CN114792876A - Method for manufacturing dielectric filter and method for manufacturing electrode thereof - Google Patents
Method for manufacturing dielectric filter and method for manufacturing electrode thereof Download PDFInfo
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- CN114792876A CN114792876A CN202110099039.3A CN202110099039A CN114792876A CN 114792876 A CN114792876 A CN 114792876A CN 202110099039 A CN202110099039 A CN 202110099039A CN 114792876 A CN114792876 A CN 114792876A
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- 238000000034 method Methods 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 67
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000001465 metallisation Methods 0.000 claims abstract description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 43
- 229910052709 silver Inorganic materials 0.000 claims description 43
- 239000004332 silver Substances 0.000 claims description 43
- 238000001035 drying Methods 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 36
- 230000008569 process Effects 0.000 description 29
- 238000000576 coating method Methods 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000007776 silk screen coating Methods 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000015895 biscuits Nutrition 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000010356 wave oscillation Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
The application discloses a manufacturing method of a dielectric filter and an electrode manufacturing method thereof. The electrode manufacturing method is used for forming an electrode on a dielectric body, the dielectric body is provided with an opening, and the electrode manufacturing method comprises the following steps: providing a shielding piece, and arranging the shielding piece on the hole surface of the hole by surrounding the hole; carrying out metallization treatment on the medium body provided with the shielding piece so as to form a metal layer on the outer surface of the medium body, the outer surface of the shielding piece and the opening; and removing the shielding part to complete the manufacture of the electrode. By the method, the manufacturing process of the dielectric filter electrode can be simplified, and the cost is saved.
Description
Technical Field
The present application relates to the field of communications technologies, and in particular, to a method for manufacturing a dielectric filter and a method for manufacturing an electrode thereof.
Background
With the rise of 5G technology in recent two years, the advantages brought by hundreds of 5G are still mentioned. However, since the 5G signal belongs to a high frequency wave, the transmission range thereof is greatly limited, and thus the 5G base station will be arranged more densely, and the dielectric filter is an indispensable component of the base station.
The existing dielectric filter for 5G is formed by sintering ceramic materials, and the final finished product manufacturing process can be divided into: powder material-pressing-sintering-metalizing-electrode preparation-SMT paster-debugging, and electrode preparation is a more critical ring. The electrode manufacturing is a process of removing the silver layer around the opening of the dielectric substrate after the dielectric substrate is metalized, namely, the silver is soaked, so as to expose part of the dielectric substrate, and the exposed dielectric substrate is convenient for electromagnetic signal transmission.
The inventor of the application discovers that the existing electrode manufacturing mode mainly comprises a CNC silver scraping layer mode and a screen printing coating mode in a long-term research and development process, the cost of the former is high, mass production cannot be carried out, and the latter has more process steps and is complex.
Disclosure of Invention
The dielectric filter mainly solves the technical problem of how to simplify the manufacturing process of the dielectric filter electrode and save the cost.
In order to solve the technical problem, the application adopts a technical scheme that: a method for manufacturing an electrode of a dielectric filter is provided. The electrode manufacturing method is used for forming an electrode on a dielectric body, the dielectric body is provided with an opening, and the electrode manufacturing method comprises the following steps: providing a shielding piece, and arranging the shielding piece on the hole surface of the hole by surrounding the hole; carrying out metallization treatment on the medium body provided with the shielding piece so as to form a metal layer on the outer surface of the medium body, the outer surface of the shielding piece and the opening; and removing the shielding part to complete the manufacture of the electrode.
In order to solve the technical problem, the other technical scheme adopted by the application is as follows: a method for manufacturing a dielectric filter is provided. The manufacturing method of the dielectric filter comprises the following steps: providing a medium body with an opening; manufacturing an electrode on the dielectric body by adopting the electrode manufacturing method; and assembling and debugging the dielectric body with the electrode.
