CN114713973A - Laser cutting method, device, equipment and storage medium - Google Patents
Laser cutting method, device, equipment and storage medium Download PDFInfo
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- CN114713973A CN114713973A CN202210195189.9A CN202210195189A CN114713973A CN 114713973 A CN114713973 A CN 114713973A CN 202210195189 A CN202210195189 A CN 202210195189A CN 114713973 A CN114713973 A CN 114713973A
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 126
- 238000000034 method Methods 0.000 title claims abstract description 57
- 238000003860 storage Methods 0.000 title claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 267
- 238000006243 chemical reaction Methods 0.000 claims abstract description 29
- 238000004364 calculation method Methods 0.000 claims description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 238000004590 computer program Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The invention discloses a laser cutting method, a laser cutting device, laser cutting equipment and a storage medium, wherein the laser cutting method comprises the following steps: acquiring plane cutting parameters when a laser cutting head is vertical to a cutting surface of a workpiece; when a groove is cut, obtaining an included angle between a laser cutting head and a normal line of a cutting surface of a workpiece; calculating groove cutting parameters by combining the plane cutting parameters and the included angle through a preset conversion formula; and controlling the laser cutting head to move along a preset track according to the groove cutting parameters to complete groove cutting. The method can convert the groove cutting parameters of the corresponding angle only by inputting the set plane cutting parameters into the process parameter window of the groove laser cutting machine, and can complete groove cutting by adjusting the cutting parameters of the laser cutting head in real time, thereby effectively simplifying the setting process of the groove cutting parameters.
Description
Technical Field
The present invention relates to the field of laser cutting technologies, and in particular, to a laser cutting method, apparatus, device, and storage medium.
Background
In order to ensure the welding quality, the part to be welded of the welding piece is processed before welding, and the slope formed by processing is the groove. The groove can be processed by a laser groove cutting machine, and the cutting process needs to be carried out by controlling the cutting head to run corresponding tracks by a system to cut the corresponding groove. Compared with plane cutting, the control technology of groove cutting and the groove process method are complex, more cutting parameters need to be set, and otherwise, the groove cutting section effect cannot reach the optimal state.
Disclosure of Invention
In view of the defects of the prior art, the application provides a laser cutting method, a device, equipment and a storage medium, which can simplify the cutting parameter setting process during groove cutting.
The embodiment adopts the following technical scheme:
a laser cutting method comprising the steps of:
acquiring plane cutting parameters when a laser cutting head is vertical to a cutting surface of a workpiece;
when a groove is cut, acquiring the angle of an included angle between a laser cutting head and the normal of the cutting surface of a workpiece;
calculating the groove cutting parameters by combining the plane cutting parameters and the included angle through a preset conversion formula;
and controlling the laser cutting head to move along a preset track according to the groove cutting parameters to complete groove cutting.
Further, in the laser cutting method, the preset conversion formula includes:
V1＝V0*cos|θ|*cos|θ|；
wherein, V0For the cutting speed, V, of the laser cutting head in the plane cutting parameters1The cutting speed of the laser cutting head in the groove cutting parameters is shown, and theta is an included angle between the laser cutting head and the normal line of the cutting surface of the workpiece.
Further, in the laser cutting method, the preset conversion formula includes:
W1＝W0/(cos|θ|*cos|θ|)；
wherein, W0For the cutting power of the laser cutting head in the plane cutting parameters, W1The cutting power of the laser cutting head in the groove cutting parameters is shown, and theta is an angle of an included angle between the laser cutting head and a normal line of a cutting surface of the workpiece.
Further, in the laser cutting method, the preset conversion formula includes:
P1＝P0+0.45bar+0.45sin(4|θ|-90°)bar；
wherein, P0For cutting air pressure of the nozzle in the plane cutting parameters, P1Is the cutting air pressure of the nozzle in the groove cutting parameters, and theta is the angle of an included angle between the laser cutting head and the normal line of the cutting surface of the workpiece.
Further, in the laser cutting method, the preset conversion formula includes:
F1＝F0，H1＝H0；
wherein, F0For the focal position of the laser cutting head in the plane cutting parameters, F1For the focal position of the laser cutting head in the groove cutting parameters, H0For the height of the nozzle in the plane cutting parameters, H1Is the height of the nozzle in the groove cutting parameters.
Further, in the laser cutting method, the step of obtaining an angle between a laser cutting head and a normal of a cutting surface of a workpiece during groove cutting includes:
and when the groove is cut, reading a program processing instruction in real time, and acquiring the angle of an included angle between the laser cutting head and the normal line of the cutting surface of the workpiece from the program processing instruction.
Further, in the laser cutting method, the step of controlling the laser cutting head to move along a preset track according to the groove cutting parameters includes:
the groove cutting of the laser cutting head is assisted by spraying oxygen through a nozzle which is coaxial with the laser cutting head.
A cutting control device comprising:
the parameter acquisition module is used for acquiring plane cutting parameters when the laser cutting head is vertical to the cutting surface of the workpiece;
the angle acquisition module is used for acquiring the angle of an included angle between the laser cutting head and the normal of the cutting surface of the workpiece;
the parameter calculation module is used for calculating the groove cutting parameters through a preset conversion formula according to the plane cutting parameters and the included angle;
and the cutting module is used for controlling the laser cutting head to move along a preset track according to the groove cutting parameters so as to complete groove cutting.
A cutting control apparatus comprising a memory having a computer program stored therein and a processor which, when executed, implements a laser cutting method as in any one of the above.
A computer readable storage medium having computer executable instructions stored thereon, the computer executable instructions being arranged to perform a laser cutting method as claimed in any one of the preceding claims.
Compared with the prior art, the laser cutting method, the device, the equipment and the storage medium provided by the invention can convert the groove cutting parameters of the corresponding angle by inputting the set plane cutting parameters into the process parameter window of the groove laser cutting machine, and can complete groove cutting by adjusting the cutting parameters of the laser cutting head in real time, thereby effectively simplifying the setting process of the groove cutting parameters.
Drawings
Fig. 1 is a flowchart of a laser cutting method provided in the present application.
Fig. 2 is a block diagram of a laser cutting apparatus provided in the present application.
Fig. 3 is a block diagram of a laser cutting apparatus provided in the present application.
Detailed Description
In order to make the purpose, technical solution and effect of the present application clearer and clearer, the present application is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific examples described herein are intended merely to illustrate the application and are not intended to limit the application, as elements, structures and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
Laser cutting is a cutting process in which a laser light source is generated by a fiber laser and irradiated to the surface of a workpiece through a laser cutting head, so that the surface of the workpiece is rapidly melted, and simultaneously, the melted material is oxidized or blown off with the aid of an auxiliary gas blown coaxially with the laser beam, thereby forming a cut of a desired shape on the workpiece. The laser cutting has the advantages of large and concentrated spot energy, small deformation caused by cutting a workpiece, smooth cutting surface without slag adhering, basically no need of subsequent processing treatment of the cut workpiece and the like.
The laser groove cutting machine is suitable for engineering welding, ship manufacturing and other industries. The cutting process of the groove cutting machine needs to control the laser cutting head to move along the cutting track by the control system so as to form a corresponding groove on the workpiece. However, the control technology and the groove process method of the laser groove cutting machine are complex, more windows need to be arranged on a process parameter interface, and different groove cutting process parameters need to be manually adjusted and input according to the included angle of groove cutting.
During groove cutting, the included angle between the laser cutting head and the cutting surface is generally 0-45 degrees. The common cutting process parameter setting is to divide a groove with the angle of 0-45 degrees into three cutting layers, for example, a process parameter A for groove cutting is set when the included angle is 0-15 degrees, a process parameter B for groove cutting is set when the included angle is 15-30 degrees, a process parameter C for groove cutting is adopted when the included angle is 30-45 degrees, the process parameters A, B, C need to be manually debugged and then filled into windows corresponding to the process parameters, the number of process parameter windows is large, requirements on equipment research and development and operators are high, and equipment use is more complex.
In addition, when the groove is cut, the same constant groove cutting parameter is used at the similar included angle, so that the groove cutting section effect can not reach the optimal state.
Referring to fig. 1, the laser cutting method provided in the present application includes the steps of:
s100, acquiring plane cutting parameters when a laser cutting head is vertical to a cutting surface of a workpiece;
s200, recording the angle of an included angle between a laser cutting head and the normal of the cutting surface of the workpiece when the groove is cut;
s300, calculating groove cutting parameters by combining the plane cutting parameters and the included angle through a preset conversion formula;
s400, controlling the laser cutting head to move along a preset track according to the groove cutting parameters to complete groove cutting.
When the laser cutting head is perpendicular to the cutting surface of the workpiece, the laser cutting head is in a basically plane straight cutting state, and the cutting surface of the workpiece generally refers to the upper surface of the workpiece. When the groove needs to be cut on the workpiece, the laser cutting head can rotate by a certain angle and is aligned to the edge part of the workpiece, and a certain included angle is formed between the laser cutting head and the cutting surface of the workpiece.
Because the cutting attitude of the laser cutting head when the laser cutting head performs plane straight cutting and groove cutting on the workpiece changes, the cutting effect of the laser cutting beam on the workpiece also changes accordingly. The cutting parameters of the laser cutting head need to be adjusted correspondingly, otherwise, good and consistent cutting effects cannot be achieved on the groove cutting section and the plane straight cutting section.
According to the method, simulation research and calculation are carried out on the process big data of groove cutting with different powers and different angles, a preset conversion formula is provided, and after the angle of the included angle between the laser cutting head and the normal line of the cutting surface of the workpiece is obtained (the plane direct cutting state of the laser cutting head is a special state when the included angle is 0), the plane cutting parameters are converted into the groove cutting parameters through the preset conversion formula, so that the process parameter setting step is simplified.
Therefore, the groove cutting parameters of the corresponding angle can be obtained through conversion only by inputting the set plane cutting parameters into a process parameter window of the groove laser cutting machine, and the cutting parameters of the laser cutting head are adjusted in real time through the control system, so that the laser cutting head moves along the preset groove cutting track according to the groove cutting parameters, and the groove cutting can be completed.
In step S100, the control system may obtain the planar cutting parameters by acquiring the manually input information, or may preset the planar cutting parameters in the corresponding cutting mode in the control system. The planar cutting parameters may include the speed of the laser cutting head, the power of the laser cutting head, the focal point of the laser cutting head, the cutting air pressure of the nozzle, the height of the nozzle, and the like.
In step S200, a program processing instruction of the apparatus during processing may be read in real time by the controller, and the included angle θ between the laser cutting head and the normal direction may be obtained from the program processing instruction.
Specifically, when the cutting head is machined, the controller reads CALL LASER ON from a program instruction in real time, reads THETA THETA of the next line, the THETA value is the included angle THETA value between the cutting head and the normal direction, the controller controls the cutting head to change into an angle THETA with the normal direction in real time to perform groove movement, and meanwhile the controller performs cutting planned by the instruction by using a groove cutting parameter value calculated by using a preset conversion formula. When the controller reads CALL LASER OFF in real time, the cutting head returns to the original vertical state (i.e. θ is 0).
In step S300, the preset conversion formula includes a calculation formula of a cutting speed in groove cutting, that is:
V1＝V0*cos|θ|*cos|θ|；
wherein, V0For the cutting speed, V, of the laser cutting head in the plane cutting parameters1The cutting speed of the laser cutting head in the groove cutting parameters is shown, and theta is an included angle between the laser cutting head and the normal line of the cutting surface of the workpiece. Is the absolute value of the included angle theta due to the included angle thetaSince there are both positive and negative cases, the absolute value | θ | of the angle θ is calculated.
The preset conversion formula also comprises a calculation formula of cutting power of groove cutting, namely:
W1＝W0/(cos|θ|*cos|θ|)；
wherein, W0For the cutting power of the laser cutting head in the plane cutting parameters, W1The cutting power of the laser cutting head in the groove cutting parameters is shown, and theta is an angle of an included angle between the laser cutting head and a normal line of a cutting surface of the workpiece. When W is obtained1Is greater than the rated power W of the lasermaxWhen, then define Wmax＝W1Ensuring that the laser operates at rated power.
The preset conversion formula also comprises a calculation formula of the cutting air pressure of groove cutting, namely:
P1＝P0+0.45bar+0.45sin(4|θ|-90°)bar；
wherein, P0For cutting air pressure of the nozzle in the plane cutting parameters, P1The cutting air pressure of a nozzle in the groove cutting parameters is shown, theta is the angle of an included angle between a laser cutting head and the normal line of the cutting surface of the workpiece, and 0.45bar is 45 kPa.
The preset conversion formula also comprises a calculation formula of the focal position of groove cutting and the height of the nozzle, namely:
F1＝F0，H1＝H0；
wherein, F0For the focal position of the laser cutting head in the plane cutting parameters, F1For the focal position of the laser cutting head in the groove cutting parameters, H0For the height of the nozzle in the plane cutting parameters, H1Is the height of the nozzle in the groove cutting parameters. In the groove cutting process, the technological factors of cutting focus and nozzle height are basically consistent with the plane cutting process, so that the focus position of the laser cutting head and the nozzle height can be kept unchanged.
After the calculation is finished, the control system adjusts the speed of the laser cutting head, the power of the laser cutting head, the focus of the laser cutting head, the cutting air pressure of the nozzle and the height of the nozzle in real time according to the calculated groove cutting parameters, then controls the laser cutting head to move according to a preset cutting track, and further forms a required groove on the workpiece.
In step S400, oxygen may be ejected through a nozzle coaxially disposed with the laser cutting head to achieve the purpose of oxidizing and fluxing and assist in cutting the bevel of the laser cutting head. I.e. the assist gas during cutting can be selected as oxygen to better match the above calculation formula.
The preset conversion formula is used for carrying out analog calculation on the process big data of the groove cutting with different powers and different angles, and the obtained new process data is good in accuracy and high in stability. In order to illustrate the calculation effect of the preset conversion formula, two specific embodiments are described below, in which, for the laser groove cutting machines of 12000W and 20000W, when the auxiliary cutting gas is oxygen, the reference standard value of the plate to be cut and the parameter value calculated by using the preset conversion formula are compared.
The reference standard for cutting the plate by the laser groove cutting machine of 12000W and the parameter values calculated by using a formula are compared as follows:
firstly, calculating cutting speed comparison by referring to the cutting speed and a formula:
TABLE 1 standard cutting speed reference value (mm/min) of 12000W laser groove cutting machine
TABLE 2 12000W laser groove cutter formula calculation speed (mm/min)
By comparing table 1 and table 2, it can be seen that when the 12000W laser groove cutting machine is adopted, the preset conversion formula is adoptedV1＝V0And the groove cutting speed value calculated by cos | theta | is close to the standard cutting speed reference value.
Secondly, calculating the cutting power comparison by referring to the cutting power and a formula:
TABLE 3 Standard cutting Power reference (W) of 12000W laser groove cutter
TABLE 4 12000W laser groove cutter formula calculation power (W)
By comparing tables 3 and 4, it can be seen that when the 12000W laser groove cutting machine is adopted, the formula W is converted by presetting1＝W0And/or (cos | theta |) the calculated value of the groove cutting power is close to the standard cutting power reference value.
Thirdly, calculating the cutting air pressure contrast by referring to the cutting air pressure and a formula:
TABLE 5 standard cutting air pressure reference value (bar) of 12000W laser groove cutting machine
TABLE 6 formula calculation of cutting air pressure (bar) for 12000W laser groove cutting machine
By comparing tables 5 and 6, it can be seen that when the 12000W laser groove cutting machine is adopted, the formula P is converted by presetting1＝P0And the groove cutting air pressure value calculated by +0.45bar +0.45sin (4| theta | -90 ℃) bar is close to the standard cutting air pressure reference value.
The reference standard of the 20000W laser groove cutting machine for cutting the plate is compared with the parameter values calculated by using a formula as follows:
firstly, calculating cutting speed comparison by referring to the cutting speed and a formula:
TABLE 7 standard cutting speed reference value (mm/min) of 20000W laser groove cutting machine
TABLE 8 calculation speed of 20000W laser groove cutter formula (mm/min)
By comparing table 7 and table 8, it can be seen that when the 20000W laser groove cutting machine is adopted, the formula V is converted by presetting1＝V0And the groove cutting speed value calculated by cos | theta | is within the standard cutting speed reference value.
Secondly, calculating the cutting power comparison by referring to the cutting power and a formula:
TABLE 9, 20000W Standard cutting Power reference (W) for laser groove cutter
TABLE 10 20000W laser groove cutter formula calculation power (W)
By comparing table 9 and table 10, it can be seen that when the 20000W laser groove cutting machine is used, the formula W is converted by presetting1＝W0And/(cos thetaji) the groove cutting power value calculated approaches the standard cutting power reference value.
Thirdly, calculating the cutting air pressure contrast by referring to the cutting air pressure and a formula:
TABLE 11 Standard cutting air pressure reference value (bar) of 20000W laser groove cutting machine
TABLE 12, 20000W laser groove cutter formula calculation cutting air pressure (bar)
By comparing tables 11 and 12, it can be seen that the preset conversion formula P is used when the 12000W laser groove cutting machine is adopted1＝P0And the groove cutting air pressure value calculated by +0.45bar +0.45sin (4| theta | -90 ℃) bar is close to the standard cutting air pressure reference value.
Therefore, the preset conversion formula for calculating the groove cutting parameters of different angles according to the plane direct cutting process parameters disclosed by the application can give consideration to the relations among the laser grooves, the focal points, the air pressure, the plate thickness and the like, so that the process parameter adjusting window is simplified, and the use stability of equipment is improved. By the laser cutting method, the consistency of the groove cutting section and the straight cutting section can be improved, the cutting efficiency is improved, the stability of groove cutting is greatly improved, and the process parameter adjusting window is simplified.
In addition, referring to fig. 2, the present application further provides a laser cutting apparatus, including:
10. the parameter acquisition module is used for acquiring plane cutting parameters when the laser cutting head is vertical to the cutting surface of the workpiece;
20. the included angle acquisition module is used for acquiring the included angle between the laser cutting head and the normal line of the cutting surface of the workpiece;
30. the parameter calculation module is used for calculating the groove cutting parameters through a preset conversion formula according to the plane cutting parameters and the included angle;
40. and the cutting module is used for controlling the laser cutting head to move along a preset track according to the groove cutting parameters so as to complete groove cutting.
The present application also provides a non-transitory computer-readable storage medium having stored thereon computer-executable instructions configured to perform the laser cutting method of the above embodiments.
Referring to fig. 3, the present application further provides a mechanical cutting apparatus, including: at least one central processing unit a1(processor), exemplified by a central processing unit a1 in fig. 3; a memory a2 (memory); display a3, a Communications Interface (Communications Interface), and a bus may also be included. The central processing unit A1, the memory A2, the display screen A3 and the communication interface can complete mutual communication through a bus; the display screen A3 is set to display a user operation interface preset in an initial setting mode, and meanwhile, the display screen A3 can also display a process control window; the communication interface can transmit information; the central processor a1 may call logic instructions in the memory a2 to perform the methods in the embodiments described above.
The Central Processing Unit a1 may be a Central Processing Unit (CPU), and the Processor a1 may also be other general purpose processors, Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field-Programmable Gate arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components, etc.
In addition, the logic instructions in the memory a2 may be implemented in the form of software functional units and stored in a computer readable storage medium when the logic instructions are sold or used as independent workpieces.
The memory a2 is a computer readable storage medium and can be configured to store software programs, computer executable programs, such as program instructions or modules corresponding to the methods in the embodiments of the present application. The central processor a1 executes functional applications and data processing by executing software programs, instructions or modules stored in the memory a2, that is, implements the methods in the above embodiments.
The memory a2 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created according to the use of the terminal device, and the like. Further, memory A2 may include high speed random access memory, and may also include non-volatile memory.
All or part of the steps of the above embodiments may be implemented by hardware, or may be implemented by a program instructing related hardware, where the program may be stored in a computer-readable storage medium, and the storage medium may be a non-transitory storage medium, and includes various media that can store program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, an optical disk, and so on, and may also be a transitory storage medium.
It should be understood that equivalents and modifications of the technical solution and inventive concept thereof may occur to those skilled in the art, and all such modifications and alterations should fall within the scope of the appended claims.
Claims (10)
1. A laser cutting method, comprising the steps of:
acquiring plane cutting parameters when a laser cutting head is vertical to a cutting surface of a workpiece;
when a groove is cut, the included angle between the laser cutting head and the normal line of the cutting surface of the workpiece is obtained;
calculating the groove cutting parameters by combining the plane cutting parameters and the included angle through a preset conversion formula;
and controlling the laser cutting head to move along a preset track according to the groove cutting parameters to complete groove cutting.
2. The laser cutting method of claim 1, wherein the preset conversion formula comprises:
V1＝V0*cos|θ|*cos|θ|；
wherein, V0For the cutting speed, V, of the laser cutting head in the plane cutting parameters1And theta is the cutting speed of the laser cutting head in the groove cutting parameters, and theta is the angle of an included angle between the laser cutting head and the normal line of the cutting surface of the workpiece.
3. The laser cutting method according to claim 1, wherein the preset conversion formula comprises:
W1＝W0/(cos|θ|*cos|θ|)；
wherein, W0For the cutting power of the laser cutting head in the plane cutting parameters, W1The cutting power of the laser cutting head in the groove cutting parameters is shown, and theta is an angle of an included angle between the laser cutting head and a normal line of a cutting surface of the workpiece.
4. The laser cutting method according to claim 1, wherein the preset conversion formula comprises:
P1＝P0+0.45bar+0.45sin(4|θ|-90°)bar；
wherein, P0For cutting air pressure of the nozzle in the plane cutting parameters, P1Is the cutting air pressure of the nozzle in the groove cutting parameters, and theta is the angle of an included angle between the laser cutting head and the normal line of the cutting surface of the workpiece.
5. The laser cutting method according to claim 1, wherein the preset conversion formula comprises:
F1＝F0，H1＝H0；
wherein, F0For the focal position of the laser cutting head in the plane cutting parameters, F1For the focal position of the laser cutting head in the groove cutting parameters, H0For the height of the nozzle in the plane cutting parameters, H1Is the height of the nozzle in the groove cutting parameters.
6. The laser cutting method according to claim 1, wherein the step of obtaining the angle between the laser cutting head and the normal of the cutting surface of the workpiece when cutting the groove comprises:
and when the groove is cut, reading a program processing instruction in real time, and acquiring the angle of an included angle between the laser cutting head and the normal line of the cutting surface of the workpiece from the program processing instruction.
7. The laser cutting method of claim 1, wherein the step of controlling the laser cutting head to move along the preset track with the groove cutting parameters comprises:
the groove cutting of the laser cutting head is assisted by spraying oxygen through a nozzle which is coaxial with the laser cutting head.
8. A cutting control device, comprising:
the parameter acquisition module is used for acquiring plane cutting parameters when the laser cutting head is vertical to the cutting surface of the workpiece;
the angle acquisition module is used for acquiring the angle of an included angle between the laser cutting head and the normal of the cutting surface of the workpiece;
the parameter calculation module is used for calculating the groove cutting parameters through a preset conversion formula according to the plane cutting parameters and the included angle;
and the cutting module is used for controlling the laser cutting head to move along a preset track according to the groove cutting parameters to complete groove cutting.
9. A cutting control apparatus comprising a memory in which a computer program is stored and a processor which, when executed, implements a laser cutting method as claimed in any one of claims 1 to 7.
10. A computer-readable storage medium having computer-executable instructions stored thereon, the computer-executable instructions configured to perform the laser cutting method of any one of claims 1 to 7.
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| JP2005021932A (en) * | 2003-06-30 | 2005-01-27 | Nissan Tanaka Corp | Laser cutting method, and laser cutting device |
| CN109702361A (en) * | 2019-03-27 | 2019-05-03 | 佛山市宏石激光技术有限公司 | A kind of laser bevel cutting method and laser cutting machine |
| US20200246920A1 (en) * | 2018-03-26 | 2020-08-06 | Panasonic Intellectual Property Management Co., Ltd. | Laser cutting device and laser cutting method |
| CN112975164A (en) * | 2021-04-29 | 2021-06-18 | 湖南大捷智能装备有限公司 | Laser cutting method and laser cutting platform |
| CN114952026A (en) * | 2022-03-22 | 2022-08-30 | 大族激光科技产业集团股份有限公司 | Groove cutting compensation method, computer readable storage medium and machining device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005021932A (en) * | 2003-06-30 | 2005-01-27 | Nissan Tanaka Corp | Laser cutting method, and laser cutting device |
| US20200246920A1 (en) * | 2018-03-26 | 2020-08-06 | Panasonic Intellectual Property Management Co., Ltd. | Laser cutting device and laser cutting method |
| CN109702361A (en) * | 2019-03-27 | 2019-05-03 | 佛山市宏石激光技术有限公司 | A kind of laser bevel cutting method and laser cutting machine |
| CN112975164A (en) * | 2021-04-29 | 2021-06-18 | 湖南大捷智能装备有限公司 | Laser cutting method and laser cutting platform |
| CN114952026A (en) * | 2022-03-22 | 2022-08-30 | 大族激光科技产业集团股份有限公司 | Groove cutting compensation method, computer readable storage medium and machining device |
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