CN114759332A - Transmission line and electronic equipment - Google Patents

Transmission line and electronic equipment Download PDF

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Publication number
CN114759332A
CN114759332A CN202210349903.5A CN202210349903A CN114759332A CN 114759332 A CN114759332 A CN 114759332A CN 202210349903 A CN202210349903 A CN 202210349903A CN 114759332 A CN114759332 A CN 114759332A
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CN
China
Prior art keywords
dielectric layer
signal line
transmission line
signal
line
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Pending
Application number
CN202210349903.5A
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Chinese (zh)
Inventor
齐伟
杨丰标
潘丽
王玲
刘红梅
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AKM Electronics Industrial (PanYu) Ltd
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AKM Electronics Industrial (PanYu) Ltd
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Priority to CN202210349903.5A priority Critical patent/CN114759332A/en
Publication of CN114759332A publication Critical patent/CN114759332A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines

Abstract

An embodiment of the present invention provides a transmission line and an electronic device, where the transmission line includes: a first dielectric layer, a first signal line and a ground plane arranged on the first dielectric layer, at least one second dielectric layer arranged on the ground plane and on both sides of the first signal line, wherein the first dielectric layer and the second dielectric layer are flexible dielectric layers, an air layer is arranged between the first dielectric layer and the second dielectric layer, the first signal line is used for transmitting radio frequency signals, the second signal line is used for transmitting digital signals, the second signal line can meet the requirement of simultaneous transmission of radio frequency signals and digital signals, an air layer is arranged between the first dielectric layers, the stress generated by mutual extrusion between the first dielectric layers and the second dielectric layers is reduced, the bending of the transmission line is facilitated, the ground plane on the first dielectric layers can be used as a reference ground for the second signal line, the ground plane does not need to be arranged on the second dielectric layers, and the bending performance of the transmission line can be improved.

Description

Transmission line and electronic equipment
Technical Field
The embodiment of the invention relates to the technical field of signal transmission, in particular to a transmission line and electronic equipment.
Background
As a main carrier of wireless communication, antennas are widely used in various smart devices, such as a mini (multiple-in multiple out) antenna of 5G, sub-6G, and on the other hand, smart devices are also continuously pursuing "light", "thin", "portable" appearance and form, wherein a thin and portable folding device is increasingly favored by consumers, while a mini antenna like 5G, sub-6G is a multi-antenna system, and the antenna is not foldable, so as to avoid mutual interference of multiple same or similar frequencies and space adaptation of the folding device, designers usually dispose multiple antennas on two side planes of the folding device, and use a flexible transmission line in the middle folding area for radio frequency signal transmission between the antennas.
In the existing scheme, a shielding film is used as a flexible transmission line of a reference ground to realize radio frequency signal transmission, and digital signals are used as main signals of an antenna for controlling antenna matching and working states and also need to be transmitted by a transmission line.
Disclosure of Invention
The embodiment of the invention provides a transmission line and electronic equipment, and aims to solve the problems that the transmission line in the existing scheme cannot meet the requirements of simultaneous transmission of radio frequency signals and digital signals and is easy to break under high bending times.
In a first aspect, an embodiment of the present invention provides a transmission line, including:
the antenna comprises a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first dielectric layer is provided with a first signal line and a ground plane, and the ground plane is arranged on two sides of the first signal line;
the second signal line is arranged on the second dielectric layer;
the first dielectric layer and the second dielectric layer are flexible dielectric layers, and an air layer is arranged between the first dielectric layer and the second dielectric layer;
the first signal line is used for transmitting radio frequency signals, the second signal line is used for transmitting digital signals, and the second signal line takes the ground plane on the first medium layer as a reference ground.
Optionally, the number of the second signal lines is more than one.
Optionally, the first signal line is a coplanar waveguide signal line.
Optionally, the number of the coplanar waveguide signal lines is more than one.
Optionally, if the number of the coplanar waveguide signal lines is greater than 1, the coplanar waveguide signal lines and the ground plane are spaced apart from each other.
Optionally, an absolute value of a difference between the numbers of the second dielectric layers disposed on both sides of the first dielectric layer is less than or equal to 1.
Optionally, an orientation of the second signal line on the second dielectric layer is the same as an orientation of the first signal line on the first dielectric layer.
Optionally, the second signal line on the second dielectric layer is disposed on a side of the second dielectric layer facing the first dielectric layer.
Optionally, a film layer is disposed on one side of the first dielectric layer, where the first signal line is disposed, and a film layer is disposed on one side of the second dielectric layer, where the second signal line is disposed.
In a second aspect, an embodiment of the present invention further provides an electronic device, including a motherboard, an antenna, and the transmission line according to the first aspect, where the antenna is electrically connected to the motherboard through the transmission line.
Compared with the prior art, the transmission line provided by the embodiment of the invention has the beneficial effects that:
the air layer is arranged between the first medium layer and the second medium layer, so that a gap is formed between the first medium layer and the second medium layer instead of the gap, when the two medium layers are folded, the stress generated when the first medium layer and the second medium layer are mutually extruded is greatly reduced, the bending performance of the transmission line is improved, the transmission line loss of a bending area when the transmission line is folded is also reduced, and the requirement of high bending times can be met.
Secondly, the transmission line at least comprises a second dielectric layer, a second signal line is arranged on the second dielectric layer, the first signal line is used for transmitting radio-frequency signals, the second signal line is used for transmitting digital signals, and the number of the second dielectric layers can be determined according to the number of the digital signals, so that the radio-frequency signals and the digital signals can be transmitted simultaneously.
Furthermore, the grounding surface is made of copper generally, has certain hardness and is not beneficial to bending of the dielectric layers, if the grounding surface is arranged on each dielectric layer, the transmission line is easy to break under high folding times, and the second signal line can use the grounding surface on the first dielectric layer as a reference ground without arranging the grounding surface on the second dielectric layer, so that the transmission line can meet the requirement of high bending performance, the design of a control circuit is simplified, and the production cost is saved.
Drawings
Fig. 1 is a side sectional view of a transmission line according to an embodiment of the invention;
fig. 2 is a top view of a first signal line and a ground plane on a first dielectric layer according to a first embodiment of the present invention;
FIG. 3 is a side sectional view of a transmission line with three dielectric layers according to an embodiment of the present invention;
fig. 4 is a diagram illustrating a positional relationship between a first signal line and a ground plane according to a first embodiment of the present invention;
fig. 5 is a schematic structural diagram of an electronic device according to a second embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings, not all of them.
Example one
Fig. 1 is a side sectional view of a transmission line according to a first embodiment of the present invention, as shown in fig. 1, the transmission line of the present embodiment includes a first dielectric layer 10 and a second dielectric layer 20, a first signal line 11 and a ground plane 12 disposed on two sides of the first signal line 11 are disposed on the first dielectric layer 10, a second signal line 21 is disposed on the second dielectric layer 20, and an air layer 30 is disposed between the first dielectric layer 10 and the second dielectric layer 20.
Fig. 2 is a top view of a first signal line 11 and a ground plane 12 on a first dielectric layer 10 according to an embodiment of the present invention, and as shown in fig. 2, the ground plane 12 is disposed on two sides of the first signal line 11.
The first dielectric layer 10 and the second dielectric layer 20 are commonly called as base materials or copper clad laminates, and are substrate materials in transmission line manufacturing, and have the functions of interconnecting, conducting, insulating and supporting transmission line components, wherein the first dielectric layer 10 and the second dielectric layer 20 are flexible dielectric layers, and are substrates based on fpc (flexible Printed Circuit board), that is, pcbs (Printed Circuit boards) made of flexible materials capable of being folded and bent, and have the characteristics of excellent flexibility, flexible application and foldability, and the forms of the dielectric layers can be changed along with the state change of the transmission line, that is, when the transmission line is changed from a straight state to a bent state, the first dielectric layer 10 and the second dielectric layer 20 can be extruded to the bent state, and when the transmission line is changed from the bent state to the straight state, the first dielectric layer 10 and the second dielectric layer 20 can be stretched to the straight state, for example, the first dielectric layer 10 and the second dielectric layer 20 can be high-performance flexible dielectric layers, so that the first dielectric layer 10 and the second dielectric layer 20 can be applied to a transmission line of a folding device.
The first signal line 11 is used for transmitting radio frequency signals, which are modulated electric waves with a certain transmitting frequency, generally, the radio frequency signals are a general term of electromagnetic waves with oscillation frequency between 3KHz and 300GHz, and the high-frequency electromagnetic waves have high energy, strong penetration capability and higher bandwidth, can carry more information, and are widely applied to radar and wireless communication.
The second signal line 21 is used for transmitting a digital signal, where the independent variable is a discrete signal, and the dependent variable is a discrete signal, and the digital signal has a particularly strong interference resistance. For example, in this embodiment, the digital signal may be a signal for controlling the operating state of the antenna, and may also be a signal for controlling and matching the resonant frequency of the antenna.
The ground plane 12 in this embodiment provides a signal return path for the radio frequency signal in the first signal line 11, and the ground plane 12 is disposed on two sides of the first signal line 11, and since the first signal line 11 and the ground plane 12 are in the same plane, a via hole does not need to be disposed on the first dielectric layer 10, and the manufacturing process is simple.
In addition, the frequency spectrum component of the radio frequency signal contains high frequency components, the corresponding wavelength is short, the signal on a longer transmission line needs to consider the volatility, namely, impedance matching is needed, and the impedance matching means that the load impedance and the characteristic impedance of the transmission line are required to be equal when the signal is transmitted, so that energy loss in transmission is avoided. In the present embodiment, the ground planes 12 are disposed on two sides of the first signal line 11, and are located on the same plane of the first dielectric layer 10 as the first signal line 11, and under the condition that the width of the first signal line 11 is constant, reasonable impedance matching can be effectively achieved by adjusting the distance between the first signal line 11 and the ground plane 12, in the present embodiment, the distance between the ground plane 12 and the first signal line 11 can be designed according to practical requirements, and generally, the first signal line 11 can be a differential line or a coplanar waveguide line.
In one example of the present embodiment, the first signal line 11 is a coplanar waveguide signal line. In the prior art, a flexible transmission line using a shielding film as a reference ground is used for realizing radio frequency signal transmission, because the surface of the shielding film has certain roughness, different parasitic inductances can be generated, and the impedance of the surface of a conductor changes, on the other hand, because the transmission line has a generally thin dielectric layer in order to meet the bending performance, the insertion loss of the transmission line in a high-frequency band is easily large due to the reasons, and the coplanar waveguide has a firm grounding structure and lower loss in the high-frequency band, so that potential advantages and stability performance are provided for high-frequency signal transmission.
In addition, the second signal line 21 uses the ground plane 12 on the first dielectric layer 10 as a reference ground, the second signal line 21 transmits a low-speed digital signal, and the reference ground does not need to be strictly designed like a high-frequency signal, and only a ground loop needs to be used as a reference for high and low levels, so that the second signal line 21 of the present embodiment can use the ground plane 12 on the first dielectric layer 10 as a reference ground, and does not need to lay an additional reference ground on the second dielectric layer 20. The ground plane 12 is generally indirectly connected to the first signal line 11 and the second signal line 21 through other circuits such as a diode and a transistor in the circuit, that is, a ground loop is formed. In addition, as shown in fig. 1, the second signal line 21 is not disposed directly above the first signal line 11, but disposed at a position without overlapping in a vertical space, because the metal material of the second signal line 21 interferes with the impedance of the first signal line 11, thereby affecting the uniformity of the impedance of the first signal line 11.
The first signal line 11, the second signal line 21 and the ground plane 12 are made of copper, and are laid on each dielectric layer, while in the design of the flexible circuit board, the hardness characteristic of copper is not favorable for the bending of the dielectric layers, if the ground plane (copper) is arranged on each dielectric layer, the copper on the dielectric layers is easy to break under the condition of high folding times of the transmission line, therefore, in the embodiment, except that the first dielectric layer 10 needs to be laid with the ground plane 12, the second dielectric layer 20 does not lay with the ground plane any more, and the advantage of the arrangement is that: the hardness of the second dielectric layer 20 can be prevented from being increased, the bending performance of the second dielectric layer 20 is improved, the bending performance of the transmission line is further improved, the design of a control circuit is simplified, and meanwhile, the production cost is saved.
An air layer 30 is further arranged between the first dielectric layer 10 and the second dielectric layer 20, so that a gap is left between the first dielectric layer 10 and the second dielectric layer 20 instead of being attached to each other, when the transmission line is in a bent state, the first dielectric layer 10 and the second dielectric layer 20 are also extruded to be in the bent state, if the air layer 30 does not exist, the first dielectric layer 10 and the second dielectric layer 20 can be mutually extruded and rubbed to generate stress, the transmission line is not bent easily, signal lines on the dielectric layers are worn out, and the transmission line is not suitable for being used with high bending times, therefore, the air layer 30 is arranged between the first dielectric layer 10 and the second dielectric layer 20, the stress of mutual extrusion of the first dielectric layer 10 and the second dielectric layer 20 when the transmission line is bent can be greatly reduced, and the transmission performance reduction or failure caused by the abrasion of transmission line materials in an area when the transmission line is folded can also be avoided, the requirement of high bending times can be realized.
The dielectric constant of the air is different from the dielectric constants of the first dielectric layer 10 and the second dielectric layer 20, and the electric field is mainly concentrated on the two dielectric layers and does not affect the transmission of signals.
In an alternative embodiment of the present invention, the number of the second signal lines 21 is more than one on each of the second dielectric layers 20. The trend of digital signal control and matching of resonant frequency is future, and as the number of wireless frequency bands increases, the antenna needs more and more resonant frequencies, which means that the transmission line needs to transmit more types of digital signals, in this embodiment, the digital signals of the digital control circuit are transmitted through the second signal line 21, and when the types of the digital signals increase but the number of the digital signals is small, the number of the second signal lines 21 may also increase correspondingly, for example, a plurality of second signal lines 21 are arranged on the same second dielectric layer 20, and each second signal line 21 is used for transmitting different types of digital signals, so that the number of layers of the dielectric layers does not need to be additionally increased while the requirement of small increase of the types of the digital signals is met.
In an optional embodiment of the present invention, when a plurality of digital signals need to be transmitted, the number of layers of the second dielectric layer 20 may be set to be more than two, as shown in fig. 3, which is a side sectional view of a transmission line with three dielectric layers in this embodiment, where, compared with the transmission line with a two-dielectric-layer structure shown in fig. 1, in fig. 3, a newly added second dielectric layer 20 may be disposed on the other side of the first dielectric layer 10, and the orientation of the second signal line 21 on the second dielectric layer 20 is the same as the orientation of the first signal line 11 on the first dielectric layer 10, so that the layout of the entire transmission line is regular and uniform, and the production and manufacturing are convenient. When the number of the second dielectric layers 20 is increased, that is, more second signal lines 21 can be arranged on the second dielectric layers 20 to meet the requirement of more digital signals in number and type, meanwhile, the second dielectric layers 20 are arranged on both sides of the first dielectric layer 10, so that the reflection of surrounding metal to the radio-frequency signals transmitted by the first signal lines 11 on the first dielectric layer 10 can be reduced, and the transmission quality of the radio-frequency signals and the working efficiency of the antenna are improved. It should be noted that the number of the second signal lines 21 disposed on each second dielectric layer 20 is not necessarily the same, and in addition, in order to increase the bending performance of the transmission line and meet the requirements of increasing the number and types of digital signals, the number of the second dielectric layers 20 may be 2-4.
Since the second signal line 21 on the second dielectric layer 20 needs to use the ground plane 12 on the first dielectric layer 10 as a reference ground, the farther the second signal line 21 is from the first dielectric layer 10, the more dielectric layer layers are spaced in between, which means that the larger the number of dielectric layer vias and the longer the lead connection, the more one via can bring about a distributed capacitance of about 0.5pF, the reduced number of vias can significantly improve the speed and reduce the possibility of data errors, the radiation intensity of the signal is proportional to the trace length of the signal line, and the longer the radio frequency signal lead is, the easier it is to couple to the component close to it, so it is required that the shorter the trace is as good as possible for high frequency signal lines such as clock, crystal oscillator, etc. of the signal.
In an optional embodiment of the present invention, an absolute value of a difference between numbers of the second dielectric layers 20 disposed on both sides of the first dielectric layer 10 is less than or equal to 1, that is, if the number of the second dielectric layers 20 is an even number, the number of the second dielectric layers 20 disposed on both sides of the first signal line 11 of the first dielectric layer 10 is the same, and if the number of the second dielectric layers 20 is an odd number, the number of the second dielectric layers 20 disposed on both sides of the first signal line 11 of the first dielectric layer 10 is 1, so that the number of the second dielectric layers 20 on both sides of the first dielectric layer 10 is the same or similar, that is, the distance from the second signal line 21 on each second dielectric layer 20 to the first dielectric layer 10 is the shortest, thereby reducing the number of the dielectric layers to be punched and the number of lead connections, further improving the speed and reducing the possibility of data errors, and reducing signal coupling.
In an example of this embodiment, since the second signal line 21 on the second dielectric layer 20 is relatively far from the ground plane 12 on the first dielectric layer 10, the lead is long, noise may be generated due to signal coupling, and a decoupling capacitor may be disposed at the output end of the second signal line 21 to remove the noise, thereby improving the quality of the transmission signal.
In an alternative embodiment of the present invention, the second signal line 21 on the second dielectric layer 20 is disposed on the side of the second dielectric layer 20 facing the first dielectric layer 10, as described in the previous embodiment, the farther the second signal line 21 is from the first dielectric layer 10, which means that the circuit connection may be more complicated, and this is improved in this embodiment, by disposing the second signal line 21 on the second dielectric layer 20 on the side of the second dielectric layer 20 facing the first dielectric layer 10, the distance from the second signal line 21 to the first dielectric layer 10 is shortened, that is, the connection line from the second signal line 21 to the ground plane 12 on the first dielectric layer 10 can be reduced, and the complexity of the line is further reduced.
In an alternative embodiment of the present invention, the first signal lines 11 are coplanar waveguide signal lines, and the number of the coplanar waveguide signal lines is more than one. Not only digital signals are of various types, but also radio frequency signals of antennas of mobile phones, radios and the like can have multiple frequency bands, for example, in order to be able to transmit different television signals in the air, a video must be modulated into a radio frequency signal from a television signal, each signal occupies one channel, so that multiple television programs can be simultaneously transmitted in the air without causing confusion, in order to adapt to the requirement of more antenna transceiving frequency bands, the number of the first signal lines 11 in this embodiment may be more than 1, and when the number of the first signal lines 11 is greater than 1, the first signal lines 11 and the ground plane 12 are arranged at an interval, specifically, as shown in fig. 4, fig. 4 is a diagram of a positional relationship between the first signal lines 11 and the ground plane 12 when the number of the first signal lines 11 is greater than 1. For two adjacent first signal lines 11, the two first signal lines share the sandwiched ground plane 12, and for each first signal line 11, the distance between the first signal line and the ground planes 12 on two sides may also be set according to actual requirements, and the number and shape of the first signal lines 11 and the ground planes 12 may be designed according to actual frequency band requirements, models of devices in which the transmission lines are located, and the like.
In an alternative embodiment of the present invention, the side of the first dielectric layer 10 on which the first signal line 11 is disposed is provided with a coating layer, and the side of the second dielectric layer 20 on which the second signal line 21 is disposed is provided with a coating layer. The coating layer is used for protecting the first signal line 11 and the second signal line 21, has the characteristics of dust prevention, dirt prevention and static electricity prevention, can protect the circuit from being exposed in the air, avoids the oxidation and corrosion of the circuit, and can reduce the loss in the signal transmission process.
The transmission line of the embodiment of the invention is applied to the folding equipment as follows: the transmission line can be arranged in a bending area of the folding equipment, a control circuit of the folding equipment generates digital signals and transmits the digital signals to the antenna through the transmission line so as to regulate and control the working state of the antenna, the control circuit also transmits the modulated radio-frequency signals to the antenna through the transmission line and transmits the modulated radio-frequency signals to the outside through the antenna in an electromagnetic wave form, and on the other hand, the antenna receives electromagnetic waves from the outside and converts the electromagnetic waves into radio-frequency signals, and transmits the radio-frequency signals to the control circuit through the transmission line so as to perform signal amplification, frequency selection, demodulation and the like. Wherein, folding equipment can be for buckling screen cell-phone, flat board, smart glasses etc..
Example two
Fig. 5 is an electronic device according to a second embodiment of the present invention, where the electronic device includes a main board 3, an antenna 2 and a transmission line 1 according to the first embodiment, the antenna 2 is electrically connected to the main board 3 through the transmission line 1, and the transmission line 1 passes through a folding area of the electronic device. The main board 3 is used for generating digital signals and modulating radio frequency signals, and the transmission line 1 is used for transmitting the digital signals and the radio frequency signals to the antenna 2 so as to control the antenna 2 to send and receive signals.
The electronic device provided by the embodiment of the invention can transmit signals through the transmission line provided by the first embodiment of the invention, and has the functional modules and the beneficial effects corresponding to the transmission line shown in the embodiment.
It should be noted that, in the embodiment of the transmission line, each included unit and each included module are only divided according to functional logic, but are not limited to the above division as long as the corresponding functions can be realized; in addition, specific names of the functional units are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present invention.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A transmission line, comprising:
the antenna comprises a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first dielectric layer is provided with a first signal line and a ground plane, and the ground plane is arranged on two sides of the first signal line;
the second signal line is arranged on the second dielectric layer;
the first dielectric layer and the second dielectric layer are flexible dielectric layers, and an air layer is arranged between the first dielectric layer and the second dielectric layer;
the first signal line is used for transmitting radio frequency signals, the second signal line is used for transmitting digital signals, and the second signal line takes the ground plane on the first medium layer as a reference ground.
2. The transmission line according to claim 1, wherein the number of the second signal lines is one or more.
3. The transmission line of claim 1, wherein the first signal line is a coplanar waveguide signal line.
4. The transmission line of claim 3, wherein the number of coplanar waveguide signal lines is more than one.
5. The transmission line of claim 4, wherein if the number of coplanar waveguide signal lines is greater than 1, the coplanar waveguide signal lines are spaced from the ground plane.
6. The transmission line according to claim 1, wherein an absolute value of a difference in the number of the second dielectric layers disposed on both sides of the first dielectric layer is 1 or less.
7. The transmission line of claim 6, wherein the orientation of the second signal line on the second dielectric layer coincides with the orientation of the first signal line on the first dielectric layer.
8. The transmission line of claim 6, wherein said second signal line on said second dielectric layer is disposed on a side of said second dielectric layer facing said first dielectric layer.
9. The transmission line according to any one of claims 1 to 8, wherein a side of the first dielectric layer on which the first signal line is provided with a coating layer, and a side of the second dielectric layer on which the second signal line is provided with a coating layer.
10. An electronic device comprising a main board, an antenna, and the transmission line of any one of claims 1 to 9, wherein the antenna is electrically connected to the main board through the transmission line.
CN202210349903.5A 2022-04-02 2022-04-02 Transmission line and electronic equipment Pending CN114759332A (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN115275552A (en) * 2022-07-27 2022-11-01 中国科学院半导体研究所 Four-channel radio frequency signal transmission device and system

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WO2016186447A1 (en) * 2015-05-18 2016-11-24 (주)기가레인 Antenna-integrated flexible circuit board
US20170149111A1 (en) * 2015-04-09 2017-05-25 Murata Manufacturing Co., Ltd. Composite transmission line and electronic device
US20170214121A1 (en) * 2016-01-26 2017-07-27 Qualcomm Incorporated Signal delivery and antenna layout using flexible printed circuit board (pcb)
CN211457494U (en) * 2019-08-20 2020-09-08 华为机器有限公司 Flexible circuit board
CN112071194A (en) * 2020-09-07 2020-12-11 武汉华星光电半导体显示技术有限公司 Display device and electronic apparatus

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Publication number Priority date Publication date Assignee Title
US20080315977A1 (en) * 2007-06-22 2008-12-25 Tessera, Inc. Low loss RF transmission lines
US20170149111A1 (en) * 2015-04-09 2017-05-25 Murata Manufacturing Co., Ltd. Composite transmission line and electronic device
WO2016186447A1 (en) * 2015-05-18 2016-11-24 (주)기가레인 Antenna-integrated flexible circuit board
US20170214121A1 (en) * 2016-01-26 2017-07-27 Qualcomm Incorporated Signal delivery and antenna layout using flexible printed circuit board (pcb)
CN211457494U (en) * 2019-08-20 2020-09-08 华为机器有限公司 Flexible circuit board
CN112071194A (en) * 2020-09-07 2020-12-11 武汉华星光电半导体显示技术有限公司 Display device and electronic apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115275552A (en) * 2022-07-27 2022-11-01 中国科学院半导体研究所 Four-channel radio frequency signal transmission device and system
CN115275552B (en) * 2022-07-27 2023-10-03 中国科学院半导体研究所 Four-channel radio frequency signal transmission device and system

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