CN114799157A - Method for manufacturing powder of high-porosity through-hole foamy copper - Google Patents
Method for manufacturing powder of high-porosity through-hole foamy copper Download PDFInfo
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- CN114799157A CN114799157A CN202110535135.8A CN202110535135A CN114799157A CN 114799157 A CN114799157 A CN 114799157A CN 202110535135 A CN202110535135 A CN 202110535135A CN 114799157 A CN114799157 A CN 114799157A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 76
- 239000010949 copper Substances 0.000 title claims abstract description 76
- 239000000843 powder Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000006260 foam Substances 0.000 claims abstract description 72
- 239000003822 epoxy resin Substances 0.000 claims abstract description 30
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 30
- 238000002156 mixing Methods 0.000 claims abstract description 24
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 claims abstract description 21
- 235000012538 ammonium bicarbonate Nutrition 0.000 claims abstract description 21
- 239000001099 ammonium carbonate Substances 0.000 claims abstract description 21
- 239000011812 mixed powder Substances 0.000 claims abstract description 20
- 239000011148 porous material Substances 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 10
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 5
- 238000007711 solidification Methods 0.000 claims abstract description 3
- 230000008023 solidification Effects 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims description 23
- 238000000498 ball milling Methods 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000007789 gas Substances 0.000 claims description 7
- 230000009467 reduction Effects 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 238000007873 sieving Methods 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- 238000005187 foaming Methods 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 3
- 238000005979 thermal decomposition reaction Methods 0.000 abstract description 3
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 238000012546 transfer Methods 0.000 description 20
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 238000002459 porosimetry Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1103—Making porous workpieces or articles with particular physical characteristics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1121—Making porous workpieces or articles by using decomposable, meltable or sublimatable fillers
- B22F3/1125—Making porous workpieces or articles by using decomposable, meltable or sublimatable fillers involving a foaming process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1143—Making porous workpieces or articles involving an oxidation, reduction or reaction step
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a method for manufacturing powder of high-porosity through-hole foamy copper, which comprises the steps of adding thermosetting epoxy resin and ammonium bicarbonate into copper powder, mixing the powder, forming the powder, removing organic matters and reducing, foaming and forming the mixed powder by utilizing the synchronization of thermal decomposition of the ammonium bicarbonate and thermal solidification of the thermosetting epoxy resin, so that the formed foamy copper blank contains a certain through-hole porosity, and then oxidizing and removing the epoxy resin, thereby further improving the through-hole porosity of the foamy copper. The epoxy resin has low curing temperature, high curing speed, small curing shrinkage, good stability and good mechanical property, the ammonium bicarbonate can be decomposed at 60 ℃, the decomposition temperature is low, the gas generated by decomposition can be recycled, the generated pore structure is fine and uniform, and the porosity of the final foam copper through the raw material improvement and the adjustment of the process route in the process is improved.
Description
Technical Field
The invention relates to a foam metal preparation technology, in particular to a method for preparing high-porosity through-hole foam copper powder.
Background
The foam metal has the characteristics of light weight, high strength, large specific surface area, good permeability and the like, and has irreplaceable effects on the aspects of filtration and separation, heat exchange, noise reduction, energy absorption, shock absorption, fluid control, electromagnetic shielding, catalytic electrodes and the like. The open pore structure of the through-hole foam metal has a higher specific surface area, so that the heat exchange area with a cooling medium can be greatly increased in the heat transfer process, the heat transfer efficiency of the heat transfer element is remarkably improved, and the purpose of quickly transferring heat at the hot end under the condition of high heat flow density is realized. Therefore, the heat transfer element prepared by taking the foam metal as the liquid absorption core has extremely wide application in the fields of mobile phones, notebook computers, tablet computers and the like.
The thermal conductivity of copper is 397W/m.K (0-100 ℃), and the foam copper can realize the capability of quickly transferring heat to electronic products by means of the high thermal conductivity of the copper and adjusting the structural parameters of the holes. With the development of electronic products toward modularization, high performance, ultra-thinness, high reliability, low heat transfer cost and short-cycle manufacturing direction, components with small heat transfer space and high heat flux density have very urgent needs for rapid heat transfer. The porosity of a liquid absorption core structure of the existing heat transfer element is not high (less than 60%), and the phenomena of large temperature difference, high thermal resistance and the like occur when the existing heat transfer element bears high heat flow density, so that the application of the existing heat transfer element in the aspects of heat transfer and cooling is limited to a certain extent. The high-porosity through-hole copper foam has high effective thermal conductivity, and when the porosity is further increased to more than 65%, the heat transfer capacity of the heat transfer element taking the copper foam as the liquid absorption core is further improved.
The manufacturing method of the foam metal mainly comprises the methods of molten metal foaming, powder/fiber sintering, metal deposition and the like. The porous structure of the foam metal prepared by the molten metal foaming method is mostly closed, and the preparation of the porous structure needs to use an inorganic material preform, but the preparation process has the defects that the size of the prepared porous structure is large, the inorganic material preform is difficult to remove, the pore size distribution is difficult to regulate and control, and the like. The metal deposition method can prepare the foam metal with an open-cell structure, but has the disadvantages of high cost, uncontrollable pore size distribution, complex process and difficult subsequent processing.
Disclosure of Invention
Technical problem to be solved
In order to overcome the defects of the prior art, the method for manufacturing the powder of the high-porosity through-hole foamy copper is provided, the formed foamy copper through-hole has higher porosity, simple process and low processing difficulty, and larger heat transfer specific surface area can be obtained.
(II) technical scheme
The invention is realized by the following technical scheme: the invention provides a method for manufacturing high-porosity through-hole foam copper powder, which is characterized in that thermosetting epoxy resin and ammonium bicarbonate are added into metal powder, and the manufacturing of a high-porosity through-hole foam copper structure is realized by thermal decomposition of the ammonium bicarbonate and thermal curing and oxidation removal of the thermosetting epoxy resin, and the manufacturing steps are as follows:
a. powder mixing: weighing copper powder, thermosetting epoxy resin and ammonium bicarbonate according to the mass part ratio of 65-80:19-30:1-5, mixing in a planetary ball mill, pouring the powder into a ball milling tank, mixing in a planetary ball mill according to certain parameters, and sieving the mixed powder to obtain mixed powder;
b. powder forming: pouring the mixed powder in the step a into a stainless steel mold, heating the powder to 80 ℃, curing the epoxy resin and decomposing the pore-forming agent ammonium bicarbonate to obtain a foam copper blank;
c. removing organic matters: b, taking the foam copper blank obtained in the step a out of the die, heating to 400 ℃, and completely removing the epoxy resin remained in the foam copper blank;
d. reduction: and c, heating the blank of the copper foam obtained in the step c to 900 ℃ in a reducing atmosphere to obtain the copper foam with a through hole structure.
Further, in the step a, the material ratio of the ball milling mixed balls is 4:1, the rotating speed is 150-200 r/min, the mixing time is 30-60 min, and the ball mill is stopped every 15min for ball milling and rotates in a positive and negative mode alternately.
Further, the screen in step a is a 100 mesh screen.
Furthermore, the heating time for powder forming in the step b is 0.5-1.5h, and the formed blank is a round blank.
Further, in the step c, the blank of the foam copper is heated in an air environment for 2-4 h.
Further, in the step d, the reducing atmosphere is hydrogen-argon mixed gas with the hydrogen content of 5%, the heating rate is 5-10 ℃/min, the reducing process is 600 ℃ multiplied by 1h +900 ℃ multiplied by 2.5h, and finally the mixture is cooled to the room temperature along with the furnace.
(III) advantageous effects
Compared with the prior art, the invention has the following beneficial effects:
according to the method for manufacturing the powder of the high-porosity through-hole foamy copper, thermosetting epoxy resin and ammonium bicarbonate are added into copper powder, the mixed powder is foamed and molded by utilizing the synchronization of the thermal decomposition of the ammonium bicarbonate and the thermal solidification of the thermosetting epoxy resin, so that the molded foamy copper blank contains a certain through-hole porosity, and then the epoxy resin is oxidized and removed, so that the through-hole porosity of the foamy copper is further improved. The epoxy resin has the advantages of low curing temperature, high curing speed, small curing shrinkage, good stability and good mechanical property, the ammonium bicarbonate can be decomposed at 60 ℃, the decomposition temperature is low, the gas generated by decomposition can be recycled, and the generated pore structure is fine and uniform. Through the improvement of raw materials in the process and the adjustment of a process route, the through hole porosity of the final foam copper is improved.
According to the invention, the foamy copper with the porosity of 65-75% of the through holes is manufactured by regulating and controlling the raw material proportion and the process parameters, so that a larger heat transfer specific surface area can be obtained, the heat conduction performance of a heat transfer element is improved, and the urgent need of an electronic product for improving the heat transfer efficiency is met.
Drawings
FIG. 1 is a microstructure view of a copper foam of example 1.
FIG. 2 is a microstructure view of the copper foam of example 2.
FIG. 3 is a microstructure view of the copper foam of example 3.
FIG. 4 is a microstructure view of a comparative example copper foam.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the embodiments and the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1
A method for manufacturing powder of high-porosity through-hole foam copper is realized by the following steps:
a. powder mixing: mixing copper powder, epoxy resin and ammonium bicarbonate according to a mass ratio of 65:30:5, mixing in a planetary ball mill, pouring the powder into a ball milling tank, placing the ball milling tank in a ball mill, milling for 15 minutes at a ball-material ratio of 4:1 at a rotating speed of 150r/min for 30 minutes, rotating the ball mill in the opposite direction after stopping the ball mill, mixing, and sieving the mixed powder with a 100-mesh sieve to obtain mixed powder;
b. powder forming: pouring the mixed powder into a stainless steel mold, heating the powder to 80 ℃, and preserving heat for 1.5 hours to solidify the epoxy resin and decompose the pore-forming agent ammonium bicarbonate to obtain a foam copper blank;
c. removing organic matters: taking the foam copper blank obtained in the step b out of the die, heating to 400 ℃, preserving heat for 4 hours, and completely removing the epoxy resin remained in the foam copper blank;
d. reduction: and c, heating the foam copper blank obtained in the step c to 900 ℃ in a hydrogen-argon mixed gas with the hydrogen content of 5% in a reducing atmosphere, and preserving the heat for 2.5 hours to obtain the foam copper with a through hole structure, wherein FIG. 1 is a microstructure diagram of the foam copper prepared in the embodiment.
The copper foam had a porosity of 75.3% as measured by mercury intrusion porosimetry.
Example 2
A method for manufacturing high-porosity through-hole foam copper powder is realized by the following steps:
a. powder mixing: mixing copper powder, epoxy resin and ammonium bicarbonate according to a mass ratio of 70:27:3, mixing in a planetary ball mill, pouring the powder into a ball milling tank, placing the ball milling tank in a ball mill, milling for 15 minutes at a ball-material ratio of 4:1 at a rotating speed of 180r/min for 45 minutes, rotating the ball mill in the opposite direction after stopping the ball mill, mixing, and sieving the mixed powder with a 100-mesh sieve to obtain the mixed powder;
b. powder forming: pouring the mixed powder into a stainless steel mold, heating the powder to 80 ℃, and preserving heat for 1 hour to solidify the epoxy resin and decompose the pore-forming agent ammonium bicarbonate to obtain a foam copper blank;
c. removing organic matters: taking the foam copper blank obtained in the step b out of the die, heating to 400 ℃, preserving heat for 3 hours, and completely removing the epoxy resin remained in the foam copper blank;
d. reduction: and c, heating the foam copper blank obtained in the step c to 900 ℃ in hydrogen-argon mixed gas with the hydrogen content of 5% in a reducing atmosphere, and preserving the heat for 2.5 hours to obtain the foam copper with a through hole structure, wherein FIG. 2 is a microscopic structure diagram of the foam copper prepared in the example.
The copper foam had a porosity of 71.9% as measured by mercury intrusion porosimetry.
Example 3
A method for manufacturing powder of high-porosity through-hole foam copper comprises the following steps:
a. powder mixing: mixing copper powder, epoxy resin and ammonium bicarbonate according to a mass ratio of 80:19:1, mixing in a planetary ball mill, pouring the powder into a ball milling tank, placing the ball milling tank in a ball mill, milling for 15 minutes at a ball material ratio of 4:1 at a rotating speed of 200r/min for 60 minutes, rotating the ball mill in the opposite direction after stopping the ball mill, mixing, and sieving the mixed powder with a 100-mesh sieve to obtain mixed powder;
b. powder forming: pouring the mixed powder into a stainless steel mold, heating the powder to 80 ℃, and preserving heat for 0.5 hour to solidify the epoxy resin and decompose the pore-forming agent ammonium bicarbonate to obtain a foam copper blank;
c. removing organic matters: taking the foam copper blank obtained in the step b out of the die, heating to 400 ℃, and preserving heat for 2 hours to completely remove the epoxy resin remained in the foam copper blank;
d. reduction: and c, heating the foam copper blank obtained in the step c to 900 ℃ in hydrogen-argon mixed gas with the hydrogen content of 5% in a reducing atmosphere, and preserving the heat for 2.5 hours to obtain the foam copper with a through hole structure, wherein fig. 3 is a microstructure diagram of the foam copper prepared in the embodiment.
The copper foam had a porosity of 67.9% as measured by mercury intrusion porosimetry.
Comparative example
A method for manufacturing a powder of open-cell copper foam comprising the steps of:
a. powder mixing: mixing copper powder and epoxy resin according to a mass ratio of 80:20, mixing in a planetary ball mill, pouring the powder into a ball milling tank, placing the ball milling tank in a ball mill, rotating at a rotation speed of 200r/min for 60 minutes, performing reverse rotation on the ball mill for 15 minutes after stopping the ball mill, and sieving the mixed powder with a 100-mesh sieve to obtain mixed powder;
b. powder forming: pouring the mixed powder into a stainless steel mold, heating the powder to 80 ℃, and preserving heat for 0.5 hour to solidify the epoxy resin and decompose the pore-forming agent ammonium bicarbonate to obtain a foam copper blank;
c. removing organic matters: taking the foam copper blank obtained in the step b out of the die, heating to 400 ℃, preserving heat for 2 hours, and completely removing the epoxy resin remained in the foam copper blank;
d. reduction: and c, heating the foam copper blank obtained in the step c to 900 ℃ in hydrogen-argon mixed gas with the hydrogen content of 5% in a reducing atmosphere, and preserving the heat for 2.5 hours to obtain the foam copper with a through hole structure, wherein FIG. 4 is a microstructure diagram of the foam copper prepared in the example.
The copper foam had a porosity of 57.1% as measured by mercury intrusion porosimeter.
The porosity of the copper foam obtained in the above examples 1 to 3 is 75.3%, 71.9% and 67.9%, respectively, and the average porosity thereof reaches 71.7%, and compared with the data that the porosity of the copper foam of 57.1% in the comparative example and the general porosity of the existing copper foam are less than 60%, it can be concluded that the porosity of the copper foam prepared by the preparation method of the present invention is higher, which is beneficial to obtaining a larger heat transfer specific surface area, and improving the heat conductivity of the heat transfer element, so as to satisfy the urgent demand of the electronic product for improving the heat transfer efficiency.
The parts not involved in the present invention are the same as or can be implemented using the prior art.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention and do not limit the spirit and scope of the present invention. Various modifications and improvements of the technical solutions of the present invention may be made by those skilled in the art without departing from the design concept of the present invention, and the technical contents of the present invention are all described in the claims.
Claims (6)
1. A method for manufacturing powder of high-porosity through-hole foamy copper is characterized by comprising the following steps: through adding thermosetting epoxy resin and ammonium bicarbonate in metal powder, through the decomposition of being heated of ammonium bicarbonate and thermosetting epoxy resin be heated solidification and oxidation and get rid of, realize the manufacturing of high porosity foamy copper through-hole structure, its preparation step is as follows:
a. powder mixing: weighing copper powder, thermosetting epoxy resin and ammonium bicarbonate according to the mass part ratio of 65-80:19-30:1-5, mixing in a planetary ball mill, pouring the powder into a ball milling tank, mixing in a planetary ball mill according to certain parameters, and sieving the mixed powder to obtain mixed powder;
b. powder forming: pouring the mixed powder in the step a into a stainless steel mold, heating the powder to 80 ℃, curing the epoxy resin and decomposing the pore-forming agent ammonium bicarbonate to obtain a foam copper blank;
c. removing organic matters: b, taking the foam copper blank obtained in the step a out of the die, heating to 400 ℃, and completely removing the epoxy resin remained in the foam copper blank;
d. reduction: and c, heating the blank of the copper foam obtained in the step c to 900 ℃ in a reducing atmosphere to obtain the copper foam with a through hole structure.
2. The method of claim 1, wherein the powder of high porosity open pore copper foam is prepared by the following steps: in the step a, the material ratio of the ball milling mixed balls is 4:1, and the rotating speed is
150-200 r/min, mixing time is 30-60 min, and the ball mill is stopped to rotate and mix in a positive and negative rotation mode every 15min of ball milling.
3. The method of claim 1, wherein the powder of high porosity open pore copper foam is prepared by the following steps: the screen in step a is a 100-mesh screen.
4. The method of claim 1, wherein the powder of high porosity open pore copper foam is prepared by the following steps: and c, heating time for powder forming in the step b is 0.5-1.5h, and the formed blank is a round blank.
5. The method of claim 1, wherein the powder of high porosity open pore copper foam is prepared by the following steps: and c, heating the foam copper blank in the step c in an air environment for 2-4 h.
6. The method of claim 1, wherein the powder of high porosity open pore copper foam is prepared by the following steps: in the step d, the reducing atmosphere is hydrogen-argon mixed gas with the hydrogen content of 5%, the heating rate is 5-10 ℃/min, the reducing process is 600 ℃ multiplied by 1h +900 ℃ multiplied by 2.5h, and finally the mixture is cooled to the room temperature along with the furnace.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115635080A (en) * | 2022-11-15 | 2023-01-24 | 北京中石伟业科技宜兴有限公司 | High-power heat pipe and preparation method thereof |
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