CN114729904A - Plate defect detection method and device - Google Patents
Plate defect detection method and device Download PDFInfo
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- CN114729904A CN114729904A CN202080078549.6A CN202080078549A CN114729904A CN 114729904 A CN114729904 A CN 114729904A CN 202080078549 A CN202080078549 A CN 202080078549A CN 114729904 A CN114729904 A CN 114729904A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8858—Flaw counting
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8861—Determining coordinates of flaws
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
Abstract
The invention relates to a defect detection method and a device for plates such as wafers, and particularly relates to the defect detection method for the plates, which comprises the following time sequence steps: an installation step (S100) for installing the plate material (200) on the inspection equipment (10); an inspection step (S200) of inspecting the panel surface (210) and the interior (220) after the mounting step; and a determination step (S300) of determining, at the control unit (400), the position, size and form of the defect after the inspection step. The plate defect detection device comprises: a panel mounting unit (100) in which a plurality of clamps for fixing a panel are formed; a photographing unit (600) positioned at one side of the panel mounting unit, photographing a surface (210) of a panel; and a control unit (400) that receives the image of the photographing unit and determines a defect.
Description
Technical Field
The present invention relates to a method and an apparatus for detecting defects in a plate material such as a wafer.
Background
The invention 001 relates to a wafer defect detection method using Reactive Ion Etching and a wafer structure thereof, and discloses a wafer defect detection method using Reactive Ion Etching (RIE), which comprises the following steps: forming an etching Mask (Etch Mask) film on a silicon wafer; patterning the etching mask film (Patterning); subjecting the silicon wafer to a Reactive Ion Etching (RIE) process inside a chamber, etching a surface of the wafer exposed by the transmission window of the etching mask pattern; and observing the wafer defects revealed by the Reactive Ion Etching (RIE).
The invention 002 relates to a defect detection method of a semiconductor wafer, which is a method for detecting micro defect factors of a silicon wafer, and discloses a defect detection method of the semiconductor wafer, which comprises the following steps: performing heat treatment on the silicon wafer in an atmosphere gas to grow the micro defect elements into a measurable size in the temperature range of 500-1300 ℃; mirror polishing the surface of the wafer; cleaning the polished wafer; and inspecting the grown defects using a particle counter.
Patent invention 003 relates to a method for inspecting defects of a silicon wafer, and more particularly, discloses a method for inspecting defects of a silicon wafer, comprising the steps of: carrying out heat treatment on a silicon single crystal wafer in an oxygen atmosphere to form an oxide film on the surface of the wafer; performing heat treatment on the wafer in a nitrogen atmosphere to form a nitride film on the oxide film; nucleating internal defects of the wafer by heat-treating the wafer in a gas atmosphere step by step; heat-treating the wafer in which the internal defects are nucleated in an oxygen atmosphere to grow the nucleated internal defects; and inspecting the wafer for defects.
Patent invention 004 is a defect inspection method of a silicon single crystal wafer, which discloses that Ni is contaminated on the silicon single crystal wafer, a first stage heat treatment is performed to form nuclei of metal precipitates on the silicon single crystal wafer, a second stage heat treatment is performed to grow the nuclei of metal precipitates, and defects of the silicon single crystal wafer are confirmed.
(patent document 1) (patent invention 001) KR10-0912342B1 (08 months and 07 days 2009)
(patent document 2) (patent invention 002) KR10-2002-
(patent document 3) (patent invention 003) KR10-2005-0059910A (2005, 06, 21)
(patent document 4) (patent invention 004) KR10-1364937B1(2014, 12 months and 02 days)
Disclosure of Invention
Technical problem
The invention relates to a method and a device for detecting defects of a plate material such as a wafer.
Technical scheme
The invention relates to a plate defect detection method, which specifically comprises the following time sequence steps: an installation step S100 of installing the plate material 200 to the inspection equipment 10; an inspection step S200 of inspecting the board surface 210 and the inside 220 after the mounting step; and a determination step S300 of determining, at the control unit 400, the position, size and form of the defect after the inspection step.
The invention relates to a method for detecting defects of a plate, which comprises the following steps: the first inspection step S210 confirms the defect position of the plate material 200.
The invention relates to a method for detecting defects of a plate, which comprises the following steps: the second inspection step S220 confirms the size and type of the defect.
The invention relates to a method for detecting the defect of a plate, wherein in the step S300, the step S comprises the following steps: a first determination step S310 of determining a plurality of defect positions using the coordinate data after the first inspection step.
The invention relates to a method for detecting defects of a plate, in the steps, the judging step S300 comprises the following steps: a second determination step S320 of determining the size and kind of the defect after the second inspection step.
The invention relates to a method for detecting defects of a plate, which comprises the following steps: a correction step S500 of correcting the inspection equipment 10 before the mounting step.
The invention relates to a plate defect detection device, which specifically comprises: a panel mounting unit 100 formed with a plurality of clamps for fixing a panel; a photographing unit 600 positioned at one side of the panel mounting unit to photograph the panel surface 210; and a control unit 400 receiving the photographing unit image and determining a defect.
Effects of the invention
The invention can automatically detect the defects of the plate material such as semiconductor wafer.
The invention has the effects of adjusting the illumination of light and improving the accuracy of camera images.
The present invention has the effect of determining a certain number of defects and defect density in the first inspection step, determining wafer defects in advance, and performing the second inspection step on wafers within the defect limit.
The present invention can determine the safety of the wafer mounting step and can perform the first inspection and the second inspection in a stable mounting step. If the stable mounting step cannot be realized, the re-mounting step is repeated.
The invention has the effect of correcting the accuracy of the equipment at any time by correcting the plate before checking the wafer.
Drawings
FIGS. 1 and 2 are flow charts of the sheet defect detection method of the present invention;
FIG. 3 is a schematic layout of the plate, the light emitting device and the camera unit of the present invention;
FIG. 4 is a layout view of the inspection apparatus of the present invention;
fig. 5 is a perspective view of a plate material defect detecting apparatus of the present invention.
Detailed Description
In order that those skilled in the art to which the invention pertains will readily appreciate that the present invention may be practiced without these specific details.
The numbers referred to in the following embodiments are not limited to the reference objects, and are applicable to all embodiments. Objects having the same purpose and exhibiting the same effects as those of the configurations proposed in the embodiments belong to equivalent alternative objects. The higher-level concept proposed in the embodiments includes a lower-level concept object not described.
Embodiment 1-1 the present invention relates to a sheet defect detection method, specifically, comprising the following time-series steps: an installation step S100 of installing the plate material 200 to the inspection equipment 10; an inspection step S200 of inspecting the panel surface 210 and the inside 220 after the mounting step; and a determination step S300 of determining, at the control unit 400, the position, size and form of the defect after the inspection step.
Example 1-2 the present invention relates to a sheet defect detecting method, in example 1-1, comprising: the plate material 200 is formed as a silicon wafer.
The semiconductor manufacturing process includes a process of generating a semiconductor pattern on the completed wafer surface 210 and cutting it into a plurality of chips to produce individual semiconductors. The wafer interior 220 in the shape of a thin plate cannot be defective because it would lead to a failure of the final product. Wafer defects may be generated during the cutting and grinding process or may be generated during the ingot crystallization process.
The invention is used for judging the defects of the finished wafer. The disc-shaped wafer needs to be stably mounted on the inspection equipment 10, and then the inside 220 and the surface 210 of the wafer are inspected to determine the position, kind, and the like of a defect by the inspection.
Examples 1-3 the present invention relates to a sheet material defect detecting method, and in example 1-1, the inspecting step includes: in the projecting step S201, light is projected from one surface and/or the other surface of the plate material by the light emitting device 500.
Examples 1 to 4 the present invention relates to a sheet defect detecting method, which includes, in examples 1 to 3: the light is formed of any one selected from the group consisting of ultraviolet rays, infrared rays, visible light, X-rays, and laser light.
Examples 1-5 the present invention relates to a sheet material defect detecting method, and in example 1-1, the inspecting step includes: in the photographing step S203, an image of one surface of the plate is photographed by the photographing unit (one or more cameras) 600.
Examples 1-3 to 1-5 are specific limitations of example 1-1, and embody the wafer inspection step. Specifically, light is projected on one surface of the semiconductor, and light is captured on the other surface of the semiconductor. The light is transmitted through the wafer and uniformly dispersed.
If the wafer has surface 210 defects (grooves, protrusions, etc.) and internal 220 defects (voids, through-holes), the light is scattered, and the defect location can be confirmed by determining the location of the scattered light. The type of the defect of the wafer can be detected by discriminating the type of the scattering.
As shown in examples 1-4, the transmitted light may be ultraviolet, infrared, visible or X-ray laser light, preferably infrared light.
The photographing step is photographed by one or more cameras in order to prevent errors due to damage to the cameras.
As another example, light may be projected on one side or the other of the wafer. Or may be projected simultaneously. As another embodiment, the projecting step may include: the illuminance adjusting step S202 adjusts the illuminance of the light emitting device 500.
Examples 1-6 the present invention relates to a sheet defect detecting method, in example 1-1, comprising: and a mounting determination step S110, after the mounting step, determining whether the mounting is normal.
Examples 1 to 7 the present invention relates to a sheet defect detecting method, which includes, in examples 1 to 6: an installation stopping step S120 of stopping the subsequent steps when an error is confirmed after the installation judging step. After the installation determination step, comprising: a first alarm step S130 of issuing an alarm when an error is confirmed.
Examples 1 to 8 the present invention relates to a sheet defect detecting method, which includes, in examples 1 to 7: and a remounting step S120 of remounting the panel 200 when an error is confirmed after the mounting determination step.
Examples 1-6 to 1-8 are steps of determining whether or not the plate material 200 mounted on the inspection equipment 10 is normally mounted. The panel 200 mounted on the inspection equipment 10 is confirmed whether or not it is normally mounted through the mounting determination step. Carrying out subsequent inspection steps under the condition of normal installation; in the case of abnormal installation, the re-installation step of re-installing the panel 200 is performed. In the abnormal case, the inspection equipment 10 enters an installation stop step to issue an alarm for prompting the user of the status. The installation determination step is divided into: a horizontal installation determination step S111 of determining whether or not the plate material 200 is horizontally installed; and a fastening force determination step S112 of confirming whether the same fastening force is applied through the plurality of pinch points.
Example 2-1 the present invention relates to a sheet defect detection method, and in example 1-1, the inspection step includes the following time-series steps: the first inspection step S210 confirms the presence of a defect in the plate material 200.
Embodiment 2-2 the present invention relates to a sheet material defect detection method, and in embodiment 2-1, the first inspection step includes: the inspection is performed by the first camera 610.
Embodiment 2-3 the present invention relates to a sheet defect detecting method, in embodiment 2-2, comprising: the first camera is arranged in plurality.
Embodiment 3-1 the present invention relates to a sheet material defect detection method, and in embodiment 1-1, the inspection step includes the following time-series steps: the second inspection step S220 confirms the size and type of the defect.
Embodiment 3-2 the present invention relates to a sheet material defect detecting method, and in embodiment 3-1, the second inspection step includes: the second camera 620 is fixed at the bonding position and is checked by focus adjustment.
Example 3-3 the present invention relates to a sheet defect detecting method, in example 3-1, comprising: the second camera is coupled to an up-and-down movement actuator (activator) 630 a.
Examples 2-1 and 3-1 are embodiments of the examination procedure of the present invention. The inspection step is realized through two steps, which are: a first step (first inspection step) of discriminating a defective position of a plate material; a second step (second inspection step) of discriminating the size, type, etc. of the defect.
After the first step, the second step is performed in sequence. The first step stores the position (coordinates) of the defect measured by the camera in the control unit 400, and the second step positions the second camera with the coordinates and determines the size and type of the defect by focus adjustment. The focus adjustment is achieved by moving the actuator up and down, or may be achieved by the camera range operation actuator 630 b. The first inspection step uses a plurality of first cameras (line scanning cameras), and the second inspection step uses 1 second camera (inspection camera). The first and second inspection steps may be implemented by fixing a camera, moving the sheet material 200, or fixing the sheet material 200, moving the camera.
Embodiment 4-1 the present invention relates to a sheet material defect detecting method, and in embodiment 2-1, the judging step S300 includes the following time-series steps: a first determination step S310 of determining a plurality of defect positions using the coordinate data after the first inspection step.
Embodiment 4-2 the present invention relates to a sheet defect detecting method, in embodiment 4-1, comprising: a position data storing step S311 of storing the defective position in the control unit 400 after the first determination step.
Embodiment 4-3 the present invention relates to a sheet material defect detection method, and in embodiment 4-1, the first determination step includes: the defect density determination step S312 determines the defect density. The first determination step includes: the defect number determination step S313 determines the number of defects.
Example 4-4 the present invention relates to a sheet defect detecting method, in example 4-1, including: an inspection stopping step S314 of stopping the inspection equipment 10 when the number of defects having a standard value or more occurs after the first determination step.
Embodiments 4 to 5 the present invention relates to a plate material defect detecting method, in an embodiment 4 to 4, including: and a second alarm step S410 for giving an alarm when the number of defects is larger than a standard value after the first judgment step. The method comprises the following steps: and a replacing step S420 of replacing the plate material 200 after the inspection stopping step.
Examples 4-1 to 4-5 specifically describe the first determination step. The first determination step determines the position, number, and density of defects (the second determination step described later determines the size and type of defects). Based on the result of the first determination step, it is decided to perform or discard a second inspection step described later. If there are too many defects in a wafer, the wafer is discarded. On the other hand, if there is a defect of an appropriate level or less, the second inspection step described later is performed. For the defect determined in the first determination step, a feature code is issued, and the feature code and the coordinates are stored in the storage device of the control unit 400 together to generate data. The data is used in a second inspection step and a second determination step, which will be described later.
Embodiment 5-1 the present invention relates to a sheet material defect detecting method, and in embodiment 2-1, the judging step S300 includes the following time-series steps: the second determination step S320 determines the size and kind of the defect after the second inspection step.
Example 5-2 the present invention relates to a sheet material defect detection method, and in example 5-1, the second determination step includes: the focus adjustment step S321 adjusts the focus of the defective image.
Embodiment 5-3 the present invention relates to a plate material defect detecting method, in embodiment 5-2, including: a type determination step S322, after the focus adjustment step, of checking the defect type. The method comprises the following steps: a size determination step S323 of confirming the defect size after the focus adjustment step.
Example 5-4 the present invention relates to a sheet defect detecting method, in example 5-1, comprising: a defect data storing step S311 of storing the defect type and the defect size after the second determination step.
Example 5-1 to example 5-4 specifically describe the second determination step. The second determination step determines the size and type of the defect. The data of the first determination step is recognized, and the defect is photographed by the inspection camera (second camera). In order to ensure the definition of the captured image, a focus adjustment step is performed. The focus may be adjusted by moving the up-down position of the camera or adjusting the lens position. After the focus is determined, the camera is checked by the recheck confirmation lens to accurately shoot. The captured image is transmitted to the control unit 400, and the control unit 400 compares the captured image with the calibration data to determine the actual size of the defect. The defect includes various types, and the type of the defect is automatically determined by comparing the defect with the video information. The determined data is provided to the semiconductor manufacturing equipment together with the wafer characteristic number.
Example 6-1 the present invention relates to a sheet defect detecting method, which comprises the following time-series steps in example 1-1: a correction step S500 of correcting the inspection equipment 10 before the mounting step.
Example 6-2 the present invention relates to a sheet material defect detecting method, and in example 6-1, the correcting step includes: the coordinate and length correcting step S510 identifies the reference mark of the correction plate material 300, and corrects the coordinate and length.
Example 6-3 the present invention relates to a sheet defect detecting method, in example 6-2, including: a shift step S520, after the coordinate and length correction step, of initializing the inspection equipment 10.
Embodiments 6-1 to 6-3 of the present invention relate to the correction of the board defect inspection equipment 10. To ensure the accuracy of the equipment, periodic corrections are required. In the calibration of the present invention, after the calibration plate 300 is put into the inspection equipment 10, the reference mark formed on the calibration plate 300 is recognized, thereby calibrating the coordinates and the length. The reference mark forms a reference mark for confirming a length and a position of the image-recognized data by a position and a length of the reference mark. The calibration step is periodic and after the calibration step, the accuracy of the inspection apparatus 10 can be improved by offsetting the apparatus.
Embodiment 7-1 the present invention relates to a sheet defect detecting apparatus, specifically, comprising: a panel mounting unit 100 formed with a plurality of clamps for fixing a panel; a photographing unit 600 positioned at one side of the panel mounting unit to photograph the surface 210 of the panel; and a control unit 400 receiving the image of the photographing unit and determining a defect.
Embodiment 7-2 the present invention relates to a sheet material defect detecting apparatus, in embodiment 7-1, comprising: and a light emitting device 500 positioned at the other side of the panel mounting unit to project light on a surface 210 of the panel.
Embodiment 7-3 the present invention relates to a plate material defect detecting apparatus, which includes, in embodiment 7-1: the photographing unit is composed of a plurality of cameras.
Embodiment 7-4 the present invention relates to a sheet material defect detecting apparatus, and in embodiment 7-3, the photographing unit includes: the first camera 610 photographs the entire panel to confirm the position of the defect.
Embodiment 7-5 the present invention relates to a sheet material defect detecting apparatus, and in embodiment 7-3, the photographing unit includes: the second camera 620 photographs each defect for confirming the size and kind of the defect.
Embodiment 7-6 the present invention relates to a sheet material defect detecting apparatus, in embodiment 7-1, comprising: and a focus adjusting device 630 attached to the second camera to change the focus of the camera.
Embodiment 7-7 the present invention relates to a sheet material defect detecting apparatus, in embodiment 7-1, comprising: and a transfer device 700 mounted to the panel mounting unit for moving the panel.
Embodiment 7-8 the present invention relates to a plate material defect detecting apparatus, and in embodiment 7-7, the transfer device includes: the actuator 800 is driven in rectangular coordinates.
Description of the reference numerals
10: the inspection apparatus 100: panel mounting unit
200: plate material 210: surface of sheet material
220: the interior of the plate 300: correction plate
400: the control unit 500: light emitting device
600: the photographing unit 610: first camera
620: the second camera 630: focus adjusting device
630 a: up-and-down movement actuator 630 b: range operation actuator
700: the transfer device 800: actuator
Claims (7)
1. A method of sheet defect detection, the method comprising:
an installation step (S100) for installing the plate material (200) on the inspection equipment (10);
an inspection step (S200) of inspecting the panel surface (210) and the interior (220) after the mounting step; and
a determination step (S300) of determining, at the control unit (400), the position, size and morphology of the defect after the inspection step.
2. The sheet defect detection method according to claim 1, wherein the inspecting step includes:
the first inspection step (S210) is to confirm the defect position of the plate material (200).
3. The sheet defect detection method of claim 1, wherein said inspecting step comprises:
the second checking step (S220) confirms the size and type of the defect.
4. The sheet defect detecting method according to claim 2, wherein said determining step (S300) includes:
a first determination step (S310) of determining a plurality of defect positions using the coordinate data after the first inspection step.
5. The sheet defect detecting method according to claim 2, wherein said determining step (S300) includes:
a second determination step (S320) of determining the size and kind of the defect after the second inspection step.
6. The sheet defect detection method of claim 1, the method comprising:
a correction step (S500) of correcting the inspection equipment (10) before the mounting step.
7. A sheet defect detection apparatus, the apparatus comprising:
a panel mounting unit (100) in which a plurality of clamps for fixing a panel are formed;
a photographing unit (600) positioned at one side of the panel mounting unit, for photographing a panel surface (210); and
and a control unit (400) for receiving the shooting unit image and judging the defect.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190117373A KR102221447B1 (en) | 2019-09-24 | 2019-09-24 | Method and apparatus for detecting defects of plate |
| KR10-2019-0117373 | 2019-09-24 | ||
| PCT/KR2020/007576 WO2021060667A1 (en) | 2019-09-24 | 2020-06-11 | Method and apparatus for detecting defect in board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114729904A true CN114729904A (en) | 2022-07-08 |
Family
ID=75166698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080078549.6A Pending CN114729904A (en) | 2019-09-24 | 2020-06-11 | Plate defect detection method and device |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102221447B1 (en) |
| CN (1) | CN114729904A (en) |
| WO (1) | WO2021060667A1 (en) |
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| AU2003290752A1 (en) * | 2002-11-12 | 2004-06-03 | Fei Company | Defect analyzer |
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| KR20170032602A (en) * | 2015-09-15 | 2017-03-23 | 삼성전자주식회사 | Defect imaging apparatus for imaging defects, Defect inspection system having the same and method of inspecting defects using the same inspection system |
| KR101987895B1 (en) * | 2017-02-02 | 2019-06-12 | 주식회사 투윈테크 | Test dummy for precision transfer position measurement using the semiconductor system or display system and precision transfer position measurement method using the test dummy |
| JP6490771B1 (en) * | 2017-09-27 | 2019-03-27 | 株式会社アルバック | POSITION DETECTION DEVICE, POSITION DETECTION METHOD, AND DEPOSITION DEVICE |
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2019
- 2019-09-24 KR KR1020190117373A patent/KR102221447B1/en active IP Right Grant
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2020
- 2020-06-11 CN CN202080078549.6A patent/CN114729904A/en active Pending
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| WO2021060667A1 (en) | 2021-04-01 |
| KR102221447B1 (en) | 2021-03-02 |
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