CN108436278A - Super large breadth three-dimensional laser engraving process and system - Google Patents
Super large breadth three-dimensional laser engraving process and system Download PDFInfo
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- CN108436278A CN108436278A CN201810076851.2A CN201810076851A CN108436278A CN 108436278 A CN108436278 A CN 108436278A CN 201810076851 A CN201810076851 A CN 201810076851A CN 108436278 A CN108436278 A CN 108436278A
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- laser engraving
- laser
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- microscope carrier
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to a kind of super large breadth three-dimensional laser engraving processes and system, this method to include：Laser control system obtains the three-dimensional data and laser engraving parameter of object or object module to be carved；The laser engraving parameter includes speed parameter；According to laser engraving parameter, microscope carrier kinematic parameter is calculated；The microscope carrier kinematic parameter includes microscope carrier movement speed and step pitch；Start laser control system and carry out laser engraving, and based on microscope carrier kinematic parameter control microscope carrier movement, so that the probe breadth of the laser control system covers the laser processing line or machined surface of the object to be carved or object module always.The present invention is by linking object to be carved and laser running orbit, remain that laser is processed in continuous light extraction, each processing line is all uninterrupted, avoid the seam problems caused by splicing, it is finally obtained smooth complete finished surface, realizes the super large breadth three-dimensional laser engraving of higher precision.
Description
Technical field
The invention belongs to laser three-D marking technique field more particularly to a kind of super large breadth three-dimensional laser engraving process and
System.
Background technology
With the rapid development of laser application technique, industrial lasers will be used wider and wider, and laser marking, laser are cut
Cut, laser welding etc. all already belongs to ripe and is widely applied technique, be widely used in the industrial processes of all trades and professions, and
Along with the continuous upgrading and the continuous development of photoelectron technology of industry, the application range of three-dimensional laser marking technology is increasingly
Extensively, required precision is also higher and higher.
Three-dimensional laser marking processing is based on traditional numeric-control technology, using laser as process medium, controllable
Laser irradiation makes machined material transient evaporation or fusing on machined material, by the high energy flow characteristic of laser, to real
Existing processing purpose.
In existing industrial lasers application, the control to laser is to coordinate F-Theta field lenses to realize by laser scanning head
What positioning focused, therefore, final laser can process breadth and all have certain limitations, when in face of overlength degree process requirements, usually
Way be that the laser processing of more large format is realized using the method for splicing, i.e., by the mobile segmental machining of microscope carrier, i.e., first
Laser engraving is carried out within the scope of laser scanning head breadth, then stops laser, mobile microscope carrier, then last time marking end progress
The engraving of next breadth unit is finished until by entire object engraving, can connecing in two breadths in this processing method
Occur apparent joint seam trace at seam, be unable to reach smooth complete finished surface, cannot be satisfied have to surface flatness it is higher
It is required that demand.
Invention content
The object of the present invention is to provide a kind of super large breadth three-dimensional laser engraving process and system, for overlength degree object,
When marking by the calculating control to laser motion track and microscope carrier movement locus, to reach, laser is continual continuously to be added
Work, to eliminate the presence for processing seam caused by laser scanning head processes joining method used by breadth limits, with reality
Now more accurate three-dimensional laser processing obtains the three-dimensional surface of complete and smooth.
The present invention provides a kind of super large breadth three-dimensional laser engraving processes, including：
Laser control system obtains the three-dimensional data and laser engraving parameter of object or object module to be carved；Wherein,
Laser engraving parameter includes speed parameter；
According to laser engraving parameter, microscope carrier kinematic parameter is calculated；Wherein, microscope carrier kinematic parameter include microscope carrier movement speed and
Step pitch；
Start laser control system and carry out laser engraving, and based on the control microscope carrier movement of microscope carrier kinematic parameter, so that laser
The probe breadth of control system covers the laser processing line or machined surface of object or object module to be carved always.
Further, laser engraving parameter further includes depth parameter and kerf quality parameter.
Further, microscope carrier movement passes through stepper motor or Serve Motor Control.
Further, laser engraving includes treating the surface progress three dimensional sculpture of engraving object and being carried out to object module
Three dimensional sculpture.
The present invention also provides a kind of super large breadth three-dimensional laser engraving systems, including：
Laser engraving control unit, for according to acquisition take object or object module to be carved three-dimensional data and swash
Light carves parameter and carries out laser engraving；Wherein, laser engraving parameter includes speed parameter；
Microscope carrier motion control unit, for while laser engraving, being moved based on microscope carrier kinematic parameter control microscope carrier, with
The probe breadth of laser engraving control unit is set to cover laser processing line or the processing of object or object module to be carved always
Face；Wherein, microscope carrier kinematic parameter is calculated according to laser engraving parameter and is obtained, including microscope carrier movement speed and step pitch.
Further, laser engraving parameter further includes depth parameter and kerf quality parameter.
Further, microscope carrier motion control unit is moved by stepper motor or Serve Motor Control microscope carrier.
Further, laser engraving includes treating the surface progress three dimensional sculpture of engraving object and being carried out to object module
Three dimensional sculpture.
According to the above aspect of the present invention, by super large breadth three-dimensional laser engraving process and system, object to be carved and laser are transported
Row track is linked, and remains that laser is processed in continuous light extraction, and each processing line is all uninterrupted, is avoided caused by splicing
Seam problems are finally obtained smooth complete finished surface, realize the super large breadth three-dimensional laser engraving of higher precision.
Above description is only the general introduction of technical solution of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, below with presently preferred embodiments of the present invention and after coordinating attached drawing to be described in detail such as.
Description of the drawings
Fig. 1 is the schematic diagram that super large breadth three-dimensional laser engraving is carried out using the present invention.
Specific implementation mode
With reference to the accompanying drawings and examples, the specific implementation mode of the present invention is described in further detail.Implement below
Example is not limited to the scope of the present invention for illustrating the present invention.
A kind of super large breadth three-dimensional laser engraving process is present embodiments provided, including：
Laser control system obtains the three-dimensional data and laser engraving parameter of object or object module to be carved；Wherein,
Laser engraving parameter includes speed parameter；
According to laser engraving parameter, microscope carrier kinematic parameter is calculated；Wherein, microscope carrier kinematic parameter include microscope carrier movement speed and
Step pitch；
Start laser control system and carry out laser engraving, and based on the control microscope carrier movement of microscope carrier kinematic parameter, so that laser
The probe breadth of control system covers the laser processing line or machined surface of object or object module to be carved always.
By the super large breadth three-dimensional laser engraving process, the present invention solves super large breadth three-dimensional marking and is swept by laser
A problem of breadth limitation is unable to Continuous maching is retouched, can realize that the continuous of the super large object limited beyond probe breadth adds
Work can obtain smooth complete marking surface, avoid splicing and lead due to maintaining laser continuously continual processing
The marking seam problems of cause, disclosure satisfy that the demand having higher requirements to surface flatness.
The present embodiment additionally provides a kind of super large breadth three-dimensional laser engraving system, including：
Laser engraving control unit, for according to acquisition take object or object module to be carved three-dimensional data and swash
Light carves parameter and carries out laser engraving；Wherein, laser engraving parameter includes speed parameter；
Microscope carrier motion control unit, for while laser engraving, being moved based on microscope carrier kinematic parameter control microscope carrier, with
The probe breadth of laser engraving control unit is set to cover laser processing line or the processing of object or object module to be carved always
Face；Wherein, microscope carrier kinematic parameter is calculated according to laser engraving parameter and is obtained, including microscope carrier movement speed and step pitch.
By the super large breadth three-dimensional laser engraving system, the present invention solves super large breadth three-dimensional marking and is swept by laser
A problem of breadth limitation is unable to Continuous maching is retouched, can realize that the continuous of the super large object limited beyond probe breadth adds
Work can obtain smooth complete marking surface, avoid splicing and lead due to maintaining laser continuously continual processing
The marking seam problems of cause, disclosure satisfy that the demand having higher requirements to surface flatness.
Invention is further described in detail below.
Join shown in Fig. 1, present embodiments provides a kind of super large breadth three-dimensional laser engraving process, this method is using general
Laser marking principle generates laser beam 3 by the laser scanning head 2 of laser, is expanded through beam positioning systems, focuses on workbench
In be in the object to be carved 1 of focal plane position, the three-dimensional data of target piece is imported into laser control system, by laser scanning
First 2 X or Y-direction running orbit and range is combined with object microscope carrier X or Y-direction movement locus, by laser beam 3 and microscope carrier fortune
The compensation of dynamic mutual alignment links (running orbit that arrow direction indicates object 1 to be carved in Fig. 1), and laser beam 3 is made to treat
Carve the continuous continual processing of object 1, you can realization reaches continuous laser processing line or added in the engraving of super-long object
Work face to realize the one-pass molding carved to super-long object three-dimensional laser, and obtains smooth complete finished surface.It is specific
Implementation steps include：
1) three-dimensional data of object to be carved or object module is imported into index carving system；
2) determine that the parameter of laser engraving, emphasis are speed parameters according to technological requirement；
3) parameters such as microscope carrier movement speed, step pitch are calculated according to laser engraving parameter；
4) it opens laser to be carved, and controls microscope carrier movement simultaneously, then when processed object exceeds probe breadth
It is compensated by microscope carrier movement, makes laser focus point can be with Continuous maching, the final three dimensional sculpture realized to the object of super large breadth.
Treated in the present embodiment step 1) engraving object engraving, can be the engraving to threedimensional model, can also be
The laser index carving that threedimensional model surface carries out.
In the present embodiment step 2), determine that laser engraving parameter includes to obtain the mark for reaching requirement according to technological requirement
Carve the parameters such as (engraving) speed, depth, kerf quality.
In the present embodiment step 3), it can also be servo motor form that the control of microscope carrier movement, which can be stepper motor form,
Or other motion control forms.
In the present embodiment step 4), realization is to the laser that the three dimensional sculpture of the object of super large breadth can be to threedimensional model
Engraving, can also be to the three-dimensional marking on three-dimensional object surface.
It should be noted that the laser controlling applied in the present embodiment, data processing and the operation of motion control can adopt
It is realized with the prior art.
The present embodiment, by controlling microscope carrier, object to be carved and laser running orbit is linked, remained in engraving
Laser is processed in continuous light extraction, and each processing line is all uninterrupted, is avoided the seam problems caused by splicing, is finally obtained
Smooth complete finished surface realizes the super large breadth three-dimensional laser engraving of higher precision.
The above is only a preferred embodiment of the present invention, it is not intended to restrict the invention, it is noted that for this skill
For the those of ordinary skill in art field, without departing from the technical principles of the invention, can also make it is several improvement and
Modification, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (8)
1. a kind of super large breadth three-dimensional laser engraving process, which is characterized in that including：
Laser control system obtains the three-dimensional data and laser engraving parameter of object or object module to be carved；Wherein, described
Laser engraving parameter includes speed parameter；
According to laser engraving parameter, microscope carrier kinematic parameter is calculated；Wherein, the microscope carrier kinematic parameter include microscope carrier movement speed and
Step pitch；
Start laser control system and carry out laser engraving, and based on microscope carrier kinematic parameter control microscope carrier movement, so that described
The probe breadth of laser control system covers the laser processing line or machined surface of the object to be carved or object module always.
2. super large breadth three-dimensional laser engraving process according to claim 1, which is characterized in that the laser engraving parameter
Further include depth parameter and kerf quality parameter.
3. super large breadth three-dimensional laser engraving process according to claim 1, which is characterized in that the microscope carrier movement passes through
Stepper motor or Serve Motor Control.
4. super large breadth three-dimensional laser engraving process according to claim 1, which is characterized in that the laser engraving includes
Three dimensional sculpture is carried out to the surface of the object to be carved and three dimensional sculpture is carried out to the object module.
5. a kind of super large breadth three-dimensional laser engraving system, which is characterized in that including：
Laser engraving control unit, for taking the three-dimensional data of object or object module to be carved and laser to carve according to acquisition
It carves parameter and carries out laser engraving；Wherein, the laser engraving parameter includes speed parameter；
Microscope carrier motion control unit, for while laser engraving, being moved based on microscope carrier kinematic parameter control microscope carrier, so that institute
State laser engraving control unit probe breadth cover always the object to be carved or object module laser processing line or
Machined surface；Wherein, the microscope carrier kinematic parameter is calculated according to the laser engraving parameter and is obtained, including microscope carrier movement speed and step
Away from.
