CN114717444A - 一种黄金靶材制备方法 - Google Patents
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- 229910052737 gold Inorganic materials 0.000 title claims abstract description 65
- 239000010931 gold Substances 0.000 title claims abstract description 65
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 239000013077 target material Substances 0.000 title claims abstract description 20
- 238000002360 preparation method Methods 0.000 title abstract description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 42
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000000956 alloy Substances 0.000 claims abstract description 26
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 26
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 21
- 229910000906 Bronze Inorganic materials 0.000 claims abstract description 21
- 229910000570 Cupronickel Inorganic materials 0.000 claims abstract description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 21
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000010951 brass Substances 0.000 claims abstract description 21
- 239000010974 bronze Substances 0.000 claims abstract description 21
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052742 iron Inorganic materials 0.000 claims abstract description 21
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 21
- 229910052709 silver Inorganic materials 0.000 claims abstract description 21
- 239000004332 silver Substances 0.000 claims abstract description 21
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 21
- 239000011701 zinc Substances 0.000 claims abstract description 21
- 238000007670 refining Methods 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 238000002844 melting Methods 0.000 claims abstract description 17
- 230000008018 melting Effects 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 238000000137 annealing Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000005096 rolling process Methods 0.000 claims abstract description 9
- 238000010008 shearing Methods 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims 1
- 239000004615 ingredient Substances 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 239000002932 luster Substances 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000003353 gold alloy Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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Abstract
本发明提供一种黄金靶材制备方法，涉及有色金属加工技术领域。该黄金靶材制备方法，按照质量百分比的化学组成为：黄金98％、黄铜0.5‑0.8％，青铜0.1‑0.2％、白铜0.1‑0.2％、白银0.5‑0.9％、锌0.1‑0.2％、铁0.1‑0.2％、钯0.1‑0.2％和铝0.1‑0.2％；包括以下具体步骤：S1.按照比例组成配料；S2.将黄金加热融化，再依次加入黄铜、青铜、白铜、白银、锌、铁、钯加热融化，最后加入铝精炼；S3.待各金属元素充分融合后，将合金熔液及浇筑至模具中，冷却后得到合金锭；S4.将上述合金锭依次经过退火、轧制、剪切以及表面处理后即得到所述的黄金靶材。通过以金属黄金作为主要基材，并添加适量其他金属材料，使该靶材呈黄色，相较于传统纯金材料，该靶材不仅色泽更加均匀、整体的亮度和硬度也更高，可以满足更多的市场需求。
Description
技术领域
本发明涉及有色金属加工技术领域，具体为一种黄金靶材制备方法。
背景技术
镀膜靶材是通过磁控溅射、多弧离子镀或其他类型的镀膜系统在适当工艺条件下溅射在基板上形成各种功能薄膜的溅射源。更换不同的靶材(如铝、铜、不锈钢、钛、镍靶等)，即可得到不同的膜系(如超硬、耐磨、防腐的合金膜等)。
黄金在很多金属制品领域都有广泛应用，尤其是各种高端装饰品以及装饰材料，目前市场上有多种不同类型的金合金材料，近年来，人们对装饰品的色彩多样性有了更多的需求，基于目前表面装饰金基材料的制备方法由传统的水镀电镀金合金制品工艺逐步过渡为先进的真空磁控溅射镀膜技术，一系列黄金靶材的开发，不但可以满足市场的需求，也可以丰富金基合金系列产品。
为此，我们研发出了新的一种黄金靶材制备方法。
发明内容
(一)解决的技术问题
针对现有技术的不足，本发明提供了一种黄金靶材制备方法，通过以金属黄金作为主要基材，并添加适量其他金属材料制得的黄金靶材，相较于传统纯金材料，该靶材不仅色泽更加均匀、整体的亮度和硬度也更高，可以满足更多的市场需求。
(二)技术方案
为实现以上目的，本发明通过以下技术方案予以实现：一种黄金靶材，按照质量百分比的化学组成为：黄金98％、黄铜0.5-0.8％，青铜0.1-0.2％、白铜0.1-0.2％、白银0.5-0.9％、锌0.1-0.2％、铁0.1-0.2％、钯0.1-0.2％和铝0.1-0.2％。
优选的，所述黄金靶材按照质量百分比的优选化学组成为：黄金98％、黄铜0.6％、青铜0.1％、白铜0.1％、白银0.8％、锌0.1％、铁0.1％、钯0.1％和铝0.1％。
优选的，所述黄金靶材色度值为：a*值为4.2-6.8,b*值为42.5-50.6,硬度值为180-203HV。
一种黄金靶材制备方法，包括以下具体步骤：
S1.按照黄金98％、黄铜0.6％、青铜0.1％、白铜0.1％、白银0.8％、锌0.1％、铁0.1％、钯0.1％和铝0.1％的比例组成配料；
S2.将黄金加热融化，再依次加入黄铜、青铜、白铜、白银、锌、铁、钯加热融化，最后加入铝精炼；
S3.待各金属元素充分融合后，将合金熔液及浇筑至模具中，冷却成型后即得到合金锭；
S4.将上述合金锭依次经过退火、轧制、剪切以及表面处理后即得到所述的黄金靶材。
优选的，所述S2中精炼的温度控制在950-980℃，精炼时间为15-20min。
优选的，所述S4中退火温度为450-500℃，退火时间为1-1.5h。
(三)有益效果
本发明提供了一种黄金靶材制备方法。具备以下有益效果：
1、该黄金靶材制备方法，通过以金属黄金作为主要基材，并添加适量其他金属材料，使该靶材呈黄色，相较于传统纯金材料，该靶材不仅色泽更加均匀、整体的亮度和硬度也更高，可以满足更多的市场需求。
2、该黄金靶材制备方法，通过采用简单的生产工工艺，可以快速制得质量更高，色泽更加丰富的金合金材料，不仅可以应用于各种高端装饰品，也可以应用于各种装饰材料以及多种生活用品的生产制造，其整体的应用范围更加广泛。
具体实施方式
下面将对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明实施例中采用的金属黄金的重量纯度≥99.99％、黄铜的重量纯度≥99.95％、青铜的重量纯度≥99.95％、白铜的重量纯度≥99.95％、白银的重量纯度≥99.99％、锌的重量纯度≥99.98％、铁的重量纯度≥99.99％、钯的重量纯度≥99.99％、铝的重量纯度≥99.98％。
本发明实施例中采用的加热炉为中频真空感应熔炼炉。
本发明实施例中精炼过程采用的熔炼坩埚为石墨坩埚。
本发明实施例中采用真空气体保护管式炉进行退火。
本发明实施例中采用300X1C8008-21EF滚剪机进行剪切。
本发明实施例中采用抛光机进行表面处理。
本发明实施例中采用美能达700d色差仪进行色度检测。
本发明实施例中制备的靶材尺寸为58X58X2.0mm。
下面结合具体的实施例对本发明做进一步详细说明，所述是对本发明的解释而不是限定。
实施例一：
按照黄金98％、黄铜0.6％、青铜0.1％、白铜0.1％、白银0.8％、锌0.1％、铁0.1％、钯0.1％和铝0.1％的比例组成配料；将黄金加热融化，再依次加入黄铜、青铜、白铜、白银、锌、铁、钯加热融化，最后加入铝精炼，精炼的温度控制在950-980℃，精炼时间为15-20min；待各金属元素充分融合后，将合金熔液及浇筑至模具中，冷却成型后即得到合金锭；将上述合金锭依次经过退火、轧制、剪切以及表面处理后即得到黄金靶材；该黄金靶材的色度值为：a*值为4.2-6.8,b*值为42.5-50.6,硬度值为180-203HV。
实施例二：
按照黄金98％、黄铜0.5％、青铜0.1％、白铜0.1％、白银0.9％、锌0.1％、铁0.1％、钯0.1％和铝0.1％的比例组成配料；将黄金加热融化，再依次加入黄铜、青铜、白铜、白银、锌、铁、钯加热融化，最后加入铝精炼，精炼的温度控制在940-960℃，精炼时间为15-18min；待各金属元素充分融合后，将合金熔液及浇筑至模具中，冷却成型后即得到合金锭；将上述合金锭依次经过退火、轧制、剪切以及表面处理后即得到黄金靶材；该黄金靶材的色度值为：a*值为4.5-7.2,b*值为44.3-52.1,硬度值为185-204HV。
实施例三：
按照黄金98％、黄铜0.5％、青铜0.2％、白铜0.2％、白银0.5％、锌0.1％、铁0.2％、钯0.2％和铝0.1％的比例组成配料；将黄金加热融化，再依次加入黄铜、青铜、白铜、白银、锌、铁、钯加热融化，最后加入铝精炼，精炼的温度控制在950-970℃，精炼时间为20-25min；待各金属元素充分融合后，将合金熔液及浇筑至模具中，冷却成型后即得到合金锭；将上述合金锭依次经过退火、轧制、剪切以及表面处理后即得到黄金靶材；该黄金靶材的色度值为：a*值为4.8-6.8,b*值为42.2-49.3,硬度值为195-212HV。
实施例四：
按照黄金98％、黄铜0.5％、青铜0.2％、白铜0.2％、白银0.5％、锌0.2％、铁0.1％、钯0.2％和铝0.1％的比例组成配料；将黄金加热融化，再依次加入黄铜、青铜、白铜、白银、锌、铁、钯加热融化，最后加入铝精炼，精炼的温度控制在950-970℃，精炼时间为20-23min；待各金属元素充分融合后，将合金熔液及浇筑至模具中，冷却成型后即得到合金锭；将上述合金锭依次经过退火、轧制、剪切以及表面处理后即得到黄金靶材；该黄金靶材的色度值为：a*值为4.8-7.0,b*值为45.2-53.7,硬度值为179-198HV。
实施例五：
按照黄金98％、黄铜0.7％、青铜0.1％、白铜0.1％、白银0.5％、锌0.2％、铁0.1％、钯0.1％和铝0.2％的比例组成配料；将黄金加热融化，再依次加入黄铜、青铜、白铜、白银、锌、铁、钯加热融化，最后加入铝精炼，精炼的温度控制在950-970℃，精炼时间为20-23min；待各金属元素充分融合后，将合金熔液及浇筑至模具中，冷却成型后即得到合金锭；将上述合金锭依次经过退火、轧制、剪切以及表面处理后即得到黄金靶材；该黄金靶材的色度值为：a*值为4.3-6.1,b*值为41.4-50.1,硬度值为177-189HV。
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由所附权利要求及其等同物限定。
Claims (6)
1.一种黄金靶材，其特征在于，按照质量百分比的化学组成为：黄金98％、黄铜0.5-0.8％，青铜0.1-0.2％、白铜0.1-0.2％、白银0.5-0.9％、锌0.1-0.2％、铁0.1-0.2％、钯0.1-0.2％和铝0.1-0.2％。
2.根据权利要求1所述的一种黄金靶材，其特征在于，所述黄金靶材按照质量百分比的优选化学组成为：黄金98％、黄铜0.6％、青铜0.1％、白铜0.1％、白银0.8％、锌0.1％、铁0.1％、钯0.1％和铝0.1％。
3.根据权利要求1所述的一种黄金靶材制备方法，其特征在于：所述黄金靶材色度值为：a*值为4.2-6.8,b*值为42.5-50.6,硬度值为180-203HV。
4.根据权利要求1-3中任意一项所述的一种黄金靶材制备方法，其特征在于，包括以下具体步骤：
S1.按照黄金98％、黄铜0.6％、青铜0.1％、白铜0.1％、白银0.8％、锌0.1％、铁0.1％、钯0.1％和铝0.1％的比例组成配料；
S2.将黄金加热融化，再依次加入黄铜、青铜、白铜、白银、锌、铁、钯加热融化，最后加入铝精炼；
S3.待各金属元素充分融合后，将合金熔液及浇筑至模具中，冷却成型后即得到合金锭；
S4.将上述合金锭依次经过退火、轧制、剪切以及表面处理后即得到所述的黄金靶材。
5.根据权利要求4所述的一种黄金靶材制备方法，其特征在于：所述S2中精炼的温度控制在950-980℃，精炼时间为15-20min。
6.根据权利要求4所述的一种黄金靶材制备方法，其特征在于：所述S4中退火温度为450-500℃，退火时间为1-1.5h。
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