CN211372806U - Semiconductor temperature control device system - Google Patents
Semiconductor temperature control device system Download PDFInfo
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- CN211372806U CN211372806U CN201922339832.7U CN201922339832U CN211372806U CN 211372806 U CN211372806 U CN 211372806U CN 201922339832 U CN201922339832 U CN 201922339832U CN 211372806 U CN211372806 U CN 211372806U
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- water
- expansion valve
- precooler
- electronic expansion
- temperature control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Abstract
The utility model discloses a semiconductor temperature control device system, including refrigerating system and circulation system, refrigerating system includes compressor, condenser, evaporimeter and electronic expansion valve one, the circulation system includes water tank, water pump, load equipment and precooler, refrigerating system and circulation system link to each other, electronic expansion valve two is connected to the precooler and forms the refrigeration branch road with evaporimeter and electronic expansion valve a parallel. The precooler is additionally arranged between the refrigeration system and the circulating system, so that water is cooled in advance before entering the heat exchanger, the impact of the excessive temperature difference on the heat exchanger is avoided, the pressure change of the refrigeration system is slowed down, the temperature fluctuation is reduced, the anti-impact load capacity is enhanced, and the heat exchange efficiency is further improved.
Description
Technical Field
The utility model relates to a semiconductor production field, concretely relates to semiconductor temperature control device system.
Background
In the manufacturing process of the semiconductor wafer, constant temperature output is required to be kept, and meanwhile, high requirements are also provided for temperature control under the conditions of cooling and loading, so that a temperature control device is required to keep the ambient temperature, and the temperature requirement of a current host computer platform is difficult to be well met only in the aspect of a refrigeration system.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a semiconductor temperature control device system to solve the problem that the temperature control system cooling effect is not good enough in the prior art.
The semiconductor temperature control device system comprises a refrigeration system and a circulating system, wherein the refrigeration system comprises a compressor, a condenser, an evaporator and a first electronic expansion valve, the circulating system comprises a water tank, a water pump, load equipment and a precooler, the refrigeration system is connected with the circulating system, and the precooler is connected with a second electronic expansion valve and is connected with the evaporator and the electronic expansion valve in parallel to form a refrigeration branch.
Preferably, the water outlet of the water tank is connected with the water pump, the water outlet of the water pump is connected with the water inlet of the load equipment, the water outlet of the load equipment is connected with the water inlet of the precooler, the water outlet of the precooler is connected with the water inlet of the evaporator, the water outlet of the evaporator is connected with the water inlet of the water tank, the refrigerant outlet of the precooler is connected with the air inlet of the compressor, and the refrigerant inlet of the precooler is connected with the dryer through the electronic expansion valve II.
Preferably, a refrigerant outlet of the condenser is connected with an inlet of an accumulator, an outlet of the accumulator is connected with a refrigerant inlet of the evaporator through the dryer and the electronic expansion valve in sequence, a refrigerant outlet of the evaporator is connected with an air inlet of the compressor, and an air outlet of the compressor is connected with a refrigerant inlet of the condenser.
Preferably, a liquid viewing mirror is connected between the dryer and the first electronic expansion valve and between the dryer and the second electronic expansion valve.
Preferably, a water level gauge is installed on the water tank.
The utility model has the advantages that: a precooler is additionally arranged between the refrigeration system and the circulating system, so that water is cooled in advance before entering the heat exchanger, the impact of excessive temperature difference on the heat exchanger is avoided, the pressure change of the refrigeration system is slowed down, the temperature fluctuation is reduced, the anti-impact load capacity is enhanced, and the heat exchange efficiency is further improved; the condition of the refrigerant in the pipeline can be observed by the liquid sight glass; the water level gauge can observe the water level in the water tank, and the influence on the system caused by overhigh or overlow water level is prevented.
Drawings
Fig. 1 is a schematic diagram of the system of the present invention.
The system comprises a compressor, a condenser, an evaporator, a dryer, a liquid storage device, a liquid viewing mirror, an electronic expansion valve I, a water tank, a water pump, a load device, a precooler, an electronic expansion valve II and a water level meter, wherein the compressor is 1, the condenser is 2, the evaporator is 3, the dryer is 4, the liquid storage device is 5, the liquid viewing mirror is 6, the electronic expansion valve I is 7, the water tank is 8, the water pump is 9, the load device.
Detailed Description
The following detailed description of the embodiments of the present invention will be provided to help those skilled in the art understand the concept and technical solutions of the present invention more completely, accurately and deeply.
As shown in fig. 1, a semiconductor temperature control device system comprises a refrigeration system and a circulation system, wherein the refrigeration system comprises a compressor 1, a condenser 2, an evaporator 3 and a first electronic expansion valve 7, the circulation system comprises a water tank 8, a water pump 9, a load device 10 and a precooler 11, the refrigeration system is connected with the circulation system, and the precooler 11 is connected with a second electronic expansion valve 12 and connected with the evaporator 3 and the first electronic expansion valve 7 in parallel to form a refrigeration branch.
The water outlet of the water tank 8 is connected with a water pump 9, the water outlet of the water pump 9 is connected with the water inlet of a load device 10, the water outlet of the load device 10 is connected with the water inlet of a precooler 11, the water outlet of the precooler 11 is connected with the water inlet of an evaporator 3, the water outlet of the evaporator 3 is connected with the water inlet of the water tank 8, the refrigerant outlet of the precooler 11 is connected with the air inlet of a compressor 1, and the refrigerant inlet of the precooler 11 is connected with a dryer 4 through a second electronic expansion valve 12.
The refrigerant outlet of the condenser 2 is connected with the inlet of a liquid storage device 5, the outlet of the liquid storage device 5 is connected with the refrigerant inlet of the evaporator 3 through a dryer 4 and an electronic expansion valve I7 in sequence, the refrigerant outlet of the evaporator 3 is connected with the air inlet of the compressor 1, and the air outlet of the compressor 1 is connected with the refrigerant inlet of the condenser 2.
And a liquid viewing mirror 6 is connected between the dryer 4 and the electronic expansion valve I7 and the electronic expansion valve II 12.
A water level gauge 13 is mounted on the water tank 8.
The utility model discloses a theory of operation and process are as follows:
in the refrigeration process, high-temperature refrigerant gas enters a condenser 2 from a compressor 1, circulating liquid in the condenser 2 absorbs heat, the refrigerant gas releases heat and is cooled into liquid, the refrigerant passes through a liquid storage device 5 and a dryer 4 and then is throttled and expanded into low-temperature and low-pressure steam through a first electronic expansion valve 7 and a second electronic expansion valve 12 respectively, then the low-temperature and low-pressure steam enters an evaporator 3 and a precooler 11, the circulating liquid in a water tank 8 enters the precooler 11 through a load device 10 through a water pump 9, the refrigerant in the precooler 11 absorbs heat and then enters the compressor 1, the temperature of the circulating liquid in the precooler 11 is reduced and enters the evaporator 3, the refrigerant in the evaporator 3 further cools the circulating liquid, and the cooled circulating liquid returns to a water tank 8 to cool the load device. And the flow of the precooler 11 is adjusted according to the load variation and the evaporation heat exchange quantity of the evaporator 3, and the control of the electronic expansion valve II 12 is carried out according to the feedback of the pressure and the temperature.
The above description is made for the exemplary purposes with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above embodiments, and various insubstantial improvements can be made without modification to the present invention.
Claims (5)
1. A semiconductor temperature control device system is characterized in that: the refrigeration system comprises a compressor (1), a condenser (2), an evaporator (3) and a first electronic expansion valve (7), the circulation system comprises a water tank (8), a water pump (9), load equipment (10) and a precooler (11), the refrigeration system is connected with the circulation system, and the precooler (11) is connected with a second electronic expansion valve (12) and is connected with the evaporator (3) and the first electronic expansion valve (7) in parallel to form a refrigeration branch.
2. The semiconductor temperature control device system according to claim 1, wherein: the water outlet of the water tank (8) is connected with a water pump (9), the water outlet of the water pump (9) is connected with the water inlet of a load device (10), the water outlet of the load device (10) is connected with the water inlet of a precooler (11), the water outlet of the precooler (11) is connected with the water inlet of an evaporator (3), the water outlet of the evaporator (3) is connected with the water inlet of the water tank (8), the refrigerant outlet of the precooler (11) is connected with the air inlet of a compressor (1), and the refrigerant inlet of the precooler (11) is connected with a dryer (4) through a second electronic expansion valve (12).
