CN114771042B - Diamond carbon fiber composite material and preparation method thereof - Google Patents

Diamond carbon fiber composite material and preparation method thereof Download PDF

Info

Publication number
CN114771042B
CN114771042B CN202210458098.XA CN202210458098A CN114771042B CN 114771042 B CN114771042 B CN 114771042B CN 202210458098 A CN202210458098 A CN 202210458098A CN 114771042 B CN114771042 B CN 114771042B
Authority
CN
China
Prior art keywords
diamond
carbon fiber
self
supporting
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210458098.XA
Other languages
Chinese (zh)
Other versions
CN114771042A (en
Inventor
于盛旺
高洁
郑可
马永
周兵
王永胜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyuan University of Technology
Original Assignee
Taiyuan University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyuan University of Technology filed Critical Taiyuan University of Technology
Priority to CN202210458098.XA priority Critical patent/CN114771042B/en
Publication of CN114771042A publication Critical patent/CN114771042A/en
Application granted granted Critical
Publication of CN114771042B publication Critical patent/CN114771042B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/162—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B32B2038/0016—Abrading
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/42—Alternating layers, e.g. ABAB(C), AABBAABB(C)
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention relates to a diamond carbon fiber composite material and a preparation method thereof, wherein the material is formed by stacking self-supporting diamond films and carbon fiber layers which are sequentially and alternately arranged along the up-down direction, and the top layer and the bottom layer of the material are self-supporting diamond films; the carbon fiber layer may be pure carbon fiber or a composite body of diamond powder distributed in the carbon fiber. When the material is prepared, firstly, performing shape cutting, thickness trimming and surface smoothing treatment on a CVD diamond film; then spreading a carbon fiber layer and a diamond film on the surface of the diamond film in sequence, and bonding the carbon fiber layer and the diamond film together through a bonding agent; and finally, applying static pressure between the upper diamond film and the lower diamond film, discharging surplus binder and bubbles, and removing the static pressure after the binder is solidified to obtain the diamond carbon fiber composite material. The diamond carbon fiber composite material has the advantages of high heat conduction, high strength, high toughness and low density, and is simple in preparation process, low in cost and easy for large-scale and batch production.