The beneficial effect of this application is: different from the prior art, the electrode manufacturing method of the dielectric filter in the embodiment of the application is used for forming an electrode on a dielectric body, the dielectric body is provided with an opening, and the electrode manufacturing method includes: providing a shielding piece, and arranging the shielding piece on the hole surface of the hole by surrounding the hole; carrying out metallization treatment on the medium body provided with the shielding part so as to form a metal layer on the outer surface of the medium body, the outer surface of the shielding part and the opening; and removing the shielding part to finish the manufacture of the electrode. The embodiment of the application adopts the shielding piece to shield the hole surface of the open hole, namely the electrode, when the medium body is metalized, so that the metal layer is prevented from covering the hole surface of the open hole in the metallization process, and the shielding piece is directly uncovered after the metallization process to form the required electrode. Through the mode, compared with a silk-screen coating mode, the manufacturing method does not need to adopt a coating and a coating process thereof, so that a subsequent coating drying process and a coating residue cleaning process are not needed, the process can be simplified, and the cost is saved; on the other hand, the embodiment of the application can avoid adopting CNC technology to polish and remove the metal layer on the surface of the hole, and can reduce cost. Therefore, the manufacturing method of the dielectric filter electrode can simplify the production process and save the cost.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic diagram of a dielectric filter according to an embodiment of the present application;
FIG. 2 is a schematic flow chart diagram illustrating a method for fabricating a dielectric filter according to an embodiment of the present invention;
FIG. 3 is a schematic flow chart diagram illustrating an embodiment of a method for fabricating an electrode of a dielectric filter according to the present invention;
FIG. 4 is a schematic flowchart of the step S302 in the method for manufacturing an electrode of a dielectric filter in the embodiment of FIG. 3;
fig. 5 is a schematic flowchart of an embodiment of a method for manufacturing an electrode of a dielectric filter according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
The terms "first" and "second" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The present application firstly proposes a dielectric filter, as shown in fig. 1, fig. 1 is a schematic structural diagram of an embodiment of the dielectric filter of the present application. The dielectric filter 10 of the present embodiment includes: a dielectric body 110 and a metal layer 120 covering the outer surface of the dielectric body 110; the metal layer 120 serves to confine the electromagnetic field within the dielectric body 110 and can prevent leakage of the electromagnetic signal to form a standing wave oscillation signal within the dielectric body 110.
Further, the dielectric body 110 of the present embodiment is provided with an opening 130, and the metal layer 120 further covers an inner wall of the opening 130; the metal layer 120 is not disposed on the aperture surface 140 of the opening 130, so that the dielectric body 110 is partially exposed to form an electromagnetic signal transmission channel, i.e., an electrode.
The aperture face 140 of the aperture 130 according to the embodiments of the present application refers to a portion of the sidewall of the aperture 130 on the surface of the media body 110.
The opening 130 of the present embodiment may be a through hole or a blind hole, and is not limited in particular.
The present application further provides a method for manufacturing a dielectric filter, as shown in fig. 2, fig. 2 is a schematic flow chart of an embodiment of the method for manufacturing a dielectric filter of the present application. The method of manufacturing the dielectric filter of the present embodiment can be used to manufacture the dielectric filter 10. Specifically, the manufacturing method of the dielectric filter of the embodiment includes the following steps:
step S201: a dielectric body 110 having an opening is provided.
The dielectric body 110 of the present embodiment is a dielectric block made of a solid dielectric material, which may be a ceramic material. In other embodiments, the material of the dielectric body may be other materials with high dielectric constant and low loss, such as glass, quartz crystal, or titanate.
The opening 130 and the dielectric body 110 of the present embodiment may be integrally formed by a mold or the like. Specifically, firstly, medium ceramic powder is made into spherical granules with better fluidity; then, putting the granulated spherical granules into a die by a dry pressing forming process, and applying pressure by a pressure head to form a ceramic biscuit with certain strength and shape; then reducing air holes in the formed body through high-temperature sintering, removing impurities, enhancing the combination among particles and improving the mechanical strength; and finally, grinding by adopting a CNC (computerized numerical control) machine tool to accurately obtain the size precision of the medium body 110.
Step S202: electrodes are fabricated on the dielectric body 110.
In this embodiment, the input electrode and the output electrode are formed on the dielectric body 110. Of course, in other embodiments, similar fabrication methods can be used to fabricate the coupling electrode and the like on the dielectric body 110.
The method of forming the electrodes on the dielectric body 110 will be described in detail in the following examples and will not be described here.
Step S203: the dielectric body 110 with the electrodes fabricated thereon is assembled and debugged.
Specifically, the dielectric body 110 with electrodes and other accessories are assembled by Surface Mount Technology (SMT), and the dielectric body 110 with electrodes is mounted on the Surface of a circuit board or other substrate, and then soldered or dip-soldered; then, the SMT assembled dielectric body 110 is debugged, mainly to debug the passband bandwidth, insertion loss, and the like of the dielectric filter 10.
The present application further provides a method for manufacturing an electrode of a dielectric filter, as shown in fig. 3, fig. 3 is a schematic flowchart of an embodiment of the method for manufacturing an electrode of a dielectric filter according to the present application. The manufacturing method of the present embodiment can be used to manufacture the electrode of the dielectric filter 10. The manufacturing method of the embodiment comprises the following steps:
step S301: a shield (not shown) is provided and is disposed around the opening 130 on the aperture face 140 of the opening 130.
Optionally, the shielding member of the present embodiment is an annular shielding member, and the opening 130 is a circular hole. The annular shield is affixed to the bore surface 140 of the circular bore coaxially with the circular bore.
In other embodiments, the openings may also be other shapes, such as triangular or square, etc.; the shape of the hollow part in the middle of the shielding piece is consistent with that of the opening, the shape of the periphery of the shielding piece can be triangular or square, and the shape of the periphery of the shielding piece can be the same as or different from that of the hollow part.
The inner diameter of the shielding member of the present embodiment is equal to the radius of the opening 130, so that when the dielectric body 110 is metalized subsequently, the inner wall of the opening 130 can quickly cover the metal layer 120, and the opening surface 140 of the opening 130 can be ensured not to be covered by the metal layer 120.
In other embodiments, the inner diameter of the shield may be smaller than the radius of the opening, i.e. the shield may partially block the opening, which may result in a slower metallization process of the dielectric body, but may improve the subsequent process of removing the shield because the shield protrudes from the opening.
Optionally, the covering of the present embodiment includes a tape, a sticker, an organic mold, or the like. Such as PU films, polycarbonate films, silicone adhesive sealants, and the like.
The shielding member of the embodiment can bear more than eight hundred degrees of high temperature without decomposition, namely the shielding member is not decomposed in the metallization process of the subsequent medium body, and the material of the shielding member does not have chemical reaction and physical reaction with the metal used in the metallization process.
Optionally, the shield is composed of a barrier layer and an adhesive layer disposed between the barrier layer and the dielectric body 110 for adhering the barrier layer to the dielectric body 110; the barrier layer is made of sparse alloy materials, so that metal residues on the shielding piece in a metallization process can be reduced, and the shielding piece can be conveniently and quickly uncovered and removed.
Step S302: the dielectric body 110 with the shielding member is metallized to form a metal layer 120 on the outer surface of the dielectric body 110, the outer surface of the shielding member and the opening 130.
The material of the metal layer 120 of this embodiment is silver, and in other embodiments, the material of the metal layer may also be copper, tin, aluminum, titanium, gold, or the like.
Alternatively, the present embodiment may implement step S302 by using the method shown in fig. 4. The method of the embodiment comprises the following steps:
step S401: and mounting the medium body 110 provided with the shielding piece on a throwing disc, immersing the throwing disc into silver paste, and lifting the throwing disc to spin-dry the redundant silver paste on the medium body 110 clockwise.
And mounting the medium body 110 provided with the shielding piece on a throwing disc, immersing the throwing disc in the silver paste for 60-200 seconds, lifting and then rotating clockwise to spin-dry the redundant silver paste on the medium body 110, wherein the rotating speed of the throwing disc is 1000r/min, and the silver throwing time of the throwing disc is 1 min.
Step S402: and putting the medium body 110 after being soaked with the silver into a silver burning screen frame, and putting the silver burning screen frame into a chain infrared silver baking furnace for drying.
And (3) putting the medium body 110 after being soaked with the silver into a chain infrared silver baking furnace for drying at the temperature of 160-220 ℃/15 min.
Multiple silver coatings are typically required to the dielectric body 110 to meet the silver layer thickness requirements.
In one embodiment, if the thickness of the sintered silver layer is less than 10 μm, the dielectric body 110 needs to be repeatedly coated with silver until the thickness is greater than or equal to 10 μm.
Step S303: and removing the shielding part to finish the manufacture of the electrode.
After the metallization of the dielectric body 110, a metal layer 120 is formed on the outer surface of the dielectric body 110, the outer surface of the shield, and the opening 130; the masking member is then removed to expose the dielectric body 110 at the aperture surface 140 of the opening 130, thereby completing the fabrication of the electrode.
To improve the efficiency of removing the shield, the inner diameter of the shield may be set smaller than the radius of the opening, i.e. the shield will partially cover the opening, because the shield protrudes from the opening, the protruding portion of the shield can be quickly clamped along the side away from the media body 110 to remove the shield.
In order to improve the efficiency of removing the shielding member, the shielding member can be further provided with a shielding part and a removing part formed on one side of the shielding part far away from the medium body 110, and the removing part can be clamped quickly and pulled along one side of the shielding part far away from the medium body 110.
In order to improve the efficiency of removing the shielding member, the shielding member may be soaked with a soaking solution to improve the separation speed between the shielding member and the medium body 110.
Compared with the prior art, on one hand, compared with a silk-screen coating mode, the manufacturing method of the embodiment does not need to adopt a coating and a coating process thereof, so that a subsequent coating drying process and a coating residue cleaning process are not needed, the process can be simplified, and the cost can be saved; on the other hand, the present embodiment can avoid the CNC process to polish and remove the metal layer 120 on the hole surface 140 of the opening 130, thereby reducing the cost. Therefore, the manufacturing method of the electrode of the dielectric filter can simplify the production process and save the cost.
Further, the thickness of the metal layer 120 is difficult to control during the metallization process of the dielectric body 110, and in the prior art, the metal layer 120 is usually polished by a laser device to adjust the thickness. The thickness of the metal layer 120 can be controlled by controlling the thickness of the shielding member in the embodiment of the present application, for example, the thickness of the shielding member can be set to the thickness of the metal layer 120, and the thickness of the metal layer 120 is controlled to be the same as the thickness of the shielding member in the process of metalizing the dielectric body 110.
Further, in some application scenarios, a circuit needs to be provided for the dielectric filter, and the embodiment of the application can form the circuit simultaneously in the process of forming the electrode by providing the electrode shield and the circuit shield which are integrated, so that the process can be further simplified.
The present application further provides a method for manufacturing an electrode of a dielectric filter according to another embodiment, as shown in fig. 5, fig. 5 is a schematic flow chart of an embodiment of the method for manufacturing an electrode of a dielectric filter according to the present application. The manufacturing method of the present embodiment can be used to manufacture the electrode of the dielectric filter 10. The manufacturing method of the embodiment comprises the following steps:
step S501: a shield (not shown) is provided and is disposed around the opening 130 on the aperture face 140 of the opening 130.
Step S501 is similar to step S301 described above, and is not described herein.
Step S502: and mounting the medium body 110 provided with the shielding piece on a throwing disc, immersing the throwing disc into silver paste, and lifting the throwing disc to spin-dry the redundant silver paste on the medium body 110 clockwise.
Step S502 is similar to step S401 described above and is not described here.
Step S503: and putting the medium body 110 after being soaked with silver into a silver burning net frame, and putting the medium body into a chain infrared silver baking furnace for drying.
Step S503 is similar to step S402 described above, and is not described herein.
Step S504: and placing the medium body 110 subjected to silver baking into a silver burning screen frame to be placed into a chain silver burning furnace to sinter the silver layer.
And placing the medium body 110 after silver baking into a silver burning screen frame, and specifically placing the medium body into a chain silver burning furnace at 820-.
Step S505: and removing the shielding part to finish the manufacture of the electrode.
Step S505 is similar to step S303 described above and is not described here.
In addition to the above embodiments, the present embodiment can improve the stability of the metal layer 120 by sintering the metal layer.
Different from the prior art, the electrode manufacturing method of the dielectric filter in the embodiment of the application is used for forming an electrode on a dielectric body, the dielectric body is provided with an opening, and the electrode manufacturing method includes: providing a shielding piece, and arranging the shielding piece on the hole surface of the opening hole in a surrounding way; carrying out metallization treatment on the medium body provided with the shielding piece so as to form a metal layer on the outer surface of the medium body, the outer surface of the shielding piece and the opening; and removing the shielding part to complete the manufacture of the electrode. The embodiment of the application adopts the shielding piece to shield the hole surface of the open hole, namely the electrode, when the medium body is metalized, so that the metal layer is prevented from covering the hole surface of the open hole in the metallization process, and the shielding piece is directly uncovered after the metallization process to form the required electrode. Through the mode, compared with a silk-screen coating mode, the manufacturing method does not need to adopt a coating and a coating process thereof, so that a subsequent coating drying process and a coating residue cleaning process are not needed, the process can be simplified, and the cost is saved; on the other hand, the embodiment of the application can avoid adopting CNC technology to polish and remove the metal layer on the surface of the hole, and can reduce cost. Therefore, the manufacturing method of the dielectric filter electrode can simplify the production process and save the cost.
Furthermore, the thickness of the metal layer can be controlled by controlling the thickness of the shielding part, so that the process can be simplified, and the precision of the thickness of the metal layer can be improved.
Further, the embodiment of the application can form the circuit simultaneously in the process of forming the electrode by arranging the electrode shielding part and the circuit shielding part which are integrated, so that the process can be further simplified.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A method for forming an electrode on a dielectric body, the dielectric body having an opening, the method comprising:
providing a shielding piece, and arranging the shielding piece on the hole surface of the hole around the hole;
carrying out metallization treatment on the medium body provided with the shielding part so as to form a metal layer on the outer surface of the medium body, the outer surface of the shielding part and the opening;
and removing the shielding piece to finish the manufacture of the electrode.
2. The method of claim 1, wherein the shield is an annular shield, the opening is a circular hole, and the inner diameter of the annular shield is equal to the radius of the circular hole; the step of disposing the shield on the aperture face of the aperture around the aperture includes:
and coaxially attaching the annular shielding piece and the round hole on the hole surface of the round hole.
3. The method of claim 2, wherein the mask comprises tape, a sticker, or an organic mold.
4. The method of claim 1, wherein the shielding member includes a shielding portion and a removing portion formed on a side of the shielding portion away from the dielectric body, and the step of removing the shielding member to complete the electrode comprises:
the tear away portion is pulled along a side facing away from the media body.
5. The method of claim 4, wherein said step of removing said covering to complete said electrode further comprises:
and soaking the shielding piece by adopting a soaking solution.
6. The method of claim 1, wherein the step of metallizing the dielectric body with the shield to form a metal layer on the outer surface of the dielectric body, the outer surface of the shield and the opening comprises:
mounting the medium body provided with the shielding piece on a throwing disc, immersing the throwing disc into silver paste, and rotating and drying the surplus silver paste on the medium body after lifting;
and putting the medium body after being soaked with the silver into a silver burning screen frame, and putting the medium body into a chain infrared silver drying furnace for drying.
7. The method of claim 6, wherein after the step of metallizing the dielectric body with the shield to form a metal layer on the outer surface of the dielectric body, the outer surface of the shield, and the opening, the method further comprises:
and placing the medium body after silver baking into a silver burning net frame so as to be placed into a chain silver burning furnace to sinter the silver layer.
8. The method for manufacturing an electrode according to claim 7, wherein the time for putting the silver paste into the spin chuck is 60-200 seconds, the rotation speed of the spin chuck is 1000r/min, the rotation time of the spin chuck is 1min, the parameters for baking silver are 220 ℃/15min and the parameters for sintering the silver layer are 820 ℃ 880 ℃/15 min.
9. A method of making a dielectric filter, the method comprising:
providing a medium body with an opening;
fabricating an electrode on the dielectric body using the electrode fabrication method of any one of claims 1 to 8;
and assembling and debugging the dielectric body with the electrode.
10. The method of claim 9, wherein the dielectric body has two openings, and the step of forming the electrode on the dielectric body by the electrode forming method comprises:
and respectively manufacturing an input electrode and an output electrode at the two openings by the electrode manufacturing method.
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| CN202110099039.3A CN114792876B (en) | 2021-01-25 | 2021-01-25 | Method for manufacturing dielectric filter and method for manufacturing electrode thereof |
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| CN202110099039.3A CN114792876B (en) | 2021-01-25 | 2021-01-25 | Method for manufacturing dielectric filter and method for manufacturing electrode thereof |
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| CN112086718A (en) * | 2020-09-21 | 2020-12-15 | 中国电子科技集团公司第二十六研究所 | High-frequency integrated dielectric filter based on half-wavelength resonator two-end open circuit structure |
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