3. The semiconductor temperature control device system according to claim 1, wherein: the refrigerant outlet of condenser (2) connects the entry of reservoir (5), the export of reservoir (5) is in proper order through desicator (4) and electronic expansion valve one (7) the refrigerant inlet of connecting evaporimeter (3), the air inlet of refrigerant exit linkage compressor (1) of evaporimeter (3), the refrigerant inlet of condenser (2) is connected to the gas outlet of compressor (1).
4. The semiconductor temperature control device system according to claim 2, wherein: and a liquid viewing mirror (6) is connected between the dryer (4) and the electronic expansion valve I (7) and the electronic expansion valve II (12).
5. The semiconductor temperature control device system according to claim 1, wherein: and a water level meter (13) is arranged on the water tank (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922339832.7U CN211372806U (en) | 2019-12-24 | 2019-12-24 | Semiconductor temperature control device system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922339832.7U CN211372806U (en) | 2019-12-24 | 2019-12-24 | Semiconductor temperature control device system |
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| Publication Number | Publication Date |
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| CN211372806U true CN211372806U (en) | 2020-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922339832.7U Active CN211372806U (en) | 2019-12-24 | 2019-12-24 | Semiconductor temperature control device system |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112181025A (en) * | 2020-10-29 | 2021-01-05 | 北京京仪自动化装备技术有限公司 | Temperature control equipment and method |
| CN112416029A (en) * | 2021-01-25 | 2021-02-26 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method for semiconductor production |
| CN114740915A (en) * | 2022-03-18 | 2022-07-12 | 北京京仪自动化装备技术股份有限公司 | Temperature control equipment capable of achieving double precooling and temperature control method |
| CN114779849A (en) * | 2022-03-18 | 2022-07-22 | 北京京仪自动化装备技术股份有限公司 | Semiconductor temperature control equipment and temperature control method |
| CN114779848A (en) * | 2022-03-18 | 2022-07-22 | 北京京仪自动化装备技术股份有限公司 | Semiconductor temperature control equipment with precooling function and temperature control method |
| CN115167561A (en) * | 2022-06-30 | 2022-10-11 | 北京京仪自动化装备技术股份有限公司 | Wide-temperature-range overlapping temperature control system and temperature control method |
-
2019
- 2019-12-24 CN CN201922339832.7U patent/CN211372806U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112181025A (en) * | 2020-10-29 | 2021-01-05 | 北京京仪自动化装备技术有限公司 | Temperature control equipment and method |
| CN112416029A (en) * | 2021-01-25 | 2021-02-26 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method for semiconductor production |
| CN112416029B (en) * | 2021-01-25 | 2021-07-20 | 北京京仪自动化装备技术股份有限公司 | Temperature control system and temperature control method for semiconductor production |
| CN114740915A (en) * | 2022-03-18 | 2022-07-12 | 北京京仪自动化装备技术股份有限公司 | Temperature control equipment capable of achieving double precooling and temperature control method |
| CN114779849A (en) * | 2022-03-18 | 2022-07-22 | 北京京仪自动化装备技术股份有限公司 | Semiconductor temperature control equipment and temperature control method |
| CN114779848A (en) * | 2022-03-18 | 2022-07-22 | 北京京仪自动化装备技术股份有限公司 | Semiconductor temperature control equipment with precooling function and temperature control method |
| CN114779849B (en) * | 2022-03-18 | 2023-11-17 | 北京京仪自动化装备技术股份有限公司 | Semiconductor temperature control equipment and temperature control method |
| CN114740915B (en) * | 2022-03-18 | 2023-12-22 | 北京京仪自动化装备技术股份有限公司 | Temperature control equipment capable of realizing double precooling and temperature control method |
| CN115167561A (en) * | 2022-06-30 | 2022-10-11 | 北京京仪自动化装备技术股份有限公司 | Wide-temperature-range overlapping temperature control system and temperature control method |
| CN115167561B (en) * | 2022-06-30 | 2023-11-17 | 北京京仪自动化装备技术股份有限公司 | Wide-temperature-range overlapping temperature control system and temperature control method |
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Address after: 100176 block a, 14th floor, yard 8, Liangshuihe 2nd Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Jingyi automation equipment Technology Co.,Ltd. Address before: 100000 block a, 14 / F, courtyard 8, Liangshuihe Second Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee before: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd. |
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