CN112304135B - Capillary structure element of temperature equalizing plate and manufacturing method thereof - Google Patents
Capillary structure element of temperature equalizing plate and manufacturing method thereof Download PDFInfo
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- CN112304135B CN112304135B CN201910686552.5A CN201910686552A CN112304135B CN 112304135 B CN112304135 B CN 112304135B CN 201910686552 A CN201910686552 A CN 201910686552A CN 112304135 B CN112304135 B CN 112304135B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
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Abstract
A capillary structure element of a temperature-uniforming plate comprises a first metal sheet and a capillary structure layer. The first metal sheet has an upper surface, and the upper surface has a groove structure. The capillary structure layer is formed in the groove structure and is provided with a first capillary structure and a second capillary structure. The first capillary structure is formed by sintering first spherical copper powder, and the second capillary structure is formed by sintering mixed second spherical copper powder and thin sheet copper powder. The capillary structure element of the temperature-equalizing plate consists of two different capillary structure layers, and the efficiency of liquid phase and gas phase circulation of working fluid in the thin temperature-equalizing plate is improved, so that the heat-clearing and heat-conducting functions of the thin temperature-equalizing plate are improved.
Description
Technical Field
A temperature-uniforming plate element structure and a manufacturing method thereof, in particular to a temperature-uniforming plate capillary structure element with a capillary structure and a manufacturing method thereof, which are used for forming a thin temperature-uniforming plate element after being sealed and processed with a second metal sheet.
Background
The temperature equalizing plate is used for heat dissipation and temperature reduction, and is a flat closed cavity, and the inner wall of the closed cavity is provided with a capillary structure and contains working fluid. When part of the temperature equalizing plate is contacted with a Heat source, working fluid close to a Heat absorbing end (Evaporator) in a closed cavity of the temperature equalizing plate absorbs Heat energy of the Heat source to cause boiling, and the working fluid is converted from a liquid phase to a gas phase to release Latent Heat (Latent Heat), and rapidly flows to a condensing end (Condenser). When the working fluid in the gas phase flows to the condensation area far away from the heat source in the closed cavity, the working fluid is converted from the gas phase to the liquid phase and flows back to the heat absorption end by the Capillary force (Capillary force) of the Capillary structure. The temperature equalizing plate achieves the functions of heat dissipation and temperature reduction of Hot spots (Hot spots) by means of the phase change and conduction of the working fluid.
The continuous capillary structure with high porosity formed by heating, baking and sintering the copper slurry in the groove of the copper sheet material in the temperature-uniforming plate is a novel technical concept. The shape and composition structure of the copper powder particles forming the capillary structure affect the horizontal transmission speed of the liquid phase of the working fluid and the vertical escape speed of the gas phase. The capillary structure with a single structure is not easy to simultaneously meet the optimization requirements of horizontal liquid phase conveying and vertical upward gas phase conveying of the working fluid, so that the temperature equalizing plate achieves the optimized heat conduction function. Therefore, how to optimize the liquid phase transportation of the working fluid in the horizontal direction in the capillary structure and the gasification transportation of the working fluid in the vertical direction at the heating end in the uniform temperature plate is a problem to be solved for manufacturing a high-efficiency ultrathin uniform temperature plate.
Disclosure of Invention
Accordingly, the present invention is directed to a temperature equalization plate capillary structure device and a method for manufacturing the same, which can overcome the defects of the prior art, and is used to form a thin temperature equalization plate device after being sealed and processed with a second metal sheet, thereby solving the efficiency problem and improving the manufacturing effect.
In order to achieve the above object, the present invention discloses a capillary structure element of a vapor chamber, which is used for forming a thin vapor chamber after being sealed and processed with a second metal sheet, and is characterized in that the capillary structure element of the vapor chamber comprises:
a first metal sheet having an upper surface with a trench structure; and
a capillary structure layer formed in the trench structure, the capillary structure layer having:
a first capillary structure comprising a first spherical copper powder sintered to form a first capillary structure; and
a second capillary structure comprising a second spherical copper powder and a thin sheet copper powder mixed and sintered;
wherein, the first capillary structure is positioned at the heat absorbing end of the thin type temperature-uniforming plate.
Wherein, in the first capillary structure, the content of the first spherical copper powder is more than 90%.
Wherein, in the second capillary structure, the content of the thin flaky copper powder is more than 15 percent.
Wherein the first metal sheet comprises at least one of copper and copper alloy.
The first spherical copper powder is obtained by heating and baking a first copper slurry to remove an organic solvent and a polymer contained in the first copper slurry, and the mixed second spherical copper powder and the thin flaky copper powder are obtained by heating and baking a second copper slurry to remove the organic solvent and the polymer contained in the second copper slurry.
Wherein, the capillary structure layer is a porous structure.
Wherein, the capillary structure layer is a continuous structure.
Also discloses a manufacturing method of the capillary structure element of the vapor chamber, which is characterized by comprising the following steps:
providing a first metal sheet with a groove structure, wherein the groove structure is provided with a first area and a second area;
providing a first copper slurry and a second copper slurry;
laying the first copper slurry in the first area;
laying the second copper slurry in the second area;
heating the first copper slurry to solidify the first copper slurry;
heating the second copper slurry to solidify the second copper slurry;
baking the solidified first copper paste and sintering to form a first capillary structure positioned in the first area; and
baking the cured second copper paste and sintering to form a second capillary structure in the second area;
the first capillary structure and the second capillary structure are continuous structures, the first copper slurry comprises a first spherical copper powder, an organic solvent and a polymer, and the second copper slurry comprises a second spherical copper powder, a thin sheet copper powder, the organic solvent and the polymer.
And the step of baking the cured second copper paste and sintering the cured second copper paste to form a second capillary structure in the second area is simultaneously carried out under the same baking and sintering process conditions.
Compared with the prior art, the capillary structure element of the temperature-equalizing plate is provided with two microcosmic different capillary structures in the groove structure on the upper surface of the first metal sheet, and the heat conducting plate capillary structure element formed by the two microcosmic different capillary structures improves the efficiency of liquid phase and gas phase circulation of the working fluid in the thin temperature-equalizing plate by the difference between a vertical gasification mechanism and a horizontal liquid conveying mechanism of the working fluid in the two different capillary structures, so that the heat clearing and heat conducting functions of the thin temperature-equalizing plate are improved.
Drawings
FIG. 1: a top view of a vapor chamber capillary structure according to an embodiment of the invention is shown.
FIG. 2: a cross-sectional view of a vapor chamber capillary structure according to one embodiment of the invention is shown.
FIG. 3: a schematic diagram of the circulation of the working fluid of the thin vapor chamber according to an embodiment of the present invention is shown.
Fig. 3A and 3B respectively show a partially enlarged schematic view of fig. 3.
FIG. 4: a flowchart of the steps of a method for fabricating a capillary structure of a vapor chamber according to one embodiment of the present invention is shown.
FIG. 5: a flow chart of steps of a method of fabricating a device with a uniform temperature plate capillary structure according to another embodiment of the present invention is shown.
Fig. 6A to 6D: a schematic diagram according to fig. 5 is shown.
FIG. 7 is a schematic view of: a flow chart of steps of a method of fabricating a device with a uniform temperature plate capillary structure according to yet another embodiment of the present invention is shown.
Fig. 8A to 8E: a schematic diagram according to fig. 7 is shown.
Detailed Description
In order that the advantages, spirit and features of the invention will be readily understood and appreciated, embodiments thereof will be described in detail hereinafter with reference to the accompanying drawings. It is to be understood that these embodiments are merely representative of the present invention, and that the specific methods, devices, conditions, materials, etc., described herein are not intended to limit the present invention or the corresponding embodiments. It should be understood that the devices shown in the drawings are merely for purposes of illustrating the relative positions thereof and are not necessarily shown to scale.
Referring to fig. 1 and fig. 2, fig. 1 is a top view of a vapor plate capillary structure device 1 according to an embodiment of the invention, and fig. 2 is a cross-sectional view of the vapor plate capillary structure device 1 according to an embodiment of the invention. For ease of illustration, the following figures are drawn in cross-section along line A-A' of FIG. 1. As shown in fig. 1 and fig. 2, the capillary structure element 1 of the temperature equalization plate of the present invention includes a first metal sheet 11 and a capillary structure layer 12. The first metal sheet 11 has an upper surface 111, and the upper surface 111 has a trench structure 112. The capillary structure layer 12 is formed in the trench structure 112. The capillary structure layer 12 is a continuous structure located in the trench structure 112, so that the working fluid moves in the trench structure 112 by using the capillary structure layer 12. In addition, the capillary structure layer 12 is a porous structure, so that the capillary structure layer 12 provides a working fluid capable of moving in the capillary structure layer 12 by using a capillary action.
Referring to fig. 3, 3A and 3B, fig. 3, 3A and 3B are schematic diagrams illustrating the circulation of the working fluid of the thin temperature-uniforming plate V according to an embodiment of the present invention. The capillary structure element 1 of the temperature equalization plate of the invention and the second metal sheet 2 are sealed and processed to form the thin temperature equalization plate V. The thin temperature-uniforming plate V has a vacuum cavity 3 formed between the first metal sheet 11 and the second metal sheet 2, the vacuum cavity 3 serves as an air passage, and the capillary structure layer 12 contains a working fluid. The working fluid transfers heat energy in a mode of liquid phase and gas phase circulation conversion, and further the effect of rapid heat conduction is achieved. As shown in fig. 1 to 3, the trench structure 112 can be divided into a first region 1121 and a second region 1122, and in one embodiment, the first region 1121 is located at the heat absorbing end 41 of the thin temperature uniforming plate V, i.e., the end close to the heat source H. In another embodiment, as in the embodiment shown in fig. 3, the first region 1121 is located at the condensation end 42 of the slim temperature equalization plate V, i.e. the end away from the heat source H, in addition to the heat absorption end 41 of the slim temperature equalization plate V. The second region 1122 is a region other than the first region 1121, and in the embodiment shown in fig. 3, the second region 1122 is located between the heat absorbing end 41 and the condensing end 42 of the thin temperature equalizing plate V.
The capillary structure layer 12 is disposed in the trench structure 112 and has a first capillary structure 121 and a second capillary structure 122. The first capillary structure 121 includes a first spheroidal copper powder 1211 formed by sintering. The second capillary structure 122 includes a mixture of second sphere-like copper powder 1221 and thin flake-like copper powder 1222, which is sintered. In the embodiment of fig. 3, the first capillary structure 121 is located in the first region 1121, and the second capillary structure 122 is located in the second region 1122. Referring to fig. 3A, for clarity, the vertical direction is the direction in which the thin temperature-uniforming plate V is perpendicular to the heat source H, and the parallel direction is the direction in which the thin temperature-uniforming plate V is parallel to the heat source H. The first capillary structure 121 in the first region 1121 is formed by sintering the first spherical copper powder 1211, and the flow rates of the working fluid in the first capillary structure 121 in the vertical direction and the parallel direction are similar and are not affected by the composition structure of the first capillary structure 121. However, the second capillary structure 122 in the second region 42 is formed by sintering the second spheroidal copper powder 1221 and the thin flake copper powder 1222 mixed therein, and the thin flake copper powder 1222 in the second capillary structure 122 is mostly stacked with the second spheroidal copper powder 1221 in a parallel direction due to the effect of the transverse printing and the shape of the copper powder. As shown in the enlarged view of the second capillary structure 122 in fig. 3B, the stacked capillary structure layer 12 is favorable for the rapid transportation of the working fluid in the horizontal direction, but is unfavorable for the removal of latent heat released by the vaporized working fluid in the vertical direction if it is located at the heating end. Therefore, the first capillary structure 121 is used to replace the second capillary structure 122 at the heat sink end.
Referring to fig. 3, the arrows indicate the moving direction of the working fluid. When the working fluid absorbs the heat energy transferred from the heat source H to the heat absorbing end 41 of the thin temperature equalizing plate V, the working fluid is transformed from liquid phase to gas phase, and moves vertically from the first capillary structure 121 to the air flow channel 5 between the capillary structure 12 and the second metal plate 2. Then, the working fluid in the gas phase flows to the condensation end 42 through the gas flow path 5. In the process of flowing to the condensation end 42, the working fluid exchanges heat with the external environment by heat conduction to release heat, and then changes from a gas phase to a liquid phase at the condensation end 42, and vertically moves from the gas flow channel 5 into the first capillary structure 121 of the condensation end 42. The working fluid flows from the first capillary structure 121 of the condensation end 42 to the first capillary structure 121 of the heat absorption end 41 through the second capillary structure 122 by the continuity and porosity of the capillary structure 12. Thus, the complete heat conduction cycle of the working fluid is obtained.
Compared with the capillary structure formed by sintering single copper powder, a copper net, a copper wire or a composite structure, the capillary structure element 1 of the uniform temperature plate of the invention enables working fluid in gas phase and liquid phase to move rapidly by different capillary structure 12 designs so as to accelerate the heat conduction rate.
In summary, the composite capillary structure layer 12 of the present invention can be achieved for a capillary structure formed by sintering and copper mesh structure of a working fluid with a gas phase and liquid phase transport mechanism other than a single copper powder.
In addition, one skilled in the art can adjust the content of the first spherical copper powder 1211 in the first capillary structure 121 according to the manufacturing process or the respective requirement. When the content of the first sphere-like copper powder 1211 is 100% (as in the previous embodiment), the pore structures of the working fluid in the first capillary structure 121 in the vertical direction and the parallel direction are approximately the same. When the content of the first sphere-like copper powder 1211 decreases, the vertical and parallel porosities of the working fluid in the first capillary structure 121 are affected by the additional powder having other shapes. If the other additive powder added to the first capillary structure 121 is the thin flake copper powder 1222, the flow rate of the working fluid in the first capillary structure 121 in the parallel direction is increased, and the vaporization rate in the perpendicular direction is decreased. However, in order to maintain the efficacy of the first capillary structure 121 according to the present invention, the content of the first spherical copper powder 1211 needs to be greater than 90%.
Similarly, the ratio of the second spherical copper powder 1221 and the thin flake copper powder 1222 in the second capillary structure 122 can be adjusted by one skilled in the art according to the manufacturing process or the requirement thereof. When the content of the mixed thin flake copper powder 1222 in the second capillary structure 122 is changed, the flow rate of the working fluid in the second capillary structure 122 in the parallel direction is also changed. However, if the content of the second spherical copper powder 1221 is too low, the stack of the thin flake copper powders 1222 is too dense, resulting in too low a flow porosity of the working fluid, and a decrease in the flow rate of the working fluid. In one embodiment, the content of the thin flake copper powder 1222 in the second capillary structure 122 is greater than 15%, and the suitable addition range is between 15% and 50%.
It should be understood that the positions of the first region 1121 and the second region 1122 are not limited to the positions illustrated in the drawings, and those skilled in the art can design the positions of the first region 1121 and the second region 1122 according to the operation principle between the first capillary structure 121 and the second capillary structure 122 and the working fluid of the present invention, and not limited thereto.
Referring to fig. 4, fig. 4 is a flow chart illustrating steps of a method for manufacturing the capillary structure element 1 of the vapor chamber according to an embodiment of the invention. As shown in fig. 4, the manufacturing method of the capillary structure element 1 of the vapor chamber of the present invention comprises the following steps: step S1: providing a first metal sheet 11 having a trench structure 112, wherein the trench structure 112 has a first region 1121 and a second region 1122; step S2: providing a first copper paste 131 and a second copper paste 132; step S31: laying a first copper paste 131 on the first region 1121; step S32: laying down a second copper paste 132 in a second region 1122; step S41: heating the first copper paste 131 to cure it; step S42: heating the second copper paste 132 to cure it; step S51: baking the solidified first copper paste 131 and sintering to form a first capillary structure 121 located in the first region 1121; step S52: the solidified second copper paste 132 is baked and sintered to form a second capillary structure 122 in the second region 1122. The first capillary structure 121 and the second capillary structure 122 are continuous structures, and the first capillary structure 121 and the second capillary structure 122 are tightly connected to achieve continuity, so that the working fluid can move between the first capillary structure 121 and the second capillary structure 122 by capillary action. As in the embodiment of fig. 4, steps S31 and S32 may be performed simultaneously, steps S41 and S42 may be performed simultaneously, and steps S51 and S52 may be performed simultaneously, so as to complete the capillary structure element 1 of the isothermal plate.
Wherein the first metal sheet 11 comprises at least one of copper and copper alloy. The first copper paste 131 comprises a first spherical copper powder 1211, an organic solvent and a polymer, and the second copper paste 132 comprises a second spherical copper powder 1221, a flake copper powder 1222, an organic solvent and a polymer. When the heating and baking processes are performed, the organic solvent and the polymer in the first copper paste 131 and the second copper paste 132 are removed, and then the heating process is continued until the first spherical copper powder 1211, the second spherical copper powder 1221 and the thin sheet copper powder 1222 are sintered into the first capillary structure 121 and the second capillary structure 122, respectively. The organic solvent and the polymer form a Colloid (Colloid) for dispersing and suspending the copper powder to form a copper paste, so as to be laid in the groove structure 112 of the first metal sheet 11 and processed to form the capillary structure layer 12.
Referring to fig. 5 and fig. 6A to 6D, fig. 5 is a flow chart illustrating steps of a method for manufacturing the capillary structure element 1 of the vapor chamber according to another embodiment of the invention, and fig. 6A to 6D are schematic diagrams according to fig. 5. In practical applications, as shown in fig. 5 and fig. 6A to fig. 6D, the capillary structure layer 12 may be formed by stencil printing, and the steps S31 and S32 are sequentially performed to lay the first copper paste 131 and the second copper paste 132 in the trench structure 112. At this time, since the first copper paste 131 and the second copper paste 132 have fluidity, they can be tightly combined at the boundary between the first copper paste 131 and the second copper paste 132, and then the steps S41 and S42, and the steps S51 and S52 are performed simultaneously, so as to form the continuous capillary structure layer 12 after heating, baking and sintering. It should be noted that the order of laying the first copper paste 131 and the second copper paste 132 is not limited thereto.
Referring to fig. 7 and fig. 8A to 8E, fig. 7 is a flowchart illustrating steps of a method for manufacturing a capillary structure element 1 of a vapor chamber according to still another embodiment of the present invention, and fig. 8A to 8E are schematic diagrams illustrating the method according to fig. 7. In practical applications, in addition to the embodiments shown in fig. 5 and 6A to 6D, steps S41 and S51 may be performed after step S31 in the embodiments shown in fig. 7 and 8A to 8E to heat and sinter the first copper paste 131 to form the first capillary structure 121. Then, step S32, step S42 and step S52 are performed again to heat and sinter the second copper paste 132 to form the second capillary structure 122. The manufacturing method of the present invention can form the capillary structure layer 12 by sequentially laying and sintering the first copper paste 131, and then laying and sintering the second copper paste 132. In addition to the above-mentioned method for forming the capillary structure layer 12, a person skilled in the art can adjust the most suitable process for the purpose of laying the first copper paste 131 on the first region 1121 and laying the second copper paste 132 on the second region 1122, and is not limited thereto.
The first spherical copper powder 1211 and the second spherical copper powder 1221 may be the same, and the ratio of the maximum inscribed circle radius to the minimum circumscribed circle radius of the spherical copper powder is 0.6 or more. The thin sheet copper powder 1222 has a thickness on the order of nanometers (nm), an average diameter 910 on the order of micrometers (um), and a ratio of diameter to thickness greater than 30. The organic solvent may be an alcohol solvent, and the polymer may be a Natural Resin (Natural Resin) or a Synthetic Resin (Synthetic Resin).
Compared with the prior art, the temperature equalization plate capillary structure element 1 of the invention is provided with two microcosmic different capillary structure layers 12, the upper surface 111 of the first metal sheet 11 is arranged in the groove structure 112, and by means of the difference of the vertical gasification mechanism and the horizontal liquid transmission mechanism of the working fluid in the two different capillary structure layers 12, the temperature equalization plate capillary structure element 1 formed by the two microcosmic different capillary structures improves the efficiency of liquid phase and gas phase circulation of the working fluid in the thin temperature equalization plate V, thereby improving the heat clearing and heat conducting functions of the thin temperature equalization plate V.
The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the claims. The scope of the invention should, therefore, be determined with reference to the above description as interpreted in the broadest possible manner, and in all possible variations and equivalent arrangements.
Claims (7)
1. A capillary structure component of a temperature equalization plate is used for forming a thin temperature equalization plate after being sealed and processed with a second metal sheet, and is characterized by comprising:
a first metal sheet having an upper surface with a trench structure; and
a capillary structure layer formed in the trench structure and having a continuous porous structure, the capillary structure layer comprising:
the first capillary structure is positioned on the heat absorbing end of the thin uniform temperature plate and comprises a first spherical copper powder formed by sintering; and
and the second capillary structure is positioned in the area between the heat absorption end and the condensation end of the thin temperature equalization plate and is formed by sintering mixed second spherical copper powder and thin flaky copper powder.
2. The vapor plate capillary structure assembly of claim 1 wherein the first spherical copper powder comprises greater than 90% of the first capillary structure.
3. The vapor panel capillary structure assembly of claim 1 wherein the second capillary structure has a content of thin flake copper powder greater than 15%.
4. The vapor plate capillary structure assembly of claim 1 wherein the first metal sheet comprises at least one of copper and a copper alloy.
5. The capillary structure of claim 1 wherein the first spherical copper powder is obtained by heating and baking a first copper paste to remove an organic solvent and a polymer contained in the first copper paste, and the second spherical copper powder and the thin flake copper powder are obtained by heating and baking a second copper paste to remove the organic solvent and the polymer contained in the second copper paste.
6. A manufacturing method of a capillary structure component of a vapor chamber is used for forming a thin vapor chamber and is characterized by comprising the following steps:
providing a first metal sheet with a groove structure, wherein the groove structure is provided with a first area and a second area, the first area is positioned at a heat absorption end of the thin temperature equalization plate, and the second area is positioned between the heat absorption end and a condensation end of the thin temperature equalization plate;
providing a first copper slurry and a second copper slurry;
laying the first copper slurry in the first area;
laying the second copper slurry in the second area;
heating the first copper slurry to solidify the first copper slurry;
heating the second copper slurry to cure the second copper slurry;
baking the solidified first copper paste and sintering to form a first capillary structure in the first area; and
baking the solidified second copper paste and sintering to form a second capillary structure in the second area;
the first capillary structure and the second capillary structure are continuous structures, the first copper slurry comprises a first spherical copper powder, an organic solvent and a polymer, and the second copper slurry comprises a second spherical copper powder, a thin sheet copper powder, the organic solvent and the polymer.
7. The method according to claim 6, wherein the step of baking the solidified first copper paste and sintering to form a first capillary structure in the first region, and the step of baking the solidified second copper paste and sintering to form a second capillary structure in the second region are performed under the same baking and sintering process conditions.
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| CN201910686552.5A CN112304135B (en) | 2019-07-29 | 2019-07-29 | Capillary structure element of temperature equalizing plate and manufacturing method thereof |
| TW109124071A TWI733525B (en) | 2019-07-29 | 2020-07-16 | Vapor chamber wick structure element and manufacturing method thereof |
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| TWI772047B (en) * | 2021-06-02 | 2022-07-21 | 華晴材料股份有限公司 | Method for producing copper grains and copper grains |
| TWI796098B (en) * | 2021-06-16 | 2023-03-11 | 盟立自動化股份有限公司 | Vapor chamber in adhering configuration and manufacturing method thereof |
| CN113388753B (en) * | 2021-06-22 | 2022-01-04 | 沈伟 | Alloy with capillary structure and preparation method thereof |
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| CN1920467A (en) * | 2005-08-26 | 2007-02-28 | 富准精密工业(深圳)有限公司 | Method for manufacturing sintered heat pipe |
| CN101059322A (en) * | 2006-04-21 | 2007-10-24 | 富准精密工业(深圳)有限公司 | Heat pipe |
| CN206131829U (en) * | 2016-08-10 | 2017-04-26 | 广东工业大学 | Slope ditch slot type flat plate heat pipe |
| CN109121354A (en) * | 2017-06-23 | 2019-01-01 | 泽鸿(广州)电子科技有限公司 | Temperature-uniforming plate |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI733525B (en) | 2021-07-11 |
| TW202104819A (en) | 2021-02-01 |
| CN112304135A (en) | 2021-02-02 |
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