CN217210497U

CN217210497U - Composite capillary structure applied to ultra-thin type uniform temperature plate assembly

Info

Publication number: CN217210497U
Application number: CN202220265493.1U
Authority: CN
Inventors: 陈振贤
Original assignee: Guangzhou Lihe Thermal Management Technology Co ltd
Current assignee: Guangzhou Lihe Thermal Management Technology Co ltd
Priority date: 2022-02-09
Filing date: 2022-02-09
Publication date: 2022-08-16
Anticipated expiration: 2032-02-09

Abstract

A composite capillary structure applied to an ultrathin temperature equalization plate component comprises a groove, a powder sintering capillary structure and a channel. The trench is formed on a metal sheet, and the trench has a trench bottom surface. A powder sintering capillary structure is formed on the bottom surface of the trench, the powder sintering capillary structure including a plurality of interconnected copper members. The channel is formed in the trench, extends along the direction of the trench and opens into both ends of the trench. The channel divides the powder sintering capillary structure into two sub-structures, and the two sub-structures extend along the direction of the groove and lead to two ends of the groove respectively. The channels facilitate the propulsion of the liquid phase working fluid; the powder sintering capillary structure provides kinetic energy vector of the liquid phase working fluid. The trench sidewalls provide the counteracting pressure. Under the synergistic effect of the three components, the flow speed of the liquid phase working fluid is accelerated.

Description

Composite capillary structure applied to ultra-thin type uniform temperature plate assembly

Technical Field

The present invention relates to a capillary structure for a uniform temperature plate assembly, and more particularly to a composite capillary structure having a sintered powder capillary structure, a channel and a groove sidewall for providing a capillary force.

Background

The temperature equalizing plate assembly is a flat vacuum sealed cavity. The inner wall of the closed cavity is paved with a capillary structure and contains working fluid. The working principle of the temperature equalizing plate is that when the heat absorption area of the temperature equalizing plate is contacted with a heat source, liquid-phase working fluid in the capillary structure of the hot spot contact area absorbs heat energy and is converted into a gas phase from a liquid phase. Due to the pressure difference in the assembly, the gas phase working fluid flows rapidly from the gas channel in the cavity to the remote condensation area. Latent heat is released when the vapor phase working fluid flows to a condensation zone remote from the heat source, transitioning from the vapor phase working fluid to the liquid phase working fluid into the capillary structure. Then, the liquid phase working fluid is transported and reflows to the hot spot contact area by the capillary force of the continuous capillary structure in the cavity, and the flow circulation of the liquid phase and the gas phase is formed. The temperature equalizing plate component achieves the purpose of quickly conducting heat energy through the phase change and circulation of the working fluid, and enables the microprocessor to cool and radiate.

With the popularization of 5G mobile communication devices, the trend of pursuing light and thin design of products has become a trend, and the requirement for the thinness of the temperature equalization plate assembly is also strict. The industry currently refers to the temperature equalization plate assembly with a thickness of less than 1mm as an ultra-thin temperature equalization plate assembly, and the limit thickness of mass production in the current market is still not less than 0.3 mm. Once the thickness of the vapor plate assembly is less than 0.3mm or 0.25mm, the thickness of the capillary structure must be less than 0.08mm or even less than 0.05mm in consideration of optimization of the air channel height and the capillary thickness. The excessively thin capillary structure affects the carrying amount of the liquid-phase working fluid, and also reduces the capillary force of the capillary structure and the conveying speed of the liquid-phase working fluid.

Therefore, how to design and manufacture the capillary structure in the ultra-thin type uniform temperature plate assembly with the thickness of less than 0.3mm, even 0.25mm, and provide sufficient transmission and migration speed of the liquid phase working fluid becomes a problem to be solved in the industry.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model aims at providing a be applied to combined type capillary structure of ultra-thin type samming board subassembly, its simple structure, convenient operation can effectively overcome prior art's defect, has accelerateed the liquid phase working fluid velocity of flow of assigned direction, provides sufficient liquid phase working fluid transmission and migration speed, has more the practicality.

In order to achieve the above object, the utility model discloses a be applied to combined type capillary structure of ultra-thin type samming board subassembly forms on a sheet metal, and this combined type capillary structure of its characterized in that includes:

a trench formed on the metal sheet, the trench having a trench bottom and a sidewall;

a powder sintering capillary structure disposed on the bottom surface of the trench, the powder sintering capillary structure comprising a plurality of interconnected copper members; and

and the channel is formed between the side wall of the groove and the powder sintering capillary structure, extends along the direction of the groove and is communicated with two ends of the groove.

The powder sintering capillary structure is a capillary structure which is formed in the groove by a copper powder slurry through a patterned printing process, laying the copper powder slurry in the groove and a heating process.

The composite capillary structure further comprises two channels which are respectively formed between the two side walls of the groove and the powder sintering capillary structure.

Wherein, the depth of this ditch groove is not more than 150um, and the width of this ditch groove is not more than 2000 um.

Wherein the width of the channel at the bottom of the trench is greater than 10 um.

Also discloses a composite capillary structure applied to the ultra-thin temperature equalization plate component, which is formed on a metal sheet, and is characterized in that the composite capillary structure comprises:

a trench formed on the metal sheet, the trench having a trench bottom surface;

and the channel divides the powder sintering capillary structure into two substructures which respectively extend along the groove direction and lead to the two ends of the groove.

The powder sintering capillary structure is formed by laying a copper powder slurry in the groove through graphical printing and heating.

Wherein the channel has an upper opening, and the width of the upper opening is smaller than the width of the bottom of the channel.

Through the structure, the utility model discloses can realize following technological effect:

1. under the synergistic effect of the side wall of the groove, the powder sintering capillary structure and the channel, the pushing and transmission capacity of the liquid phase working fluid 2 can be greatly increased, and the prejudice of the field is broken through.

2. The upper opening of the channel is narrow relative to the width of the bottom of the channel. When the ultrathin uniform temperature plate assembly operates, the directions of the gas-phase working fluid and the liquid-phase working fluid in the same groove are opposite, so that frictional resistance is easily generated, and the flow rates of the gas-phase working fluid and the liquid-phase working fluid are weakened; when the upper opening of the channel is narrow, the interface area of the gas-phase working fluid and the liquid-phase working fluid can be reduced, and further the friction resistance is reduced. In addition, when the ultrathin temperature equalization plate assembly is shaken up and down violently, the liquid-phase working fluid is not easy to separate from the channel.

Drawings

Fig. 1A shows a bird's eye view of a composite capillary structure according to an embodiment of the present invention;

FIG. 1B shows a partial cross-sectional view of line A-A of the embodiment of FIG. 1A of the present invention;

fig. 2A shows a bird's eye view of a composite capillary structure according to an embodiment of the present invention;

FIG. 2B shows a partial cross-sectional view of line B-B of the embodiment of FIG. 2A of the present invention;

fig. 3A shows a bird's eye view of a composite capillary structure according to an embodiment of the present invention;

FIG. 3B shows a partial cross-sectional view of line C-C of the embodiment of FIG. 3A of the present invention;

fig. 4A shows a bird's eye view of a composite capillary structure according to an embodiment of the present invention;

FIG. 4B shows a partial cross-sectional view of line D-D of the embodiment of FIG. 4A of the present invention;

FIG. 5 illustrates a cross-sectional view of a powder sintered wick structure in an embodiment of the invention;

FIG. 6 shows a schematic diagram of a powder sintered capillary structure in an embodiment of the invention;

fig. 7 shows a schematic diagram of a powder sintered capillary structure in another embodiment of the invention.

Detailed Description

In order to provide the advantages, spirit and features of the present invention, which will be more readily understood and appreciated, reference will now be made in detail to the preferred embodiments and accompanying drawings. It is noted that these embodiments are merely exemplary embodiments of the present invention, and the particular methods, devices, conditions, materials, etc., that are illustrated are not intended to limit the present invention or the corresponding embodiments. Also, the vertical direction, the horizontal direction and each component in the drawings are only used for expressing the relative position, and are not drawn according to the actual scale, which is described in advance.

In the drawings of the present invention, the dotted lines are used to assist understanding, and are not meant to refer to a wired strip structure. In various embodiments of the present invention, units with the same names and labels will be described, which in principle means that the units have the same functions and functions in various embodiments. However, in the embodiments, if additional description is provided for the units, the additional description shall control.

Please refer to fig. 1A and 1B. Fig. 1A shows a bird's eye view of a composite capillary structure according to an embodiment of the present invention; fig. 1B shows a partial cross-sectional view of line a-a in the embodiment of fig. 1A of the present invention. For ease of reference and illustration, FIG. 1B only illustrates the right half of the cross-sectional view.

As shown in fig. 1A and 1B, in the present embodiment, the composite capillary structure 1 applied to the ultra-thin type uniform temperature plate assembly with a thickness of not more than 0.3mm comprises a groove 10, a powder sintered capillary structure 14 and a channel 17. The trench 10 is formed on a metal sheet V, and the trench 10 has a trench bottom 100 and a sidewall 101. The sintered powder capillary structure 14 is disposed on the bottom surface 100 of the trench, but is not formed to fill the bottom surface 100 of the trench, and the sintered powder capillary structure 14 includes a plurality of interconnected copper members to form a porous structure. Channels 17 are formed between the side walls 101 of the channel 10 and the powder sintered capillary structure 14, extending in the direction of the channel 10 and opening out at both ends of the channel 10.

The dotted thick frame circle in fig. 1A shows the composite capillary structure 1 of the present invention, which is composed of the grooves 10, the powder sintering capillary structure 14 and the channels 17, instead of only the powder sintering capillary structure 14. Two ends of the groove 10 respectively represent a heat absorption end and a condensation end of the ultra-thin type uniform temperature plate assembly, and if the upper part in fig. 1A is the heat absorption end, the lower part is the condensation end. The speed of the liquid phase working fluid passing to the heat absorption end along the groove 10 greatly influences the temperature equalizing and heat clearing functions of the ultra-thin type temperature equalizing plate assembly. In the prior art, it is generally believed that the grooves of the ultra-thin type isothermal plate assembly must be filled with capillary structures to maximize the capillary capacity. However, the applicant found in the intensive research that if a groove with a proper width and a channel 17 parallel to the flowing direction of the liquid phase working fluid 2 are designed on the capillary structure route for transporting the liquid phase working fluid 2, the pushing and transporting capacity of the liquid phase working fluid 2 can be greatly increased by the cooperation of the groove side wall 101, the powder sintering capillary structure 14 and the channel 17, and the prejudice in the field is broken through.

As shown in fig. 1B, the channels 17 are sandwiched by the sidewalls 101 of the grooves 10 and the powder sintered capillary structures 14, and the lower portion of the channels 17 is the groove bottom surface 100, not the powder sintered capillary structures 14. That is, at least one of the physical surfaces of the trench 17 is the surface of the trench 10, selected from the bottom surface 100 or the sidewall 101 of the trench; and on at least one other side is a powder sintered wick structure 14. In the preferred embodiment, at least one of the solid surfaces of the channel 17 is the trench floor 100 and at least one other surface is the powder sintered wick structure 14. In this section a-a, the bottoms of the two trenches 10 are isolated from each other. The two channels 10 can communicate through the two ends (heating end and condensing end) or the upper portion of the channels 10.

The powder sintered capillary structure 14 provides the basis of the adsorption capacity of the liquid-phase working fluid 2, that is, the capillary phenomenon. However, when the temperature equalization plate assembly is very thin (less than 0.3mm) and the distance between the heat absorption end and the condensation end is long, the powder sintering capillary structure 14 enables the liquid phase working fluid 2 to be broken and not to be easily condensed, and resistance is generated to slow down the speed of the liquid phase working fluid 2. On the other hand, the groove bottom surfaces 100 of the grooves 10 form a smooth surface without a powder sintered capillary structure, and can provide a sufficient cohesive force for the liquid-phase working fluid 2, so that the channels 17 can carry and transport an appropriate amount of the liquid-phase working fluid 2.

In this embodiment, the powder sintered capillary structure 14 and the channels 17 left in the grooves 10 without the powder sintered capillary structure 14 are designed with a careful ratio and configuration to produce a special effect. The channel 17 contains the condensed liquid-phase working fluid 2, where the liquid-phase working fluid 2 is easily pushed; the powder sintered capillary structure 14 having good porosity contains the liquid-phase working fluid 2 having directionality therein, where the liquid-phase working fluid 2 provides a kinetic energy vector. The flow velocity of the liquid-phase working fluid 2 in a given direction is greatly accelerated by the mutual cooperation of the channels 17, the side walls 101, and the powder sintered capillary structure 14. Since the channels 17 extend along the direction of the groove 10 and open to both ends of the groove 10, the liquid phase working fluid 2 condensed at the condensing end is rapidly transported to the heating end through the powder sintered capillary structure 14 and the channels 17 in the composite capillary structure 1.

In addition, the ultra-thin type temperature equalization plate component is provided with at least one supporting wall body 11 and an outermost side wall 12 which are separated into at least two grooves 10. The supporting wall body 11 extends from the heating end to the condensing end of the ultra-thin temperature equalization plate assembly. The heating end and the condensing end of the ultra-thin temperature equalizing plate component can be also provided with a plurality of supporting cylinders 15. The side wall 101 may be a side wall of the supporting wall 11 or a side wall of the side wall 12.

Please refer to fig. 2A and fig. 2B. Fig. 2A shows a bird's eye view of a composite capillary structure according to another embodiment of the present invention; figure 2B shows a partial cross-sectional view of line B-B of the embodiment of figure 2A of the present invention. For ease of reference and illustration, fig. 2B only illustrates the right half of the cross-sectional view.

As shown in fig. 2A and 2B, in the present embodiment, the composite capillary structure 1 applied to the ultra-thin type temperature equalization plate assembly includes a groove 10, a powder sintered capillary structure 14, and two channels 17. The trench 10 has two side walls 101. Two channels 17 are formed between two side walls 101 of the trench 10 and the middle powder sintered capillary structure 14, respectively, extending in the direction of the trench 10 and leading to two ends of the trench 10.

In this embodiment, two channels 17 are formed in the single groove 10 on both sides of the sintered powder capillary structure 14, which makes the distribution of the liquid phase working fluid 2 in the groove 10 more uniform, and contributes to the heat removal stability of the ultra-thin type isothermal plate assembly.

Please refer to fig. 3A and fig. 3B. Fig. 3A shows a bird's eye view of a composite capillary structure according to an embodiment of the present invention; fig. 3B shows a partial cross-sectional view of line C-C in the embodiment of fig. 3A of the present invention. For ease of reference and illustration, fig. 3B only illustrates the right half of the cross-sectional view.

As shown in fig. 3A and 3B, in the present embodiment, the composite capillary structure 1 applied to the ultra-thin type temperature equalization plate assembly includes a groove 10, a powder sintered capillary structure 14, and a channel 17. The trench 10 is formed on a metal sheet V, and the trench 10 has a trench bottom 100 and two trench sidewalls 101. The powder sintering capillary 14 is disposed on the trench bottom 100, and the powder sintering capillary 14 includes a plurality of copper members connected to each other to form a porous structure. A channel 17 is formed in the groove 10, extends in the direction of the groove 10 and opens to both ends of the groove 10, and the channel 17 divides the powder sintered capillary structure 14 into two sub-structures, each extending in the direction of the groove and opening to both ends of the groove.

In this embodiment, the channels 17 are not formed on the sides of the grooves, but are formed in the middle of the powder sintered capillary structure 14 and separate the powder sintered capillary structure 14. The two sub-structures of the powder sintered wick structure 14 are connected at both ends (heating end and condensing end).

It should be noted that in the present embodiment, the upper opening of the trench 17 is narrower than the bottom width of the trench 17. When the ultrathin uniform temperature plate assembly operates, the directions of the gas-phase working fluid and the liquid-phase working fluid in the same groove are opposite, so that frictional resistance is easily generated, and the flow rates of the gas-phase working fluid and the liquid-phase working fluid are weakened; when the upper opening of the channel 17 is narrow, the interface area of the gas-phase working fluid and the liquid-phase working fluid can be reduced, and further the frictional resistance can be reduced. In addition, when the ultra-thin type temperature equalization plate assembly is shaken up and down severely, the liquid phase working fluid 2 of the embodiment is not easy to be separated from the channel 17.

Please refer to fig. 4A and 4B. Fig. 4A shows a bird's eye view of a composite capillary structure according to an embodiment of the present invention; figure 4B shows a partial cross-sectional view of line D-D in the embodiment of figure 4A of the present invention. For ease of reference and illustration, fig. 4B only illustrates the right half of the cross-sectional view.

As shown in fig. 4A and 4B, in the present embodiment, the composite capillary structure 1 applied to the ultra-thin type temperature equalization plate assembly includes grooves 10, a powder sintered capillary structure 14, and a channel 17. The trench 10 is formed on a metal sheet V, and the trench 10 has a trench bottom 100 and two sidewalls 101. The powder sintering capillary 14 is disposed on the trench bottom 100 but not formed to fill the trench bottom 100, and the powder sintering capillary 14 includes a plurality of copper members connected to each other to form a porous structure. A channel 17 is formed in the groove 10, extends in the direction of the groove 10 and opens to both ends of the groove 10, and the channel 17 divides the powder sintered capillary structure 14 into two sub-structures, each extending in the direction of the groove and opening to both ends of the groove.

In this embodiment, channels 17 are formed in the middle of the powder sintered wick structure 14 and separate the powder sintered wick structure 14. In this embodiment, the upper opening of the channel 17 is wider than the bottom width of the channel 17.

Please refer to fig. 5. Fig. 5 shows a cross-sectional view of a powder sintered capillary structure in an embodiment of the invention. This embodiment illustrates that more than three channels 17 can be included in a composite capillary structure 1. The channel 17 may be formed both in the middle of the powder sintered wick structure 14 and between the powder sintered wick structure 14 and the sidewall 101. This embodiment also illustrates that on an ultra-thin uniform temperature plate assembly, there can be two different configurations of the composite wick structure 1, separated by the support wall 11. The composite capillary structure 1 may optionally be combined from the configurations described in the five embodiments.

In the above embodiments, as illustrated in fig. 1B, the depth D1 of the trench 10 is between 30 um and 150um, such as 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150um or the depth therebetween. The width D2 of the trench 10 is between 600-2000 um, such as 600, 800, 1000, 1200, 1400, 1600, 1800, 2000um or widths therebetween. The width D3 of the single channel 17 at the trench bottom 100 is between 10-200 um, such as 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 150, 200um or a width therebetween. If there are a plurality of channels 17 in the trench 10 of a composite capillary structure 1, the sum of the widths of the plurality of channels 17 at the bottom surface 100 of the trench is not more than 30% of the width of the trench 10.

The powder of the sintered capillary structure may be copper powder containing copper (Cu), copper alloy (Cu alloy), copper oxide (CuO), and copper suboxide (Cu) ₂ O), cupric oxide (Cu) ₂ O ₃ ) And the like.

Please refer to fig. 6. Fig. 6 shows a schematic diagram of a powder sintered capillary structure in an embodiment of the invention. The powder sintered wick structure 14 in this embodiment is primarily a combination of multiple copper members to form a porous structure, such as a rounded sphere-like copper member 148. The plurality of spheroidal copper members 148 are connected by high temperature (greater than 700 degrees C) sintering or joined to each other by low temperature (less than 500 degrees C) solder.

The sintered capillary structure 14 is formed by printing a copper powder paste in a pattern on the grooves and heating and sintering the paste. The copper powder slurry contains a plurality of copper particles, a polymer and an organic solvent. The trenches are formed after a heating process in areas of the trenches not printed with the copper powder slurry. The laying pattern of the slurry is limited by the steel plate, the screen plate and the baffle plate, so that the part with the printing slurry and the part without the printing slurry can be distinguished in the groove, and the trend of the channel is designed.

Please refer to fig. 7. Fig. 7 shows a schematic diagram of a powder sintered capillary structure in another embodiment of the invention. In this embodiment, the powder sintering capillary structure 14 includes a plurality of chain-shaped copper members 147 formed by sintering cuprous oxide particles and a plurality of spheroidal copper members 148 formed by sintering copper particles, the chain-shaped copper members 147 are bonded to each other in a three-dimensional direction, the spheroidal copper members 148 are dispersed among the chain-shaped copper members, a plurality of pores are formed between the chain-shaped copper members 147 and the spheroidal copper members 148, an average width of the chain-shaped copper members 147 is less than 3um, and an average width of the spheroidal copper members 148 is greater than 10 um.

When the hexagonal octahedral fusiform cuprous oxide particles are sintered in a hydrogen-containing atmosphere, the cuprous oxide particles are gradually reduced into copper, and simultaneously the copper is outwards stretched along the two farthest end points to form a chain-shaped copper member. The powder sintered wick structure 14 in this embodiment has a better wicking capability. Spheroidal copper particles with a particle size of about 5-53 um are formed and distributed among chain-shaped copper components during sintering, and can be used as a main body of an integral capillary structure.

In summary, when the isothermal plate assembly is very thin (less than 0.3mm) and the distance between the heat absorption end and the condensation end is long, the conventional capillary structure is not easy to push the liquid phase working fluid to be transported from the condensation end to the heat absorption end. The utility model discloses a combined type capillary structure comprises slot, powder sintering capillary structure and channel three jointly. In the channels, the condensed liquid phase working fluid is easily pushed to be transported; the porous powder sintered capillary structure provides directional kinetic energy vector for the liquid phase working fluid. Under the synergistic effect of the groove side wall, the powder sintering capillary structure and the channel, the flow velocity of the liquid phase working fluid in the specified direction is greatly accelerated.

The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the invention by the above disclosed preferred embodiments. On the contrary, the intention is to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. The scope of the claims is thus to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.

Claims

1. A composite capillary structure applied to an ultra-thin type uniform temperature plate component is formed on a metal sheet, and is characterized in that the composite capillary structure comprises:

and the channel is formed between the side wall of the groove and the powder sintering capillary structure, extends along the direction of the groove and leads to two ends of the groove.

2. The composite capillary structure of claim 1 wherein the sintered powder capillary structure is a copper powder paste that is patterned printed and laid into the grooves and heated to form the capillary structure in the grooves.

3. The composite capillary structure of claim 1 wherein the groove further has two sidewalls, the composite capillary structure further comprising two channels formed between the two sidewalls of the groove and the sintered powder capillary structure.

4. The composite capillary structure of claim 1 wherein the depth of the groove is no greater than 150um and the width of the groove is no greater than 2000 um.

5. The composite capillary structure of claim 4 wherein the channel has a width at the bottom of the trench that is greater than 10 um.

6. A composite capillary structure applied to an ultra-thin type uniform temperature plate component is formed on a metal sheet, and is characterized in that the composite capillary structure comprises:

a trench formed on the metal sheet, the trench having a trench bottom surface;

and the channel is formed in the groove, extends along the groove direction and leads to two ends of the groove, and divides the powder sintering capillary structure into two substructures which respectively extend along the groove direction and lead to two ends of the groove.

7. The composite capillary structure of claim 6 wherein the sintered powder capillary structure is formed by a copper powder paste that is patterned printed into the grooves and heated.

8. The composite capillary structure of claim 6 wherein the channel has an upper opening that is less wide than the width of the bottom of the channel.

9. The composite capillary structure of claim 6 wherein the depth of the groove is no greater than 150um and the width of the groove is no greater than 2000 um.

10. The composite capillary structure of claim 9 wherein the channels have a width greater than 10um at the bottom of the trench.