CN114779848A - Semiconductor temperature control equipment with precooling function and temperature control method - Google Patents
Semiconductor temperature control equipment with precooling function and temperature control method Download PDFInfo
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- CN114779848A CN114779848A CN202210272633.2A CN202210272633A CN114779848A CN 114779848 A CN114779848 A CN 114779848A CN 202210272633 A CN202210272633 A CN 202210272633A CN 114779848 A CN114779848 A CN 114779848A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 89
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000003507 refrigerant Substances 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims description 21
- 230000001105 regulatory effect Effects 0.000 claims description 7
- 238000005057 refrigeration Methods 0.000 description 7
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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Abstract
The invention provides semiconductor temperature control equipment with a precooling function and a temperature control method, and relates to the technical field of semiconductors. The circulating liquid pre-heat exchange device has the advantages that the heat exchange device is matched with the water tank, the refrigerant is enabled to pre-exchange heat for the circulating liquid, the refrigerant is enabled to perform secondary heat exchange for the circulating liquid through the first evaporator, the temperature of the circulating liquid entering the inlet of the first evaporator is reduced through pre-exchange heat for the circulating liquid, the requirement for the first evaporator is reduced, and the temperature control precision of the temperature control equipment is improved. Because the heat exchange device and the pipeline are arranged in the water tank, the appearance and the size of the temperature control equipment and the appearance and the size of parts are not changed, and the space utilization rate of the temperature control equipment is improved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to semiconductor temperature control equipment with a precooling function and a temperature control method.
Background
At present, the wafer processing is with control by temperature change equipment overlapping refrigerating system mostly only carries out a heat transfer for circulation liquid and refrigerant through the evaporimeter, because the temperature when circulation liquid gets into the evaporimeter entry is higher, relies on circulation liquid to take place the heat transfer in the evaporimeter alone, it is great to the evaporimeter dependence, causes the evaporimeter entry temperature fluctuation too big easily, it is too big to cause compressor output fluctuation easily in the control, the fluctuation of electron expansion valve aperture is made a round trip, lead to the temperature control precision lower.
Disclosure of Invention
The invention provides semiconductor temperature control equipment with a precooling function and a temperature control method, which are used for solving the problems of low heat exchange efficiency and low temperature control precision of the conventional temperature control equipment.
The invention provides a semiconductor temperature control device with a precooling function, which comprises:
the circulating system comprises a water pump and a water tank, wherein a liquid outlet of the water pump is communicated with a liquid inlet of load equipment, a first temperature sensor is arranged at the liquid outlet of the load equipment, and the liquid outlet of the load equipment is communicated with a liquid inlet of the water tank;
refrigerating system, including refrigerating plant and refrigerant cycle device, refrigerant cycle device includes first evaporimeter, heat transfer device and first compressor, heat transfer device set up in the water tank, heat transfer device's entry with the first entry of first evaporimeter communicates jointly refrigerating plant's export, heat transfer device's entry is provided with first automatically controlled valve, heat transfer device's export with the first export of first evaporimeter communicates jointly the entry of first compressor, the export of first compressor with refrigerating plant's entry intercommunication, the second entry of first evaporimeter with the liquid outlet intercommunication of water tank, the second export of first evaporimeter with the inlet intercommunication of water pump.
According to the semiconductor temperature control device with the precooling function, which is provided by the embodiment of the invention, the refrigerating device comprises a condenser, a second compressor, an electronic expansion valve and a second evaporator, wherein the condenser is connected in series on a plant water branch, and the condenser, the electronic expansion valve, the second evaporator and the second compressor are sequentially connected in series to form a refrigerating circuit; the outlet of the first compressor is communicated with the first inlet of the second evaporator, and the inlet of the heat exchange device and the first inlet of the first evaporator are communicated with the first outlet of the second evaporator together.
According to the semiconductor temperature control device with the pre-cooling function provided by the embodiment of the invention, the refrigerant circulating device further comprises:
and the outlet of the heat exchange device and the first outlet of the first evaporator are communicated with the inlet of the first compressor and the first connecting port of the expansion container, and the outlet of the first compressor and the second connecting port of the expansion container are communicated with the first inlet of the second evaporator.
According to the semiconductor temperature control device with the pre-cooling function provided by the embodiment of the invention, the second connecting port of the expansion container is provided with the second electric control valve.
According to the semiconductor temperature control device with the pre-cooling function provided by the embodiment of the invention, the liquid inlet of the load device is provided with the second temperature sensor.
According to the semiconductor temperature control device with the precooling function, provided by the embodiment of the invention, a third electronic control valve is arranged at the first inlet of the first evaporator, and the first electronic control valve, the second electronic control valve and the third electronic control valve are all electronic expansion valves.
According to the semiconductor temperature control device with the precooling function, which is provided by the embodiment of the invention, the heat exchange device and the water tank are integrally formed, and the water tank is provided with the liquid level meter.
According to the semiconductor temperature control device with the pre-cooling function provided by the embodiment of the invention, the outlet of the heat exchange device is provided with the pressure regulating valve.
According to the semiconductor temperature control device with the pre-cooling function provided by the embodiment of the invention, the second inlet of the first evaporator is provided with the third temperature sensor.
The invention also provides a semiconductor temperature control method with a pre-cooling function, which is based on any one of the semiconductor temperature control devices with the pre-cooling function, and comprises the following steps:
acquiring a temperature value of a liquid outlet of the load equipment;
comparing the temperature value with a preset temperature value;
if the temperature value is less than the preset temperature value, closing the first electric control valve;
and if the temperature value is greater than the preset temperature value, increasing the opening degree of the first electric control valve.
According to the semiconductor temperature control equipment provided by the embodiment of the invention, the heat exchange device is matched with the water tank, the advance heat exchange of the circulating liquid by the refrigerant is realized, the secondary heat exchange of the circulating liquid by the refrigerant is realized by the first evaporator, the advance heat exchange of the circulating liquid is realized, the temperature of the circulating liquid entering the inlet of the first evaporator is reduced, the requirement on the first evaporator is reduced, and the temperature control precision of the temperature control equipment is improved. Because heat transfer device and pipeline set up inside the water tank, do not change the appearance and the size of temperature control equipment to and the appearance and the size of spare part, consequently improved temperature control equipment's space utilization.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductor temperature control device according to an embodiment of the present invention.
Reference numerals are as follows:
1. a pressure regulating valve; 2. a first electrically controlled valve; 3. a heat exchange device; 4. a water pump; 5. a first temperature sensor; 6. a second temperature sensor; 7. a water tank; 8. a first evaporator; 9. a third electrically controlled valve; 10. a condenser; 11. an electronic expansion valve; 12. a second compressor; 13. a second evaporator; 14. a second electrically controlled valve; 15. a first compressor; 16. an expansion vessel; 17. a load device; 18. a third temperature sensor.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection, unless explicitly stated or limited otherwise; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, a first feature may be "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent.
Fig. 1 is a schematic view illustrating a structural principle of a semiconductor temperature control device according to an embodiment of the present invention, and as shown in fig. 1, the semiconductor temperature control device includes a circulation system and a refrigeration system, the circulation system includes a water pump 4 and a water tank 7, a liquid outlet of the water pump 4 is communicated with a liquid inlet of a load device 17, a liquid outlet of the load device 17 is provided with a first temperature sensor 5, and the liquid outlet of the load device is communicated with a liquid inlet of the water tank.
The refrigerating system comprises a refrigerating device and a refrigerant circulating device, the refrigerant circulating device comprises a first evaporator 8, a heat exchange device 3 and a first compressor 15, the heat exchange device 3 is arranged in a water tank 7, an inlet of the heat exchange device 3 and a first inlet of the first evaporator 8 are communicated with an outlet of the refrigerating device, an inlet of the heat exchange device 3 is provided with a first electric control valve 2, an outlet of the heat exchange device 3 and a first outlet of the first evaporator 8 are communicated with an inlet of the first compressor 15, an outlet of the first compressor 15 is communicated with an inlet of the refrigerating device, a second inlet of the first evaporator 8 is communicated with a liquid outlet of the water tank 7, and a second outlet of the first evaporator 8 is communicated with a liquid inlet of a water pump.
According to the semiconductor temperature control device provided by the embodiment of the invention, the heat exchange device 3 is matched with the water tank, the advance heat exchange of the circulating liquid by the refrigerant is realized, the secondary heat exchange of the circulating liquid by the refrigerant is realized by the first evaporator 8, the advance heat exchange of the circulating liquid is realized, the temperature of the circulating liquid entering the inlet of the first evaporator 8 is reduced, the requirement on the first evaporator 8 is reduced, and the temperature control precision of the temperature control device is improved. Because heat transfer device 3 and pipeline set up inside the water tank, do not change the appearance and the size of temperature control equipment to and the appearance and the size of spare part, consequently improved temperature control equipment's space utilization.
In the embodiment of the present invention, the water pump 4, the water tank 7, the load device 17 and the first evaporator 8 form a circulation pipeline of the circulation fluid, and the water pump 4 is used for driving the circulation fluid to circulate in the circulation pipeline, so that heat exchange is completed.
In the embodiment of the present invention, the refrigeration apparatus includes a condenser 10, a second compressor 12, an electronic expansion valve 11, and a second evaporator 13, the condenser 10 is connected in series to the plant water branch, that is, a first inlet of the condenser 10 is communicated with a liquid outlet pipe of the plant water branch, and a first outlet of the condenser 10 is communicated with a liquid return pipe of the plant water branch. The condenser 10, the electronic expansion valve 11, the second evaporator 13 and the second compressor 12 are sequentially connected in series to form a refrigeration circuit, that is, a second outlet of the condenser 10 is communicated with an inlet of the electronic expansion valve 11, an outlet of the electronic expansion valve 11 is communicated with a second inlet of the second evaporator 13, a second outlet of the second evaporator 13 is communicated with an inlet of the second compressor 12, and an outlet of the second compressor 12 is communicated with a second inlet of the condenser 10. The outlet of the first compressor 15 is communicated with the first inlet of the second evaporator 13, and the inlet of the heat exchange device 3 and the first inlet of the first evaporator 8 are communicated with the first outlet of the second evaporator 13.
The condenser 10 is used for heat exchange with the liquid in the plant water branch and the second evaporator 13 is used for heat exchange with the refrigerant circuit. The first compressor 15 conveys the refrigerant to the second evaporator 13 to carry out heat exchange, so that the temperature of the refrigerant is reduced, the refrigerant after the temperature reduction respectively enters the first evaporator 8 and the heat exchange device 3, wherein the refrigerant exchanges heat with the circulating liquid in advance in the heat exchange device 3, the circulating liquid exchanges heat in advance through the heat exchange device 3 in the water tank 7, the temperature of the circulating liquid entering the inlet of the first evaporator 8 is reduced, the requirement on the first evaporator 8 is reduced, and the temperature control precision of the temperature control device is improved. By adopting PID control, the heat exchange quantity in the water tank 7 can be automatically adjusted, and the quantity of the refrigerant entering the water tank 7 for heat exchange is controlled according to the detection temperature value of the liquid inlet and/or the liquid outlet of the load equipment 17. The internal space of the water tank 7 is utilized to realize the pre-heat exchange between the circulating liquid and the refrigerant, so that the overall heat exchange amount of the system is increased. The temperature of the circulating liquid entering the first evaporator 8 can be ensured to be lower than the normal temperature, and the heat exchange of the circulating liquid at the ultralow temperature is facilitated. The cooling in the first evaporator 8 of the refrigerating system by only depending on the circulating liquid is avoided, and the load of the refrigerating system is reduced. The overlarge output fluctuation of the compressor and the back-and-forth fluctuation of the opening degree of the electronic expansion valve 11 are avoided, and the service life and the long-term stability of the whole system are favorably improved.
In the embodiment of the present invention, the refrigerant cycle device further includes an expansion container 16, the outlet of the heat exchanging device 3 and the first outlet of the first evaporator 8 are communicated with the inlet of the first compressor 15 and the first connecting port of the expansion container 16, the outlet of the first compressor 15 and the second connecting port of the expansion container 16 are communicated with the first inlet of the second evaporator 13, and the second connecting port of the expansion container 16 is provided with the second electrically controlled valve 14.
It should be noted here that, since the refrigerant is gaseous at normal temperature, and expands greatly, when the temperature is-70 ℃, the refrigerant is liquid, but if the temperature returns to normal temperature after the shutdown, the internal pressure of the pipeline is very high, so that the expansion container 16 is arranged on the pipeline, the volume of the whole system can be increased, and after the refrigerant expands, the internal pressure of the pipeline is not increased to be very high, thereby effectively improving the safety of the temperature control device. By providing the second electrically controlled valve 14, the amount of refrigerant entering the interior of the expansion vessel 16 can be controlled.
In the embodiment of the present invention, a pressure regulating valve 1 is disposed at an outlet of the heat exchanging device 3, the pressure regulating valve 1 is used for regulating the pressure of the refrigerant at the outlet of the heat exchanging device 3, and the heat exchanging device 3 may be a heat exchanger with a heat exchanging tube or a fin type.
In the embodiment of the invention, the liquid inlet of the load device 17 is provided with the second temperature sensor 6, the second temperature sensor 6 is used for detecting the temperature value of the liquid inlet of the load device 17, and the amount of the refrigerant entering the water tank 7 for heat exchange is controlled according to the temperature value of the liquid outlet and/or the liquid inlet of the load device 17, so that the temperature control precision of the temperature control device can be further improved.
In the embodiment of the present invention, the third electronic control valve 9 is disposed at the first inlet of the first evaporator 8, and the first electronic control valve 2, the second electronic control valve 14 and the third electronic control valve 9 are all electronic expansion valves, and the electronic expansion valves, the first temperature sensor 5 and the second temperature sensor 6 are electrically connected to the PID controller, respectively, so as to realize automatic control of the temperature control device.
In the embodiment of the invention, the heat exchange device 3 and the water tank 7 are integrally formed, the water tank 7 is provided with the liquid level meter, and the amount of the circulating liquid in the water tank 7 can be conveniently observed by arranging the liquid level meter.
In the embodiment of the present invention, the second inlet of the first evaporator 8 is provided with a third temperature sensor 18, the third temperature sensor 18 is configured to detect the temperature of the circulation liquid entering the second inlet of the first evaporator 8, and the temperature control precision of the temperature control device is effectively improved by detecting the temperature of the circulation liquid entering the second inlet of the first evaporator 8.
One embodiment of the present invention is described below in conjunction with FIG. 1: in fig. 1, the semiconductor temperature control device includes a circulation system and a refrigeration system, the circulation system includes a water pump 4 and a water tank 7, a liquid outlet of the water pump 4 is communicated with a liquid inlet of a load device 17, a liquid outlet of the load device 17 is provided with a first temperature sensor 5, and the liquid outlet of the load device is communicated with a liquid inlet of the water tank 7.
The refrigeration system comprises a refrigeration device and a refrigerant circulating device, the refrigeration device comprises a condenser 10, a second compressor 12, an electronic expansion valve 11 and a second evaporator 13, a first inlet of the condenser 10 is communicated with a liquid outlet pipe of the plant water branch, and a first outlet of the condenser 10 is communicated with a liquid return pipe of the plant water branch. A second outlet of the condenser 10 communicates with an inlet of the electronic expansion valve 11, an outlet of the electronic expansion valve 11 communicates with a second inlet of the second evaporator 13, a second outlet of the second evaporator 13 communicates with an inlet of the second compressor 12, and an outlet of the second compressor 12 communicates with a second inlet of the condenser 10.
The refrigerant circulating device comprises a first evaporator 8, an expansion container 16, a heat exchange device 3 and a first compressor 15, the heat exchange device 3 is arranged in the water tank 7, an inlet of the heat exchange device 3 and a first inlet of the first evaporator 8 are communicated with a first outlet of the second evaporator 13, an outlet of the heat exchange device 3 and a first outlet of the first evaporator 8 are communicated with an inlet of the first compressor 15 and a first connecting port of the expansion container 16, an outlet of the first compressor 15 and a second connecting port of the expansion container 16 are communicated with a first inlet of the second evaporator 13, the inlet of the heat exchange device 3 is provided with a first electric control valve 2, a second inlet of the first evaporator 8 is communicated with a liquid outlet of the water tank 7, and a second outlet of the first evaporator 8 is communicated with a liquid inlet of the water pump 4. A second electronic control valve 14 is arranged at a second connecting port of the expansion container 16, a third temperature sensor is arranged at a second inlet of the first evaporator 8, a third electronic control valve 9 is arranged at a first inlet of the first evaporator 8, and the first electronic control valve 2, the second electronic control valve 14 and the third electronic control valve 9 are all electronic expansion valves 11. The outlet of the heat exchange device 3 is provided with a pressure regulating valve 1, the liquid outlet of the load equipment 17 is provided with a second temperature sensor 6, the heat exchange device 3 and the water tank 7 are integrally formed, and the water tank 7 is provided with a liquid level meter.
The embodiment of the invention also provides a semiconductor temperature control method with a pre-cooling function, based on the semiconductor temperature control device with the pre-cooling function in any one of the embodiments, the semiconductor temperature control method with the pre-cooling function comprises the following steps:
acquiring a temperature value of a liquid outlet of load equipment;
the temperature value of the load device outlet is detected by a first temperature sensor 5.
Comparing the temperature value with a preset temperature value;
the purpose of comparing the temperature value with the preset temperature value is to determine a control scheme for the first electrically controlled valve 2 according to the comparison result, the control scheme consisting in increasing the opening of the first electrically controlled valve 2 and closing the first electrically controlled valve 2.
If the temperature value is less than the preset temperature value, closing the first electric control valve 2;
if the temperature value is less than the preset temperature value, it indicates that the temperature of the circulating liquid at the liquid outlet of the load equipment is low, and the first evaporator 8 alone performs heat exchange on the circulating liquid to reduce the temperature of the circulating liquid, so that the first electronic control valve 2 is closed, and only the first evaporator 8 performs heat exchange on the circulating liquid.
And if the temperature value is greater than the preset temperature value, increasing the opening degree of the first electronic control valve 2.
If the temperature value is greater than the preset temperature value, it is indicated that the temperature of the circulating liquid at the liquid outlet of the load equipment is high, and the temperature of the circulating liquid cannot be reduced enough by performing heat exchange on the circulating liquid through the first evaporator 8 alone, so that the opening degree of the first electric control valve 2 is increased, and the amount of the refrigerant entering the heat exchange device 3 can be increased. At this moment, the heat exchange device 3 is matched with the water tank 7, the refrigerant is used for exchanging heat with the circulating liquid in advance, the refrigerant is used for exchanging heat with the circulating liquid for the second time through the first evaporator 8, the circulating liquid is exchanged heat with the circulating liquid in advance, the temperature of the circulating liquid entering the first evaporator 8 is reduced, the requirement on the first evaporator 8 is lowered, and the temperature control precision of the temperature control device is improved.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A semiconductor temperature control apparatus with a pre-cooling function, comprising:
the circulating system comprises a water pump and a water tank, wherein a liquid outlet of the water pump is communicated with a liquid inlet of load equipment, a first temperature sensor is arranged at the liquid outlet of the load equipment, and the liquid outlet of the load equipment is communicated with a liquid inlet of the water tank;
refrigerating system, including refrigerating plant and refrigerant cycle device, refrigerant cycle device includes first evaporimeter, heat transfer device and first compressor, heat transfer device set up in the water tank, heat transfer device's entry with the first entry of first evaporimeter communicates jointly refrigerating plant's export, heat transfer device's entry is provided with first automatically controlled valve, heat transfer device's export with the first export of first evaporimeter communicates jointly the entry of first compressor, the export of first compressor with refrigerating plant's entry intercommunication, the second entry of first evaporimeter with the liquid outlet intercommunication of water tank, the second export of first evaporimeter with the inlet intercommunication of water pump.
2. The semiconductor temperature control device with the precooling function according to claim 1, wherein the refrigerating device comprises a condenser, a second compressor, an electronic expansion valve and a second evaporator, the condenser is connected in series to a plant water branch, and the condenser, the electronic expansion valve, the second evaporator and the second compressor are connected in series in sequence to form a refrigerating circuit; the outlet of the first compressor is communicated with the first inlet of the second evaporator, and the inlet of the heat exchange device and the first inlet of the first evaporator are communicated with the first outlet of the second evaporator.
3. The semiconductor temperature control apparatus with a pre-cooling function according to claim 2, wherein the refrigerant cycle device further includes:
and the outlet of the heat exchange device and the first outlet of the first evaporator are communicated with the inlet of the first compressor and the first connecting port of the expansion container, and the outlet of the first compressor and the second connecting port of the expansion container are communicated with the first inlet of the second evaporator.
4. The semiconductor temperature control device with pre-cooling function of claim 3, wherein the second connection port of the expansion vessel is provided with a second electrically controlled valve.
5. The semiconductor temperature control device with the pre-cooling function according to any one of claims 1 to 4, wherein the liquid inlet of the load device is provided with a second temperature sensor.
6. The semiconductor temperature control device with the pre-cooling function according to claim 4, wherein a third electronic control valve is disposed at the first inlet of the first evaporator, and the first electronic control valve, the second electronic control valve and the third electronic control valve are all electronic expansion valves.
7. The semiconductor temperature control device with the pre-cooling function according to any one of claims 1 to 4, wherein the heat exchanging device is integrally formed with the water tank, and the water tank is provided with a liquid level meter.
8. The semiconductor temperature control device with the pre-cooling function according to any one of claims 1 to 4, wherein an outlet of the heat exchanging device is provided with a pressure regulating valve.
9. The semiconductor temperature control device with the pre-cooling function according to any one of claims 1 to 4, wherein the second inlet of the first evaporator is provided with a third temperature sensor.
10. A semiconductor temperature control method with a pre-cooling function, based on the semiconductor temperature control device with a pre-cooling function of any one of claims 1 to 9, comprising the steps of:
acquiring a temperature value of a liquid outlet of the load equipment;
comparing the temperature value with a preset temperature value;
if the temperature value is less than the preset temperature value, closing the first electric control valve;
and if the temperature value is greater than the preset temperature value, increasing the opening of the first electric control valve.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210272633.2A CN114779848A (en) | 2022-03-18 | 2022-03-18 | Semiconductor temperature control equipment with precooling function and temperature control method |
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| CN202210272633.2A CN114779848A (en) | 2022-03-18 | 2022-03-18 | Semiconductor temperature control equipment with precooling function and temperature control method |
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| JPH01263461A (en) * | 1988-04-12 | 1989-10-19 | Mitsubishi Electric Corp | Heat pump device |
| CN109032201A (en) * | 2017-06-09 | 2018-12-18 | 北京京仪自动化装备技术有限公司 | Semiconductor production temperature control device |
| CN111562801A (en) * | 2020-07-14 | 2020-08-21 | 北京京仪自动化装备技术有限公司 | Circulating liquid temperature adjusting method, circulating liquid temperature adjusting control device and circulating liquid temperature adjusting control system |
| CN211372806U (en) * | 2019-12-24 | 2020-08-28 | 北京京仪自动化装备技术有限公司 | Semiconductor temperature control device system |
| CN112817347A (en) * | 2020-12-25 | 2021-05-18 | 北京京仪自动化装备技术有限公司 | Rapid temperature rise and drop system and control method thereof |
-
2022
- 2022-03-18 CN CN202210272633.2A patent/CN114779848A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01263461A (en) * | 1988-04-12 | 1989-10-19 | Mitsubishi Electric Corp | Heat pump device |
| CN109032201A (en) * | 2017-06-09 | 2018-12-18 | 北京京仪自动化装备技术有限公司 | Semiconductor production temperature control device |
| CN211372806U (en) * | 2019-12-24 | 2020-08-28 | 北京京仪自动化装备技术有限公司 | Semiconductor temperature control device system |
| CN111562801A (en) * | 2020-07-14 | 2020-08-21 | 北京京仪自动化装备技术有限公司 | Circulating liquid temperature adjusting method, circulating liquid temperature adjusting control device and circulating liquid temperature adjusting control system |
| CN112817347A (en) * | 2020-12-25 | 2021-05-18 | 北京京仪自动化装备技术有限公司 | Rapid temperature rise and drop system and control method thereof |
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Application publication date: 20220722 |