Description

Diamond carbon fiber composite material and preparation method thereof
Technical Field
The invention belongs to the technical field of thermal management materials and preparation thereof, and particularly relates to a diamond carbon fiber composite material and a preparation method thereof.
Background
With the rapid development of electronic technology, the power of components in the electronic equipment thermal control system in the army and civil field is higher and higher, and the thermal management becomes particularly important, and even becomes a bottleneck for the development of high-power electronic devices. However, currently common metals (Al, cu), ceramics (SiC, alN), metal matrix composites (Cu/Mo, al/SiC), etc. are increasingly difficult to meet the heat dissipation requirements of high-power electronic devices. Therefore, the development of a new generation of high heat conduction materials to ensure the stable operation of the thermal control system of the high-power electronic equipment is an important research and development point in the field of thermal management materials.
Unlike metal, which transfers heat by means of peripheral electrons, diamond transfers heat by means of phonons, and its heat conductivity at room temperature can reach up to 2000W/(m.K), which is 5 times that of copper. Meanwhile, diamond has excellent insulativity and low thermal expansion coefficient and density, so that diamond becomes an optimal material for heat management application of high-power electronic equipment. Currently, diamond is used in thermal management materials in three main forms: CVD diamond film was used alone; the CVD diamond film and the metal are welded to form a composite radiating fin; the diamond powder/particles form a composite material with metals such as copper, aluminum, etc. Diamond alone as a heat sink material suffers from the following problems: the diamond thick film has long growth period, difficult deep processing and high cost; the diamond film is hard and brittle, has poor toughness and is easy to break. The problems with diamond film and metal welding are: the diamond has high chemical inertia and poor infiltration with metal materials, and is difficult to form good interface bonding; the difference of the thermal expansion coefficients of diamond and metal is large, and the thermal shock can cause deformation imbalance. Diamond powder/particle and copper, aluminum and other metals are compounded to solve the problems of high interface thermal resistance and small compound thermal conductivity.
The carbon fiber has high tensile strength and small thermal expansion coefficient (even negative value-1.5X10) -6 A series of excellent properties such as low specific gravity, etc. If diamond is compounded with carbon fiber, thenThe ultrahigh heat conduction advantage of the diamond and the high strength and high toughness advantage of the carbon fiber are expected to be combined. Although carbon fiber and diamond belong to the same carbon material, the carbon fiber and the diamond are structurally different and are difficult to compound, so that a composite material of the carbon fiber and the diamond is not developed at present. According to the invention, through the structural and functional integrated design of the material, the diamond carbon fiber composite thermal management material with high heat conduction, high strength, high toughness and low density is prepared and obtained, and the heat dissipation requirement of a high-power electronic device is met.
Disclosure of Invention
Aiming at the fact that the thermal management material in the prior art cannot meet the increasing heat dissipation requirement of high-power electronic devices, the invention provides a diamond carbon fiber composite material.
The invention is realized by the following two technical schemes:
the first technical scheme provided by the invention is as follows:
a diamond carbon fiber composite material is formed by stacking self-supporting diamond films and carbon fiber layers which are sequentially and alternately arranged along the up-down direction, and the top layer and the bottom layer of the composite material are self-supporting diamond films; the carbon fiber layer is a carbon fiber-cured binder composite, and the structure of the composite is a carbon fiber-reinforced cured binder, as shown in fig. 1.
As a preferable technical scheme, in the diamond-carbon fiber composite material, the self-supporting diamond diaphragm is prepared by adopting a CVD method, the thermal conductivity is more than or equal to 600W/(m.K), the flatness is less than or equal to 0.1mm, the parallelism is less than or equal to 0.1mm, and the roughness Ra is less than or equal to 0.05 mm; the thickness of the self-supporting diamond diaphragm is 0.3 mm-1 mm, and the thickness of the carbon fiber layer is 0.1 mm-0.3 mm.
Furthermore, the invention also provides a preparation method of the diamond carbon fiber composite material, which solves the problems that diamond is difficult to deposit on the surface of carbon fiber in a film form and the connection and the compounding of the diamond and the carbon fiber are difficult. The preparation method specifically comprises the following steps:
step 1: selecting a self-supporting diamond film with proper diameter and thickness according to the size requirement of the diamond carbon fiber composite material on the self-supporting diamond film, cutting the self-supporting diamond film into a set shape by a laser cutting machine, and then performing thickness trimming and surface smoothing treatment on the self-supporting diamond film obtained by cutting by a laser trimming machine to obtain the self-supporting diamond film meeting the composite requirement;
step 2: uniformly blending the binder and absolute ethyl alcohol, soaking carbon fibers in a blending solution for 1-5 minutes, taking out, placing in the air for 10-30 minutes, then spreading and bonding the carbon fibers soaked with the binder on a self-supporting diamond film, placing a layer of self-supporting diamond film on a carbon fiber layer, and repeating the process of alternately spreading the carbon fibers soaked with the binder and the self-supporting diamond film until the composite thickness reaches the requirement to obtain a composite layer structure;
step 3: clamping the side surface of the composite layer structure through a clamping frame to ensure the flatness of the side surface, simultaneously placing a weight on the surface of the self-supporting diamond membrane on the top layer, discharging surplus binder in the carbon fiber layer and bubbles dispersed in the binder by virtue of normal static pressure of the weight, and heating and curing the binder under the state of maintaining the side surface clamping and the top layer to apply pressure;
step 4: and removing the weight and the clamping frame, polishing and ultrasonically cleaning the side surface of the composite layer structure, and finally obtaining the diamond carbon fiber composite material.
In the preparation method of the diamond carbon fiber composite material, in the step 2, the binder adopts barium phenolic resin, epoxy resin or modified epoxy resin, and the blending ratio of the binder and absolute ethyl alcohol is 1:1-1:5; in the step 3, the heating temperature for heating and curing is 200-300 ℃, and the temperature is kept for 3-8 hours; in the step 3, loose materials are adopted as the materials of the clamping frame or through holes for discharging the binder are processed on the clamping frame.
The second technical scheme provided by the invention is as follows:
a diamond carbon fiber composite material is formed by stacking self-supporting diamond films and carbon fiber layers which are sequentially and alternately arranged along the up-down direction, and the top layer and the bottom layer of the composite material are self-supporting diamond films; the carbon fiber layer is a composite of carbon fiber-diamond micropowder-curing binder, the structure of the composite is carbon fiber-reinforced curing binder, and diamond micropowder is dispersed in the composite, as shown in figure 3.
As a preferable technical scheme, in the diamond-carbon fiber composite material, the self-supporting diamond diaphragm is prepared by adopting a CVD method, the thermal conductivity is more than or equal to 600W/(m.K), the flatness is less than or equal to 0.1mm, the parallelism is less than or equal to 0.1mm, and the roughness Ra is less than or equal to 0.05 mm; the thickness of the self-supporting diamond diaphragm is 0.3 mm-1 mm, and the thickness of the carbon fiber layer is 0.1 mm-0.3 mm; the curing binder is a curing body of barium phenolic resin, epoxy resin and modified epoxy resin; the grain diameter of the diamond micropowder is 100 nm-10 mu m.
Furthermore, the invention also provides a preparation method of the diamond carbon fiber composite material, which solves the problems that diamond is difficult to deposit on the surface of carbon fiber in a film form and the connection and the compounding of the diamond and the carbon fiber are difficult. The preparation method specifically comprises the following steps:
step 1: selecting a self-supporting diamond film with proper diameter and thickness according to the size requirement of the diamond carbon fiber composite material on the self-supporting diamond film, cutting the self-supporting diamond film into a set shape by a laser cutting machine, and then carrying out thickness trimming and surface smoothing treatment on the self-supporting diamond film by a laser trimming machine to obtain the self-supporting diamond film meeting the composite requirement;
step 2: mixing diamond micropowder, curing binder and absolute ethyl alcohol in proportion, and uniformly dispersing the diamond micropowder by adopting a stirrer;
step 3: soaking carbon fiber tows in a binder formulation containing diamond micro powder, taking out the carbon fiber tows, spreading and bonding the carbon fibers on a self-supporting diamond film, placing a layer of self-supporting diamond film on a carbon fiber layer, repeating the process of alternately spreading the carbon fibers impregnated with the binder and the self-supporting diamond film until the composite thickness reaches the requirement, and obtaining a composite layer structure;
step 4: clamping the side surface of the composite layer structure after the composition by a clamping frame to keep the flatness, simultaneously placing a weight on the surface of the self-supporting diamond film on the top layer, discharging the surplus binder in the carbon fiber layer and bubbles dispersed in the binder by virtue of the normal static pressure of the weight, and heating and curing the binder under the state of keeping the side surface clamping and the top layer to apply pressure;
step 5: and removing the weight and the clamping frame, polishing and ultrasonically cleaning the side surface of the composite layer structure, and finally obtaining the diamond carbon fiber composite material.
In the step 2, when the diamond micro powder, the curing binder and the absolute ethyl alcohol are prepared, the proportion of the diamond micro powder to the curing binder is 1:1-1:5, and the proportion of the whole diamond micro powder to the absolute ethyl alcohol is 1:2-1:10; in the step 4, the heating temperature for heating and curing is 200-300 ℃, and the temperature is kept for 3-8 hours; in the step 4, the clamping frame is made of loose materials or a through hole for discharging the adhesive is processed on the clamping frame.
The two technical schemes provided by the invention have the following beneficial effects:
1) The diamond has high heat conductivity and excellent heat dissipation performance, the carbon fiber has high tensile strength and high toughness, and the two technical schemes of the invention combine the CVD self-supporting diamond diaphragm and the carbon fiber with two carbon materials with excellent performances by using adhesives such as barium phenolic resin, epoxy resin, modified epoxy resin and the like, so as to realize the performance complementation of the CVD self-supporting diamond diaphragm and the carbon fiber, and prepare the diamond carbon fiber composite material.
2) The composite material in the two technical schemes has excellent heat conductivity in the surface, the self-supporting diamond film is adopted as the composite material, the existence of a plurality of self-supporting diamond films in the horizontal direction can be used as a high-efficiency heat dissipation channel, and the contacted heat is quickly transferred away, so that the horizontal direction has higher heat conductivity and can reach about 90% of diamond; considering the problems that the thermal conductivity of the resin binder is not high, the normal thermal conductivity is affected due to the existence of interface thermal resistance, and the like, the normal thermal conductivity of the first technical scheme of the invention is lower, and the resin binder is suitable for occasions requiring only high thermal conductivity in the horizontal direction; in the second technical scheme provided by the invention, the diamond micro powder is added into the binder, and the existence of the diamond micro powder enables the resin binder to be changed into the diamond/resin binder composite material, so that the thermal conductivity of the resin binder is greatly improved, and the diamond carbon fiber composite material is ensured to have higher thermal conductivity in the normal direction, so that the diamond carbon fiber composite material is particularly suitable for being used as a radiating bracket in a thermal control system in the fields of aerospace, nuclear industry and the like.
3) The diamond carbon fiber composite material is formed by bonding two materials through an adhesive, and the shape and the thickness of the two materials are adjustable, so that the overall shape and the thickness of the composite material can be flexibly adjusted according to the space of a thermal control system, and the thermal conductivity can be regulated and controlled according to the cost and the actual requirement.
Drawings
The schematic drawings of the present application are only for further understanding of the present application and do not constitute an undue limitation of the present application.
Fig. 1 is a schematic structural diagram of a diamond-carbon fiber composite material according to a first embodiment of the present invention.
Fig. 2 is a schematic diagram of the preparation of the diamond-carbon fiber composite material according to the first embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a diamond-carbon fiber composite material according to a second embodiment of the present invention.
Fig. 4 is a schematic diagram of a diamond-carbon fiber composite material according to a second embodiment of the present invention.
Fig. 5 is a schematic structural diagram of the diamond-carbon fiber composite material prepared in example 1.
Fig. 6 is a schematic structural diagram of the diamond-carbon fiber composite material prepared in example 2.
Fig. 7 is a schematic structural diagram of the diamond-carbon fiber composite material prepared in example 3.
Fig. 8 is a schematic structural diagram of the diamond-carbon fiber composite material prepared in example 4.
Fig. 9 is a schematic structural diagram of the diamond-carbon fiber composite material prepared in example 5.
Fig. 10 is a schematic structural diagram of the diamond-carbon fiber composite material prepared in example 6.
In the figure: 1-self-supporting diamond diaphragm, 2-carbon fiber layer, 3-diamond micropowder, 4-holder and 5-weight.
Detailed Description
The invention will be further described with reference to the accompanying drawings and examples, but is not limited to the following examples. All other embodiments, which can be made by those skilled in the art without making any inventive effort, are intended to fall within the scope of the present invention.
Example 1:
the diamond carbon fiber composite material consists of an upper self-supporting diamond film 1, a lower self-supporting diamond film 1 and a carbon fiber layer 2 arranged between the upper self-supporting diamond film 1, wherein the self-supporting diamond film 1 is 30 mm multiplied by 20 multiplied by mm multiplied by 1.0 mm in length, 20 multiplied by mm in width and 1.3 mm in thickness, and the carbon fiber layer 2 is 30 mm multiplied by 20 multiplied by mm multiplied by 0.3 mm in length, width and thickness, as shown in fig. 5.
The specific preparation method of the diamond carbon fiber composite material comprises the following steps:
step 1: selecting a CVD self-supporting diamond film with the diameter of 52 mm, the thickness of 1.2 mm, the tensile strength of 1000 MPa and the thermal conductivity of 600W/(m.K), designing an array of 30 mm multiplied by 20 mm in consideration of cutting loss, cutting by a laser cutting machine, wherein the laser power is 12W, and the frequency is 6 Hz; then, carrying out thickness trimming and surface smoothing treatment on the self-supporting diamond film obtained by cutting by adopting a laser trimming machine, wherein the laser power during thickness trimming is 1000W, the trimming speed in the thickness direction is 0.02 mu m/d, the laser power during surface smoothing treatment is 450W, the surface flatness of the self-supporting diamond film after trimming treatment is 0.1mm, the parallelism is 0.1mm, and the roughness is 0.05mm, so as to obtain a self-supporting diamond film 1;
step 2: uniformly blending barium phenolic resin and absolute ethyl alcohol according to a ratio of 1:5, placing 12K carbon fiber bundles with tensile strength of 5000 Mpa and elastic modulus of 230 GPa into the solution for soaking for 5 minutes, taking out, placing in the air for 30 minutes, and then tiling and bonding the carbon fiber bundles between two layers of self-supporting diamond diaphragms 1 to obtain a composite layer structure;
step 3: the clamping frame 4 made of loose materials is adopted, the clamping force of 5N is applied to the four sides of the composite layer structure after the composite is compounded to be flat, meanwhile, a weight 5 with the mass of 0.5 Kg is placed on the surface of the upper self-supporting diamond diaphragm 1, and the excessive resin in the carbon fiber and a small amount of bubbles dispersed in the resin are discharged by virtue of the normal static pressure of the weight 5; heating and curing the barium phenolic resin under the state of maintaining the side clamping and the upper surface layer to exert pressure, slowly heating to 300 ℃, and preserving heat for 8 hours;
step 4: and removing the weight 5 and the clamping frame 4, polishing and ultrasonically cleaning four side surfaces of the composite layer structure, removing the end parts of the side surface solidified barium phenolic resin and the carbon fiber leakage, polishing by adopting 320# to 800# SiC diamond abrasive paper, ultrasonically cleaning by adopting acetone for 15 minutes, and finally preparing the diamond carbon fiber composite material, as shown in figure 5.
The in-plane thermal conductivity of the diamond carbon fiber composite material prepared by the steps is about 500W/(m.K), the tensile strength is about 2500 MPa, and the in-plane thermal conductivity is improved by 2.5 times compared with the tensile strength of diamond.
Example 2:
the diamond carbon fiber composite material is formed by stacking self-supporting diamond films 1 and carbon fiber layers 2 which are sequentially and alternately arranged along the up-down direction, and the top layer and the bottom layer of the self-supporting diamond film are self-supporting diamond films 1; wherein ten layers of self-supporting diamond films 1 and nine layers of carbon fiber layers 2 are combined, the length, width and thickness of the self-supporting diamond film 1 are 15 mm multiplied by 15 multiplied by mm multiplied by 0.6 mm, and the length, width and thickness of the carbon fiber layers 2 are 15 mm multiplied by 15 multiplied by mm multiplied by 0.2 mm, as shown in fig. 6;
the specific preparation method of the diamond carbon fiber composite material comprises the following steps:
step 1: selecting a CVD self-supporting diamond film with the diameter of 55 mm, the thickness of about 0.8 mm, the tensile strength of 600 MPa and the thermal conductivity of 1000W/(m.K), designing an array of 15 mm multiplied by 15 mm in consideration of cutting loss, cutting by a laser cutting machine, wherein the laser power is 11W and the frequency is 7 Hz; then, carrying out thickness trimming and surface smoothing treatment on the self-supporting diamond film obtained by cutting by adopting a laser trimming machine, wherein the laser power during thickness trimming is 900W, the trimming speed in the thickness direction is 0.02 mu m/d, the laser power during surface smoothing treatment is 400W, the surface flatness of the self-supporting diamond film after trimming treatment is 0.08mm, the parallelism is 0.08mm, and the roughness is 0.03 mm, so as to obtain a self-supporting diamond film 1;
step 2: uniformly blending epoxy resin and absolute ethyl alcohol according to a ratio of 1:3, placing 12K carbon fiber bundles with the tensile strength of 4500 MPa and the elastic modulus of 230 GPa into the solution, soaking for 3 minutes, taking out, placing in the air for 20 minutes, then spreading and bonding between two layers of self-supporting diamond diaphragms 1, and alternately spreading carbon fibers soaked with the epoxy resin and the self-supporting diamond diaphragms 1 until the composite thickness reaches the requirement, and orthogonally spreading adjacent carbon fiber bundles to obtain a composite layer structure for improving the composite strength;
step 3: the clamping frame 4 made of loose materials is adopted, the clamping force of 5N is applied to the four sides of the composite layer structure to enable the sides to be smooth, meanwhile, a weight 5 with the mass of 0.8 Kg is placed on the surface of the self-supporting diamond diaphragm 1 at the uppermost layer, and the excessive resin in the carbon fiber and a small amount of bubbles dispersed in the resin are discharged by virtue of the normal static pressure of the weight 5; heating and curing the epoxy resin under the state of maintaining the side clamping and the upper surface layer to exert pressure, slowly heating to 260 ℃, and preserving heat for 6 hours;
step 4: and removing the clamping frame 4 and the heavy object 5, polishing and ultrasonically cleaning four side surfaces of the composite layer structure, removing the side surface cured epoxy resin and the end part of the carbon fiber leakage, polishing by adopting 320# to 800# SiC diamond abrasive paper, ultrasonically cleaning by adopting acetone for 15 minutes, and finally preparing the diamond carbon fiber composite material, as shown in figure 6.
The in-plane thermal conductivity of the diamond carbon fiber composite material prepared by the steps is about 900W/(m.K), the tensile strength is about 1600 MPa, and the in-plane thermal conductivity is improved by 2.7 times compared with the tensile strength of diamond.
Example 3:
the diamond carbon fiber composite material is formed by stacking self-supporting diamond films 1 and carbon fiber layers 2 which are sequentially and alternately arranged along the up-down direction, and the top layer and the bottom layer of the self-supporting diamond film are self-supporting diamond films 1; the self-supporting diamond film 1 is twenty layers in total and the carbon fiber layer 2 is nineteen layers in total, the length, width and thickness of the self-supporting diamond film 1 are 10 mm multiplied by 5mm multiplied by 0.3 mm, and the length, width and thickness of the carbon fiber layer 2 are 10 mm multiplied by 5mm multiplied by 0.1mm, as shown in fig. 7;
