CN215390974U - Three-terminal steady voltage IC cuts muscle forming device - Google Patents
Three-terminal steady voltage IC cuts muscle forming device Download PDFInfo
- Publication number
- CN215390974U CN215390974U CN202121220334.1U CN202121220334U CN215390974U CN 215390974 U CN215390974 U CN 215390974U CN 202121220334 U CN202121220334 U CN 202121220334U CN 215390974 U CN215390974 U CN 215390974U
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- plate
- base
- fixed mounting
- groove
- forming device
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- 210000003205 muscle Anatomy 0.000 title claims description 6
- 238000004080 punching Methods 0.000 claims abstract description 31
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 238000004140 cleaning Methods 0.000 claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 9
- 230000006641 stabilisation Effects 0.000 claims description 8
- 238000011105 stabilization Methods 0.000 claims description 8
- 238000009966 trimming Methods 0.000 claims description 7
- 244000309464 bull Species 0.000 claims description 6
- 230000006978 adaptation Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000010405 clearance mechanism Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 25
- 239000002699 waste material Substances 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 210000002435 tendon Anatomy 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012857 repacking Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a three-terminal voltage-stabilizing IC (integrated circuit) tendon-cutting forming device, which belongs to the technical field of semiconductor production equipment and comprises a base plate, wherein a base is arranged above the base plate, a placing groove is formed in the top of the base, a semiconductor package is placed in an inner cavity of the placing groove, and punching grooves are fixedly arranged on the top of the base and positioned on the front side and the rear side of the placing groove; according to the device, through the arrangement of the cleaning mechanism, after the semiconductor packaging is subjected to rib cutting, residual punching waste can be left on the top of the base, the scraper and the cleaning plate are driven by the cleaning mechanism to clean the waste on the top of the base and in the punching groove, and the waste is cleaned to the inner cavity of the collecting box.
Description
Technical Field
The utility model relates to the technical field of semiconductor production equipment, in particular to a three-terminal voltage-stabilizing IC tendon-cutting forming device.
Background
Need in the semiconductor package product production process through processes such as muscle cutting, shaping, tubulation, three-terminal steady voltage IC is comparatively convenient because three-terminal fixed integrated voltage stabilizing circuit, often is applied to in the electron preparation, can be used for repacking discrete component's constant voltage power supply, also often is used as electronic equipment's working power supply, can use the muscle cutting device to carry out the muscle cutting to it in carrying out the production process, with unnecessary plastic envelope excision.
When the existing bar cutting device is used for cutting bars of semiconductor packaging products, centralized cleaning is not carried out on residual plastic packages after punching, and waste materials obtained after punching are scattered on stations everywhere, so that the working environment looks messy, and therefore the three-terminal voltage stabilization IC bar cutting forming device needs to be provided.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a three-terminal voltage-stabilizing IC (integrated circuit) tendon-cutting forming device which has the advantage of intensively cleaning and collecting plastic package residues generated after tendon cutting so as to solve the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a three-terminal steady voltage IC tendon cutting forming device, includes the bottom plate, the top of bottom plate is equipped with the base, the standing groove has been seted up at the top of base, semiconductor package has been placed to the inner chamber of standing groove, the top of base and the equal fixed mounting in both sides have a die-cut groove around being located the standing groove, the top of bottom plate and the outside fixed mounting that is located the base have a die-cut mechanism, the fixed surface of base installs clearance mechanism.
Preferably, the punching mechanism includes fixed mounting in the lift cylinder of bottom plate top both sides, the flexible end fixed mounting of lift cylinder has the fixed plate, the bottom equidistance fixed mounting of fixed plate has the connecting rod, the bottom fixed mounting of connecting rod has the backup pad, the equal fixed mounting in both sides has the die-cut cutter with die-cut groove looks adaptation around the backup pad bottom.
Preferably, logical groove has been seted up on the surface of fixed plate, logical groove is run through and extends to the inner chamber that leads to the groove in the top of connecting rod, the front threaded connection of fixed plate has the check lock lever, the one end of check lock lever runs through fixed plate, logical groove and connecting rod in proper order and extends to the outside of connecting rod and the inner wall threaded connection who leads to the groove.
Preferably, the front side and the rear side of the bottom of the fixing plate and the inner side of the punching cutter are fixedly provided with pressing plates, and the bottoms of the pressing plates are attached to the top of the semiconductor package.
Preferably, clearance mechanism includes the plate body at both ends around fixed mounting in base both sides, the inboard bearing support of plate body has the bull stick, the equal fixed mounting in both sides has the belt pulley around the bull stick surface, and is two sets of connect through belt transmission between the belt pulley, the positive fixed mounting of plate body has driving motor, driving motor's output shaft runs through the plate body and extends to the outside of plate body and the one end fixed mounting of bull stick, two fixed mounting has the dead lever between the belt, the bottom fixed mounting of dead lever has the scraper blade, the bottom fixed mounting of scraper blade has the clearance board with die-cut groove looks adaptation.
Preferably, the four corners of the bottom of the base are fixedly provided with support columns, and the bottoms of the support columns are fixedly arranged with the top of the bottom plate.
Preferably, the top of the bottom plate is provided with a collecting box, and the front of the collecting box is fixedly provided with a handle.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the device, through the arrangement of the cleaning mechanism, after the semiconductor package is subjected to rib cutting, residual punching waste can be left on the top of the base, the operation of the cleaning mechanism drives the scraper and the cleaning plate to clean the waste on the top of the base and inside the punching groove, and the waste is cleaned to the inner cavity of the collecting box;
2. according to the utility model, through the arrangement of the punching mechanism, a user places the semiconductor package needing to be subjected to rib cutting in the placing groove at the top of the base and presses the semiconductor package downwards through the punching cutter to perform rib cutting operation.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the die-cutting mechanism of the present invention;
FIG. 3 is a schematic structural diagram of the cleaning mechanism of the present invention.
In the figure: 1. a base plate; 2. a base; 3. a placement groove; 4. packaging the semiconductor; 5. punching a groove; 6. a punching mechanism; 601. a lifting cylinder; 602. a fixing plate; 603. a connecting rod; 604. a support plate; 605. punching and cutting the knife; 7. a cleaning mechanism; 701. a plate body; 702. a rotating rod; 703. a belt pulley; 704. a belt; 705. a drive motor; 706. fixing the rod; 707. a squeegee; 708. cleaning the plate; 8. a through groove; 9. a locking lever; 10. pressing a plate; 11. a support pillar; 12. and (4) collecting the box.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a three-terminal voltage stabilization IC trimming forming device comprises a bottom plate 1, wherein a base 2 is arranged above the bottom plate 1, a placing groove 3 is formed in the top of the base 2, a semiconductor package 4 is placed in an inner cavity of the placing groove 3, punching grooves 5 are fixedly arranged on the top of the base 2 and positioned on the front side and the rear side of the placing groove 3, a punching mechanism 6 is fixedly arranged on the top of the bottom plate 1 and positioned on the outer portion of the base 2, the punching mechanism 6 comprises a lifting cylinder 601 fixedly arranged on the two sides of the top of the bottom plate 1, a fixing plate 602 is fixedly arranged on the telescopic end of the lifting cylinder 601, connecting rods 603 are fixedly arranged on the bottom of the fixing plate 602 at equal intervals, a supporting plate 604 is fixedly arranged on the bottom of the connecting rod 603, punching knives 605 matched with the punching grooves 5 are fixedly arranged on the front side and the rear side of the bottom of the supporting plate 604, a through groove 8 is formed in the surface of the fixing plate 602, and the top of the connecting rod 603 penetrates through the through groove 8 and extends to the inner cavity of the through groove 8, the front face of the fixing plate 602 is in threaded connection with a locking rod 9, one end of the locking rod 9 sequentially penetrates through the fixing plate 602, the through groove 8 and the connecting rod 603 and extends to the outside of the connecting rod 603 to be in threaded connection with the inner wall of the through groove 8, pressing plates 10 are fixedly mounted on the front side and the rear side of the bottom of the fixing plate 602 and on the inner side of the punching cutter 605, and the bottoms of the pressing plates 10 are attached to the top of the semiconductor package 4;
through the arrangement of the bottom plate 1, the base 2, the punching mechanism 6 and the cleaning mechanism 7 can be fixedly supported, through the arrangement of the placing groove 3, the semiconductor package 4 needing to be subjected to rib cutting can be placed, so that the position of the semiconductor package 4 is fixed in the punching process, through the arrangement of the punching mechanism 6, after the semiconductor package 4 is placed in the placing groove 3 by a user, the user opens the lifting cylinder 601 through an external controller, the telescopic end of the lifting cylinder 601 drives the fixing plate 602 to move downwards, the movement of the fixing plate 602 drives the connecting rod 603 to move, the movement of the connecting rod 603 drives the supporting plate 604 to move, the movement of the supporting plate 604 drives the heavy punching cutter 605 at the bottom of the supporting plate to move downwards, rib cutting is carried out on the semiconductor package 4, through the arrangement of the pressing plate 10, when the semiconductor package 4 is punched, the pressing plate 10 can fix the position of the semiconductor package 4, through the arrangement of the through groove 8 and the locking rod 9, the punching knife 605 can be conveniently replaced, after a new punching knife 605 is replaced, a user inserts the top of the connecting rod 603 into the inner cavity of the through groove 8, then the locking rod 9 is screwed, and the rotation of the locking rod 9 enables one end of the locking rod 9 to sequentially penetrate through the fixing plate 602, the through groove 8 and the connecting rod 603 and extend to the outside of the connecting rod 603 to be in threaded connection with the inner wall of the through groove 8, so that the connecting rod 603, the supporting plate 604 and the punching knife 605 are fixed;
the surface of the base 2 is fixedly provided with a cleaning mechanism 7, the cleaning mechanism 7 comprises plate bodies 701 fixedly arranged at the front end and the rear end of the two sides of the base 2, the inner side of each plate body 701 is supported by a bearing, a rotating rod 702 is fixedly arranged on the front side and the rear side of the surface of the rotating rod 702, two groups of belt pulleys 703 are in transmission connection through a belt 704, a driving motor 705 is fixedly arranged on the front surface of each plate body 701, an output shaft of the driving motor 705 penetrates through the plate bodies 701 and extends to the outside of the plate bodies 701 to be fixedly arranged with one end of the rotating rod 702, a fixed rod 706 is fixedly arranged between the two belts 704, the bottom of the fixed rod 706 is fixedly provided with a scraper 707, the bottom of the scraper 707 is fixedly provided with a cleaning plate 708 matched with the punching groove 5, four corners of the bottom of the base 2 are fixedly provided with supporting columns 11, the bottom of the supporting columns 11 is fixedly arranged with the top of the base plate 1, and the top of the base plate 1 is provided with a collecting box 12, a handle is fixedly arranged on the front surface of the collecting box 12;
through the setting of the cleaning mechanism 7, after the semiconductor package 4 is subjected to bar cutting, residual package residues are left on the surface of the base 2, at the moment, a user turns on the driving motor 705 through an external controller, an output shaft of the driving motor 705 drives the rotating rod 702 to rotate, the rotating rod 702 drives the belt pulley 703 to rotate, the belt pulley 703 rotates to drive the belt 704 to rotate on the surface of the base 2, the belt 704 rotates to drive the fixing rod 706 to move, the fixing rod 706 moves to drive the scraper 707 to move to clean the die-cutting waste on the surface of the base 2, meanwhile, the scraper 707 moves to drive the cleaning plate 708 to move in the inner cavity of the die-cutting groove 5 to clean the die-cutting waste falling into the inner cavity of the die-cutting groove 5, through the setting of the collecting box 12, the cleaned die-cutting waste can be collected, through the setting of the handle, the collecting box 12 can be conveniently moved by the user, through the setting of the supporting column 11, the base 2 can be lifted up to leave a space between the base 2 and the bottom plate 1 for the belt 704 to move.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a three-terminal steady voltage IC cuts muscle forming device, includes bottom plate (1), its characterized in that: the semiconductor packaging structure is characterized in that a base (2) is arranged above the bottom plate (1), a placing groove (3) is formed in the top of the base (2), a semiconductor package (4) is placed in an inner cavity of the placing groove (3), a punching groove (5) is fixedly arranged on the front side and the rear side of the base (2) and located in the placing groove (3), a punching mechanism (6) is fixedly arranged on the top of the bottom plate (1) and located outside the base (2), and a cleaning mechanism (7) is fixedly arranged on the surface of the base (2).
2. The three-terminal voltage stabilization IC trimming forming device according to claim 1, characterized in that: die-cut mechanism (6) are including fixed mounting in lift cylinder (601) of bottom plate (1) top both sides, the flexible end fixed mounting of lift cylinder (601) has fixed plate (602), the bottom equidistance fixed mounting of fixed plate (602) has connecting rod (603), the bottom fixed mounting of connecting rod (603) has backup pad (604), equal fixed mounting in both sides has die-cut sword (605) with die-cut groove (5) looks adaptation around backup pad (604) bottom.
3. The three-terminal voltage stabilization IC trimming forming device according to claim 2, characterized in that: logical groove (8) have been seted up on the surface of fixed plate (602), the top of connecting rod (603) runs through logical groove (8) and extends to the inner chamber that leads to groove (8), the front threaded connection of fixed plate (602) has check lock lever (9), the one end of check lock lever (9) runs through fixed plate (602), leads to groove (8) and connecting rod (603) in proper order and extends to the outside of connecting rod (603) and the inner wall threaded connection who leads to groove (8).
4. The three-terminal voltage stabilization IC trimming forming device according to claim 2, characterized in that: the front side and the rear side of the bottom of the fixing plate (602) are respectively fixedly provided with a pressing plate (10) on the inner side of the punching knife (605), and the bottom of each pressing plate (10) is attached to the top of the semiconductor package (4).
5. The three-terminal voltage stabilization IC trimming forming device according to claim 1, characterized in that: clearance mechanism (7) are including fixed mounting in plate body (701) at both ends around base (2) both sides, the inboard bearing support of plate body (701) has bull stick (702), the equal fixed mounting in both sides has belt pulley (703) around bull stick (702) surface, and is two sets of connect through belt (704) transmission between belt pulley (703), the front fixed mounting of plate body (701) has driving motor (705), the output shaft of driving motor (705) runs through plate body (701) and extends to the outside of plate body (701) and the one end fixed mounting of bull stick (702), two fixed mounting has dead lever (706) between belt (704), the bottom fixed mounting of dead lever (706) has scraper blade (707), the bottom fixed mounting of scraper blade (707) has clearance board (708) with die-cut groove (5) looks adaptation.
6. The three-terminal voltage stabilization IC trimming forming device according to claim 1, characterized in that: the support column (11) is fixedly mounted at four corners of the bottom of the base (2), and the bottom of the support column (11) is fixedly mounted at the top of the bottom plate (1).
7. The three-terminal voltage stabilization IC trimming forming device according to claim 1, characterized in that: the top of the bottom plate (1) is provided with a collecting box (12), and the front of the collecting box (12) is fixedly provided with a handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121220334.1U CN215390974U (en) | 2021-06-02 | 2021-06-02 | Three-terminal steady voltage IC cuts muscle forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121220334.1U CN215390974U (en) | 2021-06-02 | 2021-06-02 | Three-terminal steady voltage IC cuts muscle forming device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215390974U true CN215390974U (en) | 2022-01-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121220334.1U Active CN215390974U (en) | 2021-06-02 | 2021-06-02 | Three-terminal steady voltage IC cuts muscle forming device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215390974U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114798864A (en) * | 2022-06-27 | 2022-07-29 | 江苏浦贝智能科技有限公司 | Semiconductor packaging mechanism |
| CN116834252A (en) * | 2023-09-01 | 2023-10-03 | 贵州轮胎股份有限公司 | Composite pre-orifice shape and device thereof |
-
2021
- 2021-06-02 CN CN202121220334.1U patent/CN215390974U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114798864A (en) * | 2022-06-27 | 2022-07-29 | 江苏浦贝智能科技有限公司 | Semiconductor packaging mechanism |
| CN116834252A (en) * | 2023-09-01 | 2023-10-03 | 贵州轮胎股份有限公司 | Composite pre-orifice shape and device thereof |
| CN116834252B (en) * | 2023-09-01 | 2023-11-03 | 贵州轮胎股份有限公司 | Composite pre-orifice shape and device thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 629000 workshop 2, suharuitao Science Park, 73 Chunxiao Road, east side of rose Avenue, logistics port, high tech Zone, Suining City, Sichuan Province Patentee after: Sichuan Xinhe Microelectronics Co.,Ltd. Address before: 629000 workshop 2, suharuitao Science Park, 73 Chunxiao Road, east side of rose Avenue, logistics port, high tech Zone, Suining City, Sichuan Province Patentee before: Suining Hexin Semiconductor Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |