CN114759332B - Transmission line and electronic equipment - Google Patents
Transmission line and electronic equipment Download PDFInfo
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- CN114759332B CN114759332B CN202210349903.5A CN202210349903A CN114759332B CN 114759332 B CN114759332 B CN 114759332B CN 202210349903 A CN202210349903 A CN 202210349903A CN 114759332 B CN114759332 B CN 114759332B
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 82
- 239000010410 layer Substances 0.000 claims description 159
- 239000011247 coating layer Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 abstract description 19
- 238000001125 extrusion Methods 0.000 abstract description 2
- 230000008054 signal transmission Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 241001391944 Commicarpus scandens Species 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 241001024304 Mino Species 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
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Abstract
The embodiment of the invention provides a transmission line and electronic equipment, wherein the transmission line comprises: the first dielectric layer is provided with a first signal line and a ground plane, the ground plane is arranged on two sides of the first signal line, at least one second dielectric layer is provided with a second signal line, the first dielectric layer and the second dielectric layer are flexible dielectric layers, an air layer is arranged between the first dielectric layer and the second dielectric layer, the first signal line is used for transmitting radio frequency signals, the second signal line is used for transmitting digital signals, the simultaneous transmission of the radio frequency signals and the digital signals can be met, the air layer is arranged between the first dielectric layers of the second signal line, the stress generated by mutual extrusion between the first dielectric layer and the second dielectric layer is reduced, the bending of the transmission line is facilitated, the ground plane on the first dielectric layer can be used as a reference ground, the ground plane is not required to be arranged on the second dielectric layer, and the bending performance of the transmission line can be improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of signal transmission, in particular to a transmission line and electronic equipment.
Background
Antennas are widely used as main carriers for wireless communication in various intelligent devices, such as 5G, sub-6G Mino (multiple-in multipleout) antennas, on the other hand, intelligent devices are continuously pursuing the appearance and form of "light", "thin", "portable", wherein the light and thin portable folding devices are more and more favored by consumers, the Mino antennas like 5G, sub-6G are multi-antenna systems, the antennas are non-foldable, in order to avoid mutual interference of multiple same frequencies or similar frequencies and adapt to the space of the folding devices, a designer generally arranges multiple antennas on the planes of two sides in the folding devices, and a flexible transmission line is adopted in the middle folding region for radio frequency signal transmission between the antennas.
In the existing scheme, a shielding film is used as a flexible transmission line of a reference ground to realize radio frequency signal transmission, a digital signal is used as a main signal of an antenna for controlling antenna matching and working state, the transmission line is required to transmit the digital signal, and for a multi-antenna system, more digital signals are possibly required to be transmitted.
Disclosure of Invention
The embodiment of the invention provides a transmission line and electronic equipment, which are used for solving the problem that the transmission line in the prior art cannot meet the requirement of simultaneous transmission of radio frequency signals and digital signals and is easy to break under high bending times.
In a first aspect, an embodiment of the present invention provides a transmission line, including:
The first dielectric layer is provided with a first signal wire and a grounding surface, and the grounding surface is arranged on two sides of the first signal wire;
At least one second dielectric layer, wherein a second signal line is arranged on the second dielectric layer;
the first medium layer and the second medium layer are flexible medium layers, and an air layer is arranged between the first medium layer and the second medium layer;
The first signal line is used for transmitting radio frequency signals, the second signal line is used for transmitting digital signals, and the second signal line takes the grounding surface on the first dielectric layer as a reference ground.
Optionally, the number of the second signal lines is more than one.
Optionally, the first signal line is a coplanar waveguide signal line.
Optionally, the number of the coplanar waveguide signal lines is more than one.
Optionally, if the number of the coplanar waveguide signal lines is greater than 1, the coplanar waveguide signal lines are spaced from the ground plane.
Optionally, the absolute value of the difference in the number of the second dielectric layers disposed on two sides of the first dielectric layer is less than or equal to 1.
Optionally, the second signal line on the second dielectric layer is oriented in a direction consistent with the first signal line on the first dielectric layer.
Optionally, the second signal line on the second dielectric layer is disposed on a side of the second dielectric layer facing the first dielectric layer.
Optionally, a film layer is disposed on a side, provided with the first signal line, of the first dielectric layer, and a film layer is disposed on a side, provided with the second signal line, of the second dielectric layer.
In a second aspect, an embodiment of the present invention further provides an electronic device, including a motherboard, an antenna, and a transmission line according to the first aspect, where the antenna is electrically connected to the motherboard through the transmission line.
Compared with the prior art, the transmission line provided by the embodiment of the invention has the beneficial effects that:
Through setting up the air bed between first dielectric layer and the second dielectric layer for there is the space rather than laminating between first dielectric layer and the second dielectric layer, when two-layer dielectric layer was folded, reduced the stress that produces when extrudeing each other between first dielectric layer and the second dielectric layer by a wide margin, promoted the bending property of transmission line, also reduced the transmission line loss of the region of buckling when the transmission line is folding, can realize the demand of high bending number.
And the transmission line at least comprises a second medium layer, a second signal line is arranged on the second medium layer, the first signal line is used for transmitting radio frequency signals, the second signal line is used for transmitting digital signals, the number of the second medium layer can be determined according to the number of the digital signals, and the simultaneous transmission of the radio frequency signals and the digital signals is met.
Moreover, the material of the grounding surface is generally copper, which has a certain hardness and is not beneficial to bending of the dielectric layers, if the grounding surface is arranged on each dielectric layer, the transmission line is easy to break under the condition of high folding times, and the second signal line can take the grounding surface on the first dielectric layer as the reference ground without arranging the grounding surface on the second dielectric layer, so that the transmission line can be more suitable for the requirement of high bending performance, the design of a control circuit is simplified, and the production cost is saved.
Drawings
Fig. 1 is a side sectional view of a transmission line according to a first embodiment of the present invention;
fig. 2 is a top view of a first signal line and a ground plane on a first dielectric layer according to a first embodiment of the present invention;
Fig. 3 is a side cross-sectional view of a transmission line with three dielectric layers according to a first embodiment of the present invention;
Fig. 4 is a diagram showing a positional relationship between a first signal line and a ground plane according to a first embodiment of the present invention;
Fig. 5 is a schematic structural diagram of an electronic device according to a second embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
Example 1
Fig. 1 is a side sectional view of a transmission line according to a first embodiment of the present invention, as shown in fig. 1, the transmission line in this embodiment includes a first dielectric layer 10 and a second dielectric layer 20, the first dielectric layer 10 is provided with a first signal line 11 and ground planes 12 disposed on two sides of the first signal line 11, the second dielectric layer 20 is provided with a second signal line 21, and an air layer 30 is disposed between the first dielectric layer 10 and the second dielectric layer 20.
Fig. 2 is a top view of a first signal line 11 and a ground plane 12 on a first dielectric layer 10 according to an embodiment of the present invention, and as shown in fig. 2, the ground planes 12 are disposed on two sides of the first signal line 11.
The first dielectric layer 10 and the second dielectric layer 20 are commonly called as base materials or copper-clad plates, are substrate materials in manufacturing of the transmission line and play roles of interconnection conduction, insulation and support of transmission line components, wherein the first dielectric layer 10 and the second dielectric layer 20 are flexible dielectric layers, are substrate based on FPC (Flexible Printed Circuit board), namely PCB (Printed Circuit Board) made of flexible material which can be folded and bent, have the characteristics of excellent flexibility and flexible application, the shape of the dielectric layers can be changed along with the change of the state of the transmission line, namely, when the transmission line is changed from a flat state to a bent state, the first dielectric layer 10 and the second dielectric layer 20 can be extruded to the bent state, and when the transmission line is converted from the bent state to the flat state, for example, the first dielectric layer 10 and the second dielectric layer 20 can be flexible copper-clad plates with high performance, so that the first dielectric layer 10 and the second dielectric layer 20 can be applied to the transmission line of folding equipment.
The first signal line 11 is used for transmitting radio frequency signals, which are modulated electric waves with a certain transmitting frequency, and in general, the radio frequency signals are a generic term of electromagnetic waves with oscillating frequencies between 3KHz and 300GHz, and the radio frequency signals have high electromagnetic wave energy, strong penetrating power, higher bandwidth and can carry more information, so that the radio frequency signals are widely applied to radars and wireless communication.
The second signal line 21 is used for transmitting digital signals, wherein the independent variable is discrete, and the dependent variable is also discrete, and the digital signals have particularly strong anti-interference capability. For example, in this embodiment, the digital signal may be a signal for controlling the operation state of the antenna, and may also be a signal for controlling and matching the resonant frequency of the antenna.
The ground plane 12 in this embodiment provides a signal return path for the radio frequency signal in the first signal line 11, and the ground plane 12 is disposed on two sides of the first signal line 11, and since the first signal line 11 and the ground plane 12 are in the same plane, no via hole is required to be disposed on the first dielectric layer 10, and the manufacturing process is simple.
In addition, the frequency spectrum component of the radio frequency signal contains high frequency components, the corresponding wavelength is short, the signal on a relatively long transmission line needs to consider the fluctuation, namely impedance matching is required, when the signal is transmitted, the load impedance is required to be equal to the characteristic impedance of the transmission line, and the energy loss in the transmission is avoided. In this embodiment, the ground plane 12 is disposed on two sides of the first signal line 11 and is in the same plane as the first signal line 11 and is located on the first dielectric layer 10, and in a case that the width of the first signal line 11 is constant, reasonable impedance matching can be effectively achieved by adjusting the distance between the first signal line 11 and the ground plane 12, and in this embodiment, the distance between the ground plane 12 and the first signal line 11 can be designed according to actual requirements, and generally, the first signal line 11 can be a differential line or a coplanar waveguide line.
In one example of the present embodiment, the first signal line 11 is a coplanar waveguide signal line. In the prior art, a shielding film is used as a flexible transmission line of a reference ground to realize radio frequency signal transmission, different parasitic inductances can be generated due to certain roughness of the surface of the shielding film, so that the impedance of the surface of a conductor is changed, on the other hand, the dielectric layer of the transmission line is usually thinner for meeting the bending performance, the transmission line is easy to have larger insertion loss in a high-frequency band due to the reasons, and the coplanar waveguide has a firm grounding structure and lower loss in the high-frequency band, so that potential advantages and stability are provided for high-frequency signal transmission.
In addition, the second signal line 21 uses the ground plane 12 on the first dielectric layer 10 as the reference ground, the second signal line 21 transmits a low-speed digital signal, and the reference ground is not required to be strictly designed like a high-frequency signal, and only a ground loop is required to be used as the reference of the high-low level, so that the second signal line 21 of the embodiment can use the ground plane 12 on the first dielectric layer 10 as the reference ground, and no additional reference ground is required to be laid on the second dielectric layer 20. The ground plane 12 is generally indirectly connected to the first signal line 11 and the second signal line 21 through other circuits such as a diode and a triode in the circuit, that is, a ground loop is formed. In addition, as shown in fig. 1, the second signal line 21 is generally not disposed directly above the first signal line 11, but disposed at a position where there is no overlap in the vertical space, because the metal material of the second signal line 21 may interfere with the impedance of the first signal line 11, thereby affecting the uniformity of the impedance of the first signal line 11.
The materials of the first signal line 11, the second signal line 21 and the ground plane 12 are generally copper, which is laid on each dielectric layer, but in the design of the flexible circuit board, the hardness of copper is unfavorable for bending the dielectric layers, if the ground plane (copper) is disposed on each dielectric layer, the copper on the dielectric layer is easy to break under the condition of high folding times of the transmission line, therefore, in this embodiment, besides the first dielectric layer 10, the ground plane 12 is required to be laid, the second dielectric layer 20 is not laid any more, and the following advantages are: the hardness of the second dielectric layer 20 can be prevented from being increased, the bending performance of the second dielectric layer 20 is improved, the bending performance of the transmission line is further improved, the design of a control circuit is simplified, and meanwhile production cost is saved.
The air layer 30 is further arranged between the first dielectric layer 10 and the second dielectric layer 20, so that a gap is reserved between the first dielectric layer 10 and the second dielectric layer 20 instead of being attached to each other, when the transmission line is in a bending state, the first dielectric layer 10 and the second dielectric layer 20 are also extruded to be in a bending state, if the air layer 30 does not exist, stress is generated due to mutual extrusion and friction between the first dielectric layer 10 and the second dielectric layer 20, bending of the transmission line is not facilitated, signal lines on the dielectric layers are worn, and the air layer 30 is not suitable for use of high bending times of the transmission line, therefore, the stress that the first dielectric layer 10 and the second dielectric layer 20 are mutually extruded when the transmission line is bent can be greatly reduced, the transmission performance reduction or failure caused by abrasion of transmission line materials in bending areas when the transmission line is folded can be avoided, and the requirement of high bending times can be met.
The dielectric constants of air are different from those of the first dielectric layer 10 and the second dielectric layer 20, and the electric field is mainly concentrated in the two dielectric layers, so that signal transmission is not affected.
In an alternative embodiment of the present invention, the number of second signal lines 21 is more than one on each second dielectric layer 20. As the number of the resonant frequencies is increased, the transmission line is required to transmit more types of digital signals, in this embodiment, the digital signals of the digital control circuit are transmitted through the second signal lines 21, and when the types of the digital signals are increased but the number of the digital signals is smaller, the number of the second signal lines 21 can be correspondingly increased, for example, a plurality of second signal lines 21 are arranged on the same second dielectric layer 20, each second signal line 21 is used for transmitting different types of digital signals, and the number of layers of the dielectric layer is not required to be additionally increased while the requirement of small increase of the types of the digital signals is met.
In an alternative embodiment of the present invention, when multiple digital signals need to be transmitted, the number of layers of the second dielectric layer 20 may be set to be more than two, as shown in fig. 3, which is a side sectional view of a transmission line with three dielectric layers in this embodiment, where the transmission line includes two second dielectric layers 20, and in contrast to the transmission line with two dielectric layers shown in fig. 1, in fig. 3, the newly added second dielectric layer 20 may be set on the other side of the first dielectric layer 10, and the orientation of the second signal line 21 on the second dielectric layer 20 is consistent with the orientation of the first signal line 11 on the first dielectric layer 10, so that the layout of the whole transmission line is regular and uniform, and the production and the manufacturing are convenient. When the second dielectric layer 20 is increased, more second signal lines 21 can be arranged on the second dielectric layer 20 to meet the requirements of more digital signals and types, and meanwhile, the second dielectric layers 20 are arranged on two sides of the first dielectric layer 10, so that reflection of surrounding metal on radio frequency signals transmitted by the first signal lines 11 on the first dielectric layer 10 can be reduced, and the transmission quality of the radio frequency signals and the working efficiency of the antenna are improved. It should be noted that the number of the second signal lines 21 disposed on each second dielectric layer 20 is not necessarily the same, and in addition, in order to increase the bending performance of the transmission line and meet the requirements of increasing the number and types of digital signals, the number of layers of the second dielectric layers 20 may be 2-4.
Because the second signal line 21 on the second dielectric layer 20 needs to use the ground plane 12 on the first dielectric layer 10 as the reference ground, the further the second signal line 21 is away from the first dielectric layer 10, the more dielectric layers are spaced in the middle, which means that for the greater number of dielectric layer vias and longer wire connection, one via can bring about a distributed capacitance of about 0.5pF, the reduction of the number of vias can significantly increase the speed and reduce the possibility of data errors, the radiation intensity of the signal is proportional to the trace length of the signal line, and the longer the radio frequency signal lead is, the easier it is to couple to the components close to it, so the shorter the trace is required for high frequency signal lines such as clocks, crystal oscillators and the like of the signal.
In an alternative embodiment of the present invention, the absolute value of the difference between the numbers of the second dielectric layers 20 disposed on two sides of the first dielectric layer 10 is less than or equal to 1, that is, if the number of the second dielectric layers 20 is even, the number of the second dielectric layers 20 disposed on two sides of the first signal line 11 of the first dielectric layer 10 is the same, and if the number of the second dielectric layers 20 is odd, the difference between the numbers of the second dielectric layers 20 disposed on two sides of the first signal line 11 of the first dielectric layer 10 is 1, so that the number of the second dielectric layers 20 on two sides of the first dielectric layer 10 is the same or similar, that is, the distance from the second signal line 21 on each second dielectric layer 20 to the first dielectric layer 10 is the shortest, the number of holes for the dielectric layers is reduced, the wire connection is shortened, the speed is increased, the possibility of data error is reduced, and the signal coupling is reduced.
In an example of this embodiment, since the second signal line 21 on the second dielectric layer 20 is relatively far from the ground plane 12 on the first dielectric layer 10, the lead is long, and noise may be generated due to signal coupling, and a decoupling capacitor may be disposed at the output end of the second signal line 21 to remove the noise, thereby improving the quality of the transmission signal.
In an alternative embodiment of the present invention, the second signal line 21 on the second dielectric layer 20 is disposed on the side of the second dielectric layer 20 facing the first dielectric layer 10, as in the previous embodiment, the further the second signal line 21 is from the first dielectric layer 10, which means that the more complicated the circuit connection is possible, in this embodiment, the improvement is made, by disposing the second signal line 21 on the second dielectric layer 20 on the side of the second dielectric layer 20 facing the first dielectric layer 10, so as to shorten the distance from the second signal line 21 to the first dielectric layer 10, that is, the connection line from the second signal line 21 to the ground plane 12 on the first dielectric layer 10 can be reduced, and the complexity of the line can be further reduced.
In an alternative embodiment of the present invention, the first signal line 11 is a coplanar waveguide signal line, and the number of coplanar waveguide lines is more than one. Not only the digital signals are of various types, but also the radio frequency signals of the antennas such as mobile phones and radios can have multiple frequency bands, for example, in order to be able to spread different television signals in the air, the video has to be modulated from the television signals into radio frequency signals, each signal occupies a channel, so that multiple television programs can be spread in the air at the same time without causing confusion, in order to adapt to the requirement of more receiving and transmitting frequency bands of the antennas, in this embodiment, the number of the first signal lines 11 can be more than 1, and when the number of the first signal lines 11 is more than 1, the first signal lines 11 are spaced from the ground plane 12, and in particular, as shown in fig. 4, the position relationship diagram of the first signal lines 11 and the ground plane 12 when the number of the first signal lines 11 is more than 1 is shown in fig. 4. For two adjacent first signal lines 11, the two first signal lines will share the sandwiched ground plane 12, and for each first signal line 11, the distance between the two first signal lines and the ground planes 12 on two sides can be set according to actual requirements, and the number and shape of the first signal lines 11 and the ground planes 12 can be designed according to actual frequency band requirements, the type of equipment where the transmission line is located, and the like.
In an alternative embodiment of the present invention, the side of the first dielectric layer 10 where the first signal line 11 is provided with a coating layer, and the side of the second dielectric layer 20 where the second signal line 21 is provided with a coating layer. The function of the coating layer is to protect the first signal line 11 and the second signal line 21, has the characteristics of dust prevention, dirt prevention and static electricity prevention, can also protect the circuit from being exposed in the air, avoid the oxidation and corrosion of the circuit, and can reduce the loss in the signal transmission process.
The transmission line of the embodiment of the invention is applied to folding equipment as follows: the transmission line can be arranged in a bending area of the folding equipment, the control circuit of the folding equipment generates digital signals, the digital signals are transmitted to the antenna through the transmission line so as to regulate the working state of the antenna, the control circuit also transmits the modulated radio frequency signals to the antenna through the transmission line and transmits the modulated radio frequency signals to the outside through the antenna in the form of electromagnetic waves, and on the other hand, the antenna receives the electromagnetic waves from the outside and converts the electromagnetic waves into radio frequency signals, and the radio frequency signals are transmitted to the control circuit through the transmission line so as to amplify, select frequencies, demodulate and the like. The folding equipment can be a folding screen mobile phone, a flat plate, intelligent glasses and the like.
Example two
Fig. 5 is a schematic diagram of an electronic device according to a second embodiment of the present invention, where the electronic device includes a main board 3, an antenna 2, and a transmission line 1 according to the first embodiment, the antenna 2 is electrically connected to the main board 3 through the transmission line 1, and the transmission line 1 passes through a folding area of the electronic device. The main board 3 is used for generating digital signals and modulating radio frequency signals, and the transmission line 1 is used for transmitting the digital signals and the radio frequency signals to the antenna 2 so as to control the antenna 2 to transmit and receive signals.
The electronic equipment provided by the embodiment of the invention can transmit signals through the transmission line provided by the first embodiment of the invention, and has the functional modules and beneficial effects corresponding to the transmission line shown in the embodiment.
It should be noted that, in the above-mentioned embodiment of the transmission line, each unit and module included are only divided according to the functional logic, but not limited to the above-mentioned division, so long as the corresponding functions can be implemented; in addition, the specific names of the functional units are also only for distinguishing from each other, and are not used to limit the protection scope of the present invention.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, and various modifications and variations may be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A transmission line, comprising:
The first dielectric layer is provided with a first signal wire and a grounding surface, and the grounding surface is arranged on two sides of the first signal wire;
the second dielectric layer is provided with a second signal wire, and the second signal wire and the first signal wire are not overlapped in vertical space;
the first medium layer and the second medium layer are flexible medium layers, and an air layer is arranged between the first medium layer and the second medium layer;
The first signal line is used for transmitting radio frequency signals, the second signal line is used for transmitting digital signals, and the second signal line takes the grounding surface on the first dielectric layer as a reference ground.
2. The transmission line according to claim 1, wherein the number of the second signal lines is more than one.
3. The transmission line of claim 1, wherein the first signal line is a coplanar waveguide signal line.
4. A transmission line according to claim 3, wherein the number of coplanar waveguide signal lines is more than one.
5. The transmission line of claim 4, wherein if the number of coplanar waveguide signal lines is greater than 1, the coplanar waveguide signal lines are spaced apart from the ground plane.
6. The transmission line according to claim 1, wherein an absolute value of a difference in the number of the second dielectric layers disposed on both sides of the first dielectric layer is 1 or less.
7. The transmission line of claim 6, wherein the second signal line on the second dielectric layer is oriented in line with the first signal line on the first dielectric layer.
8. The transmission line of claim 6, wherein the second signal line on the second dielectric layer is disposed on a side of the second dielectric layer facing the first dielectric layer.
9. The transmission line according to any one of claims 1 to 8, wherein a side of the first dielectric layer on which the first signal line is provided with a coating layer, and a side of the second dielectric layer on which the second signal line is provided with a coating layer.
10. An electronic device comprising a motherboard, an antenna, and the transmission line of any one of claims 1-9, the antenna being electrically connected to the motherboard via the transmission line.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210349903.5A CN114759332B (en) | 2022-04-02 | 2022-04-02 | Transmission line and electronic equipment |
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| CN202210349903.5A CN114759332B (en) | 2022-04-02 | 2022-04-02 | Transmission line and electronic equipment |
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| CN114759332A CN114759332A (en) | 2022-07-15 |
| CN114759332B true CN114759332B (en) | 2024-05-17 |
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| CN115275552B (en) * | 2022-07-27 | 2023-10-03 | 中国科学院半导体研究所 | Four-channel radio frequency signal transmission device and system |
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| CN211457494U (en) * | 2019-08-20 | 2020-09-08 | 华为机器有限公司 | Flexible circuit board |
| CN112071194A (en) * | 2020-09-07 | 2020-12-11 | 武汉华星光电半导体显示技术有限公司 | Display device and electronic apparatus |
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| CN106537684B (en) * | 2015-04-09 | 2019-11-01 | 株式会社村田制作所 | Multiplexing of transmission route and electronic equipment |
| US10347967B2 (en) * | 2016-01-26 | 2019-07-09 | Qualcomm Incorporated | Signal delivery and antenna layout using flexible printed circuit board (PCB) |
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| WO2016186447A1 (en) * | 2015-05-18 | 2016-11-24 | (주)기가레인 | Antenna-integrated flexible circuit board |
| CN211457494U (en) * | 2019-08-20 | 2020-09-08 | 华为机器有限公司 | Flexible circuit board |
| CN112071194A (en) * | 2020-09-07 | 2020-12-11 | 武汉华星光电半导体显示技术有限公司 | Display device and electronic apparatus |
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| CN114759332A (en) | 2022-07-15 |
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