CN112833576A - Semiconductor temperature control device and control method thereof - Google Patents
Semiconductor temperature control device and control method thereof Download PDFInfo
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- CN112833576A CN112833576A CN202011613684.4A CN202011613684A CN112833576A CN 112833576 A CN112833576 A CN 112833576A CN 202011613684 A CN202011613684 A CN 202011613684A CN 112833576 A CN112833576 A CN 112833576A
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- circulating liquid
- secondary refrigerant
- control device
- temperature control
- water tank
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B6/00—Compression machines, plants or systems, with several condenser circuits
- F25B6/02—Compression machines, plants or systems, with several condenser circuits arranged in parallel
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
Abstract
The invention provides a semiconductor temperature control device and a control method thereof, the device comprises a compression refrigeration unit, a circulation liquid unit and a secondary refrigerant unit, the circulation liquid unit comprises a plurality of circulation liquid channels, the compression refrigeration unit comprises an evaporator, the secondary refrigerant unit comprises a secondary refrigerant water tank, a plurality of heat exchangers and a plurality of three-way valves, each circulation liquid channel comprises a circulation liquid water tank, the heat exchangers and the three-way valves are arranged in a one-to-one correspondence manner, the outlets of the secondary refrigerant water tanks are simultaneously communicated with secondary refrigerant inlets of the plurality of heat exchangers through branch pipelines, the first water inlets of the three-way valves are communicated with corresponding branches in the branch pipelines, the second water inlets of the three-way valves are connected with the secondary refrigerant outlets of the heat exchangers, the outlets of the three-way valves are connected with the secondary refrigerant inlets of the evaporator, the secondary refrigerant outlets of the evaporator are connected with the secondary refrigerant water tanks, and a circulating liquid inlet of the heat exchanger is used for communicating a return pipeline of circulating liquid, so that the temperature control precision of a circulating liquid channel is improved, and the energy consumption is low.
Description
Technical Field
The invention relates to the technical field of semiconductor refrigeration, in particular to a semiconductor temperature control device and a control method thereof.
Background
Temperature control equipment is commonly used as auxiliary manufacturing equipment for processing technologies such as etching, physical vapor deposition, chemical vapor deposition and the like in the semiconductor production process. In these processes, it is desirable to provide a highly accurate, stable circulating liquid inlet temperature.
If a single refrigeration unit is used to control a plurality of media or objects with independent target temperatures, because the operating temperature interval of each channel may be different, a plurality of completely independent compressor systems are arranged or a compressor and a plurality of expansion valves are matched together to realize the control of a plurality of independent temperatures. However, the adoption of a multi-path completely independent compressor system needs a plurality of compressors, so that the energy consumption is high; one compressor is connected with a plurality of paths of expansion valves, the flow of other paths of expansion valves can be influenced when the expansion valves are adjusted, the temperature control precision is low, and unstable operation or out of control can easily occur.
Disclosure of Invention
The invention provides a semiconductor temperature control device and a control method thereof, which are used for solving the defect that the temperature control precision is low because unstable operation or out of control easily occurs during the control of a plurality of independent temperatures in the prior art.
The invention provides a semiconductor temperature control device, which comprises a compression refrigeration unit, a circulating liquid unit and a secondary refrigerant unit, wherein the circulating liquid unit comprises a plurality of circulating liquid channels,
the compression refrigeration unit comprises an evaporator, the secondary refrigerant unit comprises a secondary refrigerant water tank, a plurality of heat exchangers and a plurality of three-way valves, each circulating liquid channel comprises a circulating liquid water tank, the heat exchangers and the three-way valves are arranged in a one-to-one correspondence manner,
the outlet of the secondary refrigerant water tank is simultaneously communicated with the secondary refrigerant inlets of the plurality of heat exchangers through branch pipelines, the first water inlet of each three-way valve is communicated with a branch corresponding to the branch pipeline, the second water inlet of each three-way valve is connected with the secondary refrigerant outlet of the heat exchanger, the water outlet of each three-way valve is connected with the secondary refrigerant inlet of the evaporator, the secondary refrigerant outlet of the evaporator is connected with the secondary refrigerant water tank, the circulating liquid outlet of the heat exchanger is communicated with the circulating liquid water tank, and the circulating liquid inlet of the heat exchanger is used for being communicated with a return pipeline of circulating liquid.
According to the semiconductor temperature control device provided by the invention, the inlet of the secondary refrigerant water tank is provided with the first temperature sensor.
According to the semiconductor temperature control device provided by the invention, each circulating liquid channel further comprises a heater, and the heater is used for heating the temperature of the circulating liquid in the circulating liquid water tank.
According to the semiconductor temperature control device provided by the invention, a second temperature sensor is arranged at the water outlet of each circulating liquid water tank.
According to the semiconductor temperature control device provided by the invention, a third temperature sensor is arranged at the inlet of each circulating liquid water tank, and a fourth temperature sensor is arranged at the circulating liquid inlet of each heat exchanger.
According to the semiconductor temperature control device provided by the invention, a circulating liquid pump is arranged at the outlet of each circulating liquid water tank.
According to the semiconductor temperature control device provided by the invention, a coolant pump is arranged at the outlet of the coolant tank.
The invention also provides a control method of the semiconductor temperature control device, wherein the semiconductor temperature control device is the semiconductor temperature control device, the secondary refrigerant output by the secondary refrigerant water tank is branched by a branch pipeline, each branch of the branch pipeline controls the flow of the secondary refrigerant flowing through the heat exchanger by the three-way valve, and the target temperature S0 of the secondary refrigerant unit is less than the minimum value Smin the target temperatures in the plurality of circulating liquid channels.
According to the control method of the semiconductor temperature control device provided by the invention, the opening degree of the three-way valve is controlled according to the inlet temperature of the circulating liquid water tank, and the opening degree of the heater is controlled according to the outlet temperature of the circulating liquid water tank.
According to the control method of the semiconductor temperature control device provided by the invention, the output of the compression refrigeration unit is controlled according to the target temperature and the current temperature of the secondary refrigerant unit.
The semiconductor temperature control device and the control method thereof provided by the invention have the advantages that the coolant carrying unit is used for providing the coolant carrying unit with constant temperature, the coolant carrying unit with constant temperature is shunted by the branch pipeline and the quantity of the coolant flowing into the heat exchanger from each branch of the branch pipeline is adjusted by the three-way valve, so as to control the refrigeration output of the heat exchanger, when the three-way valve is adjusted, the quantity of the coolant carrying unit in other branches in each branch pipeline is kept unchanged, thereby avoiding pipeline pressure fluctuation which is easy to occur in the valve body adjusting process and improving the temperature control precision of each circulation liquid channel; in addition, the control of a plurality of independent temperatures is realized through one compression refrigeration unit, and the energy consumption is low.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a semiconductor temperature control device according to the present invention;
reference numerals:
1: a compression refrigeration unit; 2: a secondary refrigerant unit; 3: a circulating liquid unit;
4: an evaporator; 5: a secondary refrigerant water tank; 6: a heat exchanger;
7: a circulating liquid tank; 8: a three-way valve; 9: a heater;
10: a first temperature sensor; 11: a second temperature sensor; 12: a third temperature sensor;
13: a fourth temperature sensor; 14: a circulating liquid pump; 15: a secondary refrigerant water pump.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The structure of the semiconductor temperature control device of the present invention will be described with reference to fig. 1.
As shown in fig. 1, the embodiment of the present invention provides a semiconductor temperature control device, which includes a compression refrigeration unit 1, a coolant unit 2, and a circulating liquid unit 3. Each circulation liquid unit 3 comprises a plurality of circulation liquid channels, the compression refrigeration unit 1 comprises an evaporator 4, the secondary refrigerant unit 2 comprises a secondary refrigerant water tank 5, a plurality of heat exchangers 6 and a plurality of three-way valves 8, and each circulation liquid channel comprises a circulation liquid water tank 7.
The outlet of the secondary refrigerant water tank 5 is simultaneously communicated with the secondary refrigerant inlets of the plurality of heat exchangers 6 through branch pipelines, the first water inlets of the three-way valves 8 are communicated with the pipelines connected with the secondary refrigerant inlets of the heat exchangers 6, the secondary refrigerant outlet of each heat exchanger 6 is communicated with the second water inlet of the corresponding three-way valve 8, and the water outlet of each three-way valve 8 is connected with the secondary refrigerant inlet of the evaporator 4. Thus, the flow rate of the brine branched to each heat exchanger 6 via the branch line is adjusted by the three-way valve 8 to flow into the heat exchanger 6, thereby controlling the cooling output of the heat exchanger 6. A circulating liquid outlet of the heat exchanger 6 is connected with a load through a circulating liquid water tank 7 so as to cool the load; the circulating liquid flowing through the load flows back to the circulating liquid inlet of the heat exchanger 6.
In the semiconductor temperature control device, an evaporator 4, a secondary refrigerant water tank 5, a plurality of three-way valves 8 and secondary refrigerant pipelines of a plurality of heat exchangers 6 form a closed secondary refrigerant loop, a circulating liquid pipeline of each heat exchanger 6 and a circulating liquid water tank 7 form a closed circulating liquid loop together, and the circulating liquid loop is used for cooling a load.
In the semiconductor temperature control device provided by the embodiment of the invention, the coolant unit 2 is used for providing the constant-temperature coolant for the circulating liquid unit 3, the constant-temperature coolant is divided by the branch pipeline, the quantity of the coolant flowing into the heat exchanger 6 in each branch of the branch pipeline is adjusted by the three-way valve 8, and the refrigerating output of the heat exchanger 6 is further controlled. Because the three-way valve 8 is communicated with the branches in the branch pipelines, namely the secondary refrigerant circulation pipelines are communicated after the branches are shunted, when the three-way valve 8 is adjusted, the secondary refrigerant quantity circulating in each branch pipeline is kept unchanged, thereby avoiding pipeline pressure fluctuation easily occurring in the valve body adjusting process and improving the temperature control precision of each circulation liquid channel. Moreover, the whole semiconductor temperature control device realizes the control of a plurality of independent temperatures through one compression refrigeration unit 1, and the energy consumption is low.
In order to monitor the refrigerating capacity of the compression refrigerating unit 1 conveniently, a first temperature sensor 10 is arranged at the inlet of the secondary refrigerant water tank 5. The first temperature sensor 10 is used to collect the current temperature of the coolant. Specifically, the output of the compression refrigeration unit 1 is controlled according to the current temperature of the coolant collected by the first temperature sensor 10 and the target temperature of the coolant.
Specifically, each circulation liquid channel further includes a heater 9, and the heater 9 is used for heating the temperature of the circulation liquid in the circulation liquid tank 7. The heater 9 adopts heating structures such as an electric heating pipe or an electric heating rod, the electric heating pipe is inserted in the circulating liquid water tank 7 and is close to the bottom of the circulating liquid water tank 7, and an electric contact of the electric heating pipe is exposed out of the circulating liquid water tank 7 so as to be connected with an external circuit. The heater 9 is controlled to be turned on and off by being connected with a contactor.
And a second temperature sensor 11 is arranged at the water outlet of each circulating liquid water tank 7. The second temperature sensor 11 is used for detecting the effluent temperature of the circulating liquid water tank 7, the heating amount of the heater 9 is controlled according to the difference between the effluent temperature of the circulating liquid detected by the second temperature sensor 11 and the preset target temperature of the circulating liquid, and the heating amount is increased or decreased according to the change of the difference.
On the basis of the above embodiment, a third temperature sensor 12 is installed at the inlet of each circulation liquid water tank 7, and a fourth temperature sensor 13 is installed at the circulation liquid inlet of each heat exchanger 6. The third temperature sensor 12 is used for detecting the temperature of the circulating liquid entering the circulating liquid water tank 7, the fourth temperature sensor 13 is used for detecting the return temperature of the circulating liquid after flowing through the load, and the temperature control state is judged according to the third temperature sensor 12, the fourth temperature sensor 13 and the preset target temperature of the circulating liquid, and is divided into three states of no load, loading and unloading. The opening degree of the three-way valve 8 is controlled according to different temperature control states to adjust the refrigerating output quantity of the heat exchanger 6, and the energy consumption is reduced.
Wherein, a circulating liquid pump 14 is arranged at the outlet of each circulating liquid water tank 7. And a coolant pump 15 is arranged at the outlet of the coolant tank 5.
Specifically, as shown in fig. 1, there are three circulation liquid channels, and each circulation liquid channel includes a heater 9, a circulation liquid tank 7, and a circulation liquid pump 14. And circulating liquid cooled by the heat exchanger 6 is converged into the circulating liquid water tank 7, the load is cooled by pumping of the circulating liquid water pump 14, and the cooled load flows back to a circulating liquid inlet of the heat exchanger 6. Correspondingly, the secondary refrigerant discharged from the secondary refrigerant water tank 5 is divided into three paths through a branch pipeline, the branches of the branch pipeline, the secondary refrigerant pipeline of the heat exchanger 6 and the three-way valve 8 form a secondary refrigerant flow channel, the inlets of the three secondary refrigerant flow channels are communicated with the outlet of the secondary refrigerant water tank 5, and the outlets of the three secondary refrigerant flow channels are communicated with the secondary refrigerant pipeline of the evaporator 4. In each secondary refrigerant flow channel, one water inlet of the three-way valve 8 is connected with the secondary refrigerant outlet of the heat exchanger 6, the other water inlet of the three-way valve 8 is communicated with the corresponding branch in the branch pipeline so as to divide and converge the flow of the secondary refrigerant entering the heat exchanger 6, and the water outlet of the three-way valve 8 is connected with the secondary refrigerant inlet of the evaporator 4. In each circulation liquid channel, a temperature sensor is respectively arranged at an inlet and an outlet of the circulation liquid water tank 7, and a return pipeline of the circulation liquid is also provided with the temperature sensor. In the semiconductor temperature control device according to the embodiment of the present invention, the coolant is divided into a plurality of paths in the coolant unit 2 by the branch lines, for example, three circulation liquid passages, the coolant unit 2 supplies 20% of the coolant to the first branch of the branch lines, and supplies 50% and 30% of the coolant to the other two branches of the branch lines, respectively. Each branch of the branch pipeline is communicated with a three-way valve 8, and the amount of the coolant flowing into the heat exchanger 6 is regulated by the three-way valve 8, so that the refrigerating output of the heat exchanger 6 is controlled. According to the semiconductor temperature control device provided by the embodiment of the invention, the flow of the secondary refrigerant of other branches in the branch pipeline cannot be influenced when the opening degree of the three-way valve 8 is adjusted, so that the pressure fluctuation of the pipeline in the valve body adjusting process is avoided, and the amount of the secondary refrigerant entering the heat exchanger 6 is controlled and adjusted by the three-way valve 8, so that the refrigerating output quantity of the heat exchanger 6 is controlled.
In addition, the embodiment of the invention also provides a control method of the semiconductor temperature control device, which is used for controlling the semiconductor temperature control device, wherein the secondary refrigerant water tank 5 is divided by the branch pipelines, and secondary refrigerants of all branches in the branch pipelines are not influenced mutually after the division. Each branch of the branch lines controls the flow of the coolant passing through the heat exchanger 6 by means of a three-way valve 8. Wherein the target temperature S0 of the coolant unit 2 is less than the minimum value Smin of the target temperatures in the plurality of circulation fluid passages. Taking three circulation fluid passages as an example, the target temperature of the first circulation fluid passage is 25 °, the target temperature of the second circulation fluid passage is 30 °, the target temperature of the third circulation fluid passage is 20 °, and the target temperature S0 of the coolant unit 2 is lower than 20 °. For example, the target temperature S0 of the coolant unit 2 can be 15 or 10, depending on the amount of heat exchange in the evaporator 4 and the coolant flow.
The opening of the three-way valve 8 is controlled according to the inlet temperature of the circulation liquid water tank 7, and the opening of the heater 9 is controlled according to the outlet temperature of the circulation liquid water tank 7. And controlling the output of the compression refrigeration unit 1 according to the target temperature and the current temperature of the secondary refrigerant unit 2.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A semiconductor temperature control device comprises a compression refrigeration unit and a circulating liquid unit, and is characterized by also comprising a secondary refrigerant unit, wherein the circulating liquid unit comprises a plurality of circulating liquid channels,
the compression refrigeration unit comprises an evaporator, the secondary refrigerant unit comprises a secondary refrigerant water tank, a plurality of heat exchangers and a plurality of three-way valves, each circulating liquid channel comprises a circulating liquid water tank, the heat exchangers and the three-way valves are arranged in a one-to-one correspondence manner,
the outlet of the secondary refrigerant water tank is simultaneously communicated with the secondary refrigerant inlets of the plurality of heat exchangers through branch pipelines, the first water inlet of each three-way valve is communicated with the corresponding branch in the branch pipeline, the second water inlet of each three-way valve is connected with the secondary refrigerant outlet of the heat exchanger, the water outlet of each three-way valve is connected with the secondary refrigerant inlet of the evaporator, the secondary refrigerant outlet of the evaporator is connected with the secondary refrigerant water tank, the circulating liquid outlet of the heat exchanger is communicated with the circulating liquid water tank, and the circulating liquid inlet of the heat exchanger is used for being communicated with the return pipeline of circulating liquid.
2. The semiconductor temperature control device according to claim 1, wherein the inlet of the coolant tank is provided with a first temperature sensor.
3. The semiconductor temperature control device according to claim 1, wherein each of the circulating liquid passages further comprises a heater for heating a temperature of the circulating liquid in the circulating liquid tank.
4. The semiconductor temperature control device according to claim 3, wherein a second temperature sensor is attached to a water outlet of each of the circulating liquid tanks.
5. The semiconductor temperature control device according to claim 4, wherein a third temperature sensor is installed at an inlet of each of the circulating liquid water tanks, and a fourth temperature sensor is installed at a circulating liquid inlet of each of the heat exchangers.
6. The semiconductor temperature control device according to claim 1 or 2, wherein a circulating liquid pump is installed at an outlet of each circulating liquid tank.
7. The semiconductor temperature control device according to claim 1 or 2, wherein a coolant pump is installed at an outlet of the coolant tank.
8. A semiconductor temperature control device control method, characterized in that the semiconductor temperature control device is the semiconductor temperature control device according to any one of claims 1 to 7, the coolant output from the coolant tank is branched by branch lines, each branch line controlling the flow rate of the coolant flowing through the heat exchanger by the three-way valve, wherein the target temperature S0 of the coolant unit is less than the minimum value Smin of the target temperatures in the plurality of circulation liquid passages.
9. The semiconductor temperature control device control method according to claim 8, wherein an opening degree of the three-way valve is controlled in accordance with an inlet temperature of the circulating liquid water tank, and an opening degree of the heater is controlled in accordance with an outlet temperature of the circulating liquid water tank.
10. The semiconductor temperature control device control method according to claim 8, wherein the output of the compression refrigeration unit is controlled based on the target temperature and the current temperature of the coolant unit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011613684.4A CN112833576A (en) | 2020-12-30 | 2020-12-30 | Semiconductor temperature control device and control method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011613684.4A CN112833576A (en) | 2020-12-30 | 2020-12-30 | Semiconductor temperature control device and control method thereof |
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| CN112833576A true CN112833576A (en) | 2021-05-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113531936A (en) * | 2021-06-18 | 2021-10-22 | 北京京仪自动化装备技术股份有限公司 | Multi-channel low-temperature semiconductor temperature control device and semiconductor production equipment |
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| CN102954639A (en) * | 2011-08-25 | 2013-03-06 | 上海微电子装备有限公司 | Temperature control device and temperature control method thereof |
| CN208606462U (en) * | 2018-08-01 | 2019-03-15 | 北京源数科技有限公司 | Distributed secondary pumping system and circulation refrigeration equipment |
| CN111397257A (en) * | 2020-03-25 | 2020-07-10 | 北京京仪自动化装备技术有限公司 | Temperature control device and method |
| CN111538360A (en) * | 2020-07-07 | 2020-08-14 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method |
| CN112082291A (en) * | 2020-08-28 | 2020-12-15 | 北京京仪自动化装备技术有限公司 | Refrigeration system |
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2020
- 2020-12-30 CN CN202011613684.4A patent/CN112833576A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102954639A (en) * | 2011-08-25 | 2013-03-06 | 上海微电子装备有限公司 | Temperature control device and temperature control method thereof |
| CN208606462U (en) * | 2018-08-01 | 2019-03-15 | 北京源数科技有限公司 | Distributed secondary pumping system and circulation refrigeration equipment |
| CN111397257A (en) * | 2020-03-25 | 2020-07-10 | 北京京仪自动化装备技术有限公司 | Temperature control device and method |
| CN111538360A (en) * | 2020-07-07 | 2020-08-14 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113531936A (en) * | 2021-06-18 | 2021-10-22 | 北京京仪自动化装备技术股份有限公司 | Multi-channel low-temperature semiconductor temperature control device and semiconductor production equipment |
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