CN114800622B

CN114800622B - Semiconductor equipment mechanical arm deviation detection method and device

Info

Publication number: CN114800622B
Application number: CN202210738265.6A
Authority: CN
Inventors: 阮正华; 孙文彬
Original assignee: Jiangsu Yiwen Microelectronics Technology Co Ltd; Advanced Materials Technology and Engineering Inc
Current assignee: Wuxi Yiwen Microelectronics Technology Co ltd; Jiangsu Yiwen Microelectronics Technology Co Ltd
Priority date: 2022-06-28
Filing date: 2022-06-28
Publication date: 2022-09-23
Anticipated expiration: 2042-06-28
Also published as: CN114800622A

Abstract

The application provides a semiconductor equipment mechanical arm deviation detection method and device, the semiconductor equipment comprises a mechanical arm and two elastic sensors which are respectively arranged at the upper left extreme position and the lower right extreme position, or the lower left extreme position and the upper right extreme position of the bottom surface of the mechanical arm when the mechanical arm is at a first preset position, the method comprises the following steps: the method comprises the steps of controlling the mechanical arm to move by taking a first preset position as a target position at a preset time point in the working process of the mechanical arm, controlling the mechanical arm to move downwards until contacting at least one elastic sensor under the condition that the mechanical arm finishes moving and does not contact the elastic sensor, determining a horizontal deviation detection result according to a first feedback signal of the elastic sensor, controlling the mechanical arm to vertically move based on a target pressing distance, determining a vertical deviation detection result according to a second feedback signal of the elastic sensor, determining a mechanical arm deviation detection result according to the horizontal and vertical deviation detection results, and efficiently and timely detecting deviation in the working process of the mechanical arm.

Description

Semiconductor equipment mechanical arm deviation detection method and device

Technical Field

The application relates to the technical field of semiconductors, in particular to a semiconductor equipment mechanical arm deviation detection method and device.

Background

Semiconductor processing equipment generally adopts a mechanical arm to realize the transmission of wafers among various equipment parts, and in order to fully utilize the internal space of the equipment, the various parts in the equipment are arranged in the most compact mode, and only limited moving space is reserved for movable parts such as the mechanical arm and the like. Therefore, the semiconductor process equipment has very high requirements on the motion precision of the mechanical arm, and if the motion precision of the mechanical arm deviates, accidents such as wafer conveying failure and impact of the mechanical arm on other equipment parts can be caused. However, in the semiconductor processing equipment, the parts of the mechanical arm are easily damaged in the ultra-high temperature, vacuum or ultra-high pressure working environment, so that the mechanical arm generates deviation during conveying.

In the prior art, the deviation of the mechanical arm is manually detected through professional detection equipment when the semiconductor process equipment is regularly maintained, time and labor are consumed, and the deviation generated in the working process of the mechanical arm cannot be timely responded due to the long period of regular maintenance. Meanwhile, because the deviation of the mechanical arm is gradually accumulated, the prior art cannot accurately estimate the maintenance time of the mechanical arm, and further, the production accidents caused by the deviation of the mechanical arm are frequent.

Disclosure of Invention

The application provides a method and a device for detecting the deviation of a mechanical arm of semiconductor equipment, which are used for accurately detecting the deviation generated in the working process of the mechanical arm efficiently and timely, accurately estimating the maintenance opportunity of the mechanical arm and avoiding production accidents caused by the deviation of the mechanical arm.

The application provides a semiconductor equipment arm deviation detection method, semiconductor equipment contains arm and two elastic sensor, two elastic sensor set up respectively in first check point and second check point, first check point with the second check point is respectively when the arm is in first default position the upper left extreme position and the lower right extreme position of arm bottom surface, or lower left extreme position and upper right extreme position, the method includes:

controlling the mechanical arm to move by taking the first preset position as a target position at a preset mechanical arm deviation detection node, controlling the mechanical arm to vertically move downwards until the mechanical arm contacts at least one elastic sensor under the condition that the mechanical arm finishes moving and does not contact the elastic sensor, and determining a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor; the preset mechanical arm deviation detection node is a preset time point in the working process of the mechanical arm;

controlling the mechanical arm to vertically move based on a target pressing distance, and determining a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving;

and determining a mechanical arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result.

According to the method for detecting the deviation of the mechanical arm of the semiconductor equipment, the deviation detection result of the mechanical arm is used for indicating the expected time for maintaining the mechanical arm, and correspondingly, the deviation detection result of the mechanical arm is determined according to the horizontal deviation detection result and the vertical deviation detection result, and the method specifically comprises the following steps:

determining the variation trend of the vertical deviation of the mechanical arm based on the current mechanical arm deviation detection nodes and the vertical deviation detection results corresponding to the mechanical arm deviation detection nodes with the preset number in front of the current mechanical arm deviation detection nodes;

and determining the expected time for maintaining the mechanical arm based on the variation trend of the vertical deviation of the mechanical arm.

According to the semiconductor equipment mechanical arm deviation detection method provided by the application, the mechanical arm deviation detection result is used for indicating whether the mechanical arm needs to be maintained, correspondingly, the mechanical arm deviation detection result is determined according to the horizontal deviation detection result and the vertical deviation detection result, and the method specifically comprises the following steps:

determining whether the mechanical arm has a deviation in the horizontal direction and the vertical direction based on the horizontal deviation detection result and the vertical deviation detection result;

and determining the deviation detection result of the mechanical arm as the need of maintenance under the condition that the horizontal direction of the mechanical arm has deviation or the vertical direction deviation value of the mechanical arm exceeds a preset threshold value.

According to the semiconductor equipment mechanical arm deviation detection method, the horizontal deviation detection result comprises a judgment result of whether the deviation exists in the horizontal direction and a corresponding deviation direction, and the vertical deviation detection result comprises a judgment result of whether the deviation exists in the vertical direction and a corresponding deviation value.

According to the method for detecting the deviation of the mechanical arm of the semiconductor equipment, the horizontal deviation detection result of the mechanical arm is determined according to the first feedback signal of the at least one elastic sensor, and the method specifically comprises the following steps:

and determining whether the horizontal direction has deviation or not based on the number of the first feedback signals, and determining the deviation direction based on the elastic sensor corresponding to the first feedback signals.

According to the method for detecting the deviation of the mechanical arm of the semiconductor equipment, the vertical deviation detection result of the mechanical arm is determined according to the second feedback signal of the at least one elastic sensor and the target pressing distance, and the method specifically comprises the following steps:

and determining whether a deviation exists in the vertical direction and a corresponding deviation value based on the displacement distance indicated by the second feedback signal and the difference value of the target pressing distance.

According to the semiconductor equipment mechanical arm deviation detection method provided by the application, after the mechanical arm is controlled to move by taking the first preset position as a target position, the method further comprises the following steps:

and under the condition that the mechanical arm finishes moving and contacts at least one elastic sensor, determining a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor.

The application still provides a semiconductor equipment arm deviation detection device, semiconductor equipment contains arm and two elastic sensor, two elastic sensor set up respectively in first check point and second check point, first check point with the second check point is respectively when the arm is in first default position the extreme value position under the upper left side and the extreme value position under the right side of arm bottom surface, or extreme value position and upper right extreme value position under the left side, the device includes:

the horizontal deviation detection result determining module is used for controlling the mechanical arm to move by taking the first preset position as a target position at a preset mechanical arm deviation detection node, controlling the mechanical arm to vertically move downwards until the mechanical arm contacts at least one elastic sensor under the condition that the mechanical arm finishes moving and does not contact the elastic sensor, and determining a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor; the preset mechanical arm deviation detection node is a preset time point in the working process of the mechanical arm;

the vertical deviation detection result determining module is used for controlling the mechanical arm to vertically move based on a target pressing distance, and determining a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving;

and the mechanical arm deviation detection result determining module is used for determining a mechanical arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result.

The present application also provides a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of the semiconductor device robot arm deviation detecting method as recited in any one of the above.

The present application also provides a computer program product comprising a computer program which, when executed by a processor, implements the steps of the semiconductor device robot arm deviation detecting method as described in any of the above.

The application provides a method and a device for detecting the deviation of a mechanical arm of semiconductor equipment, the semiconductor equipment comprises the mechanical arm and two elastic sensors, the two elastic sensors are respectively arranged at a first detection point and a second detection point, the first detection point and the second detection point are respectively the upper left extreme value position and the lower right extreme value position or the lower left extreme value position and the upper right extreme value position of the bottom surface of the mechanical arm when the mechanical arm is positioned at a first preset position, controlling the mechanical arm to move by taking the first preset position as a target position at a preset mechanical arm deviation detection node, controlling the mechanical arm to move vertically downwards until at least one elastic sensor is contacted under the condition that the mechanical arm finishes moving and does not contact the elastic sensor, determining a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor; the preset mechanical arm deviation detection node is a preset time point in the working process of the mechanical arm; controlling the mechanical arm to vertically move based on a target pressing distance, and determining a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving; and determining a mechanical arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result, wherein the mechanical arm deviation detection result is used for indicating the expected time for maintaining the mechanical arm, so that the deviation generated in the mechanical arm working process can be accurately detected in high efficiency and in time, the maintenance time of the mechanical arm can be accurately estimated, and the production accident caused by the mechanical arm deviation can be avoided.

Drawings

In order to more clearly illustrate the technical solutions in the present application or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic flow chart of a method for detecting a deviation of a robot arm of a semiconductor device according to the present disclosure;

FIGS. 2A-2C are top views of the robotic arm and elastic sensor in different bottom surface shapes without deflection as provided herein;

3A-3C are front views of the robotic arm and elastic sensor positional relationships provided herein for different floor shapes without deflection;

FIG. 4 is a schematic diagram illustrating a positional relationship between a robot arm and an elastic sensor when a deviation occurs, according to the present disclosure;

FIG. 5 is a second schematic diagram illustrating a positional relationship between the robot arm and the elastic sensor when a deviation occurs according to the present application;

FIG. 6 is a third schematic diagram illustrating a positional relationship between the robot arm and the elastic sensor when a deviation occurs, according to the present disclosure;

FIG. 7 is a schematic structural diagram of a semiconductor device robot arm deviation detecting apparatus provided in the present application;

fig. 8 is a schematic structural diagram of an electronic device provided in the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings in the present application, and it is obvious that the described embodiments are some, but not all embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Fig. 1 is a schematic flow chart of a method for detecting a deviation of a mechanical arm of a semiconductor device according to the present application, where the semiconductor device includes the mechanical arm and two elastic sensors, the two elastic sensors are respectively disposed at a first detection point and a second detection point, and the first detection point and the second detection point are respectively an upper left extreme position and a lower right extreme position, or a lower left extreme position and an upper right extreme position, of the bottom surface of the mechanical arm when the mechanical arm is at a first preset position. As shown in fig. 1, the method includes:

step S101, controlling the mechanical arm to move by taking the first preset position as a target position at a preset mechanical arm deviation detection node, controlling the mechanical arm to vertically move downwards until contacting at least one elastic sensor under the condition that the mechanical arm finishes moving and does not contact the elastic sensor, and determining a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor; and the preset mechanical arm deviation detection node is a preset time point in the working process of the mechanical arm.

Specifically, the embodiment of the application can realize the detection of the deviation of the mechanical arm by arranging two elastic sensors in the semiconductor equipment. The elastic sensor can detect self deformation and displacement, and based on the deformation and displacement signals fed back by the elastic sensor, accurate detection of horizontal and vertical direction deviation of the mechanical arm can be realized. It is to be understood that the elastic sensor may be a single sensor capable of detecting deformation and displacement simultaneously, or may be a combination of multiple sensors capable of detecting deformation and displacement respectively, which is not specifically limited in this embodiment of the present application.

For a specific measurement principle, the inventor of the application finds that the bottom surface of the existing mechanical arm is generally in a regular pattern (such as a rectangle), and therefore, only two elastic sensors are needed to be arranged at the upper left extreme position and the lower right extreme position, or the lower left extreme position and the upper right extreme position of the bottom surface of the mechanical arm when the mechanical arm is at a first preset position, so that the horizontal and vertical deviations of the mechanical arm can be captured. It is understood that the first preset position may be any position on the working path of the robot arm, and this is not particularly limited in this embodiment of the present application. Because the work flow of the mechanical arm is controlled by the program instructions, the moving route of the mechanical arm corresponds to the related program instructions in the standardized operation process of the mechanical arm. Therefore, the first preset position is set to be any position on the working route of the mechanical arm, the corresponding control instruction can be rapidly determined, and the deviation detection efficiency is guaranteed. For clear description of the positional relationship of the robot arm and the elastic sensor, the following description will be made with reference to the accompanying drawings:

fig. 2A to 3C are schematic diagrams illustrating a positional relationship between a robot arm and an elastic sensor when no deviation occurs, fig. 2A to 2C are plan views illustrating a positional relationship between a robot arm and an elastic sensor having different bottom surface shapes when no deviation occurs, respectively, and fig. 3A to 3C are front views illustrating a positional relationship between a robot arm and an elastic sensor having different bottom surface shapes corresponding to fig. 2A to 2C when no deviation occurs, respectively. Wherein the quadrilateral shape of fig. 2A-3C represents the robotic arm, the circular symbol represents the elastic sensor, and subsequent fig. 4-6 continue this representation for ease of illustration. As shown in fig. 2A-3C, when the robot arm is not deviated (i.e. is exactly at the first preset position), the two elastic sensors are respectively located at the upper left extreme position and the lower right extreme position of the bottom surface of the robot arm (as shown in fig. 2A-2C), and of course, may also be located at the lower left extreme position and the upper right extreme position. For the sake of detection convenience, the shape of the elastic sensor is preferably regular (for example, spherical or cubic), and in conjunction with fig. 2A-3C, the elastic sensor is described as spherical, and in consideration of the volume of the elastic sensor, when the robot arm is not deviated, the upper left extreme position of the bottom surface of the robot arm (i.e., the upper left corner of the quadrangle in fig. 2A-2C) should be in contact with the upper hemisphere of the corresponding elastic sensor (as shown in fig. 3A-3C), and the lower right extreme position of the bottom surface of the robot arm (i.e., the lower right corner of the quadrangle in fig. 2A-2C) should also be in contact with the upper hemisphere of the corresponding elastic sensor (as shown in fig. 3A-3C). It will be appreciated that the volume of the elastic sensor will be set small enough to be ignored to avoid introducing errors in the detection of deviations in the horizontal direction (the corresponding circular markings of the elastic sensor in fig. 2A-3C are for convenience of illustration only and do not constitute a limitation on the size of the elastic sensor volume). It should be noted that the elastic sensor arrangement provided in the embodiments of the present application is suitable for detecting the deviation of a mechanical arm of any shape, and fig. 2A to 3C are only used as a partial example, and the embodiments of the present application are not exhaustive for the sake of simplifying the disclosure.

Based on the setting of above-mentioned elastic sensor, can accurate detection arm horizontal direction and the deviation in the vertical direction. Specifically, the following describes the deviation detection flow in detail in the case where the bottom surface of the robot arm is rectangular in shape (corresponding to fig. 2A and 3A): fig. 4-6 are schematic diagrams illustrating the positional relationship between the robot arm and the elastic sensor when the robot arm is deviated to the left (similarly to the case of deviation to the right when the robot arm is deviated to the left, and not shown), fig. 4 is a plan view illustrating the positional relationship between the robot arm and the elastic sensor when the robot arm is deviated to the lower (similarly to the case of deviation to the upper and not shown), and fig. 5, in conjunction with fig. 2A and fig. 4-5, it can be seen that the bottom surface of the robot arm can simultaneously contact with the two elastic sensors only when the robot arm is not deviated to the horizontal direction, and cannot simultaneously contact with the two elastic sensors when the robot arm is deviated to the upper and lower direction and/or to the left and right when the robot arm is deviated to the horizontal direction, and therefore, based on the number of contact signals (i.e., the first feedback signals) fed back by the elastic sensors, whether the horizontal direction of the mechanical arm has deviation can be judged, and the deviation direction can be determined based on the position of the elastic sensor corresponding to the first feedback signal, for example, the elastic sensor corresponding to the first feedback signal in fig. 4 is located at the upper left corner, so that the horizontal deviation direction can be judged to be left or upward. It is worth noting that the mechanical arm belongs to a precision instrument, the deviation of the mechanical arm is gradually accumulated, and the deviation in a short period is not large, so that for the deviation in the horizontal direction, between two mechanical arm deviation detection nodes, the situation that the bottom surface of the mechanical arm cannot be contacted with two elastic sensors due to the horizontal deviation of the mechanical arm cannot occur, namely the mechanical arm is contacted with at least one elastic sensor, and based on the situation, the deviation in the horizontal direction can be accurately detected by the embodiment of the application.

