CN211372807U - Refrigerating system of semiconductor temperature control device - Google Patents
Refrigerating system of semiconductor temperature control device Download PDFInfo
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- CN211372807U CN211372807U CN201922467889.5U CN201922467889U CN211372807U CN 211372807 U CN211372807 U CN 211372807U CN 201922467889 U CN201922467889 U CN 201922467889U CN 211372807 U CN211372807 U CN 211372807U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
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Abstract
The utility model discloses a semiconductor temperature control device refrigerating system, including compressor, condenser, evaporimeter and throttle subassembly, the throttle subassembly includes solenoid valve, electronic expansion valve and thermal expansion valve, electronic expansion valve is connected to the solenoid valve, thermal expansion valve is connected to the electronic expansion valve, the refrigerant entry of evaporimeter is connected to the thermal expansion valve, and this refrigerating system still includes regenerator, circulation system and cooling water circulation system. The flow of the refrigerant is controlled by the electromagnetic valve, the electronic expansion valve and the thermostatic expansion valve together, so that the control precision of the system is improved, the electromagnetic valve can ensure that a pipeline is completely closed, and the temperature fluctuation caused by the fact that the leaked refrigerant is evaporated again and absorbs heat is avoided; the electronic expansion valve can accurately control the flow of the refrigerant, the thermostatic expansion valve is beneficial to the evaporation of the refrigerant in the evaporator, and in addition, the thermostatic expansion valve can increase the outlet pressure of the electronic expansion valve, reduce the pressure difference of the valve and prolong the service life of the valve.
Description
Technical Field
The utility model relates to a semiconductor production field, concretely relates to semiconductor temperature control device refrigerating system.
Background
The semiconductor temperature control device is used as auxiliary equipment for producing semiconductors, and is required to keep constant temperature output in the process of manufacturing wafers, and has high requirements on the temperature increasing and decreasing process. The original refrigeration system is difficult to meet the accurate temperature control requirement of the process, and the heat exchange efficiency of the original system in a low-temperature section circulating system is poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a semiconductor temperature control device refrigerating system to solve among the prior art problem that refrigerating system's control by temperature change precision is low.
The refrigerating system of the semiconductor temperature control device comprises a compressor, a condenser, an evaporator and a throttling assembly, wherein the throttling assembly comprises an electromagnetic valve, an electronic expansion valve and a thermostatic expansion valve, the electromagnetic valve is connected with the electronic expansion valve, the electronic expansion valve is connected with the thermostatic expansion valve, and the thermostatic expansion valve is connected with a refrigerant inlet of the evaporator.
Preferably, the system further comprises a heat regenerator, an exhaust port of the compressor is connected with a refrigerant inlet of the condenser, a refrigerant outlet of the condenser is connected with a first inlet of the heat regenerator, an outlet of the heat regenerator is connected with an inlet of the liquid storage device, an outlet of the liquid storage device is connected with the dryer, the dryer is connected with the electromagnetic valve, a refrigerant outlet of the evaporator is connected with a second inlet of the heat regenerator, and a second outlet of the heat regenerator is connected with an air inlet of the compressor.
Preferably, the system further comprises a circulating system, the circulating system comprises a water tank, a first water pump and load equipment, an outlet of the water tank is connected with the first water pump, the first water pump is connected with the load equipment, the load equipment is connected with a water inlet of the evaporator, and a water outlet of the evaporator is connected with an inlet of the water tank.
Preferably, the cooling water circulation system further comprises a cooling water circulation system, the cooling water circulation system comprises a cooling tower and a second water pump, a water outlet of the cooling tower is connected with a water inlet of the condenser through the second water pump, and a water outlet of the condenser is connected with a water inlet of the cooling tower.
Preferably, a liquid viewing mirror is connected between the dryer and the electromagnetic valve.
The utility model has the advantages that: the flow of the refrigerant is controlled by the electromagnetic valve, the electronic expansion valve and the thermostatic expansion valve together, so that the control precision of the system is improved, the electromagnetic valve can ensure that a pipeline is completely closed, and the temperature fluctuation caused by the fact that the leaked refrigerant is evaporated again and absorbs heat is avoided; the electronic expansion valve can accurately control the flow of the refrigerant, realize stepless regulation and realize real-time feedback control according to load change and temperature impact; the use of the thermostatic expansion valve mechanically controls the superheat degree of the system, is beneficial to the evaporation of the refrigerant in the evaporator, and can achieve the best evaporation effect in a limited evaporation area. The heat regenerator enables gas entering the compressor to become superheated steam, so that harmful overheating is reduced; liquid drops carried in the return air are gasified, and the liquid impact of a compressor is prevented; the liquid entering the evaporator is supercooled, and throttling loss is reduced.
Drawings
Fig. 1 is a schematic diagram of the system of the present invention.
The system comprises a compressor, a condenser, an evaporator, a solenoid valve, an electronic expansion valve, a thermal expansion valve, a heat regenerator, a liquid storage device, a drier, a water tank, a water pump I, a load device, a cooling tower, a water pump II and a liquid viewing mirror 15, wherein the compressor, the condenser, the evaporator, the solenoid valve, the electronic expansion valve, the thermal expansion valve, the heat regenerator and the water storage device are 1-respectively.
Detailed Description
The following detailed description of the embodiments of the present invention will be provided to help those skilled in the art understand the concept and technical solutions of the present invention more completely, accurately and deeply.
As shown in fig. 1, a refrigeration system of a semiconductor temperature control device comprises a compressor 1, a condenser 2, an evaporator 3 and a throttling assembly, wherein the throttling assembly comprises a solenoid valve 4, an electronic expansion valve 5 and a thermostatic expansion valve 6, the solenoid valve 4 is connected with the electronic expansion valve 5, the electronic expansion valve 5 is connected with the thermostatic expansion valve 6, and the thermostatic expansion valve 6 is connected with a refrigerant inlet of the evaporator 3.
The refrigerating system of the semiconductor temperature control device further comprises a heat regenerator 7, wherein an exhaust port of the compressor 1 is connected with a refrigerant inlet of the condenser 2, a refrigerant outlet of the condenser 2 is connected with a first inlet of the heat regenerator 7, a first outlet of the heat regenerator 7 is connected with an inlet of the liquid accumulator 8, an outlet of the liquid accumulator 8 is connected with a dryer 9, the dryer 9 is connected with the electromagnetic valve 4, a refrigerant outlet of the evaporator 3 is connected with a second inlet of the heat regenerator 7, and a second outlet of the heat regenerator 7 is connected with an air inlet of the compressor 1.
The semiconductor temperature control device refrigerating system further comprises a circulating system, wherein the circulating system comprises a water tank 10, a first water pump 11 and a load device 12, an outlet of the water tank 10 is connected with the first water pump 11, the first water pump 11 is connected with the load device 12, the load device 12 is connected with a water inlet of an evaporator 3, and a water outlet of the evaporator 3 is connected with an inlet of the water tank 10.
The semiconductor temperature control device refrigerating system further comprises a cooling water circulation system, wherein the cooling water circulation system comprises a cooling tower 13 and a second water pump 14, a water outlet of the cooling tower 13 is connected with a water inlet of a condenser 2 through the second water pump 14, and a water outlet of the condenser 2 is connected with a water inlet of the cooling tower 13.
A liquid viewing mirror 15 is connected between the dryer 9 and the electromagnetic valve 4.
The utility model discloses a theory of operation and process are as follows:
in the refrigeration process, a cooling tower 13 sends water into a condenser 2 through a second water pump 14, high-temperature and high-pressure refrigerant gas enters the condenser 2 from a compressor 1, the water in the condenser 2 absorbs heat, the refrigerant gas releases heat and is cooled into liquid, the refrigerant liquid enters a heat regenerator 7 and then sequentially passes through a liquid storage device 8, a dryer 9, a liquid viewing mirror 15, an electromagnetic valve 4, an electronic expansion valve 5 and a thermostatic expansion valve 6, the dryer 9 removes moisture contained in the refrigerant, the liquid viewing mirror 15 can observe the condition of the refrigerant, the electronic expansion valve 5 and the thermostatic expansion valve 6 enable the refrigerant liquid to be fully changed into low-temperature and low-pressure gas, then the refrigerant gas enters an evaporator 3, circulating liquid in a water tank 10 enters the evaporator 3 through a first water pump 11 through load equipment, the circulating liquid in the evaporator 3 dissipates heat and cools down the water tank 10, then cools down the load equipment 12, the refrigerant gas in the evaporator 3 absorbs heat and then enters the heat regenerator 7 and absorbs the, the refrigerant liquid in the regenerator 7 is further cooled and the refrigerant gas in the regenerator 7 flows into the compressor 1.
The above description is made for the exemplary purposes with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above embodiments, and various insubstantial improvements can be made without modification to the present invention.
Claims (5)
1. The semiconductor temperature control device refrigerating system is characterized in that: including compressor (1), condenser (2), evaporimeter (3) and throttle subassembly, the throttle subassembly includes solenoid valve (4), electronic expansion valve (5) and thermal expansion valve (6), electronic expansion valve (5) are connected in solenoid valve (4), thermal expansion valve (6) are connected in electronic expansion valve (5), the refrigerant inlet of evaporimeter (3) is connected in thermal expansion valve (6).
2. The semiconductor temperature control device refrigeration system of claim 1, wherein: still include regenerator (7), the refrigerant entry of condenser (2) is connected to the gas vent of compressor (1), the refrigerant exit linkage of condenser (2) enters the mouth one of regenerator (7), the entry of the export of regenerator (7) one-tenth connection accumulator (8), exit linkage desicator (9) of accumulator (8), solenoid valve (4) are connected in desicator (9), the entry two of refrigerant exit linkage regenerator (7) of evaporimeter (3), the air inlet of compressor (1) is connected to the export two of regenerator (7).
3. The semiconductor temperature control device refrigeration system of claim 1, wherein: the water circulation system comprises a water tank (10), a first water pump (11) and load equipment (12), an outlet of the water tank (10) is connected with the first water pump (11), the first water pump (11) is connected with the load equipment (12), the load equipment (12) is connected with a water inlet of the evaporator (3), and a water outlet of the evaporator (3) is connected with an inlet of the water tank (10).
4. The semiconductor temperature control device refrigeration system of claim 1, wherein: the cooling water circulation system comprises a cooling tower (13) and a second water pump (14), the water outlet of the cooling tower (13) is connected with the water inlet of the condenser (2) through the second water pump (14), and the water outlet of the condenser (2) is connected with the water inlet of the cooling tower (13).
5. The semiconductor temperature control device refrigeration system of claim 2, wherein: a liquid viewing mirror (15) is connected between the dryer (9) and the electromagnetic valve (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922467889.5U CN211372807U (en) | 2019-12-31 | 2019-12-31 | Refrigerating system of semiconductor temperature control device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922467889.5U CN211372807U (en) | 2019-12-31 | 2019-12-31 | Refrigerating system of semiconductor temperature control device |
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| Publication Number | Publication Date |
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| CN211372807U true CN211372807U (en) | 2020-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922467889.5U Active CN211372807U (en) | 2019-12-31 | 2019-12-31 | Refrigerating system of semiconductor temperature control device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112416029A (en) * | 2021-01-25 | 2021-02-26 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method for semiconductor production |
| CN112856845A (en) * | 2021-01-25 | 2021-05-28 | 北京京仪自动化装备技术有限公司 | Wide-temperature-range temperature control device and control method thereof |
-
2019
- 2019-12-31 CN CN201922467889.5U patent/CN211372807U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112416029A (en) * | 2021-01-25 | 2021-02-26 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method for semiconductor production |
| CN112856845A (en) * | 2021-01-25 | 2021-05-28 | 北京京仪自动化装备技术有限公司 | Wide-temperature-range temperature control device and control method thereof |
| CN112416029B (en) * | 2021-01-25 | 2021-07-20 | 北京京仪自动化装备技术股份有限公司 | Temperature control system and temperature control method for semiconductor production |
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Address after: 100176 block a, 14th floor, yard 8, Liangshuihe 2nd Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Jingyi automation equipment Technology Co.,Ltd. Address before: 100000 block a, 14 / F, courtyard 8, Liangshuihe Second Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee before: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd. |
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