CN114792876B - Method for manufacturing dielectric filter and method for manufacturing electrode thereof - Google Patents
Method for manufacturing dielectric filter and method for manufacturing electrode thereof Download PDFInfo
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- CN114792876B CN114792876B CN202110099039.3A CN202110099039A CN114792876B CN 114792876 B CN114792876 B CN 114792876B CN 202110099039 A CN202110099039 A CN 202110099039A CN 114792876 B CN114792876 B CN 114792876B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 73
- 238000000034 method Methods 0.000 title claims description 65
- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 34
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 39
- 229910052709 silver Inorganic materials 0.000 claims description 39
- 239000004332 silver Substances 0.000 claims description 39
- 238000001035 drying Methods 0.000 claims description 14
- 238000005245 sintering Methods 0.000 claims description 7
- 238000010304 firing Methods 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 238000002791 soaking Methods 0.000 claims 1
- 238000001465 metallisation Methods 0.000 abstract description 16
- 239000010410 layer Substances 0.000 description 37
- 238000000576 coating method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000007776 silk screen coating Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000015895 biscuits Nutrition 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
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- 239000011148 porous material Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000010356 wave oscillation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
The application discloses a manufacturing method of a dielectric filter and an electrode manufacturing method thereof. The electrode manufacturing method is used for forming an electrode on a medium body, wherein the medium body is provided with an opening, and the electrode manufacturing method comprises the following steps: providing a shielding member, and arranging the shielding member on the hole surface of the hole around the hole; carrying out metallization treatment on the medium body provided with the shielding member so as to form a metal layer on the outer surface of the medium body, the outer surface of the shielding member and in the opening; the shielding member is removed to complete the fabrication of the electrode. In this way, the manufacturing process of the dielectric filter electrode can be simplified, and the cost is saved.
Description
Technical Field
The present disclosure relates to the field of communications technologies, and in particular, to a method for manufacturing a dielectric filter and a method for manufacturing an electrode thereof.
Background
With the rise of 5G technology in the last two years, many advantages of 5G have been mentioned. However, since the 5G signal belongs to a high frequency wave, its transmission range is greatly limited, so the 5G base station will be arranged more densely, and the dielectric filter is an indispensable component of the base station.
The existing dielectric filter for 5G is formed by sintering ceramic materials, and the final finished product manufacturing section can be divided into: powder material, pressing, sintering, metallization, electrode preparation, SMT paster and debugging, and electrode preparation is a key ring. The electrode manufacturing is a process of removing a silver layer around an opening of the dielectric substrate after the dielectric substrate is metallized, namely after silver dipping, so as to expose part of the dielectric substrate, and the exposed dielectric substrate is convenient for electromagnetic signal transmission.
The inventor of the application finds that in the long-term research and development process, the existing electrode manufacturing mode mainly comprises a CNC silver scraping layer and a silk screen coating layer, the former is high in cost and cannot be produced in mass, and the latter is more in process steps and more complex.
Disclosure of Invention
The technical problem that this application mainly solves is how to simplify dielectric filter electrode manufacturing process, practices thrift the cost.
In order to solve the technical problems, one technical scheme adopted by the application is as follows: a method for manufacturing an electrode of a dielectric filter is provided. The electrode manufacturing method is used for forming an electrode on a medium body, wherein the medium body is provided with an opening, and the electrode manufacturing method comprises the following steps: providing a shielding member, and arranging the shielding member on the hole surface of the hole around the hole; carrying out metallization treatment on the medium body provided with the shielding member so as to form a metal layer on the outer surface of the medium body, the outer surface of the shielding member and in the opening; the shielding member is removed to complete the fabrication of the electrode.
In order to solve the technical problems, another technical scheme adopted by the application is as follows: a method for manufacturing a dielectric filter is provided. The manufacturing method of the dielectric filter comprises the following steps: providing a medium body with an opening; adopting the electrode manufacturing method to manufacture an electrode on the medium body; and assembling and debugging the dielectric body with the electrode.
The beneficial effects of this application are: unlike the prior art, the method for manufacturing an electrode of a dielectric filter in the embodiment of the present application is used for forming an electrode on a dielectric body, where the dielectric body is provided with an opening, and the method for manufacturing an electrode includes: providing a shielding member, and arranging the shielding member on the hole surface of the hole around the hole; carrying out metallization treatment on the medium body provided with the shielding member so as to form a metal layer on the outer surface of the medium body, the outer surface of the shielding member and in the opening; the shielding member is removed to complete the fabrication of the electrode. The embodiment of the application adopts the shielding piece to shield the hole surface of the hole, namely the electrode, when the medium body is metallized, so as to prevent the metal layer from covering the hole surface of the hole in the metallization process, and the required electrode can be formed by directly removing the shielding piece after metallization. In this way, on one hand, compared with a silk-screen coating mode, the manufacturing method of the embodiment of the application does not need to adopt a coating and a coating process thereof, so that a subsequent coating drying process and a coating residue cleaning process are not needed, the process can be simplified, and the cost is saved; on the other hand, according to the embodiment of the application, the metal layer on the surface of the open hole can be prevented from being polished and removed by adopting a CNC process, and the cost can be reduced. Therefore, the electrode manufacturing method of the dielectric filter can simplify the production process and save the cost.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an embodiment of a dielectric filter of the present application;
FIG. 2 is a schematic flow chart of an embodiment of a method for fabricating a dielectric filter according to the present application;
FIG. 3 is a schematic flow chart of an embodiment of a method for fabricating an electrode of a dielectric filter according to the present application;
FIG. 4 is a schematic diagram showing a specific flow of step S302 in the method for manufacturing an electrode of the dielectric filter of the embodiment of FIG. 3;
fig. 5 is a schematic flow chart of an embodiment of a method for manufacturing an electrode of a dielectric filter of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The terms "first," "second," and the like in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
The application first proposes a dielectric filter, as shown in fig. 1, and fig. 1 is a schematic structural diagram of an embodiment of the dielectric filter of the application. The dielectric filter 10 of the present embodiment includes: the medium body 110 and the metal layer 120 covered on the outer surface of the medium body 110; the metal layer 120 serves to confine an electromagnetic field within the medium body 110, and can prevent leakage of electromagnetic signals to form a standing wave oscillation signal within the medium body 110.
Further, the dielectric body 110 of the present embodiment is provided with an opening 130, and the metal layer 120 further covers the inner wall of the opening 130; the metal layer 120 is not disposed on the hole surface 140 of the hole 130, so that the dielectric body 110 is partially exposed to form an electromagnetic signal transmission channel, i.e. an electrode.
The hole surface 140 of the hole 130 in the embodiment of the present application refers to a portion of the sidewall of the hole 130 located on the surface of the medium body 110.
The opening 130 of the present embodiment may be a through hole or a blind hole, which is not limited in particular.
The present application further provides a method for manufacturing a dielectric filter, as shown in fig. 2, and fig. 2 is a schematic flow chart of an embodiment of the method for manufacturing a dielectric filter of the present application. The method for manufacturing the dielectric filter of the present embodiment may be used to manufacture the dielectric filter 10 described above. Specifically, the manufacturing method of the dielectric filter of the embodiment includes the following steps:
step S201: a media body 110 having openings is provided.
The dielectric body 110 of the present embodiment is a dielectric block made of a solid dielectric material, which may be a ceramic material. In other embodiments, the material of the dielectric body may be other materials with high dielectric constant and low loss, such as glass, quartz crystal or titanate.
The opening 130 and the medium body 110 of the present embodiment may be integrally formed by a mold or the like. Specifically, firstly, preparing medium ceramic powder into spherical granules with better fluidity; then placing the granulated spherical granules into a mould through a dry pressing forming process, and applying pressure through a pressure head to form a ceramic biscuit with certain strength and shape; then reducing pores in the formed body by high-temperature sintering, removing impurities, enhancing the combination between particles and improving the mechanical strength; and finally, grinding by adopting a CNC numerical control machine tool, and accurately measuring the dimensional accuracy of the medium body 110.
Step S202: an electrode is fabricated on the dielectric body 110.
The present embodiment makes the input electrode and the output electrode on the dielectric body 110. Of course, in other embodiments, similar fabrication methods may be used to fabricate coupling electrodes, etc. on the dielectric body 110.
The method of fabricating the electrode on the dielectric body 110 will be described in detail in the following embodiments, and will not be described here.
Step S203: the dielectric body 110 with the electrode is assembled and debugged.
Specifically, the dielectric body 110 with the electrode is assembled with other accessories through an electronic circuit surface assembly technology (Surface Mount Technology, SMT), and the dielectric body 110 with the electrode is mounted on the surface of a circuit board or the surface of other substrates, and is welded and assembled through a reflow soldering or dip soldering method; the SMT-assembled dielectric body 110 is then debugged, mainly to debug passband bandwidth, insertion loss, etc. of the dielectric filter 10.
The application further provides a method for manufacturing an electrode of the dielectric filter, as shown in fig. 3, and fig. 3 is a schematic flow chart of an embodiment of the method for manufacturing an electrode of the dielectric filter. The manufacturing method of the present embodiment may be used to manufacture the electrode of the dielectric filter 10 described above. The manufacturing method of the embodiment comprises the following steps:
step S301: a shield (not shown) is provided and disposed around the aperture 130 on the aperture face 140 of the aperture 130.
Alternatively, the shield of this embodiment is an annular shield and the aperture 130 is a circular aperture. The annular shield is attached coaxially with the circular aperture to the aperture face 140 of the circular aperture.
In other embodiments, the openings may also be other shapes, such as triangular or square, etc.; the shape of the hollowed-out part in the middle of the shielding piece is consistent with the shape of the opening, the shape of the periphery of the shielding piece can be triangle or square, and the shape of the periphery of the shielding piece can be the same as or different from the shape of the hollowed-out part.
The inner diameter of the shielding member in this embodiment is equal to the radius of the opening 130, so that the inner wall of the opening 130 can rapidly cover the metal layer 120 when the medium body 110 is metallized later, and the hole surface 140 of the opening 130 can be prevented from being covered by the metal layer 120.
In other embodiments, the inner diameter of the shield may also be smaller than the radius of the opening, i.e. the shield may partially block the opening, which structure, while resulting in a somewhat slower metallization process of the media body, may enhance the subsequent process of removing the shield because the shield protrudes at the opening.
Optionally, the covering of the present embodiment includes an adhesive tape, a sticker, an organic mold, or the like. Such as PU film, polycarbonate film, silicone adhesive sealant, and the like.
The shielding member of the embodiment can bear more than eight hundred degrees of high temperature without decomposition, namely, the shielding member is not decomposed in the subsequent metallization process of the medium body, and the material of the shielding member does not react with the metal used in the metallization process chemically and physically.
Optionally, the shielding member is composed of a barrier layer and an adhesive layer, the adhesive layer is disposed between the barrier layer and the medium body 110, and is used for adhering the barrier layer on the medium body 110; the blocking layer is made of gold-repellent materials, so that metal residues on the shielding member in a metallization process can be reduced, and the subsequent rapid removal of the shielding member is facilitated.
Step S302: the dielectric body 110 provided with the shield is metallized to form a metal layer 120 on the outer surface of the dielectric body 110, the outer surface of the shield and within the openings 130.
The material of the metal layer 120 in this embodiment is silver, and in other embodiments the material of the metal layer may be copper, tin, aluminum, titanium, gold, or the like.
Alternatively, the present embodiment may implement step S302 using the method shown in fig. 4. The method of the embodiment comprises the following steps:
step S401: the medium body 110 provided with the shielding member is arranged on the throwing disc, the throwing disc is immersed in silver paste, and after being lifted, the surplus silver paste on the medium body 110 is dried in a clockwise rotation mode.
The medium body 110 with the shielding piece is arranged on the throwing disc, the throwing disc is immersed in silver paste for 60-200 seconds, the surplus silver paste on the medium body 110 is dried by clockwise rotation after being lifted, the rotating speed of the throwing disc is 1000r/min, and the silver throwing time of the throwing disc is 1min.
Step S402: the medium body 110 after silver immersion is put into a silver burning screen frame to be put into a chain infrared silver drying furnace for drying.
And (3) putting the medium body 110 after silver immersion into a chain infrared silver drying furnace for drying at 160-220 ℃/15min.
Multiple silver coating of the dielectric body 110 is typically required to meet the silver layer thickness requirements.
In one embodiment, if the sintered silver layer has a thickness less than 10 μm, it is necessary to repeat the silver plating on the dielectric body 110 until the thickness is greater than or equal to 10 μm.
Step S303: the shielding member is removed to complete the fabrication of the electrode.
After the metallization of the dielectric body 110, a metal layer 120 is formed on the outer surface of the dielectric body 110, the outer surface of the shield and within the openings 130; the masking member is then removed to expose the dielectric body 110 at the face 140 of the opening 130, thereby completing the fabrication of the electrode.
To increase the effectiveness of removing the shield, the shield may be provided with an inner diameter that is smaller than the radius of the opening, i.e. the shield may partially block the opening, because the shield protrudes at the opening, and the protruding portion of the shield may be snapped onto the side facing away from the media body 110 to remove the shield.
To improve the efficiency of removing the shield, the shield may further include a shielding portion and a removing portion formed on a side of the shielding portion away from the medium body 110, and the removing portion may be rapidly clamped to pull the removing portion along a side away from the medium body 110.
To increase the effectiveness of removing the shield, the shield may also be soaked with a soak solution to increase the separation rate of the shield from the media body 110.
Compared with the prior art, on one hand, compared with the silk-screen coating mode, the manufacturing method of the embodiment does not need to adopt a coating and a coating process thereof, so that a subsequent coating drying process and a coating residue cleaning process are not needed, the process can be simplified, and the cost is saved; on the other hand, the present embodiment can avoid polishing and removing the metal layer 120 on the hole surface 140 of the hole 130 by CNC process, and can reduce the cost. Therefore, the electrode manufacturing method of the dielectric filter can simplify the production process and save the cost.
Further, during the metallization of the dielectric body 110, the thickness of the metal layer 120 is difficult to control, and in the prior art, a laser device is typically used to polish the metal layer 120 to adjust the thickness. While the thickness of the metal layer 120 may be controlled by controlling the thickness of the shield, for example, the thickness of the shield may be set to be the thickness of the metal layer 120, and the thickness of the metal layer 120 is controlled to be the same as the thickness of the shield during the metallization of the dielectric body 110.
Further, in some application scenarios, a circuit needs to be provided for the dielectric filter, and the embodiment of the application can further simplify the process by providing the electrode shielding member and the circuit shielding member integrally and forming the circuit simultaneously in the process of forming the electrode.
The present application further proposes another embodiment of a method for manufacturing an electrode of a dielectric filter, as shown in fig. 5, and fig. 5 is a schematic flow chart of an embodiment of the method for manufacturing an electrode of a dielectric filter of the present application. The manufacturing method of the present embodiment may be used to manufacture the electrode of the dielectric filter 10 described above. The manufacturing method of the embodiment comprises the following steps:
step S501: a shield (not shown) is provided and disposed around the aperture 130 on the aperture face 140 of the aperture 130.
Step S501 is similar to step S301 described above, and is not described here.
Step S502: the medium body 110 provided with the shielding member is arranged on the throwing disc, the throwing disc is immersed in silver paste, and after being lifted, the surplus silver paste on the medium body 110 is dried in a clockwise rotation mode.
Step S502 is similar to step S401 described above, and is not described here.
Step S503: the medium body 110 after silver immersion is put into a silver burning screen frame to be put into a chain infrared silver drying furnace for drying.
Step S503 is similar to step S402 described above, and is not repeated here.
Step S504: and placing the medium body 110 after silver baking into a silver baking net frame to be placed into a chain silver baking furnace for silver layer sintering.
And (3) placing the medium body 110 after silver drying into a silver-firing screen frame, and specifically placing into a chain silver-firing furnace at the speed of 820-880 ℃/15min to sinter a silver layer.
Step S505: the shielding member is removed to complete the fabrication of the electrode.
Step S505 is similar to step S303 described above, and is not described here.
On the basis of the above embodiment, the stability of the metal layer 120 can be improved by sintering the metal layer in this embodiment.
Unlike the prior art, the method for manufacturing an electrode of a dielectric filter in the embodiment of the present application is used for forming an electrode on a dielectric body, where the dielectric body is provided with an opening, and the method for manufacturing an electrode includes: providing a shielding member, and arranging the shielding member on the hole surface of the hole around the hole; carrying out metallization treatment on the medium body provided with the shielding member so as to form a metal layer on the outer surface of the medium body, the outer surface of the shielding member and in the opening; the shielding member is removed to complete the fabrication of the electrode. The embodiment of the application adopts the shielding piece to shield the hole surface of the hole, namely the electrode, when the medium body is metallized, so as to prevent the metal layer from covering the hole surface of the hole in the metallization process, and the required electrode can be formed by directly removing the shielding piece after metallization. In this way, on one hand, compared with a silk-screen coating mode, the manufacturing method of the embodiment of the application does not need to adopt a coating and a coating process thereof, so that a subsequent coating drying process and a coating residue cleaning process are not needed, the process can be simplified, and the cost is saved; on the other hand, according to the embodiment of the application, the metal layer on the surface of the open hole can be prevented from being polished and removed by adopting a CNC process, and the cost can be reduced. Therefore, the electrode manufacturing method of the dielectric filter can simplify the production process and save the cost.
Further, the thickness of the metal layer can be controlled by controlling the thickness of the shielding piece, so that the process can be simplified, and the thickness accuracy of the metal layer can be improved.
Further, the embodiment of the application can form the circuit simultaneously in the process of forming the electrode by arranging the electrode shielding member and the circuit shielding member integrally, so that the process can be further simplified.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.
Claims (8)
1. The electrode manufacturing method of the dielectric filter is characterized by being used for forming an electrode on a dielectric body, wherein the dielectric body is provided with an opening, and a metal layer is not arranged on the surface of the opening so that the dielectric body is partially exposed to form the electrode, and the electrode manufacturing method comprises the following steps of:
providing a shield, and arranging the shield on a hole surface of the hole around the hole;
metallizing the medium body provided with the shielding member to form a metal layer on the outer surface of the medium body, the outer surface of the shielding member and in the opening;
removing the shielding member to complete the manufacture of the electrode;
wherein the shield comprises an adhesive tape, a sticker or an organic die;
the shielding member comprises a shielding part and a uncovering part formed on one side of the shielding part far away from the medium body, and the step of uncovering the shielding member to finish the manufacture of the electrode comprises the following steps:
the tear-off portion is pulled along a side facing away from the media body.
2. The method of claim 1, wherein the shield is an annular shield, the opening is a circular hole, and an inner diameter of the annular shield is equal to a radius of the circular hole; the step of disposing the shield around the aperture on the aperture face of the aperture comprises:
and coaxially attaching the annular shielding piece and the round hole to the hole surface of the round hole.
3. The method of manufacturing an electrode according to claim 1, wherein the step of removing the shield to complete the manufacturing of the electrode further comprises:
the shield is soaked with a soaking solution.
4. The method of claim 1, wherein the step of metallizing the dielectric body provided with the shield to form a metal layer on the outer surface of the dielectric body, the outer surface of the shield, and within the opening comprises:
mounting the medium body provided with the shielding piece on a throwing disc, immersing the throwing disc into silver paste, lifting, and spin-drying the superfluous silver paste on the medium body;
and (3) placing the medium body after silver immersion into a silver burning screen frame to be dried in a chain infrared silver drying furnace.
5. The method of claim 4, further comprising, after the step of metallizing the dielectric body provided with the shield to form a metal layer on the outer surface of the dielectric body, the outer surface of the shield, and within the opening:
and placing the medium body after silver drying into a silver-firing screen frame so as to be placed into a chain silver-firing furnace for sintering a silver layer.
6. The method for manufacturing the electrode according to claim 5, wherein the time for feeding silver paste into the throwing disc is 60-200 seconds, the rotating speed of the throwing disc is 1000r/min, the rotating time of the throwing disc is 1min, the parameters for silver drying are 160-220 ℃/15min, and the parameters for sintering the silver layer are 820-880 ℃/15min.
7. A method for manufacturing a dielectric filter, the method comprising:
providing a medium body with an opening;
manufacturing an electrode on the dielectric body by the electrode manufacturing method according to any one of claims 1 to 6;
and assembling and debugging the dielectric body with the electrode.
8. The method of claim 7, wherein two openings are formed in the dielectric body, and the step of forming the electrode on the dielectric body by using the electrode forming method comprises:
and respectively manufacturing an input electrode and an output electrode at the two openings through the electrode manufacturing method.
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| CN202110099039.3A CN114792876B (en) | 2021-01-25 | 2021-01-25 | Method for manufacturing dielectric filter and method for manufacturing electrode thereof |
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| CN202110099039.3A CN114792876B (en) | 2021-01-25 | 2021-01-25 | Method for manufacturing dielectric filter and method for manufacturing electrode thereof |
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| CN114792876A CN114792876A (en) | 2022-07-26 |
| CN114792876B true CN114792876B (en) | 2024-04-02 |
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| KR101189905B1 (en) * | 2010-07-13 | 2012-10-10 | 플란제 에스이 | Plasma shield for electrode |
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