the specific preparation method of the diamond carbon fiber composite material comprises the following steps:
step 1: selecting a CVD self-supporting diamond film with the diameter of 20 mm, the thickness of 0.5 mm, the tensile strength of 500 MPa and the thermal conductivity of 2000W/(m.K), designing an array of 10 mm multiplied by 5mm by considering cutting loss, cutting by a laser cutting machine, wherein the laser power is 10W and the frequency is 8 Hz; then, carrying out thickness trimming and surface smoothing treatment on the self-supporting diamond film obtained by cutting by adopting a laser trimming machine, wherein the laser power is 850W when the thickness is trimmed, the trimming speed is 0.02 mu m/d along the thickness direction, the laser power is 350W when the surface is smoothed, and the evenness of the diamond surface is 0.05mm, the parallelism is 0.05mm and the roughness is 0.01mm after the trimming treatment, so as to obtain a self-supporting diamond film 1;
step 2: uniformly blending modified epoxy resin and absolute ethyl alcohol according to a ratio of 1:1, placing 12K carbon fiber bundles with the tensile strength of 4000 Mpa and the elastic modulus of 200 GPa in the solution for soaking for 1 minute, taking out, placing in the air for 10 minutes, then spreading and bonding between two layers of self-supporting diamond diaphragms 1, and alternately spreading carbon fibers soaked with the modified epoxy resin and the self-supporting diamond diaphragms 1 until the composite thickness reaches the requirement, and orthogonally spreading adjacent carbon fiber bundles to obtain a composite layer structure for improving the composite strength;
step 3: the clamping frame 4 with through holes is adopted to apply 5N clamping force to four side surfaces of the composite layer structure to flatten the side surfaces, and simultaneously a weight 5 with the mass of 1 Kg is placed on the surface of the self-supporting diamond diaphragm 1 at the uppermost layer, and the excessive resin in the carbon fiber and a small amount of bubbles dispersed in the resin are discharged by virtue of the normal static pressure of the weight 5; heating and curing the modified epoxy resin under the state of maintaining the side clamping and the upper surface layer to apply pressure, slowly heating to 200 ℃, and preserving heat for 3 hours;
step 4: removing the clamping frame 4 and the heavy object 5, polishing and ultrasonically cleaning four side surfaces of the composite layer structure, removing the side surface solidified modified epoxy resin and the end part of the carbon fiber leakage, polishing by adopting 320# to 800# SiC diamond abrasive paper, ultrasonically cleaning by adopting acetone for 15 minutes, and finally preparing the diamond carbon fiber composite material, as shown in figure 7.
The in-plane thermal conductivity of the diamond carbon fiber composite material prepared by the steps is about 1800W/(m.K), the tensile strength is about 1500 MPa, and the in-plane thermal conductivity is improved by 3 times compared with the tensile strength of diamond.
Example 4:
the diamond carbon fiber composite material consists of an upper layer of self-supporting diamond film 1, a lower layer of self-supporting diamond film 1 and a carbon fiber layer 2 arranged between the upper layer of self-supporting diamond film 1, wherein the length, the width and the thickness of the self-supporting diamond film 1 are 35 mm multiplied by 25 multiplied by mm multiplied by 0.8 mm, and the length, the width and the thickness of the carbon fiber layer 2 are 35 mm multiplied by 25 multiplied by mm multiplied by 0.3 mm; the carbon fiber layer 2 is a composite of carbon fiber-diamond micropowder 3-curing binder, the structure of the composite is carbon fiber reinforced curing binder, and the diamond micropowder 3 is dispersed in the composite, as shown in fig. 8.
The specific preparation method of the diamond carbon fiber composite material comprises the following steps:
step 1: a CVD self-supporting diamond film with the diameter of 65 mm, the thickness of 1mm, the tensile strength of 1000 MPa and the thermal conductivity of 800W/(m.K) is selected, an array of 35 mm multiplied by 25 mm is designed in consideration of cutting loss, a laser cutting machine is adopted for cutting, the laser power is 12W, and the frequency is 6 Hz; then, carrying out thickness trimming and surface smoothing treatment on the self-supporting diamond film by adopting a laser trimming machine, wherein the laser power during thickness trimming is 1000W, the trimming speed in the thickness direction is 0.02 mu m/d, the laser power during surface smoothing treatment is 450W, the surface flatness of the self-supporting diamond film after trimming treatment is 0.1mm, the parallelism is 0.1mm, and the roughness is 0.05mm, so as to obtain a self-supporting diamond film 1;
step 2: diamond micropowder 3 with the particle size of 10 mu m is selected, firstly, the diamond micropowder and the barium phenolic resin are blended according to the proportion of 1:5, and then the whole diamond micropowder and the barium phenolic resin are uniformly blended with absolute ethyl alcohol according to the proportion of 1:2;
step 3: placing 12K carbon fiber bundles with the tensile strength of 4500 MPa and the elastic modulus of 220 GPa in the solution for soaking for 5 minutes, taking out, placing in the air for 30 minutes, and then spreading and bonding between two layers of self-supporting diamond diaphragms 1 to obtain a composite layer structure;
step 4: the clamping frame 4 with through holes is adopted to apply clamping force of 5N to four side surfaces of the composite layer structure to flatten the composite layer structure, meanwhile, a weight 5 with the mass of 0.5 Kg is placed on the surface of the upper self-supporting diamond diaphragm 1, and residual resin in the carbon fiber and a small amount of bubbles dispersed in the resin are discharged by virtue of normal static pressure of the weight 5; heating and curing the barium phenolic resin under the state of maintaining the side clamping and the upper surface layer to exert pressure, slowly heating to 300 ℃, and preserving heat for 8 hours;
step 5: and removing the weight 5 and the clamping frame 4, polishing and ultrasonically cleaning four side surfaces of the composite layer structure, removing the end parts of the side surface solidified barium phenolic resin and the carbon fiber leakage, polishing by adopting 320# to 800# SiC diamond abrasive paper, ultrasonically cleaning by adopting acetone for 15 minutes, and finally preparing the diamond carbon fiber composite material, as shown in figure 8.
The in-plane thermal conductivity of the diamond carbon fiber composite material prepared by the steps is about 700W/(m.K), the normal thermal conductivity is about 550W/(m.K), the tensile strength is about 2200 MPa, and the in-plane thermal conductivity is improved by 2.2 times compared with the tensile strength of diamond.
Example 5:
the diamond carbon fiber composite material is formed by stacking self-supporting diamond films 1 and carbon fiber layers 2 which are sequentially and alternately arranged along the up-down direction, and the top layer and the bottom layer of the self-supporting diamond film are self-supporting diamond films 1; the self-supporting diamond film 1 has five layers in total, and the length, the width and the thickness of each layer of self-supporting diamond film 1 are 20 mm multiplied by 20 multiplied by mm multiplied by 0.6 mm; the carbon fiber layers 2 are four in total, and the length, the width and the thickness of each carbon fiber layer 2 are 20 mm multiplied by 20 multiplied by mm multiplied by 0.2 mm; the carbon fiber layer 2 is a composite of carbon fiber-diamond micropowder 3-curing binder, the structure of the composite is carbon fiber reinforced curing binder, and the diamond micropowder 3 is dispersed in the composite, as shown in fig. 9.
The specific preparation method of the diamond carbon fiber composite material comprises the following steps:
step 1: a CVD self-supporting diamond film with the diameter of 65 mm, the thickness of 0.8 mm, the tensile strength of 800 MPa and the thermal conductivity of 1200W/(m.K) is selected, an array of 20 mm multiplied by 20 mm is designed in consideration of cutting loss, a laser cutting machine is adopted for cutting, the laser power is 11W, and the frequency is 7 Hz; then, carrying out thickness trimming and surface smoothing treatment on the self-supporting diamond film by adopting a laser trimming machine, wherein the laser power during thickness trimming is 900W, the trimming speed in the thickness direction is 0.02 mu m/d, the laser power during surface smoothing treatment is 400W, the surface flatness of the self-supporting diamond film after trimming treatment is 0.08mm, the parallelism is 0.08mm, and the roughness is 0.03 mm, so as to obtain a self-supporting diamond film 1;
step 2: diamond micro powder 3 with the grain diameter of 2.5 mu m is selected, firstly, the diamond micro powder and the epoxy resin are prepared according to the proportion of 1:2, and then the whole diamond micro powder and the epoxy resin are uniformly prepared with absolute ethyl alcohol according to the proportion of 1:8;
step 3: placing 12K carbon fiber bundles with the tensile strength of 4000 MPa and the elastic modulus of 200 GPa into the solution for soaking for 3 minutes, taking out, placing in the air for 20 minutes, then spreading and bonding on the self-supporting diamond membrane 1, placing a layer of self-supporting diamond membrane 1 on the self-supporting diamond membrane, and alternately spreading the carbon fibers soaked with the adhesive and the self-supporting diamond membrane 1 until the composite thickness reaches the requirement, so that the adjacent carbon fiber bundles are orthogonally spread to obtain a composite layer structure for improving the composite strength;
step 4: the clamping frame 4 made of loose materials is adopted, the clamping force of 5N is applied to the four sides of the composite layer structure to enable the sides to be smooth, meanwhile, a weight 5 with the mass of 0.8 Kg is placed on the surface of the self-supporting diamond diaphragm 1 at the uppermost layer, and the excessive resin in the carbon fiber and a small amount of bubbles dispersed in the resin are discharged by virtue of the normal static pressure of the weight 5; heating and curing the epoxy resin under the state of maintaining the side clamping and the upper surface layer to exert pressure, slowly heating to 260 ℃, and preserving heat for 6 hours;
step 5: and removing the weight 5 and the clamping frame 4, polishing and ultrasonically cleaning four side surfaces of the composite layer structure, removing the side surface cured epoxy resin and the end part of the carbon fiber leakage, polishing by adopting 320# to 800# SiC diamond abrasive paper, ultrasonically cleaning by adopting acetone for 15 minutes, and finally preparing the diamond carbon fiber composite material, as shown in figure 9.
The in-plane thermal conductivity of the diamond carbon fiber composite material prepared by the steps is about 1100W/(m.K), the normal thermal conductivity is about 900W/(m.K), the tensile strength is about 1900 MPa, and the in-plane thermal conductivity is improved by 2.4 times compared with the tensile strength of diamond.
Example 6:
the diamond carbon fiber composite material is formed by stacking self-supporting diamond films 1 and carbon fiber layers 2 which are sequentially and alternately arranged along the up-down direction, and the top layer and the bottom layer of the self-supporting diamond film are self-supporting diamond films 1; the self-supporting diamond film 1 is formed by nine layers, and the length, the width and the thickness of each layer of self-supporting diamond film 1 are 15 mm multiplied by 10 mm multiplied by 0.4 mm; eight carbon fiber layers 2 are added, and the length, width and thickness of each carbon fiber layer 2 are 20 mm multiplied by 20 multiplied by mm multiplied by 0.1 mm; the carbon fiber layer 2 is a composite of carbon fiber-diamond micropowder 3-curing binder, the structure of the composite is carbon fiber reinforced curing binder, and the diamond micropowder 3 is dispersed in the composite, as shown in fig. 10.
The specific preparation method of the diamond carbon fiber composite material comprises the following steps:
step 1: selecting a CVD self-supporting diamond film with the diameter of 32 mm, the thickness of 0.6 mm, the tensile strength of 600 MPa and the thermal conductivity of 1800W/(m.K), designing an array of 15 mm multiplied by 10 mm in consideration of cutting loss, cutting by a laser cutting machine, wherein the laser power is 10W and the frequency is 8 Hz; then, a laser trimming machine is adopted to carry out thickness trimming and surface smoothing treatment on the diamond diaphragm, the laser power during thickness trimming is 850W, the trimming speed along the thickness direction is 0.02 mu m/d, the laser power during surface smoothing treatment is 350W, the evenness of the diamond surface after trimming treatment is 0.05mm, the parallelism is 0.05mm, and the roughness is 0.01mm, so that the self-supporting diamond diaphragm 1 is obtained;
step 2: diamond micro powder 3 with the grain diameter of 100 nm is selected, firstly, the diamond micro powder and the modified epoxy resin are prepared according to the proportion of 1:3, and then the whole diamond micro powder and the modified epoxy resin and the absolute ethyl alcohol are uniformly prepared according to the proportion of 1:10;
step 3: placing 12K carbon fiber bundles with the tensile strength of 3800 MPa and the elastic modulus of 190 GPa into the solution for soaking for 1 minute, taking out, placing in the air for 10 minutes, then spreading and bonding on the self-supporting diamond membrane 1, placing a layer of self-supporting diamond membrane 1 on the self-supporting diamond membrane, and alternately spreading the carbon fibers soaked with the adhesive and the self-supporting diamond membrane 1 until the composite thickness reaches the requirement, and spreading adjacent carbon fiber bundle layers in an orthogonal manner to obtain a composite layer structure for improving the composite strength;
step 4: the clamping frame 4 with through holes is adopted to apply 5N clamping force to four side surfaces of the composite layer structure to flatten the side surfaces, and simultaneously a weight 5 with the mass of 1 Kg is placed on the surface of the self-supporting diamond diaphragm 1 at the uppermost layer, and the excessive resin in the carbon fiber and a small amount of bubbles dispersed in the resin are discharged by virtue of the normal static pressure of the weight 5; heating and curing the modified epoxy resin under the state of maintaining the side clamping and the upper surface layer to apply pressure, slowly heating to 200 ℃, and preserving heat for 3 hours;
step 5: and removing the weight 5 and the clamping frame 4, polishing and ultrasonically cleaning four side surfaces of the composite layer structure, removing the side surface solidified modified epoxy resin and the end part of the carbon fiber leakage, polishing by adopting 320# to 800# SiC diamond abrasive paper, ultrasonically cleaning by adopting acetone for 15 minutes, and finally preparing the diamond carbon fiber composite material, as shown in figure 10.
The in-plane thermal conductivity of the diamond carbon fiber composite material prepared by the steps is about 1650W/(m.K), the normal thermal conductivity is about 1400W/(m.K), the tensile strength is about 1800 MPa, and the in-plane thermal conductivity is improved by about 3 times compared with the tensile strength of diamond.

Claims (7)

1. A diamond carbon fiber composite material, characterized in that: the self-supporting diamond film is formed by stacking self-supporting diamond films and carbon fiber layers which are sequentially and alternately arranged along the up-down direction, and the top layer and the bottom layer of the self-supporting diamond film are self-supporting diamond films; the carbon fiber layer is a carbon fiber-curing binder composite, and the structure of the composite is a carbon fiber reinforced curing binder;
the preparation method of the diamond carbon fiber composite material comprises the following steps:
step 1: selecting a self-supporting diamond film with proper diameter and thickness according to the size requirement of the diamond carbon fiber composite material on the self-supporting diamond film, cutting the self-supporting diamond film into a set shape by a laser cutting machine, and then performing thickness trimming and surface smoothing treatment on the self-supporting diamond film obtained by cutting by a laser trimming machine to obtain the self-supporting diamond film meeting the composite requirement;
step 2: uniformly blending the binder and absolute ethyl alcohol, soaking carbon fibers in a blending solution for 1-5 minutes, taking out, placing in the air for 10-30 minutes, then spreading and bonding the carbon fibers soaked with the binder on a self-supporting diamond film, placing a layer of self-supporting diamond film on a carbon fiber layer, and repeating the process of alternately spreading the carbon fibers soaked with the binder and the self-supporting diamond film until the composite thickness reaches the requirement to obtain a composite layer structure;
step 3: clamping the side surface of the composite layer structure through a clamping frame to ensure the flatness of the side surface, simultaneously placing a weight on the surface of the self-supporting diamond membrane on the top layer, discharging surplus binder in the carbon fiber layer and bubbles dispersed in the binder by virtue of normal static pressure of the weight, and heating and curing the binder under the state of maintaining the side surface clamping and the top layer to apply pressure;
step 4: and removing the weight and the clamping frame, polishing and ultrasonically cleaning the side surface of the composite layer structure, and finally obtaining the diamond carbon fiber composite material.
2. A diamond carbon fiber composite according to claim 1, wherein: in the step 2, the adhesive adopts barium phenolic resin, epoxy resin or modified epoxy resin, and the blending ratio of the adhesive to absolute ethyl alcohol is 1:1-1:5; in the step 3, the heating temperature for heating and curing is 200-300 ℃, and the temperature is kept for 3-8 hours.
3. A diamond carbon fiber composite material, characterized in that: the self-supporting diamond film is formed by stacking self-supporting diamond films and carbon fiber layers which are sequentially and alternately arranged along the up-down direction, and the top layer and the bottom layer of the self-supporting diamond film are self-supporting diamond films; the carbon fiber layer is a composite of carbon fiber-diamond micropowder-curing binder, the structure of the composite is carbon fiber-reinforced curing binder, and diamond micropowder is dispersed in the composite;
the preparation method of the diamond carbon fiber composite material comprises the following steps:
step 1: selecting a self-supporting diamond film with proper diameter and thickness according to the size requirement of the diamond carbon fiber composite material on the self-supporting diamond film, cutting the self-supporting diamond film into a set shape by a laser cutting machine, and then carrying out thickness trimming and surface smoothing treatment on the self-supporting diamond film by a laser trimming machine to obtain the self-supporting diamond film meeting the composite requirement;
step 2: mixing diamond micropowder, curing binder and absolute ethyl alcohol in proportion, and uniformly dispersing the diamond micropowder by adopting a stirrer;
step 3: soaking carbon fiber tows in a binder formulation containing diamond micro powder, taking out the carbon fiber tows, spreading and bonding the carbon fibers on a self-supporting diamond film, placing a layer of self-supporting diamond film on a carbon fiber layer, repeating the process of alternately spreading the carbon fibers impregnated with the binder and the self-supporting diamond film until the composite thickness reaches the requirement, and obtaining a composite layer structure;
step 4: clamping the side surface of the composite layer structure after the composition by a clamping frame to keep the flatness, simultaneously placing a weight on the surface of the self-supporting diamond film on the top layer, discharging the surplus binder in the carbon fiber layer and bubbles dispersed in the binder by virtue of the normal static pressure of the weight, and heating and curing the binder under the state of keeping the side surface clamping and the top layer to apply pressure;
step 5: and removing the weight and the clamping frame, polishing and ultrasonically cleaning the side surface of the composite layer structure, and finally obtaining the diamond carbon fiber composite material.
4. A diamond carbon fiber composite according to claim 3, wherein: the curing binder is a curing body of barium phenolic resin, epoxy resin and modified epoxy resin; the grain diameter of the diamond micropowder is 100 nm-10 mu m.
5. A diamond carbon fiber composite according to claim 3, wherein: in the step 2, when the diamond micro powder, the curing binder and the absolute ethyl alcohol are prepared, the proportion of the diamond micro powder to the curing binder is 1:1-1:5, and the proportion of the whole diamond micro powder to the absolute ethyl alcohol is 1:2-1:10; in the step 4, the heating temperature for heating and curing is 200-300 ℃, and the temperature is kept for 3-8 hours.
6. A diamond carbon fiber composite according to claim 1 or 3, wherein: the self-supporting diamond diaphragm is prepared by adopting a CVD method, and has the thermal conductivity of more than or equal to 600W/(m.K), the flatness of less than or equal to 0.1mm, the parallelism of less than or equal to 0.1mm and the roughness Ra of less than or equal to 0.05 mm; the thickness of the self-supporting diamond diaphragm is 0.3 mm-1 mm, and the thickness of the carbon fiber layer is 0.1 mm-0.3 mm.
7. A diamond carbon fiber composite according to claim 1 or 3, wherein: the clamping frame is made of loose materials or is provided with a through hole for discharging the binder.
CN202210458098.XA 2022-04-28 2022-04-28 Diamond carbon fiber composite material and preparation method thereof Active CN114771042B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210458098.XA CN114771042B (en) 2022-04-28 2022-04-28 Diamond carbon fiber composite material and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210458098.XA CN114771042B (en) 2022-04-28 2022-04-28 Diamond carbon fiber composite material and preparation method thereof

