CN114779583A - High-efficient location semiconductor wafer processing is with developing device - Google Patents
High-efficient location semiconductor wafer processing is with developing device Download PDFInfo
- Publication number
- CN114779583A CN114779583A CN202210232558.7A CN202210232558A CN114779583A CN 114779583 A CN114779583 A CN 114779583A CN 202210232558 A CN202210232558 A CN 202210232558A CN 114779583 A CN114779583 A CN 114779583A
- Authority
- CN
- China
- Prior art keywords
- liquid baffle
- liquid
- baffle
- nozzle
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
Landscapes
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The application discloses a developing device for processing a high-efficiency positioning semiconductor wafer, which comprises a shell, wherein the shell comprises a component installation box, a front baffle, a bottom plate and two opposite side plates, a rotary driving unit is installed at the bottom plate, the rotary driving unit drives a rotating shaft to rotate, a vacuum loading platform is installed at the rotating shaft, a sliding rail is fixed at the side plate, a first bearing is installed on the front baffle, a first motor is installed in the component installation box, a first lead screw is connected between the first bearing and the first motor, a sliding block is installed at the sliding rail, a movable guide rod is connected between the two sliding blocks, and a sliding seat is installed at the movable guide rod; the sliding seat is provided with a first nozzle mounting block and a rotary cylinder, the rotary cylinder is provided with a second nozzle mounting block, the first nozzle mounting block is provided with a developing solution nozzle, and the second nozzle mounting block is provided with a cleaning solution nozzle and a gas nozzle. The developing device can realize the development of the wafer and keep the inner space of the device clean.
Description
Technical Field
The application relates to the field of semiconductors, in particular to a developing device for processing a high-efficiency positioning semiconductor wafer.
Background
English Integrated Circuit: integrated circuit, abbreviated IC; or microcircuits (microcircuits), microchips (microchips), and chips (chips) are one way to miniaturize circuits (including primarily semiconductor devices, including passive components, etc.) in electronics, and are often fabricated on the surface of semiconductor wafers. Chip fabrication represents the highest level of human manufacturing, and chips are typically fabricated integrally on individual wafers, which are then diced into individual chips for use in electronic devices. The wafer needs to go through a plurality of steps such as photoresist leveling, photolithography, development, doping and the like during manufacturing, each step is critical, and the steps need to be repeated for dozens of times, so that the layered structure of the chip is formed, and a fault of any one step can cause the failure of chip manufacturing. In the developing step, a developing solution and a cleaning solution are required to be used, and when the developing solution and the cleaning solution are used, the chip is driven to rotate by a vacuum carrying platform, so that the developing solution or the cleaning solution can splash due to centrifugal force, once the developing solution or the cleaning solution splashes into the equipment, the cleaning is difficult, the cleaning lasts for a long time or the cleanness in the equipment is insufficient, and the manufacturing and production of the chip are influenced.
Disclosure of Invention
The invention aims to: the application aims to overcome the defects of the prior art and provides the developing device for efficiently positioning the semiconductor wafer.
The technical scheme is as follows: a developing device for efficiently positioning semiconductor wafers for processing comprises a shell, wherein the shell comprises a component installation box, a front baffle, a bottom plate and two opposite side plates, a rotary driving unit is installed at the bottom plate and drives a rotary shaft to rotate, a vacuum loading platform is installed at the rotary shaft, slide rails are fixed at the side plates, a first bearing is installed on the front baffle, a first motor is installed in the component installation box, a first lead screw is connected between the first bearing and the first motor, a slide block is installed at the slide rails and provided with a first threaded hole through which the first lead screw penetrates, a movable guide rod is connected between the slide blocks at the slide rails of the two side plates, a slide seat is installed at the movable guide rod, a second bearing is installed at one end of the movable guide rod, a second motor is installed at the other end of the movable guide rod, and a second lead screw is connected between the second bearing and the second motor, the sliding seat is provided with a second threaded hole through which a second screw rod passes; the utility model discloses a developing solution spraying device, including slide, revolving cylinder, first nozzle installation piece, second nozzle installation piece, washing liquid nozzle and gas nozzle, the slide department installs first nozzle installation piece and revolving cylinder, revolving cylinder department installs second nozzle installation piece, first nozzle installation piece department installs the developing solution nozzle, second nozzle installation piece department installs washing liquid nozzle and gas nozzle, the developing solution nozzle is connected with the developing solution and supplies the liquid unit, the washing liquid nozzle is connected with the washing liquid and supplies the liquid unit, the gas nozzle is connected with the air feed unit.
Further, the component mounting box has a control panel at the location, the control panel including a display unit. Thereby facilitating the display of the parameter information of the developing device.
Further, the bottom plate is provided with a liquid discharging hole; the bottom plate department is fixed with the outer fender liquid board of annular interior fender liquid board of annular and annular, interior fender liquid board surrounds the pivot, outer fender liquid board surrounds interior fender liquid board, the drain hole is located between outer fender liquid board and the interior fender liquid board.
Thereby limiting the space for draining between the inner liquid baffle and the outer liquid baffle and facilitating draining of residual liquid.
Furthermore, a plurality of guide pillars are fixed at the bottom plate, a movable liquid baffle is arranged between the inner liquid baffle and the outer liquid baffle, the movable liquid baffle comprises an annular lifting liquid baffle and a rotatable rotating liquid baffle, the lifting liquid baffle and the rotating liquid baffle are connected through a bearing, the outer ring of the bearing is fixedly connected with the lifting liquid baffle, the inner ring of the bearing is fixedly connected with the rotating liquid baffle, a plurality of lifting blocks are fixed at the outer circumference of the lifting liquid baffle, the lifting blocks are equal in number and correspond to the guide pillars one by one, and each lifting block is provided with a sliding chute matched with the guide pillars; two of the guide posts are first guide posts, the rest are second guide posts, a limiting plate is arranged at the top end of each first guide post, an installation through hole is further formed in each first guide post, a fixed pulley is installed in each installation through hole, a fixing ring is further arranged at the lifting block of each first guide post, an electric winding device is installed on each side plate, the two electric winding devices correspond to the two first guide posts one by one, a pull rope at each electric winding device passes through the fixed pulley and is fixedly connected with the fixing ring; a plurality of supporting plates are fixed on the inner circumference of the rotary liquid baffle plate, and the rotary shaft is connected with an annular driving plate through a plurality of connecting supports; when the pull ropes of the two electric winding devices are tightened, the rotary liquid baffle is located at a first height, the top end of the rotary liquid baffle abuts against the limiting plate, and all the supporting plates are not in contact with the driving plate; when the pull ropes of the two electric winding devices are loosened, the rotary liquid baffle plate is located at a second height, and all the support plates are abutted to the drive plate and supported by the drive plate; the first height is higher than the second height.
Further, the lower surface of the limiting plate is provided with an anti-skid coating; the top end of the rotary liquid baffle plate is provided with an anti-skid coating; the upper surface of drive plate and the lower surface of backup pad all have anti-skidding coating.
Thereby having better anti-skid effect; when the rotation liquid baffle is supported tightly by the limiting plate, unexpected rotation can not happen, and when the driving plate and the supporting plate are supported tightly, the rotation liquid baffle can be well driven to rotate.
Further, when the rotary liquid baffle is positioned at the first height, the top end of the rotary liquid baffle is higher than the upper surface of the vacuum carrying platform by more than 1 cm; and when the rotating liquid baffle is at the second height, the top end of the rotating liquid baffle is lower than the upper surface of the vacuum carrying platform by more than 2 cm.
Therefore, when the rotary liquid baffle is at the first height, the splashed liquid splashes to the inner side of the rotary liquid baffle, and the cleaning is convenient.
Further, the number of the guide pillars is 4, wherein 2 of the guide pillars are first guide pillars, and the other two guide pillars are second guide pillars; the 4 guide pillars are distributed in an annular shape at equal intervals, and the two first guide pillars and the two second guide pillars are alternately distributed.
Furthermore, the number of the connecting supports is 3-6, and the connecting supports are distributed in an annular shape at equal intervals; the connecting bracket comprises a first horizontal rod fixedly connected with the rotating shaft, a second horizontal rod connected with the driving plate and a vertical rod connecting the first horizontal rod and the second horizontal rod; the number of the supporting plates is 3-6, and the supporting plates are located at the same horizontal height and are distributed in an annular equal interval mode.
Further, the height of the rotary liquid baffle is equal to that of the lifting liquid baffle, and the top end of the rotary liquid baffle is higher than that of the lifting liquid baffle; and a plurality of balancing weights are fixed at the outer circumference of the lifting liquid baffle.
Furthermore, the counterweight block is an iron counterweight block, and the bottom plate is provided with a plurality of magnetic blocks for attracting the counterweight block; the balancing weights and the magnetic blocks are equal in number and correspond to each other one by one, and when the liquid baffle is rotated to be at the second height, the corresponding balancing weights and the magnetic blocks are abutted and attracted.
The setting of balancing weight and magnetic path for can support tightly enough between backup pad and the drive plate, thereby conveniently make the drive plate with rotate the synchronous rotation of fender liquid board.
Further, the developer solution supply unit comprises a developer solution storage container and a developer solution pump; the cleaning liquid nozzle comprises a cleaning liquid storage container and a cleaning liquid pump.
Has the advantages that: the developing device can well realize the development of the semiconductor wafer, and integrates the steps of developing, cleaning and drying. And the device of this application can effectively show the developer that the development used and the scope of splashing of washing liquid when developing to easily clear up, thereby guarantee the inside cleanliness factor of developing device, ensure the production quality of chip.
Drawings
FIG. 1 is a schematic view of a loaded wafer before a develop operation;
FIG. 2 is a schematic diagram illustrating a developing operation performed on a semiconductor wafer;
FIG. 3 is a schematic view of the inside of the cleaning rotating baffle.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Reference numerals are as follows: 1.1, 1.2 side plates; 1.3 front baffle; 1.4 parts mounting case; 1.4.1 display element; 1.5 a bottom plate; 2.1 sliding rails; 2.2 a first screw rod; 3.1, a movable guide rod; 3.1.1 sliding block; 3.2 a second screw rod; 3.3 a slide seat; 3.4 rotating the cylinder; 3.4.1 cleaning solution nozzle; 3.4.2 a gas nozzle; 3.5 developer solution nozzle; 4.1 a rotating shaft; 4.2 vacuum carrying platform; 4.3 connecting the bracket; 4.3.1 first horizontal bar; 4.3.2 second horizontal bar; 4.3.3 vertical rods; 4.4 drive the board; 5 a semiconductor wafer; 6.1 lifting the liquid baffle; 6.1.1 lifting block; 6.1.2 balancing weight; 6.1.3 magnetic blocks; 6.2 rotating the liquid baffle; 6.2.1 support plates; 6.3 first guide post; 6.3.1 limiting plate; 6.3.2 fixed pulley; 6.3.3 electric winding device; 6.3.4 pulling a rope; 6.3.5 fixing the ring; 6.4 second guide post; 7.1 an inner liquid baffle; 7.2 outer liquid baffle.
As shown in the figure: a developing device for processing a high-efficiency positioning semiconductor wafer comprises a shell, wherein the shell comprises a component installation box 1.4, a front baffle 1.3, a bottom plate 1.5 and two opposite side plates 1.1 and 1.2, a rotary driving unit is installed at the position of the bottom plate 1.5, the rotary driving unit drives a rotating shaft 4.1 to rotate, a vacuum carrying platform 4.2 is installed at the position of the rotating shaft 4.1, a sliding rail 2.1 is fixed at the position of the side plate 1.1, a first bearing is installed on the front baffle 1.3, a first motor is installed in the component installation box 1.4, a first lead screw 2.2 is connected between the first bearing and the first motor, a sliding block 3.1.1 is installed at the position of the sliding rail 2.1, the sliding block 3.1.1 is provided with a first threaded hole which is penetrated by the first lead screw 2, a movable guide rod 3.1 is connected between the sliding blocks 3.1 at the positions of the sliding rails 2.1 of the two side plates 1, a movable guide rod 3.3.1 is installed at the position of the movable guide rod 3.3, and a second bearing is installed at one end of the movable sliding block 3.1, a second motor is arranged at the other end of the sliding seat, a second screw rod 3.2 is connected between a second bearing and the second motor, and a second threaded hole through which the second screw rod 3.2 passes is formed in the sliding seat 3.3; slide 3.3 department installs first nozzle installation piece and revolving cylinder 3.4, revolving cylinder 3.4 department installs second nozzle installation piece, first nozzle installation piece department installs developer nozzle 3.5, second nozzle installation piece department installs washing liquid nozzle 3.4.1 and gas nozzle 3.4.2, developer nozzle 3.5 is connected with developer solution and supplies the liquid unit, developer nozzle 3.4.1 is connected with washing liquid and supplies the liquid unit, gas nozzle 3.4.2 is connected with the air feed unit.
The component mounting box 1.4 has a control panel including a display unit 1.4.1. The bottom plate 1.5 is provided with a liquid discharging hole; the bottom plate department is fixed with annular interior baffler 7.1 and annular outer baffler 7.2 of circle, interior baffler 7.1 surrounds pivot 4.1, outer baffler 7.2 surrounds interior baffler 7.1, the drain hole is located between outer baffler 7.2 and the interior baffler 7.1.
A plurality of guide pillars 6.3 and 6.4 are fixed at the bottom plate 1.5, a movable liquid baffle is arranged between the inner liquid baffle 7.1 and the outer liquid baffle 7.2, the movable liquid baffle comprises a circular lifting liquid baffle 6.1 and a rotatable rotating liquid baffle 6.2, the lifting liquid baffle 6.1 and the rotating liquid baffle 6.2 are connected through a bearing, the outer ring of the bearing is fixedly connected with the lifting liquid baffle 6.1, the inner ring of the bearing is fixedly connected with the rotating liquid baffle 6.1, a plurality of lifting blocks 6.1.1 are fixed at the outer circumference of the lifting liquid baffle 6.1, the number of the lifting blocks 6.1.1 is equal to that of the guide pillars 6.3 and 6.4, and the lifting blocks 6.1.1 are in one-to-one correspondence with the guide pillars 6.3 and 6.4; two of the guide posts are first guide posts 6.3, the rest are second guide posts 6.4, the top end of the first guide post 6.3 is provided with a limiting plate 6.3.1, the first guide post 6.3 is also provided with an installation through hole, a fixed pulley 6.3.2 is installed in the installation through hole, the lifting block 6.1.1 at the first guide post 6.3 is also provided with a fixing ring 6.3.5, the side plates 1.1 and 1.2 are provided with electric winding devices 6.3.3, the two electric winding devices 6.3.3 correspond to the two first guide posts 6.3 one by one, a pull rope 6.3.4 at the electric winding device 6.3.3 passes through the fixed pulley 6.3.2 and is fixedly connected with the fixing ring 6.3.5 between the corresponding electric winding devices 6.3.3 and the first guide post 6.3; a plurality of supporting plates 6.2.1 are fixed on the inner circumference of the rotating liquid baffle 6.2, and a circular driving plate 4.4 is connected to the rotating shaft 4.1 through a plurality of connecting supports 4.3; when the pull ropes 6.3.4 of the two electric winding devices 6.3.3 are tightened, the rotary liquid baffle 6.2 is located at a first height, the top end of the rotary liquid baffle 6.2 abuts against the limiting plate 6.3.1, and all the supporting plates 6.2.1 are not in contact with the driving plate 4.4; when the pull ropes of the two electric winding devices 6.3.3 are loosened, the rotary liquid baffle 6.2 is positioned at a second height, and all the support plates 6.2.1 are abutted against the drive plate 4.4 and supported by the drive plate 4.4; the first height is higher than the second height.
The lower surface of the limiting plate is provided with an anti-skid coating; the top end of the rotary liquid baffle 6.2 is provided with an anti-skid coating; the upper surface of the drive plate 4.4 and the lower surface of the support plate are provided with an anti-slip coating. When the rotary liquid baffle 6.2 is positioned at the first height, the top end of the rotary liquid baffle 6.2 is higher than the upper surface of the vacuum carrying platform 4.2 by more than 1 cm; when the rotating liquid baffle 6.2 is at the second height, the top end of the rotating liquid baffle 6.2 is lower than the upper surface of the vacuum carrying platform 4.2 by more than 2 cm. The guide posts 6.3 and 6.4 are 4, 2 of the guide posts are first guide posts 6.3, and the other two guide posts are second guide posts 6.4; the 4 guide columns 6.3 and 6.4 are distributed at equal intervals in a ring shape, and the two first guide columns 6.3 and the two second guide columns are alternately distributed. The number of the connecting supports 4.3 is 3-6, and the connecting supports are distributed in an annular shape at equal intervals; the connecting bracket 4.3 comprises a first horizontal rod 4.3.1 fixedly connected with the rotating shaft 4.1, a second horizontal rod 4.3.2 connected with the driving plate 4.4 and a vertical rod 4.3.3 connecting the first horizontal rod 4.3.1 and the second horizontal rod 4.3.2; 3-6 support plates 6.2.1 are located at the same horizontal height and are distributed in an annular equal-interval mode.
In addition, in order to ensure the driving effect of the driving plate, the following scheme is provided: the height of the rotary liquid baffle 6.2 is equal to that of the lifting liquid baffle 6.1, and the top end of the rotary liquid baffle 6.2 is higher than that of the lifting liquid baffle 6.1; a plurality of balancing weights 6.1.2 are fixed at the outer circumference of the lifting liquid baffle 6.1. The counterweight block 6.1.2 is an iron counterweight block, and a plurality of magnetic blocks 6.1.3 for attracting the counterweight block 6.1.2 are arranged at the position 1.5 of the bottom plate; the balancing weights and the magnetic blocks are equal in number and are in one-to-one correspondence, and when the liquid baffle is rotated to be at the second height, the corresponding balancing weights and the magnetic blocks are abutted and attracted.
As shown in the drawings, in the developing device of the present application, the vacuum stage can be loaded with a wafer and the wafer is driven to rotate at a desired rotation speed. And the nozzle unit can realize two-dimensional free movement under the drive of the first motor and the second motor, and the angles of the cleaning liquid nozzle and the gas nozzle can also be adjusted. Thus, as shown in fig. 1, when a robot (not shown) loads or removes a wafer, the slide is in the initial position (in a corner, not interfering with the operation of the robot); as shown in fig. 2, at the time of the developing operation, the vacuum stage rotates, and the developer nozzle can eject the developer. After the development is finished, the cleaning liquid nozzle sprays cleaning liquid for cleaning, and then the gas nozzle is used for spraying gas for drying. And at the moment, the electric winding device pulls the rotary liquid baffle to the first height and is abutted and limited by the limiting plate, so that liquid splashed by the rotation of the wafer can be blocked by the inner side surface of the rotary liquid baffle, and the inner space of the device cannot be polluted. After drying, the wafer can be taken away.
After using a period, because it also needs the clearance to rotate the fender liquid inboard, consequently can utilize electric take-up to place the stay cord, thereby lift fender liquid board descends, and the backup pad is by the drive plate butt, because magnetic path and balancing weight are to lift fender liquid board appeal and gravity, it is tight consequently to support between backup pad and the drive plate, thereby the rotation of vacuum microscope carrier can drive the drive plate and rotate, thereby the drive rotates fender liquid board and rotates, and the washing liquid nozzle slope washes the inboard that rotates fender liquid board this moment, thereby wash whole inboard, dry after the washing, thereby realize the clearance to rotating fender liquid board on the whole. The device of this application can guarantee the inside cleanliness factor of device all the time to guarantee the production quality of chip.
It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
While the invention has been shown and described with respect to the preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined in the following claims.
Claims (10)
1. A developing device for efficiently positioning semiconductor wafers for processing is characterized by comprising a shell, wherein the shell comprises a component installation box, a front baffle, a bottom plate and two opposite side plates, a rotary driving unit is installed at the bottom plate and drives a rotary shaft to rotate, a vacuum loading platform is installed at the rotary shaft, slide rails are fixed at the side plates, a first bearing is installed on the front baffle, a first motor is installed in the component installation box, a first lead screw is connected between the first bearing and the first motor, a slide block is installed at the slide rail and provided with a first threaded hole through which the first lead screw penetrates, a movable guide rod is connected between the slide blocks at the slide rails of the two side plates, a slide seat is installed at the movable guide rod, a second bearing is installed at one end of the movable guide rod, a second motor is installed at the other end of the movable guide rod, and a second lead screw is connected between the second bearing and the second motor, the sliding seat is provided with a second threaded hole through which a second screw rod passes; the utility model discloses a developing solution spraying device, including slide, revolving cylinder, first nozzle installation piece, second nozzle installation piece, washing liquid nozzle and gas nozzle, the slide department installs first nozzle installation piece and revolving cylinder, revolving cylinder department installs second nozzle installation piece, first nozzle installation piece department installs the developing solution nozzle, second nozzle installation piece department installs washing liquid nozzle and gas nozzle, the developing solution nozzle is connected with the developing solution and supplies the liquid unit, the washing liquid nozzle is connected with the washing liquid and supplies the liquid unit, the gas nozzle is connected with the air feed unit.
2. The apparatus as claimed in claim 1, wherein the component mounting box has a control panel thereon, and the control panel comprises a display unit.
3. The apparatus of claim 1, wherein the base plate has a dip hole; the bottom plate department is fixed with the outer liquid baffle of annular inner liquid baffle of annular and annular, inner liquid baffle surrounds the pivot, outer liquid baffle surrounds inner liquid baffle, the lower liquid hole is located between outer liquid baffle and the inner liquid baffle.
4. The apparatus as claimed in claim 3, wherein a plurality of guide posts are fixed on the bottom plate, a movable liquid baffle is disposed between the inner liquid baffle and the outer liquid baffle, the movable liquid baffle comprises a circular elevating liquid baffle and a rotatable liquid baffle, the elevating liquid baffle and the rotatable liquid baffle are connected by a bearing, an outer ring of the bearing is fixedly connected with the elevating liquid baffle, an inner ring of the bearing is fixedly connected with the rotatable liquid baffle, a plurality of lifting blocks are fixed on an outer circumference of the elevating liquid baffle, the plurality of lifting blocks correspond to the plurality of guide posts in equal number one-to-one, and the lifting blocks have sliding grooves engaged with the guide posts; two of the guide posts are first guide posts, the rest are second guide posts, a limiting plate is arranged at the top end of each first guide post, an installation through hole is formed in each first guide post, a fixed pulley is installed at the installation through hole, a fixing ring is further arranged at a lifting block of each first guide post, an electric winding device is installed on each side plate, the two electric winding devices correspond to the two first guide posts one by one, a pull rope at each electric winding device passes through the fixed pulley and is fixedly connected with the fixing ring; a plurality of supporting plates are fixed on the inner circumference of the rotary liquid baffle plate, and the rotary shaft is connected with an annular driving plate through a plurality of connecting supports; when the pull ropes of the two electric winding devices are tightened, the rotary liquid baffle is located at a first height, the top end of the rotary liquid baffle abuts against the limiting plate, and all the supporting plates are not in contact with the driving plate; when the pull ropes of the two electric winding devices are loosened, the rotary liquid baffle plate is located at a second height, and all the support plates are abutted to the drive plate and supported by the drive plate; the first height is higher than the second height.
5. The developing device for processing the high-efficiency positioning semiconductor wafer as claimed in claim 4, wherein the lower surface of the limiting plate is provided with an anti-slip coating; the top end of the rotary liquid baffle plate is provided with an anti-skid coating; the upper surface of drive plate and the lower surface of backup pad all have anti-skidding coating.
6. The efficient positioning developing device for processing semiconductor wafers as recited in claim 4, wherein when the liquid blocking plate is at the first height, the top end of the liquid blocking plate is 1cm or more higher than the upper surface of the vacuum stage; and when the rotating liquid baffle is at the second height, the top end of the rotating liquid baffle is lower than the upper surface of the vacuum carrying platform by more than 2 cm.
7. The apparatus of claim 4, wherein the number of the pillars is 4, 2 of the pillars are first pillars and the other two are second pillars; the 4 guide posts are distributed in an annular shape at equal intervals, and the two first guide posts and the two second guide posts are alternately distributed.
8. The apparatus as claimed in claim 4, wherein the number of the connecting brackets is 3-6, and the connecting brackets are distributed at equal intervals in a ring shape; the connecting bracket comprises a first horizontal rod fixedly connected with the rotating shaft, a second horizontal rod connected with the driving plate and a vertical rod connecting the first horizontal rod and the second horizontal rod; the number of the supporting plates is 3-6, the supporting plates are positioned at the same horizontal height and are distributed at equal intervals in a ring shape.
9. The apparatus of claim 4, wherein the height of the liquid baffle is equal to the height of the liquid baffle, and the top end of the liquid baffle is higher than the top end of the liquid baffle; and a plurality of balancing weights are fixed at the outer circumference of the lifting liquid baffle.
10. The developing apparatus for efficiently positioning semiconductor wafer processing as recited in claim 9, wherein the weight is an iron weight, and the bottom plate has a plurality of magnetic blocks for attracting the weight; the balancing weights and the magnetic blocks are equal in number and correspond to each other one by one, and when the liquid baffle is rotated to be at the second height, the corresponding balancing weights and the magnetic blocks are abutted and attracted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210232558.7A CN114779583B (en) | 2022-03-09 | 2022-03-09 | High-efficient location semiconductor wafer processing is with developing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210232558.7A CN114779583B (en) | 2022-03-09 | 2022-03-09 | High-efficient location semiconductor wafer processing is with developing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114779583A true CN114779583A (en) | 2022-07-22 |
| CN114779583B CN114779583B (en) | 2023-03-31 |
Family
ID=82423602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210232558.7A Active CN114779583B (en) | 2022-03-09 | 2022-03-09 | High-efficient location semiconductor wafer processing is with developing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114779583B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115365023A (en) * | 2022-08-15 | 2022-11-22 | 苏州普瑞得电子有限公司 | Automatic coating system for surface treatment and development |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11133625A (en) * | 1997-10-31 | 1999-05-21 | Toyobo Co Ltd | Method and device for developing photosensitive resin plate |
| CN101017332A (en) * | 2006-02-07 | 2007-08-15 | 大日本网目版制造株式会社 | Developing apparatus and developing method |
| CN109445254A (en) * | 2018-11-16 | 2019-03-08 | 福建省福联集成电路有限公司 | A kind of device reducing development pipeline bubble |
| CN110161804A (en) * | 2019-06-21 | 2019-08-23 | 沈阳芯源微电子设备股份有限公司 | Glue-spreading development equipment and system |
| CN213855959U (en) * | 2020-11-17 | 2021-08-03 | 广东惠信浦电路有限公司 | Hinder and weld developing machine spray set |
-
2022
- 2022-03-09 CN CN202210232558.7A patent/CN114779583B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11133625A (en) * | 1997-10-31 | 1999-05-21 | Toyobo Co Ltd | Method and device for developing photosensitive resin plate |
| CN101017332A (en) * | 2006-02-07 | 2007-08-15 | 大日本网目版制造株式会社 | Developing apparatus and developing method |
| CN109445254A (en) * | 2018-11-16 | 2019-03-08 | 福建省福联集成电路有限公司 | A kind of device reducing development pipeline bubble |
| CN110161804A (en) * | 2019-06-21 | 2019-08-23 | 沈阳芯源微电子设备股份有限公司 | Glue-spreading development equipment and system |
| CN213855959U (en) * | 2020-11-17 | 2021-08-03 | 广东惠信浦电路有限公司 | Hinder and weld developing machine spray set |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115365023A (en) * | 2022-08-15 | 2022-11-22 | 苏州普瑞得电子有限公司 | Automatic coating system for surface treatment and development |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114779583B (en) | 2023-03-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5829156A (en) | Spin dryer apparatus | |
| KR100827796B1 (en) | Substrate processing apparatus | |
| KR100887360B1 (en) | Substrate processing apparatus and substrate processing method | |
| EP2042245B1 (en) | Box cleaner for cleaning wafer shipping box | |
| CN114779583B (en) | High-efficient location semiconductor wafer processing is with developing device | |
| KR100907125B1 (en) | Substrate processing method and substrate processing apparatus | |
| EP1263024A2 (en) | Single wafer type cleaning method and apparatus | |
| WO2005119748A1 (en) | Substrate cleaning method and computer readable recording medium | |
| KR101231749B1 (en) | Spinning apparatus for treating substrates | |
| JP4929144B2 (en) | Substrate processing apparatus, substrate processing method, and storage medium | |
| KR100757847B1 (en) | Apparatus for treating substrate and method for loading substrate in the apparatus | |
| JP4928428B2 (en) | Substrate processing apparatus, substrate processing method, and storage medium | |
| US20010045223A1 (en) | Semiconductor wafer cleaning apparatus and method of using the same | |
| JP2009158564A (en) | Substrate treatment apparatus and substrate treatment method | |
| KR101769440B1 (en) | Method for treating substrate | |
| KR101985756B1 (en) | Apparatus and Method for treating substrate | |
| CN114334608A (en) | Automatic photoresist stripping process | |
| JP3712552B2 (en) | Substrate processing equipment | |
| JP3583552B2 (en) | Processing device and processing method | |
| KR100823985B1 (en) | Apparatus and method for treating substrate | |
| KR100797082B1 (en) | Method of treating a substrate | |
| KR101958642B1 (en) | Apparatus for treating a substrate | |
| JP2003031537A (en) | Wafer processing apparatus | |
| KR100738443B1 (en) | Substrate cleaning apparatus and substrate cleaning method | |
| KR19990045515A (en) | Substrate Processing Equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |