working fluid flows back from the far-end condensation area to the evaporation area slowly, so that the heat conduction function and the antipyretic power of the thin temperature equalizing plate are affected.
At present, an ultrathin temperature-equalizing plate with the element thickness smaller than 0.8mm adopts a laid copper net as a capillary structure. In many ultra-thin temperature equalization plate design applications, in order to make up the defect of the capillary force of the copper mesh, one or more woven meshes are additionally paved to partially reinforce the conveying capacity of the copper mesh to liquid phase working fluid. The current ultra-thin temperature-equalizing plates for realizing mass production in industry are all above 0.3 mm. Once the element thickness of the temperature equalizing plate is lower than 0.3mm, the capillary structure of the copper mesh faces the problem of capillary limit, the difficulty of paving the woven mesh is high in the manufacturing process, and the problem is more serious along with the reduction of the element thickness. The industry is in urgent need of a novel capillary structure capable of meeting the requirements of the efficacy and the manufacturing process at the same time, so as to solve the problems of insufficient liquid phase working fluid conveying speed and carrying capacity caused by the reduction of the thickness and the capillary limit of the copper mesh of the current ultra-thin temperature-equalizing plate element.
Disclosure of Invention
In view of the above, the present invention is directed to providing a composite capillary structure for a thin-type temperature equalization plate, which can form a certain gap between a porous metal capillary structure and a sidewall of a groove of a metal substrate by using a directional liquid phase flow design, and form a high-efficiency composite capillary structure capable of carrying more liquid phase working fluid and rapidly conveying the liquid phase working fluid on a surface of the metal substrate of the ultra-thin temperature equalization plate, so as to accelerate a flow speed of the liquid phase working fluid in the thin-type temperature equalization plate element from a condensation area to an evaporation area, and further improve heat transfer and heat release effects of the thin-type temperature equalization plate element.
In order to achieve the above purpose, the present invention discloses a composite capillary structure applied to a thin type temperature equalization plate, which is characterized by comprising:
A first metal sheet having a trench structure with a trench bottom and two trench sidewalls; and
A porous metal capillary structure continuously formed in the trench structure, the porous metal capillary structure having:
an upper surface having a central concave region and two edge convex regions;
A lower surface attached to the bottom surface of the trench; and
And two side surfaces gradually shrink inwards from the upper surface to the lower surface, and a side wall gap is formed between the side surfaces and the side walls of the grooves.
The depth of the long groove structure is between 0.05 mm and 0.50mm, the structural length of the long groove is at least 30mm, and the structural width of the long groove is between 1.0 and 3.0 mm.
The device further comprises an evaporation zone and a far-end condensation zone, wherein one end of the long-strip-shaped groove structure points to the evaporation zone, and the other end of the long-strip-shaped groove structure points to the far-end condensation zone.
The porous metal capillary structure is further divided into a first capillary structure and a second capillary structure, wherein the first capillary structure is arranged in the evaporation area, and the porosity of the first capillary structure is larger than that of the second capillary structure.
The width of the upper surface of the porous metal capillary structure is larger than that of the lower surface, and the width of the upper surface of the porous metal capillary structure is larger than three times of that of a side wall gap.
The distance between the upper surface of the porous metal capillary structure and the side wall of the groove is between 10um and 200 um.
The groove structure is further provided with a plurality of support columns, the porous metal capillary structure is further provided with a plurality of through holes corresponding to the support columns, and a through hole gap is formed between the support columns and the porous metal capillary structure.
The porous metal capillary structure is a copper powder sintered capillary structure, and the copper powder sintered capillary structure is prepared by printing, drying, cracking and sintering a slurry, wherein the slurry comprises a plurality of metal copper powders and a polymer colloid.
The porous metal capillary structure is a powder sintered capillary structure, the powder sintered capillary structure comprises a plurality of chain-shaped copper components formed by sintering copper oxide powder and a plurality of sphere-like copper components formed by sintering copper powder, the chain-shaped copper components are combined with each other, the sphere-like copper components are scattered among the chain-shaped copper components, and a plurality of pores are formed among the chain-shaped copper components and the sphere-like copper components.
The powder sintering capillary structure is prepared by a slurry through printing, drying, cracking and sintering processes, and the slurry comprises a plurality of metal copper powders, a plurality of copper oxide powders and a polymer colloid.
Therefore, the invention utilizes the micro interval formed between the porous metal capillary structure and the substrate groove to form the composite capillary structure which combines the powder sintering capillary structure and the groove capillary structure with side gaps into a whole, thereby accelerating the carrying capacity and the conveying speed of the liquid phase working fluid.
In summary, according to the composite capillary structure provided by the invention, the composite capillary structure is formed by utilizing the sidewall gaps between the porous metal capillary structure and the sidewalls of the grooves, so that the carrying capacity of the liquid phase working fluid is increased, the conveying speed of the liquid phase working fluid from the distal condensation area to the evaporation area is accelerated, and the heat conduction capacity and the heat removal power of the thin type temperature equalization plate element are improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a composite capillary structure according to an embodiment of the invention;
FIG. 2 is a schematic diagram illustrating an overhead view of the composite capillary structure of the embodiment of FIG. 1;
FIG. 3 is a schematic diagram showing the structural dimensions of a porous metal capillary structure;
FIG. 4 is a schematic diagram of a porous metal capillary structure according to an embodiment of the invention;
FIG. 5 shows a schematic cross-sectional view of a first capillary structure and a second capillary structure;
FIG. 6 is a schematic view illustrating a composite capillary structure according to another embodiment of the present invention;
FIG. 7 is a schematic diagram of a liquid phase working fluid and a gas phase working fluid according to an embodiment of the invention;
FIG. 8 is a schematic diagram of the flow direction of the liquid phase working fluid according to an embodiment of the invention.
Detailed Description
In order that the advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It should be noted that these embodiments are merely representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. are not meant to limit the present invention or the corresponding embodiments. In the drawings, the vertical direction, the horizontal direction and the elements are merely for expressing the relative positions thereof, and are not drawn to actual scale, and are described in advance.
Please refer to fig. 1 and 2. Fig. 1 and 2 are schematic cross-sectional views and overhead views of a thin type temperature equalizing plate with a capillary structure according to an embodiment of the invention. The invention provides a composite capillary structure W applied to a thin type temperature equalization plate, which comprises a first metal sheet 1 and a porous metal capillary structure 3. The first metal sheet 1 has one or more trench structures 10, the trench structures 10 having one trench floor 102 and two trench sidewalls 104. The porous metal capillary structure 3 is continuously formed in the trench structure 10, and the porous metal capillary structure 3 has an upper surface 301, a lower surface 302 and two side surfaces 304. The upper surface 301 has a central recessed region 3015 and two edge raised regions 3014. The lower surface 302 is attached and secured to the trench floor 102. The side surfaces 304 taper inwardly from the junction of the side surfaces 304 with the upper surface 301 toward the junction of the side surfaces 304 with the lower surface 302, with a sidewall gap 54 between the side surfaces 304 and the corresponding trench sidewalls 104.
The plurality of channel structures 10 may be separated by one or more support walls 18. The support wall 18 simultaneously isolates the two adjacent channel structures 10 from direct exchange of liquid phase working fluid, and must bypass the support wall 18 for communication.
Sidewall gap 54 tapers downwardly and inwardly; the side surfaces 304 and raised edge tab areas 3014 cause the porous metal capillary structure 3 to have a cross-section like a boat-shaped structure. In practical applications, the greater the curvature of the curved surface formed by the central concave region 3015 and the two edge convex regions 3014 of the upper surface 301 of the boat-shaped porous metal capillary structure 3, the better the capillary force.
In one embodiment, the trench structure 10 is a strip-shaped trench structure 10, and the depth D1 of the strip-shaped trench structure 10 may be between 0.05mm and 0.50mm, so that the thickness of the porous metal capillary structure 3 may be controlled between 0.02mm and 0.2 mm. The elongated trench structure 10 may be made of a metal sheet by etching. The length D2 of the elongated trench structure 10 is at least 30mm, and the width D3 of the elongated trench structure 10 is between 1.0mm and 3.0 mm.
Please refer to fig. 3. FIG. 3 is a schematic structural dimension of the composite capillary structure. The width D4 of the upper surface 301 of the porous metal capillary structure 3 is greater than the width D5 of the lower surface 302, and the width D4 of the upper surface 301 of the porous metal capillary structure 3 is greater than four times the width D6 of one sidewall gap 54. The sidewall gap 54 described herein refers to the gap width of the channel seen when the first metal sheet 1 is overlooked from above, that is, the closest distance between the edge of the upper surface 301 and the trench sidewall 104. The height D7 of the porous metal capillary 3 corresponding to the edge projection 3014 is higher than the height D8 of the porous metal capillary 3 corresponding to the middle recess 3015.
The distance between the edge bead 3014 of the porous metal capillary structure 3 and the trench sidewall 104, which is also the minimum width D6 of the sidewall gap 54, is between 10um and 200 um. The distance between the bottom surface 302 of the porous metal capillary structure 3 and the side walls of the grooves, which is also the maximum width D9 of the side wall gap 54, is between 20um and 300 um. D6 and D9 determine the liquid phase working fluid loading in the sidewall clearance channels.
The composite capillary structure W of the present invention is composed of a boat-shaped porous metal capillary structure 3, an elongated groove structure 10 and a sidewall gap 54. The channel of the sidewall gap 54 and the complementary effect formed by the boat-shaped porous metal capillary structure 3 together serve as a channel for conveying the liquid phase working fluid in the thin type temperature equalization plate. Since the sidewall gap 54 is in the shape of a long fine groove, it has a good liquid phase working fluid permeability, and the porous metal capillary structure 3 has a good capillary pressure difference, so that the liquid phase working fluid is rapidly transported to the evaporation area by the resultant force.
In practical applications, the porous metal capillary structure 3 in the composite capillary structure of the present invention is formed by powder sintering. Or the porous metal capillary structure 3 is formed by spreading a metal paste in the metal strip-shaped groove structure 10 and then performing the processes of drying, cracking and sintering.
Please refer to fig. 2, fig. 4 and fig. 5. FIG. 4 is a schematic diagram of a porous metal capillary structure according to an embodiment of the invention; fig. 5 shows a schematic cross-sectional view of a first capillary structure and a second capillary structure. The porous metal capillary structure 3 is a copper powder sintered capillary structure, and the porous metal capillary structure 3 comprises a plurality of chain-shaped copper members 37 and a plurality of sphere-like copper members 38, wherein the chain-shaped copper members 37 are connected with each other, the sphere-like copper members 38 are dispersed among the chain-shaped copper members 37, and a plurality of pores are formed between the chain-shaped copper members and the sphere-like copper members. In one embodiment, the average diameter of the spheroidal copper members 38 is greater than the average diameter of the chain-like copper members 37.
In one embodiment, the porous metal capillary structure 3 is formed by a paste including a polymer colloid, a plurality of metal copper particles and a plurality of copper oxide particles through a printing process, a drying process, a cracking process and a sintering process. The paste is laid into the trench structure 10 by means of steel plate printing or screen printing. Because of the rheology of the slurry, the slurry will now uniformly spread across the trench structure 10, covering the trench floor 102 and touching the trench sidewalls 104.
The slurry is dried and then the solvent is removed to form a solidified substance, and the polymer colloid is adhered between the metal copper powder and the copper oxide powder. The polymer in the solidified material is gasified and removed in the cracking process, leaving pores between the metallic copper powder and the copper oxide powder. In practical application, the sintering process is controlled at 700-900 deg.c and is performed in strictly controlled atmosphere of mixed nitrogen and hydrogen to form composite capillary structure W comprising boat-shaped porous metal capillary structure 3 and side wall gaps 54.
In one embodiment, the average particle size D50 of the metallic copper powder contained in the slurry is between about 10um and 53 um. Or in another embodiment, the average particle diameter D50 of the metallic copper powder contained in the slurry is between about 10um and about 30 um.
The average diameter of the copper oxide powder is about 0.5um to 5um, and may be, in particular, a polygonal crystal cuprous oxide powder.
The slurry is laid in the trench structure 10, and is subjected to a reduction sintering process under a nitrogen-hydrogen mixed atmosphere after being dried and cracked. After sintering, the metallic copper powder forms a spheroidal copper member 38, and the copper oxide powder is reduced, sintered and stretched to form a chain-like copper member 37. The reduced copper oxide powder stretches along the spheroidal copper members 38 in the aforementioned holes, and after solidification, forms chain-like copper members 37 and spheroidal copper members 38 that are interlaced with each other.
The composite wick structure W is further divided into an evaporation zone W1 and a distal condensation zone W2. One end of the elongated trench structure 10 is directed to the evaporation area W1, and the other end of the elongated trench structure 10 is directed to the distal condensation area W2. The porous metal capillary structure 3 is further divided into a first capillary structure 31 and a second capillary structure 32. The first capillary structure 31 is disposed in the evaporation area W1, the second capillary structure 32 is not disposed in the evaporation area W1, and the second capillary structure 32 is disposed outside the evaporation area W1, especially in the remote condensation area W2.
The first capillary structure 31 and the second capillary structure 32 are continuous structures, and the first capillary structure and the second capillary structure have different porosities. In one embodiment, the first capillary structure 31 has a porosity greater than that of the second capillary structure 32. The first capillary structure 31 has a larger pore size than the second capillary structure 32. The average particle diameter of the first capillary structure 31 is larger than that of the second capillary structure 32. In particular, the average particle size of the spheroidal copper members 38 of the first capillary structure 31 is greater than the average particle size of the spheroidal copper members 38 of the second capillary structure 32.
The large average particle diameter of the first capillary structure 31 is beneficial to forming a water film with larger area on the surface for evaporation when the liquid-phase working fluid is boiled, so that the thermal resistance is reduced, and the evaporation speed of the liquid-phase working fluid into a gas-phase working fluid is higher; in contrast, the small average particle size of the second capillary structure 32 is beneficial to improving the capillary force for transporting the liquid phase working fluid, so as to increase the flow speed of the liquid phase working fluid. Therefore, the first capillary structure 31 is disposed in the evaporation area W1 to facilitate the liquid phase to be converted into the gas phase working fluid, and the second capillary structure 32 is disposed in the other portion to facilitate the liquid phase working fluid to flow back to the evaporation end.
Please refer to fig. 6. Fig. 6 is a schematic overhead view of a composite capillary structure in another embodiment of the invention. The trench structure 10 is further provided with a plurality of support pillars 19, the porous metal capillary structure 3 is further provided with a plurality of perforations 39 corresponding to the plurality of support pillars 19, and a perforation gap 59 is formed between the plurality of support pillars 19 and the porous metal capillary structure 3. The support wall 18 and the support column 19 serve to support the space of the first metal sheet 1 and the second metal sheet, and the support column 19 serves as a main support member for the evaporation area W1 and the distal condensation area W2, particularly among the evaporation area W1 and the distal condensation area W2 where the support wall 18 is inconvenient to set. At the perforation gap 59, the side surfaces of the porous metal capillary structure 3 are also tapered from top to bottom.