Fig. 6 is a front view showing a comparison of the positional relationship between the robot arm and the elastic sensor when there is no deviation and when there is a vertical downward deviation (similarly to the case of the vertical upward deviation, not shown here). The left side is a schematic diagram of the position relationship between the mechanical arm and the elastic sensor when no deviation exists, and the right side is a schematic diagram of the position relationship between the mechanical arm and the elastic sensor when vertical downward deviation exists. It should be noted that, under the action of the robot arm, the elastic sensor can move vertically downward (i.e. move vertically downward with the detection point as a starting point) based on the corresponding mounting component (e.g. a spring or other telescopic component), and when the action of the robot arm is eliminated, the elastic sensor can automatically return to the corresponding detection point position. Based on this, when the deviation of the mechanical arm in the vertical direction occurs, the moving distance of the mechanical arm can be determined based on the moving distance of the elastic sensor, and then the accurate detection of the vertical deviation can be carried out. Based on the characteristic that the elastic sensor can automatically return to the corresponding detection point position, the deviation detection in the vertical direction can be carried out for multiple times at one mechanical arm deviation detection node, so that the error caused by single detection is avoided. It is understood that the elastic sensor may be fixedly disposed, and accordingly, the moving distance of the robot arm may be determined based on the deformation amount of the elastic sensor, so as to perform accurate detection of the vertical deviation.

Based on the principle, the embodiment of the application can set the mechanical arm deviation detection node at the preset time point in the working process of the mechanical arm, so that the deviation condition of the mechanical arm can be mastered in time, and targeted maintenance measures can be made. It should be understood that the robot deviation detecting node may be any time point in the robot working process, for example, before a batch of wafers are processed by the robot each time, or a certain time point in the process of a batch of wafers, or a certain time point in a day, which is not specifically limited in this embodiment of the present application.

As for a specific detection process, the mechanical arm is first controlled to move with the first preset position as a target position, that is, a control instruction is sent to the mechanical arm, and the mechanical arm moves with the first preset position as the target position. It will be appreciated that the current position of the robotic arm is known and, once the target position is determined, the corresponding control command can be determined. However, the control command is issued when the default robot arm has no deviation, and therefore, if the robot arm has a deviation, the robot arm cannot move to the first preset position. It should be noted that, when there is a vertical downward deviation, the bottom surface of the mechanical arm may not normally contact the elastic sensor when the mechanical arm moves to the first predetermined position, so that the mechanical arm cannot measure the vertical deviation based on the elastic sensor. Based on this, when the mechanical arm is controlled to move with the first preset position as the target position, the mechanical arm is firstly allowed to vertically move upwards for a preset distance, so as to ensure that the mechanical arm does not collide with the elastic sensor in the horizontal movement process. After the mechanical arm is controlled to move vertically upwards for a preset distance, the mechanical arm is controlled to move along a target position in the horizontal direction, and it can be understood that after the mechanical arm is moved in the horizontal direction, the mechanical arm is located above the target position. And then controlling the mechanical arm to move vertically downwards until the mechanical arm finishes moving (namely executing the control command). It can be understood that, in the step of controlling the robot arm to move with the first preset position as the target position, only the command of moving vertically upward for the preset distance and the command of moving vertically downward for the same distance need to be added to the control command, and the original control command and the control effect are not affected.

Because the mechanical arm may have a vertical upward deviation, when the mechanical arm finishes moving, there may be a case where the mechanical arm does not contact the elastic sensor (i.e., the mechanical arm may be located above the elastic sensor), and based on this, in the case where the mechanical arm finishes moving and does not contact the elastic sensor, the embodiment of the present application controls the mechanical arm to vertically move downward until contacting at least one elastic sensor, so as to ensure that subsequent horizontal and vertical deviations can be normally detected. The judgment of whether the mechanical arm contacts the elastic sensor may be determined based on a feedback signal of the elastic sensor, that is, when the mechanical arm contacts the elastic sensor, the elastic sensor may feed back a contact signal, for example, the contact signal is generated based on self-deformation, and certainly, the contact signal may also be generated by other detection methods, which is not specifically limited in this embodiment of the present disclosure. Based on the principle, after the mechanical arm is controlled to vertically move downwards until the mechanical arm contacts at least one elastic sensor, the horizontal deviation detection result of the mechanical arm can be determined according to the first feedback signal of the at least one elastic sensor.

And S102, controlling the mechanical arm to vertically move based on a target pressing distance, and determining a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving.

Specifically, after determining the horizontal deviation detection result of the mechanical arm, the vertical deviation detection may be performed. Based on the foregoing detection principle, the specific detection mode of the vertical deviation is as follows:

and controlling the mechanical arm to vertically move based on a target pressing distance, and determining a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving. Based on the foregoing detection principle, the second feedback signal can indicate an actual pressing distance of the robot arm. It is understood that, if there is no deviation in the vertical direction of the robot arm, the actual pressing distance is the same as the target pressing distance. If the difference exists between the two, the deviation of the mechanical arm in the vertical direction can be judged, and the deviation value of the mechanical arm in the vertical direction can be determined based on the difference value of the two.

And S103, determining a mechanical arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result.

Specifically, a mechanical arm deviation detection result can be determined according to the horizontal deviation detection result and the vertical deviation detection result. It is understood that the robot arm deviation detection result may include a deviation determination result such as whether there is a deviation in the horizontal and vertical directions and a deviation value in the corresponding horizontal and vertical directions, further may include a determination result indicating whether maintenance is required based on the deviation determination result, and further may include an expected time for robot arm maintenance.

The method provided by the embodiment of the application comprises the steps that the semiconductor equipment comprises a mechanical arm and two elastic sensors, the two elastic sensors are respectively arranged at a first detection point and a second detection point, the first detection point and the second detection point are respectively the upper left extreme value position and the lower right extreme value position or the lower left extreme value position and the upper right extreme value position of the bottom surface of the mechanical arm when the mechanical arm is positioned at a first preset position, controlling the mechanical arm to move by taking the first preset position as a target position at a preset mechanical arm deviation detection node, controlling the mechanical arm to move vertically downwards until at least one elastic sensor is contacted under the condition that the mechanical arm finishes moving and does not contact the elastic sensor, determining a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor; the preset mechanical arm deviation detection node is a preset time point in the working process of the mechanical arm; controlling the mechanical arm to vertically move based on a target pressing distance, and determining a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving; and determining a mechanical arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result, and accurately detecting the deviation generated in the mechanical arm working process in high efficiency and time to avoid production accidents caused by mechanical arm deviation.

Based on the above embodiment, the determining the mechanical arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result specifically includes:

determining an expected time for performing maintenance on the robot arm based on a trend of variation in vertical deviation of the robot arm.

Specifically, because the deviation of the mechanical arm is gradually accumulated, in the prior art, because the period of regular maintenance is long, the detection result of the previous maintenance node may not need maintenance, but before the next maintenance node, the deviation of the mechanical arm may reach the maintenance critical point. Based on this, prior art can not in time deal with the production accident that the arm deviation leads to, nevertheless if in order to in time deal with, blindly shorten the maintenance cycle and can cause the waste of a large amount of manpower and materials again. Therefore, it is necessary to estimate the maintenance time of the robot arm to ensure timely handling of the robot arm deviation and reduce the occurrence rate of production accidents caused by the robot arm deviation on the basis of reducing the consumption of manpower and material resources to the maximum extent.

Based on the above, the embodiment of the application indicates the expected time for performing maintenance on the robot arm through the robot arm deviation detection result. The method comprises the following specific steps:

and determining the variation trend of the vertical deviation of the mechanical arm based on the current mechanical arm deviation detection nodes and the vertical deviation detection results corresponding to the mechanical arm deviation detection nodes with the preset number in front of the current mechanical arm deviation detection nodes. It should be noted that the embodiment of the present application only predicts the variation trend of the vertical deviation of the mechanical arm, and the reason is that: in the actual process of the wafer, the wafer is transported into the process chambers through the mechanical arm, and therefore each process chamber is provided with a corresponding wafer inlet. The shape of the wafer inlet is generally rectangular, the wafer inlet is arranged to be small in order to ensure the process environment in the process chamber, the wafer is generally horizontally placed into the process chamber, and the wafer is thin, so that when the wafer is fed into the wafer inlet of the process chamber by the mechanical arm, more allowance exists in the space of the wafer in the vertical direction, and the allowance in the horizontal direction is low (because the wafer inlet is narrow in the horizontal direction, the wafer can pass through smoothly). Therefore, once the mechanical arm has a deviation in the horizontal direction, a production accident may be caused, i.e., immediate maintenance is required. When the deviation exists in the vertical direction, as the space of the wafer in the vertical direction has more allowance, the corresponding tolerance value exists for the deviation of the mechanical arm in the vertical direction, and the mechanical arm can work normally as long as the vertical deviation of the mechanical arm does not exceed the tolerance value.

Based on this, it is determined when the expected time for servicing the robot arm will actually be an estimate of when the vertical deviation of the robot arm will exceed the tolerance. Simultaneously, the deviation that combines the arm is the characteristic of accumulation gradually, and this application embodiment is through based on current arm deviation detection node and the vertical deviation testing result that the arm deviation detection node of preset quantity corresponds before the current arm deviation detection node is confirmed the trend of change of the vertical deviation of arm, promptly through the analysis the time that needs maintain is estimated to the accumulation law of vertical deviation. Specifically, the corresponding relation between the deviation value in the vertical direction and the working time of the mechanical arm or the number of times that the mechanical arm transmits the wafer can be determined through the vertical deviation detection result corresponding to each mechanical arm deviation detection node, based on the corresponding relation, the variation trend of the corresponding relation between the deviation value in the vertical direction and the working time of the mechanical arm or the number of times that the mechanical arm transmits the wafer can be determined through the vertical deviation detection results obtained by the plurality of mechanical arm deviation detection nodes, and then the working time of the mechanical arm or the number of times that the mechanical arm transmits the wafer corresponding to the deviation value reaches the tolerance value can be determined. The variation trend can be specifically fitted with a variation curve of the corresponding relation between the deviation value in the vertical direction and the working time of the mechanical arm or the number of times of wafer transmission by the mechanical arm through a least square method, and then the expected time for maintaining the mechanical arm is accurately estimated. Of course, any other method may be used to determine the trend of the vertical deviation of the mechanical arm, and this is not particularly limited in the embodiments of the present application. Correspondingly, when the expected time for maintaining the mechanical arm, namely the deviation value reaches a tolerance value, the working time of the corresponding mechanical arm or the time corresponding to the times of transmitting the wafer by the mechanical arm.

The method provided by the embodiment of the application is based on the current mechanical arm deviation detection node and the vertical deviation detection result corresponding to the mechanical arm deviation detection nodes with the preset number in front of the current mechanical arm deviation detection node, the change trend of the vertical deviation of the mechanical arm is determined, the expected time for maintaining the mechanical arm is determined based on the change trend of the vertical deviation of the mechanical arm, the expected time for maintaining the mechanical arm can be accurately estimated, the timeliness for responding to the mechanical arm deviation is further improved, and production accidents caused by the mechanical arm deviation are avoided.

Based on any of the above embodiments, the robot arm deviation detection result is used to indicate whether the robot arm needs to be maintained, and correspondingly, the determining the robot arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result specifically includes:

and determining that the deviation detection result of the mechanical arm is required to be maintained under the condition that the horizontal direction of the mechanical arm has deviation or the vertical direction deviation value of the mechanical arm exceeds a preset threshold value.

Specifically, based on the foregoing embodiments, in the wafer processing process, tolerance for deviation in the horizontal direction of the robot arm is very low, and therefore, when it is determined that the horizontal direction of the robot arm has deviation, the embodiment of the present application determines that the robot arm deviation detection result is that maintenance needs to be performed, thereby avoiding production accidents caused by the horizontal direction deviation of the robot arm to the maximum extent. Correspondingly, in the wafer processing process, certain tolerance exists for the deviation in the vertical direction of the mechanical arm, so that the deviation detection result of the mechanical arm is determined to be required to be maintained only under the condition that the deviation value in the vertical direction of the mechanical arm is judged to exceed a preset threshold value (namely the tolerance value).

The method that this application embodiment provided, based on horizontal deviation testing result with vertical deviation testing result confirms whether arm horizontal direction and vertical direction have the deviation the arm horizontal direction has the deviation or under the circumstances that the deviation value of arm vertical direction surpassed preset threshold value, confirms arm deviation testing result maintains for needs, can accurately judge whether the arm needs to maintain at present, guarantees the promptness that the arm deviation was answered, avoids the production accident that the arm deviation arouses, can avoid unnecessary maintenance as far as possible simultaneously, and manpower and materials are saved guarantees the technology progress.

According to any of the above embodiments, the horizontal deviation detection result includes a determination result of whether there is a deviation in the horizontal direction and a corresponding deviation direction, and the vertical deviation detection result includes a determination result of whether there is a deviation in the vertical direction and a corresponding deviation value.

Specifically, the corresponding principle has been described in detail in the foregoing embodiments, and is not described herein again.

According to the method provided by the embodiment of the application, the horizontal deviation detection result comprises the judgment result of whether the deviation exists in the horizontal direction and the corresponding deviation direction, the vertical deviation detection result comprises the judgment result of whether the deviation exists in the vertical direction and the corresponding deviation value, and the accuracy of the mechanical arm deviation detection result can be ensured.

Based on any one of the above embodiments, the determining a horizontal deviation detection result of the mechanical arm according to the first feedback signal of the at least one elastic sensor specifically includes:

Specifically, when the number of the first feedback signals is two (i.e., both the elastic sensors detect contact with the robot arm), it is determined that there is no deviation. When the number of the first feedback signals is one (namely, only one elastic sensor detects the contact with the mechanical arm), the deviation is judged to exist. Meanwhile, determining a deviation direction based on the elastic sensor corresponding to the first feedback signal, and referring to fig. 4-5, if the elastic sensor corresponding to the first feedback signal is an elastic sensor at the upper left corner, the corresponding deviation direction is horizontal to the left or upward; if the elastic sensor corresponding to the first feedback signal is the elastic sensor at the lower right corner, the corresponding deviation direction is horizontal rightward or downward. Based on this, the horizontal deviation of the robot arm can be accurately determined.

According to the method provided by the embodiment of the application, whether deviation exists in the horizontal direction is determined based on the number of the first feedback signals, the deviation direction is determined based on the elastic sensor corresponding to the first feedback signals, and the horizontal deviation of the mechanical arm can be accurately determined.

Based on any one of the above embodiments, the determining a vertical deviation detection result of the mechanical arm according to the second feedback signal of the at least one elastic sensor and the target pressing distance specifically includes:

Specifically, based on the displacement distance indicated by the second feedback signal and the difference between the target depression distances, it can be determined whether there is a deviation in the vertical direction and a corresponding deviation value. For example, if the difference is a positive value, there is a downward deviation in the vertical direction, and if the difference is a negative value, there is an upward deviation in the vertical direction, and the corresponding deviation value is an absolute value of the difference. The corresponding principle has been described in detail in the foregoing embodiments, and is not described herein again.

According to the method provided by the embodiment of the application, whether deviation exists in the vertical direction and a corresponding deviation value is determined based on the displacement distance indicated by the second feedback signal and the difference value of the target pressing distance, and the vertical deviation of the mechanical arm can be accurately determined.

Based on any embodiment, after the controlling the mechanical arm to move with the first preset position as the target position, the method further includes:

Specifically, when the mechanical arm finishes moving and contacts at least one elastic sensor, the horizontal deviation detection result of the mechanical arm can be determined directly according to the first feedback signal of the at least one elastic sensor, and the mechanical arm does not need to be controlled to be pressed down. Based on this, the high efficiency of the horizontal deviation detection result of the mechanical arm can be ensured.

According to the method provided by the embodiment of the application, under the condition that the mechanical arm finishes moving and contacts with at least one elastic sensor, the horizontal deviation detection result of the mechanical arm is determined according to the first feedback signal of the at least one elastic sensor, and the high efficiency of the horizontal deviation detection result of the mechanical arm is ensured.

The semiconductor device robot deviation detecting apparatus provided by the present application is described below, and the semiconductor device robot deviation detecting apparatus described below and the semiconductor device robot deviation detecting method described above may be referred to in correspondence with each other.

Based on any of the above embodiments, fig. 7 is a schematic structural diagram of a semiconductor device mechanical arm deviation detecting apparatus provided in the present application, where the semiconductor device includes a mechanical arm and two elastic sensors, the two elastic sensors are respectively disposed at a first detection point and a second detection point, and the first detection point and the second detection point are respectively an upper left extreme position and a lower right extreme position, or a lower left extreme position and an upper right extreme position, of a bottom surface of the mechanical arm when the mechanical arm is at a first preset position, as shown in fig. 7, the apparatus includes:

a horizontal deviation detection result determining module 701, configured to control, at a preset mechanical arm deviation detection node, the mechanical arm to move with the first preset position as a target position, control the mechanical arm to vertically move downward until contacting at least one elastic sensor when the mechanical arm finishes moving and does not contact the elastic sensor, and determine a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor; the preset mechanical arm deviation detection node is a preset time point in the working process of the mechanical arm;

a vertical deviation detection result determining module 702, configured to control the mechanical arm to vertically move based on a target pressing distance, and determine a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving;

a mechanical arm deviation detection result determining module 703, configured to determine a mechanical arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result.

The device provided by the embodiment of the application comprises a mechanical arm and two elastic sensors, the two elastic sensors are respectively arranged at a first detection point and a second detection point, the first detection point and the second detection point are respectively an upper left extreme value position and a lower right extreme value position or a lower left extreme value position and an upper right extreme value position of the bottom surface of the mechanical arm when the mechanical arm is at a first preset position, controlling the mechanical arm to move by taking the first preset position as a target position at a preset mechanical arm deviation detection node, controlling the mechanical arm to move vertically downwards until at least one elastic sensor is contacted under the condition that the mechanical arm finishes moving and does not contact the elastic sensor, determining a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor; the preset mechanical arm deviation detection node is a preset time point in the working process of the mechanical arm; controlling the mechanical arm to vertically move based on a target pressing distance, and determining a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving; and determining a mechanical arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result, and accurately detecting the deviation generated in the mechanical arm working process in high efficiency and time to avoid production accidents caused by mechanical arm deviation.

Based on the above embodiment, the robot arm deviation detection result is used to indicate an expected time for performing maintenance on the robot arm, and accordingly, the robot arm deviation detection result determination module 703 is further configured to perform the following steps:

determining the variation trend of the vertical deviation of the mechanical arm based on the current mechanical arm deviation detection nodes and the vertical deviation detection results corresponding to the mechanical arm deviation detection nodes with the preset number before the current mechanical arm deviation detection nodes;

Based on any of the above embodiments, the robot arm deviation detection result is used to indicate whether the robot arm needs to be maintained, and correspondingly, the robot arm deviation detection result determining module 703 is further configured to perform the following steps:

Based on any of the above embodiments, the determining a horizontal deviation detection result of the mechanical arm according to the first feedback signal of the at least one elastic sensor specifically includes:

Based on any of the above embodiments, the horizontal deviation detection result determining module 701 is further configured to perform the following steps:

Fig. 8 illustrates a physical structure diagram of an electronic device, and as shown in fig. 8, the electronic device may include: a processor (processor)801, a communication Interface (Communications Interface)802, a memory (memory)803 and a communication bus 804, wherein the processor 801, the communication Interface 802 and the memory 803 complete communication with each other through the communication bus 804. The processor 801 may call the logic instructions in the memory 803 to execute the method for detecting the deviation of the robot arm of the semiconductor device provided by the above methods, where the semiconductor device includes a robot arm and two elastic sensors, the two elastic sensors are respectively disposed at a first detection point and a second detection point, and the first detection point and the second detection point are respectively an upper left extreme position and a lower right extreme position, or a lower left extreme position and an upper right extreme position, of the bottom surface of the robot arm when the robot arm is at a first preset position, and the method includes: controlling the mechanical arm to move by taking the first preset position as a target position at a preset mechanical arm deviation detection node, controlling the mechanical arm to vertically move downwards until the mechanical arm contacts at least one elastic sensor under the condition that the mechanical arm finishes moving and does not contact the elastic sensor, and determining a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor; the preset mechanical arm deviation detection node is a preset time point in the working process of the mechanical arm; controlling the mechanical arm to vertically move based on a target pressing distance, and determining a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving; and determining a mechanical arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result.

In addition, the logic instructions in the memory 803 may be implemented in the form of software functional units and stored in a computer readable storage medium when the logic instructions are sold or used as independent products. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.

In another aspect, the present application further provides a computer program product, the computer program product comprising a computer program, the computer program being stored on a non-transitory computer readable storage medium, wherein when the computer program is executed by a processor, the computer is capable of executing the method for detecting the deviation of a robot arm of a semiconductor device provided by the above methods, the semiconductor device comprises a robot arm and two elastic sensors, the two elastic sensors are respectively disposed at a first detection point and a second detection point, and the first detection point and the second detection point are respectively an upper left extreme position and a lower right extreme position, or a lower left extreme position and an upper right extreme position of the bottom surface of the robot arm when the robot arm is at a first preset position, the method comprises: controlling the mechanical arm to move by taking the first preset position as a target position at a preset mechanical arm deviation detection node, controlling the mechanical arm to vertically move downwards until the mechanical arm contacts at least one elastic sensor under the condition that the mechanical arm finishes moving and does not contact the elastic sensor, and determining a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor; the preset mechanical arm deviation detection node is a preset time point in the working process of the mechanical arm; controlling the mechanical arm to vertically move based on a target pressing distance, and determining a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving; and determining a mechanical arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result.

In still another aspect, the present application further provides a non-transitory computer readable storage medium, having a computer program stored thereon, wherein the computer program is implemented to perform the method for detecting the deviation of a robot arm of a semiconductor equipment provided by the above methods when executed by a processor, the semiconductor equipment comprises a robot arm and two elastic sensors respectively disposed at a first detection point and a second detection point, where the first detection point and the second detection point are respectively a top-left extreme position and a bottom-right extreme position, or a bottom-left extreme position and a top-right extreme position of the bottom surface of the robot arm when the robot arm is at a first preset position, the method comprising: controlling the mechanical arm to move by taking the first preset position as a target position at a preset mechanical arm deviation detection node, controlling the mechanical arm to vertically move downwards until the mechanical arm contacts at least one elastic sensor under the condition that the mechanical arm finishes moving and does not contact the elastic sensor, and determining a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor; the preset mechanical arm deviation detection node is a preset time point in the working process of the mechanical arm; controlling the mechanical arm to vertically move based on a target pressing distance, and determining a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving; and determining a mechanical arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result.

The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. Based on the understanding, the above technical solutions substantially or otherwise contributing to the prior art may be embodied in the form of a software product, which may be stored in a computer-readable storage medium, such as ROM/RAM, magnetic disk, optical disk, etc., and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method according to the various embodiments or some parts of the embodiments.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A semiconductor equipment mechanical arm deviation detection method is characterized in that semiconductor equipment comprises a mechanical arm and two elastic sensors, the two elastic sensors are respectively arranged at a first detection point and a second detection point, the first detection point and the second detection point are respectively an upper left extreme value position and a lower right extreme value position, or a lower left extreme value position and an upper right extreme value position of the bottom surface of the mechanical arm when the mechanical arm is at a first preset position, and the method comprises the following steps:

controlling the mechanical arm to move by taking the first preset position as a target position at a preset mechanical arm deviation detection node, controlling the mechanical arm to vertically move downwards until the mechanical arm contacts at least one elastic sensor under the condition that the mechanical arm finishes moving and does not contact the elastic sensor, and determining a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor; the preset mechanical arm deviation detection node is a preset time point in the working process of the mechanical arm; the first feedback signal is a contact signal fed back by the at least one elastic sensor;

controlling the mechanical arm to vertically move based on a target pressing distance, and determining a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving; the second feedback signal is indicative of an actual depression distance of the robotic arm;

2. The method as claimed in claim 1, wherein the robot arm deviation detection result is used to indicate an expected time for performing maintenance on the robot arm, and accordingly, the determining the robot arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result specifically comprises:

3. The method as claimed in claim 1, wherein the robot arm deviation detection result is used to indicate whether the robot arm needs to be maintained, and accordingly, the determining the robot arm deviation detection result according to the horizontal deviation detection result and the vertical deviation detection result specifically comprises:

4. The method as claimed in claim 1, wherein the horizontal deviation detection result comprises a determination result of whether there is a deviation in the horizontal direction and a corresponding deviation direction, and the vertical deviation detection result comprises a determination result of whether there is a deviation in the vertical direction and a corresponding deviation value.

5. The method as claimed in claim 4, wherein the determining the horizontal deviation detection result of the robot arm according to the first feedback signal of the at least one elastic sensor specifically comprises:

6. The method as claimed in claim 4, wherein the determining the vertical deviation detection result of the robot arm according to the second feedback signal of the at least one elastic sensor and the target pressing distance comprises:

7. The method as claimed in claim 1, wherein after the controlling the robot arm to move with the first predetermined position as the target position, the method further comprises:

8. A semiconductor device mechanical arm deviation detection device is characterized in that the semiconductor device comprises a mechanical arm and two elastic sensors, the two elastic sensors are respectively arranged at a first detection point and a second detection point, the first detection point and the second detection point are respectively an upper left extreme value position and a lower right extreme value position, or a lower left extreme value position and an upper right extreme value position of the bottom surface of the mechanical arm when the mechanical arm is at a first preset position, and the device comprises:

the horizontal deviation detection result determining module is used for controlling the mechanical arm to move by taking the first preset position as a target position at a preset mechanical arm deviation detection node, controlling the mechanical arm to vertically move downwards until the mechanical arm contacts at least one elastic sensor under the condition that the mechanical arm finishes moving and does not contact the elastic sensor, and determining a horizontal deviation detection result of the mechanical arm according to a first feedback signal of the at least one elastic sensor; the preset mechanical arm deviation detection node is a preset time point in the working process of the mechanical arm; the first feedback signal is a contact signal fed back by the at least one elastic sensor;

the vertical deviation detection result determining module is used for controlling the mechanical arm to vertically move based on a target pressing distance, and determining a vertical deviation detection result of the mechanical arm according to a second feedback signal of the at least one elastic sensor and the target pressing distance when the mechanical arm finishes moving; the second feedback signal is indicative of an actual depression distance of the robotic arm;

9. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor when executing the program implements the steps of the semiconductor device robot arm deviation detecting method according to any one of claims 1 to 7.

10. A non-transitory computer readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the semiconductor device robot arm deviation detecting method according to any one of claims 1 to 7.