CN114724986A - EAP equipment automation system for wafer preparation - Google Patents
EAP equipment automation system for wafer preparation Download PDFInfo
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- CN114724986A CN114724986A CN202210357694.9A CN202210357694A CN114724986A CN 114724986 A CN114724986 A CN 114724986A CN 202210357694 A CN202210357694 A CN 202210357694A CN 114724986 A CN114724986 A CN 114724986A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/0008—General problems related to the reading of electronic memory record carriers, independent of its reading method, e.g. power transfer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Automation & Control Theory (AREA)
- General Factory Administration (AREA)
Abstract
The invention discloses an automatic system of EAP equipment for wafer preparation, which comprises an equipment automatic management module, automatic processing equipment, a reader and a radio frequency card, wherein the radio frequency card is bound with wafers in batches and has turnover together, processing information of the wafers in the current batch is recorded in the radio frequency card, the automatic processing equipment is connected with the reader, the automatic processing equipment reads the processing information in the radio frequency card through the reader and uploads the processing information to the equipment automatic management module, the equipment automatic management module generates a processing program through the processing information and carries out processing by the automatic processing equipment, the automatic system also comprises a judging unit, the judging unit is used for analyzing the processing information in the radio frequency card and judging whether the processing information is lost or not, if the processing information is not lost, generating a processing program, and when the processing program is missing, carrying out information interaction between the equipment automation management module and the MES manufacturing execution system and modifying the processing information in the radio frequency card by the reader. The invention can rapidly read the processing information and reduce the network pressure.
Description
Technical Field
The invention relates to the technical field of wafer preparation, in particular to an automatic system of EAP equipment for wafer preparation.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. The preparation of wafers is extremely demanding in terms of production environment and equipment, and therefore automated production is essential.
The EAP realizes real-time monitoring of machines on a production line, is an indispensable control system for factory automation, and communicates with equipment, transmits data and sends an instruction to control the equipment to perform production processing according to a predefined flow, so that remote control and state monitoring of the equipment are realized, and automation of equipment operation is realized.
In the existing automatic production process, production data can not be effectively obtained, interaction with an MES system is needed, and the problem of network blockage is easily caused and the processing efficiency is influenced because the information interaction amount at the same time is large, so that how to effectively relieve the network pressure is very important.
Disclosure of Invention
The invention aims to provide an automatic system of EAP equipment for wafer preparation, which can rapidly read processing information and reduce network pressure.
In order to solve the technical problem, the invention provides an automatic system of EAP equipment for wafer preparation, which comprises an equipment automatic management module, automatic processing equipment, a reader and a radio frequency card, wherein the radio frequency card is bound with wafers in batches and has turnover together, processing information of the wafers in the current batch is recorded in the radio frequency card, the automatic processing equipment is connected with the reader, the automatic processing equipment reads the processing information in the radio frequency card through the reader and uploads the processing information to the equipment automatic management module, and the equipment automatic management module generates a processing program through the processing information and executes processing by the automatic processing equipment;
the automatic processing system further comprises a judging unit, the judging unit is used for analyzing and judging whether the processing information in the radio frequency card is missing or not, if not, a processing program is generated, if so, the automatic equipment management module carries out information interaction with the MES manufacturing execution system to obtain production information and generate a new processing program, and the automatic equipment management module modifies the processing information in the radio frequency card through the reader according to the production information.
Further, the processing information includes a unique identification code, a wafer name and production data, and the equipment automation management module generates a processing program according to the production data.
Further, the processing program comprises a processing parameter list, and the production data is recorded into the processing parameter list to form the processing program.
Further, when the production data is not matched with the items of the processing parameter list, the equipment automation management module carries out information interaction with the MES manufacturing execution system to generate a new processing program.
Further, the radio frequency card is fixed with a carrier for loading batch wafers.
Further, after the processing is finished, the equipment automation management module writes the turnover information of the next automation processing equipment into the radio frequency card through the reader, and the crown block or the trolley for the turnover carrier conveys the batch wafers to the next automation processing equipment according to the turnover information.
Furthermore, the overhead traveling crane and the trolley are both provided with readers, and the starting and stopping positions of the carriers are read and written in the radio frequency card through the readers.
Further, the equipment automation management module writes the waiting time of the next processing into the radio frequency card, and the crown block and the trolley plan the conveying path and the conveying time according to the waiting time.
Furthermore, a processing waiting area is further arranged, the overhead travelling crane or the trolley waits in the processing waiting area and is conveyed to next automatic processing equipment according to the specified time, an adjusting module is arranged in the processing waiting area, the adjusting module and an equipment automatic management module are arranged, the next automatic processing equipment is abnormal, the equipment automatic management module replans the turnover information and carries out information interaction with the overhead travelling crane or the trolley through the adjusting module.
The invention has the beneficial effects that:
1. the radio frequency card stores processing information of the current batch of wafer production, and the processing information is bound with the wafer to be circulated, so that the wafer is circulated with all information required by processing, all information of the current wafer can be read and known by the processing equipment, and the processing equipment is fast and efficient.
2. The information in the radio frequency card is directly read for processing, so that the interaction with an MES system about process parameters can be reduced, the automatic processing is directly carried out, and the network pressure is reduced.
Drawings
FIG. 1 is a schematic diagram of an automated manufacturing architecture for an EAP device automation system for wafer fabrication in accordance with the present invention;
FIG. 2 is a schematic diagram of the manufacturing structure of the automatic system for wafer fabrication EAP device in the absence of RF card information according to the present invention;
FIG. 3 is a schematic diagram of an automated system for wafer fabrication EAP devices in a turnaround configuration.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Referring to fig. 1, an embodiment of an EAP device automation system for wafer fabrication according to the present invention includes a device automation management module, an automation processing device, a reader, and a radio frequency card, where the radio frequency card is bound with a batch of wafers and has a turnover function, processing information of a current batch of wafers is recorded in the radio frequency card, the processing information includes a unique identification code, a wafer name, and production data, the automation processing device is connected to the reader, the automation processing device reads the processing information in the radio frequency card through the reader and uploads the processing information to the device automation management module, and the device automation management module generates a processing program through the production data and executes processing by the automation processing device, so as to achieve an effect of fast processing and reduce network pressure.
Specifically, the processing program comprises a processing parameter list, the production data are recorded into the processing parameter list to form the processing program, the efficiency is high, and the reading is convenient.
The system is also provided with a judging unit which is used for analyzing and judging whether the processing information in the radio frequency card has deficiency or not, if not, a processing program is generated, and if so, the equipment automation management module and the MES manufacturing execution system carry out information interaction to obtain production information and generate a new processing program; referring to fig. 2, in the specific judgment, in order to judge whether the production data matches with the items in the processing parameter list, avoid the problem of data loss of the radio frequency card, and also to enable rapid and continuous production when the problem occurs, the equipment automation management module performs information interaction with the MES manufacturing execution system to generate a new processing program. And the equipment automation management module modifies the processing information in the radio frequency card through the reader according to the production information, corrects and marks the modification, which represents that the defect problem exists. Meanwhile, the missing processing information is backed up and stored, so that manual checking and looking up can be conveniently carried out on the processing information subsequently, and the integrity of data is achieved.
The radio frequency card is fixedly connected with a carrier for loading batch wafers, and the radio frequency card and the carrier are rotated together. After the processing is finished, the equipment automation management module writes the turnover information of the next automation processing equipment into the radio frequency card through the reader, and the overhead traveling crane or the trolley for the turnover carrier conveys the wafers in batches to the next automation processing equipment according to the turnover information, so that the reaction is fast and convenient. Specifically, the overhead traveling crane and the trolley are both provided with readers, and the starting and stopping positions of the carriers are read and written in the radio frequency card through the readers, so that the efficiency is high. Because the equipment processing has a waiting condition, the equipment automation management module also writes the waiting time of the next processing into the radio frequency card, and the overhead traveling crane and the trolley plan the conveying path and the conveying time according to the waiting time, so that the effective planning is realized, and the efficiency is high.
Referring to fig. 3, a processing waiting area is further provided, the overhead traveling crane or the trolley waits in the processing waiting area and is conveyed to the next automatic processing device according to the specified time, an adjusting module is arranged in the processing waiting area, the adjusting module and the equipment automatic management module are abnormal, the equipment automatic management module plans the turnover information again and carries out information interaction with the overhead traveling crane or the trolley through the adjusting module, the unified management is carried out through the equipment automatic management module, the middle information turnover process is reduced, and the integrity of data is guaranteed.
Compared with the prior art: the radio frequency card stores the processing information of the current batch of wafer production, and the processing information is bound and circulated along with the wafers, so that the wafers are circulated with all information required by processing, and the processing equipment can read and know all information of the current wafers in the first time, thereby being fast and efficient. And the information in the radio frequency card is directly read for processing, so that the interaction with an MES system about process parameters can be omitted or reduced, the automatic processing is directly carried out, and the network pressure is reduced.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (9)
1. An automatic system of EAP equipment for wafer preparation is characterized by comprising an equipment automatic management module, automatic processing equipment, a reader and a radio frequency card, wherein the radio frequency card is bound with wafers in batches and has turnover together, processing information of the wafers in the current batch is recorded in the radio frequency card, the automatic processing equipment is connected with the reader, the automatic processing equipment reads the processing information in the radio frequency card through the reader and uploads the processing information to the equipment automatic management module, and the equipment automatic management module generates a processing program through the processing information and executes processing by the automatic processing equipment;
the automatic processing system further comprises a judging unit, the judging unit is used for analyzing and judging whether the processing information in the radio frequency card is missing or not, if not, a processing program is generated, if so, the automatic equipment management module carries out information interaction with the MES manufacturing execution system to obtain production information and generate a new processing program, and the automatic equipment management module modifies the processing information in the radio frequency card through the reader according to the production information.
2. The automated EAP apparatus for wafer fabrication as in claim 1, wherein the process information comprises a unique identification code, a wafer name, and production data, the process program being generated by the apparatus automation management module from the production data.
3. The automated EAP apparatus for wafer fabrication as in claim 2, wherein the process program includes a process parameter list, and wherein the process program is formed by entering the production data into the process parameter list.
4. The automated EAP device automation system of claim 3, wherein the device automation management module interacts with the MES manufacturing execution system to generate a new process when the production data does not match an entry in the process parameter list.
5. The automated EAP apparatus for wafer preparation as in claim 1, wherein the radio frequency card is secured to a carrier that holds a batch of wafers.
6. The automated EAP apparatus automation system of claim 5, wherein after the process is completed, the apparatus automation management module writes the turnaround information of the next automated process apparatus into the rf card through the reader, and the overhead traveling crane or the cart for the turnaround carrier transports the batch of wafers to the next automated process apparatus according to the turnaround information.
7. The automated EAP device automation system of claim 6, wherein the overhead traveling crane and the cart are each provided with a reader, and the start and stop positions of the carriers are read and written in the radio frequency card through the readers.
8. The automated EAP apparatus for wafer fabrication as in claim 7, wherein the apparatus automation management module further writes a waiting time for a next process into the radio frequency card, and the crown block and the cart plan a transport path and a transport time according to the waiting time.
9. The automated EAP apparatus for wafer fabrication as claimed in claim 8, wherein a process waiting area is further provided, the overhead traveling crane or the cart waits in the process waiting area and is transported to a next automated process apparatus according to a predetermined time, and an adjustment module is provided in the process waiting area, and the adjustment module and the apparatus automation management module, and the next automated process apparatus is abnormal, and the apparatus automation management module replans the turnaround information and performs information interaction with the overhead traveling crane or the cart through the adjustment module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210357694.9A CN114724986A (en) | 2022-04-06 | 2022-04-06 | EAP equipment automation system for wafer preparation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210357694.9A CN114724986A (en) | 2022-04-06 | 2022-04-06 | EAP equipment automation system for wafer preparation |
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| Publication Number | Publication Date |
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| CN114724986A true CN114724986A (en) | 2022-07-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210357694.9A Pending CN114724986A (en) | 2022-04-06 | 2022-04-06 | EAP equipment automation system for wafer preparation |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116055523A (en) * | 2022-12-29 | 2023-05-02 | 西安奕斯伟材料科技有限公司 | Wafer factory communication method, system, electronic equipment and readable storage medium |
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2022
- 2022-04-06 CN CN202210357694.9A patent/CN114724986A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116055523A (en) * | 2022-12-29 | 2023-05-02 | 西安奕斯伟材料科技有限公司 | Wafer factory communication method, system, electronic equipment and readable storage medium |
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