Publications (2)

Publication Number Publication Date
CN114771042A CN114771042A (en) 2022-07-22
CN114771042B true CN114771042B (en) 2024-01-16

Family

ID=82433774

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210458098.XA Active CN114771042B (en) 2022-04-28 2022-04-28 Diamond carbon fiber composite material and preparation method thereof

Country Status (1)

Country Link
CN (1) CN114771042B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0400655A1 (en) * 1989-06-01 1990-12-05 Seiko Instruments Inc. Optical window piece
US5277975A (en) * 1987-03-30 1994-01-11 Crystallume High thermal-conductivity diamond-coated fiber articles
CN102909905A (en) * 2012-10-24 2013-02-06 中国航空工业集团公司北京航空材料研究院 Composite thermally-conductive thin layer and preparation method and application thereof
CN105818476A (en) * 2016-03-21 2016-08-03 中南大学 Surface-modification three-dimensional-network-carbon-fiber-reinforced composite material and preparing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5277975A (en) * 1987-03-30 1994-01-11 Crystallume High thermal-conductivity diamond-coated fiber articles
EP0400655A1 (en) * 1989-06-01 1990-12-05 Seiko Instruments Inc. Optical window piece
CN102909905A (en) * 2012-10-24 2013-02-06 中国航空工业集团公司北京航空材料研究院 Composite thermally-conductive thin layer and preparation method and application thereof
CN105818476A (en) * 2016-03-21 2016-08-03 中南大学 Surface-modification three-dimensional-network-carbon-fiber-reinforced composite material and preparing method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
低成本金刚石/铝复合材料的研究;刘永正;;材料导报(04);全文 *

Also Published As

Publication number Publication date
CN114771042A (en) 2022-07-22

Similar Documents

Publication Publication Date Title
CN105378914B (en) Heat conductive sheet
KR101007621B1 (en) Metal-based composite material containing both micron-size carbon fiber and nano-size carbon fiber
JP5759152B2 (en) Aluminum-diamond composite and method for producing the same
TWI513592B (en) Anisotropic thermal conduction element and manufacturing method
JP5988977B2 (en) Heat dissipation parts for semiconductor elements
JPWO2010007922A1 (en) Aluminum-diamond composite and method for producing the same
JP2002088171A (en) Heat-conductive sheet and method for producing the same and heat radiation device
JPWO2017158993A1 (en) Aluminum-diamond composite and heat dissipation parts
CN108407425A (en) A kind of graphene-carbon nano tube fiber base heat-conducting pad and preparation method thereof
TW201536907A (en) Thermally conductive composite material, and manufacturing method therefor
WO2008079594A2 (en) Dimensionally stable, leak-free graphite substrate
CN109791918B (en) Heat radiation structure of circuit device
JP2012158783A (en) Aluminum-diamond composite, and method for production thereof
CN104553105B (en) A kind of heat-conducting type polymer matrix composite and preparation method thereof
JP2023181341A (en) thermal conductive sheet
JP6621736B2 (en) Aluminum-diamond composite and heat dissipation component using the same
CN114771042B (en) Diamond carbon fiber composite material and preparation method thereof
CN114771043B (en) High-bonding-strength diamond carbon fiber composite material and preparation method thereof
CN113415060A (en) Oriented high-thermal-conductivity thermal interface heat conduction material and application thereof
CN114771041B (en) Preparation method of diamond carbon fiber multi-layer woven composite material
CN109265919B (en) 3D heat-conducting composite material and preparation method thereof
KR20120078270A (en) Susceptor using low thermal expansion composite materials and method for manufacturing esc component
CN114834105B (en) High-thermal conductivity diamond carbon fiber composite material and preparation method thereof
JPH09129793A (en) Heat conductive plate for semiconductor package
CN113084176B (en) Self-supporting diamond film/Cu composite heat sink material and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant