CN114758975A - 在传输中自动晶圆定中方法及设备 - Google Patents

在传输中自动晶圆定中方法及设备 Download PDF

Info

Publication number
CN114758975A
CN114758975A CN202210281765.1A CN202210281765A CN114758975A CN 114758975 A CN114758975 A CN 114758975A CN 202210281765 A CN202210281765 A CN 202210281765A CN 114758975 A CN114758975 A CN 114758975A
Authority
CN
China
Prior art keywords
end effector
substrate
transport apparatus
substrate transport
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210281765.1A
Other languages
English (en)
Chinese (zh)
Inventor
B.殷
J.T.穆拉
V.曾
A.高利克
N.斯派克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borucos Automation Usa Co ltd
Original Assignee
Borucos Automation Usa Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Borucos Automation Usa Co ltd filed Critical Borucos Automation Usa Co ltd
Priority claimed from PCT/US2016/042142 external-priority patent/WO2017011581A1/fr
Publication of CN114758975A publication Critical patent/CN114758975A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202210281765.1A 2015-07-13 2016-07-13 在传输中自动晶圆定中方法及设备 Pending CN114758975A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201562191863P 2015-07-13 2015-07-13
US62/191863 2015-07-13
US201662320142P 2016-04-08 2016-04-08
US62/320142 2016-04-08
CN201680053111.6A CN108027718B (zh) 2015-07-13 2016-07-13 在传输中自动晶圆定中方法及设备
PCT/US2016/042142 WO2017011581A1 (fr) 2015-07-13 2016-07-13 Procédé et appareil de centrage automatique de tranches à la volée

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201680053111.6A Division CN108027718B (zh) 2015-07-13 2016-07-13 在传输中自动晶圆定中方法及设备

Publications (1)

Publication Number Publication Date
CN114758975A true CN114758975A (zh) 2022-07-15

Family

ID=58774474

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201680053111.6A Active CN108027718B (zh) 2015-07-13 2016-07-13 在传输中自动晶圆定中方法及设备
CN202210281765.1A Pending CN114758975A (zh) 2015-07-13 2016-07-13 在传输中自动晶圆定中方法及设备

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201680053111.6A Active CN108027718B (zh) 2015-07-13 2016-07-13 在传输中自动晶圆定中方法及设备

Country Status (3)

Country Link
EP (1) EP3341831A1 (fr)
CN (2) CN108027718B (fr)
TW (2) TWI752910B (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10903107B2 (en) 2017-07-11 2021-01-26 Brooks Automation, Inc. Semiconductor process transport apparatus comprising an adapter pendant
TWI677774B (zh) * 2018-12-03 2019-11-21 鴻勁精密股份有限公司 電子元件移料機構及其應用之作業設備
JP2021019145A (ja) * 2019-07-23 2021-02-15 川崎重工業株式会社 ブレード間隔調整装置
CN115295464A (zh) * 2022-08-08 2022-11-04 魅杰光电科技(上海)有限公司 一种晶圆传片系统
CN116313873B (zh) * 2023-05-11 2023-07-25 深圳市森美协尔科技有限公司 一种全自动晶圆测试设备及方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2071662A1 (fr) * 1991-06-26 1992-12-27 Jon J. Gulick Support de type a prises pour puces a protuberance et circuits
TW200403797A (en) * 2002-07-22 2004-03-01 Applied Materials Inc High temperature substrate transfer robot
US7458763B2 (en) * 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
TWI397969B (zh) * 2005-07-11 2013-06-01 Brooks Automation Inc 具有迅速工件定中心功能的加工裝置
US7479236B2 (en) * 2006-09-29 2009-01-20 Lam Research Corporation Offset correction techniques for positioning substrates
JP4607848B2 (ja) * 2006-10-27 2011-01-05 東京エレクトロン株式会社 基板処理装置、基板受け渡し位置の調整方法及び記憶媒体
JP4989398B2 (ja) * 2007-09-27 2012-08-01 大日本スクリーン製造株式会社 基板処理装置
US20090110532A1 (en) * 2007-10-29 2009-04-30 Sokudo Co., Ltd. Method and apparatus for providing wafer centering on a track lithography tool
CN101640181A (zh) * 2008-07-31 2010-02-03 佳能安内华股份有限公司 基底对准设备和基底处理设备
EP2791034B1 (fr) * 2011-12-16 2021-01-27 Brooks Automation, Inc. Appareil de transport
US9842757B2 (en) * 2013-06-05 2017-12-12 Persimmon Technologies Corporation Robot and adaptive placement system and method

Also Published As

Publication number Publication date
TW202224078A (zh) 2022-06-16
TWI832130B (zh) 2024-02-11
TWI752910B (zh) 2022-01-21
CN108027718A (zh) 2018-05-11
TW201707900A (zh) 2017-03-01
EP3341831A1 (fr) 2018-07-04
CN108027718B (zh) 2022-04-08

Similar Documents

Publication Publication Date Title
JP7430668B2 (ja) オンザフライ方式の自動ウェハセンタリング方法および装置
US11908721B2 (en) Tool auto-teach method and apparatus
CN108027718B (zh) 在传输中自动晶圆定中方法及设备
JP7486570B2 (ja) ロボット埋め込み型視覚装置
TW202110602A (zh) 機器人內嵌之視覺設備

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination