CN114798864A - Semiconductor packaging mechanism - Google Patents
Semiconductor packaging mechanism Download PDFInfo
- Publication number
- CN114798864A CN114798864A CN202210732582.7A CN202210732582A CN114798864A CN 114798864 A CN114798864 A CN 114798864A CN 202210732582 A CN202210732582 A CN 202210732582A CN 114798864 A CN114798864 A CN 114798864A
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- Prior art keywords
- rod
- semiconductor
- electric telescopic
- piston
- shaped
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims abstract description 40
- 238000007664 blowing Methods 0.000 claims description 24
- 238000007789 sealing Methods 0.000 claims description 20
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 11
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 11
- 241001330002 Bambuseae Species 0.000 claims description 11
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 11
- 239000011425 bamboo Substances 0.000 claims description 11
- 210000002435 tendon Anatomy 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 8
- 239000010720 hydraulic oil Substances 0.000 claims description 7
- 210000003205 muscle Anatomy 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 16
- 239000007788 liquid Substances 0.000 description 3
- 239000012467 final product Substances 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D17/00—Forming single grooves in sheet metal or tubular or hollow articles
- B21D17/02—Forming single grooves in sheet metal or tubular or hollow articles by pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
- B21D43/003—Positioning devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D45/00—Ejecting or stripping-off devices arranged in machines or tools dealt with in this subclass
- B21D45/02—Ejecting devices
- B21D45/04—Ejecting devices interrelated with motion of tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a semiconductor packaging mechanism, which relates to the technical field of semiconductor packaging and comprises a bar cutting table, an electric telescopic rod, a bar cutting tool and a fixed seat, wherein an L-shaped mounting frame is fixedly arranged at the upper end of the bar cutting table, the electric telescopic rod is fixedly arranged at the bottom end of the L-shaped mounting frame, the bar cutting tool is fixedly arranged at the bottom of the electric telescopic rod, a mounting groove is formed in the upper end surface of the fixed seat, an automatic positioning and blanking mechanism for conveniently and automatically positioning and blanking a semiconductor is arranged in the mounting groove, and a driving mechanism for driving the automatic positioning and blanking mechanism to rotate is further arranged on the electric telescopic rod. According to the automatic positioning and blanking device, the automatic positioning and calibration of the semiconductor can be realized through the automatic positioning and blanking mechanism and the driving mechanism matched with the automatic positioning and blanking mechanism, and after the rib cutting is finished, the automatic blanking of the semiconductor is realized, manual operation is not needed, the operation steps are saved, and the processing efficiency is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging mechanism.
Background
The integrated circuit package has various types and different processes, but the final product cutting process is an indispensable key process for most types, and separates the final product. The cutting process generally includes a stamping process and a cutting wheel; the key of the stamping process is that a stable and reliable rib cutting die is required, so that stress borne by a finished product during stamping is balanced, and the finished product has a good appearance. The rib cutting die belongs to a precision machining part, a plurality of parts and a cutter are matched to operate to perform operation, and the conventional rib cutting die usually has an anti-misoperation function so as to guarantee that rib cutting can be smoothly and accurately performed.
However, most of the existing rib cutting devices in the semiconductor packaging process need to be manually positioned and calibrated, and the blanking needs to be manually taken out in batches, so that the operation is troublesome and the processing efficiency is affected.
Disclosure of Invention
The invention aims to: in order to solve the above problems, a semiconductor packaging mechanism is proposed.
In order to achieve the purpose, the invention adopts the following technical scheme:
a semiconductor packaging mechanism comprises a tendon cutting table, an electric telescopic rod, a tendon cutting tool and a fixing seat, wherein an L-shaped mounting frame is fixedly arranged at the upper end of the tendon cutting table, the electric telescopic rod is fixedly mounted at the bottom end of the L-shaped mounting frame, the tendon cutting tool is fixedly mounted at the bottom of the electric telescopic rod, a mounting groove is formed in the upper end face of the fixing seat, two sealing cavities are symmetrically formed in the fixing seat, discharge holes facilitating discharge are further formed in the side wall of the fixing seat, an automatic positioning and discharging mechanism facilitating automatic positioning and automatic discharging of semiconductors is arranged in the mounting groove, and a driving mechanism for driving the automatic positioning and discharging mechanism to rotate is further arranged on the electric telescopic rod;
the automatic positioning blanking mechanism comprises a second piston arranged in a sealing cavity in a sliding mode and a movable bearing plate which is arranged in a mounting groove in a rotating mode and used for placing a semiconductor, a sleeve is fixedly arranged at one end of the second piston, a push rod is arranged at the other end of the sleeve in a rotating mode, the other end of the push rod penetrates through the sealing cavity and extends into the mounting groove, an arc-shaped limiting rod is fixedly arranged at one end, located in the mounting groove, of the push rod, two ends of the arc-shaped limiting rod are movably connected with movable limiting rods, the bottom of the arc-shaped limiting rod is connected with the upper end face of the arc-shaped limiting rod in a sliding mode, a sliding groove is formed in the surface of the push rod, and a connecting rod connected with the sliding groove in a sliding mode is arranged on the side wall of the sealing cavity;
the driving mechanism comprises two sealing cylinders symmetrically and fixedly arranged on the surface of the electric telescopic rod, a first piston is arranged in each sealing cylinder in a sliding mode, a pull rod is fixedly arranged at the bottom of each first piston, the bottom of each pull rod penetrates through the bottom of each sealing cylinder and is fixedly connected with the top of a rib cutting tool, a liquid guide pipe is connected to the lower end of the side of each sealing cylinder, the other end of each liquid guide pipe is communicated with the inside of each sealing cavity, and an air guide hole is formed in the upper end of the side of each sealing cylinder.
As a further description of the above technical solution:
the sliding groove specifically comprises two sections of parallel grooves which are staggered with each other, and a section of inclined groove is connected between the two sections of parallel grooves.
As a further description of the above technical solution:
two dovetail grooves are symmetrically formed in the surface of the movable bearing plate, two wedge-shaped blocks are fixedly arranged at the bottom of the arc-shaped limiting rod, and the wedge-shaped blocks are arranged in the dovetail grooves in a sliding mode.
As a further description of the above technical solution:
the movable bearing plate is obliquely arranged.
As a further description of the above technical solution:
the movable limiting rod is hinged to the arc-shaped limiting rod through a pin shaft, and a torsion spring is sleeved on the surface of the pin shaft.
As a further description of the above technical solution:
and hydraulic oil is filled in the sealing cylinder.
As a further description of the above technical solution:
the air blowing assembly is arranged inside the fixing seat and used for blowing air inside the mounting groove, the air blowing assembly comprises an air blowing cavity formed inside the fixing seat and a third piston movably arranged in the air blowing cavity, the air blowing assembly further comprises a semicircular clamping ring rotatably arranged on the surface of one of the push rods, one end of the semicircular clamping ring is fixedly connected with an L-shaped rod, the other end of the L-shaped rod is fixedly connected with the third piston, a channel is formed inside the fixing seat, one end of the channel is communicated with the inside of the air blowing cavity, and the other end of the channel leads to the inside of the mounting groove.
As a further description of the above technical solution:
the discharge opening is the slope setting, just it still is equipped with the collection box that is used for collecting the semiconductor to cut muscle platform up end to be located discharge opening exit position department.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
according to the automatic positioning and blanking device, the automatic positioning and calibration of the semiconductor can be realized through the automatic positioning and blanking mechanism and the driving mechanism matched with the automatic positioning and blanking mechanism, and after the rib cutting is finished, the automatic blanking of the semiconductor is realized, manual operation is not needed, the operation steps are saved, and the processing efficiency is improved.
Drawings
FIG. 1 illustrates a schematic overall appearance structure provided according to the present invention;
FIG. 2 shows a schematic overall cross-sectional structure provided in accordance with the present invention;
FIG. 3 is an enlarged schematic view of the drive mechanism of FIG. 2 according to the present invention;
FIG. 4 is a schematic top cross-sectional view of the mounting base of FIG. 2 according to the present invention;
FIG. 5 illustrates a schematic enlarged view of a portion of FIG. 4 provided in accordance with the present invention;
FIG. 6 is a schematic diagram illustrating a partially enlarged structure of the automatic positioning and blanking mechanism in FIG. 5 according to the present invention;
fig. 7 shows a schematic cross-sectional structure of a push rod and a connecting rod provided according to the present invention.
Illustration of the drawings:
1. a tendon cutting table; 2. an electric telescopic rod; 3. a tendon cutting tool; 4. a fixed seat; 5. a drive mechanism; 6. an automatic positioning and blanking mechanism; 7. a collection box; 8. a blowing assembly; 41. a discharge hole; 42. sealing the cavity; 43. a connecting rod; 51. a sealing cylinder; 52. a first piston; 53. a pull rod; 54. a catheter; 55. an air vent; 61. a movable bearing plate; 62. a second piston; 63. a sleeve; 64. a push rod; 65. an arc-shaped limiting rod; 66. a movable limiting rod; 641. a chute; 81. a semicircular snap ring; 82. an L-shaped rod; 83. a third piston; 84. a channel.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, the present invention provides a technical solution: a semiconductor packaging mechanism comprises a bar cutting table 1, an electric telescopic rod 2, a bar cutting tool 3 and a fixed seat 4, wherein an L-shaped mounting frame is fixedly arranged at the upper end of the bar cutting table 1, the electric telescopic rod 2 is fixedly arranged at the bottom end of the L-shaped mounting frame, the bar cutting tool 3 is fixedly arranged at the bottom of the electric telescopic rod 2, a mounting groove is formed in the upper end surface of the fixed seat 4, two sealed cavities 42 are symmetrically formed in the fixed seat 4, discharge holes 41 facilitating discharge are further formed in the side wall of the fixed seat 4, an automatic positioning and discharging mechanism 6 facilitating automatic positioning and automatic discharging of a semiconductor is arranged in the mounting groove, and a driving mechanism 5 for driving the automatic positioning and discharging mechanism 6 to rotate is further arranged on the electric telescopic rod 2;
the automatic positioning blanking mechanism 6 comprises a second piston 62 arranged in the sealed cavity 42 in a sliding manner and a movable bearing plate 61 which is rotatably arranged in the mounting groove and used for placing a semiconductor, a sleeve 63 is fixedly arranged at one end of the second piston 62, a push rod 64 is rotatably arranged at the other end of the sleeve 63, the other end of the push rod 64 penetrates through the sealed cavity 42 and extends into the mounting groove, an arc-shaped limiting rod 65 is fixedly arranged at one end of the push rod 64 positioned in the mounting groove, movable limiting rods 66 are movably connected at two ends of the arc-shaped limiting rod 65, the bottom of the arc-shaped limiting rod 65 is in sliding connection with the upper end face of the arc-shaped limiting rod 65, a sliding groove 641 is formed in the surface of the push rod 64, and a connecting rod 43 in sliding connection with the sliding groove 641 is arranged on the side wall of the sealed cavity 42;
Further, the sliding groove 641 specifically includes two sections of mutually staggered parallel grooves, and a section of inclined groove is connected between the two sections of parallel grooves.
Further, two dovetail grooves are symmetrically formed in the surface of the movable bearing plate 61, two wedge-shaped blocks are fixedly arranged at the bottom of the arc-shaped limiting rod 65, and the wedge-shaped blocks are arranged in the dovetail grooves in a sliding mode.
Further, the movable supporting plate 61 is disposed in an inclined manner.
Further, the movable limiting rod 66 is hinged to the arc-shaped limiting rod 65 through a pin shaft, and a torsion spring is sleeved on the surface of the pin shaft.
Further, the inside of the fixed seat 4 is also provided with an air blowing assembly 8 for blowing air into the mounting groove, the air blowing assembly 8 comprises an air blowing cavity arranged inside the fixed seat 4 and a third piston 83 movably arranged in the air blowing cavity, the air blowing assembly 8 further comprises a semicircular clamping ring 81 rotatably arranged on the surface of one of the push rods 64, one end of the semicircular clamping ring 81 is fixedly connected with an L-shaped rod 82, the other end of the L-shaped rod 82 is fixedly connected with the third piston 83, the inside of the fixed seat 4 is also provided with a channel 84, one end of the channel 84 is communicated with the inside of the air blowing cavity, and the other end of the channel 84 leads into the mounting groove; in the in-service use process, the draw-in groove has been seted up on push rod 64 surface, and semi-circular snap ring 81 rotates the joint in the draw-in groove to guarantee that push rod 64 can enough drive semi-circular snap ring 81 synchronous motion at the removal in-process, can not drive semi-circular snap ring 81 simultaneously and take place to rotate, in order to guarantee that L type pole 82 only takes place to remove, can not rotate.
Further, discharge opening 41 is the slope setting, and the tip of bar cutting platform 1 still is equipped with the collection box 7 that is used for collecting the semiconductor in the position department of discharge opening 41 export.
The working principle is as follows: when the device is used, a semiconductor to be subjected to bar cutting is placed on the movable bearing plate 61, then the electric telescopic rod 2 is started, the electric telescopic rod 2 drives the bar cutting tool 3 to descend, the bar cutting tool 3 can pull the pull rod 53 synchronously in the descending process, the pull rod 53 can drive the first piston 52 to descend in the descending process, the first piston 52 can further extrude hydraulic oil in the sealing cylinder 51, the extruded hydraulic oil can be guided into the sealing cavity 42 through the liquid guide pipe 54, then the hydraulic oil pushes the second piston 62 in the sealing cavity 42 to move, the second piston 62 can push the push rod 64 to move in the moving process, the sliding groove 641 in the surface of the push rod 64 can be limited by the connecting rod 43 in the moving process, so that the push rod 64 rotates around the sleeve 63, and the arc-shaped limiting rod 65 at the other end of the push rod 64 is connected with the surface of the movable bearing plate 61 through a dovetail groove, therefore, when the push rod 64 rotates, the movable bearing plate 61 is driven to synchronously deflect, until the connecting rod 43 slides through the inclined groove and enters the parallel groove, at this time, the push rod 64 stops rotating in the moving process, and the movable bearing plate 61 is also in a horizontal state, when the synchronous push rod 64 moves, the movable limiting rods 66 at the two ends of the arc-shaped limiting rod 65 firstly contact with the semiconductor and push the semiconductor to realize the calibration and positioning of the semiconductor, then the bar cutting tool 3 starts bar cutting operation on the semiconductor, after the cutting is finished, the electric telescopic rod 2 drives the bar cutting tool 3 to ascend, the bar cutting tool 3 synchronously pushes the pull rod 53 to reset in the ascending process, the pull rod 53 can cooperate with the first piston 52 to form a negative pressure state in the sealing cylinder 51 in the resetting process, so that the hydraulic oil in the sealing cavity 42 can be withdrawn again, the second piston 62 in the sealed cavity 42 is reset, and in the resetting process, the movable bearing plate 61 is reset to the inclined state, and at this time, the semiconductor on the surface of the movable bearing plate 61 after being cut into ribs slides through the inclined surface; the push rod 64 drives the L-shaped rod 82 to move through the semicircular clamping ring 81 while resetting, the L-shaped rod 82 pushes the third piston 83 to move in the moving process, the third piston 83 extrudes the air blowing cavity in the moving process, and air in the air blowing cavity is blown out through the other end of the channel 84 finally, so that the blanking of the movable bearing plate 61 is assisted;
until the semiconductor is led out through the discharging hole 41 and collected by the collecting box 7, thereby realizing the processing step of cutting ribs in the semiconductor packaging process.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. A semiconductor packaging mechanism comprises a tendon cutting table (1), an electric telescopic rod (2), a tendon cutting tool (3) and a fixed seat (4), an L-shaped mounting rack is fixedly arranged at the upper end of the tendon cutting table (1), the electric telescopic rod (2) is fixedly arranged at the bottom end of the L-shaped mounting rack, the tendon cutting tool (3) is fixedly arranged at the bottom of the electric telescopic rod (2), an installation groove is arranged on the upper end surface of the fixed seat (4), two sealed cavities (42) are symmetrically arranged in the fixed seat (4), the side wall of the fixed seat (4) is also provided with a discharge hole (41) convenient for discharging, it is characterized in that an automatic positioning and blanking mechanism (6) for conveniently and automatically positioning and blanking the semiconductor is arranged in the mounting groove, the electric telescopic rod (2) is also provided with a driving mechanism (5) for driving the automatic positioning and blanking mechanism (6) to rotate;
the automatic positioning blanking mechanism (6) comprises a second piston (62) which is arranged in the sealed cavity (42) in a sliding way and a movable bearing plate (61) which is arranged in the mounting groove in a rotating way and is used for placing a semiconductor, one end of the second piston (62) is fixedly provided with a sleeve (63), the other end of the sleeve (63) is rotatably provided with a push rod (64), the other end of the push rod (64) penetrates through the sealing cavity (42) and extends to the inside of the mounting groove, and one end of the push rod (64) positioned in the mounting groove is fixedly provided with an arc-shaped limiting rod (65), two ends of the arc-shaped limiting rod (65) are movably connected with movable limiting rods (66), and the bottom of the arc-shaped limiting rod (65) is connected with the upper end surface of the arc-shaped limiting rod (65) in a sliding way, the surface of the push rod (64) is provided with a sliding groove (641), and the side wall of the sealed cavity (42) is provided with a connecting rod (43) which is in sliding connection with the sliding groove (641);
actuating mechanism (5) are including two sealed section of thick bamboo (51) of the fixed setting in electric telescopic handle (2) surface of symmetry, sealed section of thick bamboo (51) inside all slides and is equipped with first piston (52), first piston (52) bottom fixed mounting has pull rod (53), pull rod (53) bottom run through sealed section of thick bamboo (51) bottom and with muscle cutter (3) top fixed connection, two sealed section of thick bamboo (51) side lower extreme all is connected with catheter (54), catheter (54) other end and sealed cavity (42) inside intercommunication, air guide hole (55) have been seted up to sealed section of thick bamboo (51) side upper end.
2. The semiconductor packaging mechanism according to claim 1, wherein the sliding groove (641) comprises two parallel grooves staggered with each other, and a section of inclined groove is connected between the two parallel grooves.
3. The semiconductor packaging mechanism according to claim 1, wherein the surface of the movable bearing plate (61) is symmetrically provided with two dovetail grooves, and two wedge-shaped blocks are fixedly arranged at the bottom of the arc-shaped limiting rod (65), and are slidably arranged in the dovetail grooves.
4. A semiconductor package according to claim 1, wherein the movable carrier plate (61) is inclined.
5. A semiconductor package according to any one of claims 1-4, wherein the movable limiting rod (66) is hinged to the arc-shaped limiting rod (65) by a pin, and a torsion spring is sleeved on the surface of the pin.
6. A semiconductor packaging arrangement according to claim 1, characterized in that the interior of the sealing cylinder (51) is filled with hydraulic oil.
7. The semiconductor packaging mechanism according to claim 1, wherein a blowing assembly (8) for blowing air into the mounting groove is further arranged inside the fixing base (4), the blowing assembly (8) comprises a blowing cavity arranged inside the fixing base (4) and a third piston (83) movably arranged in the blowing cavity, the blowing assembly (8) further comprises a semicircular clamping ring (81) rotatably arranged on the surface of one of the push rods (64), one end of the semicircular clamping ring (81) is fixedly connected with an L-shaped rod (82), the other end of the L-shaped rod (82) is fixedly connected with the third piston (83), a channel (84) is further arranged inside the fixing base (4), one end of the channel (84) is communicated with the inside of the blowing cavity, and the other end of the channel (84) leads to the mounting groove.
8. A semiconductor packaging mechanism according to claim 1, wherein the discharge hole (41) is arranged obliquely, and a collection box (7) for collecting semiconductors is further arranged on the upper end face of the tendon cutting table (1) at the position of the outlet of the discharge hole (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210732582.7A CN114798864A (en) | 2022-06-27 | 2022-06-27 | Semiconductor packaging mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210732582.7A CN114798864A (en) | 2022-06-27 | 2022-06-27 | Semiconductor packaging mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114798864A true CN114798864A (en) | 2022-07-29 |
Family
ID=82520503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210732582.7A Pending CN114798864A (en) | 2022-06-27 | 2022-06-27 | Semiconductor packaging mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114798864A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206425399U (en) * | 2016-11-16 | 2017-08-22 | 深圳市正宇兴电子有限公司 | A kind of automatic Trim Molding machine |
| CN109047582A (en) * | 2018-07-23 | 2018-12-21 | 江苏宝浦莱半导体有限公司 | A kind of Trim Molding machine and its application method for packaging semiconductor |
| CN109093032A (en) * | 2018-07-02 | 2018-12-28 | 江苏赫芝电气有限公司 | A kind of automatic bar shear of triode and its cutting method |
| CN208527810U (en) * | 2018-05-03 | 2019-02-22 | 东莞市鼎通精密五金股份有限公司 | A kind of self-feeding Rib-cutting die |
| CN112974668A (en) * | 2021-04-27 | 2021-06-18 | 四川明泰电子科技有限公司 | Semiconductor device bar cutting device |
| CN213936128U (en) * | 2020-12-24 | 2021-08-10 | 江苏长弘半导体有限公司 | Rib cutting dispersion die of triode |
| CN113471114A (en) * | 2021-09-03 | 2021-10-01 | 四川明泰电子科技有限公司 | Semiconductor integrated circuit package forming apparatus |
| CN215390974U (en) * | 2021-06-02 | 2022-01-04 | 遂宁合芯半导体有限公司 | Three-terminal steady voltage IC cuts muscle forming device |
| CN216324807U (en) * | 2021-10-26 | 2022-04-19 | 山东赛克罡正半导体有限公司 | Rib cutting forming machine suitable for chip processing |
-
2022
- 2022-06-27 CN CN202210732582.7A patent/CN114798864A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206425399U (en) * | 2016-11-16 | 2017-08-22 | 深圳市正宇兴电子有限公司 | A kind of automatic Trim Molding machine |
| CN208527810U (en) * | 2018-05-03 | 2019-02-22 | 东莞市鼎通精密五金股份有限公司 | A kind of self-feeding Rib-cutting die |
| CN109093032A (en) * | 2018-07-02 | 2018-12-28 | 江苏赫芝电气有限公司 | A kind of automatic bar shear of triode and its cutting method |
| CN109047582A (en) * | 2018-07-23 | 2018-12-21 | 江苏宝浦莱半导体有限公司 | A kind of Trim Molding machine and its application method for packaging semiconductor |
| CN213936128U (en) * | 2020-12-24 | 2021-08-10 | 江苏长弘半导体有限公司 | Rib cutting dispersion die of triode |
| CN112974668A (en) * | 2021-04-27 | 2021-06-18 | 四川明泰电子科技有限公司 | Semiconductor device bar cutting device |
| CN215390974U (en) * | 2021-06-02 | 2022-01-04 | 遂宁合芯半导体有限公司 | Three-terminal steady voltage IC cuts muscle forming device |
| CN113471114A (en) * | 2021-09-03 | 2021-10-01 | 四川明泰电子科技有限公司 | Semiconductor integrated circuit package forming apparatus |
| CN216324807U (en) * | 2021-10-26 | 2022-04-19 | 山东赛克罡正半导体有限公司 | Rib cutting forming machine suitable for chip processing |
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Application publication date: 20220729 |