Please refer to fig. 7 and 8. FIG. 7 is a schematic diagram of a liquid phase working fluid and a gas phase working fluid according to an embodiment of the invention; FIG. 8 is a schematic diagram of the flow direction of the liquid phase working fluid according to an embodiment of the invention. The first metal sheet and the composite capillary structure 3 can form a thin type temperature equalizing plate element when the second metal sheet is arranged on the composite capillary structure. At this point, the liquid phase working fluid 70 may be poured into the thin isopipe element. The liquid phase working fluid 70 is adsorbed within the porous metal capillary structure 3 and within the sidewall gap 54. The level of liquid phase working fluid 70 in sidewall gap 54 may be higher than the average level of liquid phase working fluid 70 within porous metal capillary structure 3.
In operation, the liquid phase working fluid 70 in the sidewall gap 54 and the liquid phase working fluid 70 within the porous metal capillary structure 3 advance in the same direction (arrow direction in fig. 8). But the fluid resistance in the sidewall gap 54 is smaller and the liquid phase working fluid 70 flows faster; the fluid resistance within the porous metal capillary structure 3 is high and the liquid phase working fluid 70 flows at a slower rate. The liquid phase working fluid 70 in the sidewall gap 54 may also be replenished within the porous metal capillary structure 3.
In the antigravity vertical water absorption test, the conveying speed of the composite capillary structure can reach more than 30mm/sec for pure water, and is more than twice as fast as that of pure water of a copper mesh capillary structure. The capillary force of the thin type temperature equalizing plate element has obvious benefit.
In summary, the composite capillary structure provided by the present invention utilizes the sidewall gap between the porous metal capillary structure and the sidewall of the trench to form the composite capillary structure. The side wall gaps also form strip-shaped micro-groove capillary action, so that the liquid phase working fluid has good permeability, meanwhile, the carrying capacity of the liquid phase working fluid in the whole composite capillary structure is increased due to the existence of the side wall gaps, the conveying speed of the liquid phase working fluid from a far-end condensation area to an evaporation area is accelerated, and the heat conduction capacity and the heat relieving power of the thin type temperature equalizing plate element are further improved.
The foregoing detailed description of the preferred embodiments is intended to more clearly describe the features and spirit of the invention, but is not intended to limit the scope of the invention by way of the preferred embodiments disclosed above. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the invention as defined by the appended claims. The scope of the invention as claimed should therefore be accorded the broadest interpretation based upon the foregoing description so as to encompass all such modifications and equivalent arrangements.
Claims (8)
1. The utility model provides a be applied to compound capillary structure of slim samming board which characterized in that contains:
A first metal sheet having a trench structure with a trench bottom and two trench sidewalls; and
A porous metal capillary structure continuously formed in the trench structure, the porous metal capillary structure having:
an upper surface having a central concave region and two edge convex regions;
A lower surface attached to the bottom surface of the trench; and
Two side surfaces which gradually shrink inwards from the upper surface to the lower surface, wherein a side wall gap is formed between the side surfaces and the side walls of the grooves;
the width of the upper surface of the porous metal capillary structure is larger than that of the lower surface, and the width of the upper surface of the porous metal capillary structure is larger than three times of the width of one side wall gap;
the distance between the upper surface of the porous metal capillary structure and the side wall of the groove is between 10um and 200 um.
2. The composite capillary structure for a thin-type temperature equalization plate according to claim 1, wherein said groove structure is a strip-type groove structure, the depth of said strip-type groove structure is between 0.05 mm and 0.50 mm, the structural length of said strip-type groove is at least 30 mm, and the structural width of said strip-type groove is between 1.0 mm and 3.0 mm.
3. The composite wick structure for a thin-type temperature-equalization plate of claim 2, further comprising an evaporation zone and a distal condensation zone, wherein one end of said elongated trench structure is directed toward said evaporation zone and the other end of said elongated trench structure is directed toward said distal condensation zone.
4. The composite capillary structure for a thin type temperature equalization plate according to claim 3, wherein the porous metal capillary structure is further divided into a first capillary structure and a second capillary structure, the first capillary structure is disposed in the evaporation zone, and the porosity of the first capillary structure is greater than the porosity of the second capillary structure.
5. The composite capillary structure of claim 1, wherein the groove structure is further provided with a plurality of support columns, the porous metal capillary structure further has a plurality of through holes corresponding to the support columns, and a through hole gap is formed between the support columns and the porous metal capillary structure.
6. The composite capillary structure for a thin type temperature equalization plate according to claim 1, wherein the porous metal capillary structure is a copper powder sintered capillary structure, the copper powder sintered capillary structure is prepared by a paste, the paste comprises a plurality of metal copper powders and a polymer colloid through printing, drying, cracking and sintering processes.
7. The composite capillary structure for a thin-type temperature equalization plate according to claim 1, wherein the porous metal capillary structure is a powder sintered capillary structure comprising a plurality of chain-like copper members formed by sintering copper oxide powder and a plurality of ball-like copper members formed by sintering copper powder, the chain-like copper members being combined with each other, the ball-like copper members being interspersed between the chain-like copper members, and a plurality of pores being formed between the chain-like copper members and the ball-like copper members.
8. The composite capillary structure for a thin type temperature equalization plate according to claim 7, wherein said powder sintering capillary structure is a paste prepared by printing, drying, cracking and sintering processes, said paste comprising a plurality of metallic copper powders, a plurality of copper oxide powders and a polymer colloid.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110114324.8A CN114812241B (en) | 2021-01-28 | 2021-01-28 | Composite capillary structure applied to thin type temperature equalization plate |
| PCT/CN2022/070470 WO2022161131A1 (en) | 2021-01-28 | 2022-01-06 | Composite capillary structure applied to thin vapor chamber |
Applications Claiming Priority (1)
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| TWI742993B (en) * | 2021-01-28 | 2021-10-11 | 大陸商廣州力及熱管理科技有限公司 | Composite wick structure for thin vapor chamber |
| CN214502178U (en) * | 2021-01-28 | 2021-10-26 | 广州力及热管理科技有限公司 | Composite capillary structure applied to thin temperature equalization plate |
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| US4489777A (en) * | 1982-01-21 | 1984-12-25 | Del Bagno Anthony C | Heat pipe having multiple integral wick structures |
| TWM327021U (en) * | 2007-08-30 | 2008-02-11 | Tai Ye Technology Co Ltd | Structure of isothermal plate with supporting members covered with capillary tissues |
| CN201772793U (en) * | 2010-08-24 | 2011-03-23 | 山东大学 | Panel heat pipe |
| CN202329324U (en) * | 2011-10-26 | 2012-07-11 | 讯凯国际股份有限公司 | Thin type heat pipe |
| TWI524047B (en) * | 2011-11-25 | 2016-03-01 | 超眾科技股份有限公司 | Vapor chamber with improved combined capillary structure |
| CN103217039B (en) * | 2012-01-19 | 2016-05-11 | 奇鋐科技股份有限公司 | Hot pipe cooling structure |
| CN105588463B (en) * | 2014-10-22 | 2018-12-07 | 奇鋐科技股份有限公司 | thin heat pipe structure |
| CN105658032B (en) * | 2016-01-22 | 2019-06-04 | 白鹏飞 | A kind of ultra-thin soaking plate and preparation method thereof |
| US20190353431A1 (en) * | 2018-05-18 | 2019-11-21 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having compensational wick geometry to enhance fluid flow |
| CN111761050B (en) * | 2019-04-01 | 2022-06-03 | 广州力及热管理科技有限公司 | Method for manufacturing capillary structure by using metal slurry |
| TWI708919B (en) * | 2019-10-31 | 2020-11-01 | 建準電機工業股份有限公司 | Temperature-uniformizing board and capillary thin film |
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| TWI742993B (en) * | 2021-01-28 | 2021-10-11 | 大陸商廣州力及熱管理科技有限公司 | Composite wick structure for thin vapor chamber |
| CN214502178U (en) * | 2021-01-28 | 2021-10-26 | 广州力及热管理科技有限公司 | Composite capillary structure applied to thin temperature equalization plate |
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| WO2022161131A1 (en) | 2022-08-04 |
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