6. super large breadth three-dimensional laser engraving system according to claim 5, which is characterized in that the laser engraving parameter
Further include depth parameter and kerf quality parameter.
7. super large breadth three-dimensional laser engraving system according to claim 5, which is characterized in that the microscope carrier motion control
Unit is moved by stepper motor or Serve Motor Control microscope carrier.
8. super large breadth three-dimensional laser engraving system according to claim 5, which is characterized in that the laser engraving includes
Three dimensional sculpture is carried out to the surface of the object to be carved and three dimensional sculpture is carried out to the object module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810076851.2A CN108436278A (en) | 2018-01-26 | 2018-01-26 | Super large breadth three-dimensional laser engraving process and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810076851.2A CN108436278A (en) | 2018-01-26 | 2018-01-26 | Super large breadth three-dimensional laser engraving process and system |
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| Publication Number | Publication Date |
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| CN108436278A true CN108436278A (en) | 2018-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810076851.2A Pending CN108436278A (en) | 2018-01-26 | 2018-01-26 | Super large breadth three-dimensional laser engraving process and system |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109570779A (en) * | 2018-12-29 | 2019-04-05 | 大族激光科技产业集团股份有限公司 | A kind of laser processing and laser-processing system |
| CN109671146A (en) * | 2018-12-27 | 2019-04-23 | 东莞市誉铭新精密技术股份有限公司 | 3D pattern laser carving spraying process |
| CN109759718A (en) * | 2019-03-19 | 2019-05-17 | 无锡欣盛包装材料科技有限公司 | Using the method for laser engraving machine production super large printing surface version |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2749703Y (en) * | 2004-12-02 | 2006-01-04 | 梁伟 | Guide rail device of large-breadth shaking mirror laser engraving machine |
| CN201038180Y (en) * | 2006-12-31 | 2008-03-19 | 李毅 | Large breadth laser marking solar cell device |
| CN102009271A (en) * | 2010-10-20 | 2011-04-13 | 武汉金运激光股份有限公司 | Large format laser cutting machine |
| CN201863607U (en) * | 2010-10-20 | 2011-06-15 | 苏州楚天光电设备有限公司 | Wide-breadth laser describing system |
| CN102179631A (en) * | 2011-05-18 | 2011-09-14 | 苏州德龙激光有限公司 | Device and method for processing large-breadth light guide plate |
| CN202123321U (en) * | 2011-05-18 | 2012-01-25 | 苏州德龙激光有限公司 | Device for processing large-breadth light guide plate |
| CN202411663U (en) * | 2011-12-26 | 2012-09-05 | 苏州领创激光科技有限公司 | High-speed large-format laser cutting machine |
| CN202763279U (en) * | 2012-08-16 | 2013-03-06 | 杭州先临三维科技股份有限公司 | Large-size inner carven processing device |
| CN204122928U (en) * | 2014-09-11 | 2015-01-28 | 苏州菲镭泰克激光技术有限公司 | A kind of big width laser engraving machine |
| CN104249219B (en) * | 2013-06-28 | 2017-09-26 | 韦黛瑛 | A kind of method of big width laser engraving |
-
2018
- 2018-01-26 CN CN201810076851.2A patent/CN108436278A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2749703Y (en) * | 2004-12-02 | 2006-01-04 | 梁伟 | Guide rail device of large-breadth shaking mirror laser engraving machine |
| CN201038180Y (en) * | 2006-12-31 | 2008-03-19 | 李毅 | Large breadth laser marking solar cell device |
| CN102009271A (en) * | 2010-10-20 | 2011-04-13 | 武汉金运激光股份有限公司 | Large format laser cutting machine |
| CN201863607U (en) * | 2010-10-20 | 2011-06-15 | 苏州楚天光电设备有限公司 | Wide-breadth laser describing system |
| CN102179631A (en) * | 2011-05-18 | 2011-09-14 | 苏州德龙激光有限公司 | Device and method for processing large-breadth light guide plate |
| CN202123321U (en) * | 2011-05-18 | 2012-01-25 | 苏州德龙激光有限公司 | Device for processing large-breadth light guide plate |
| CN202411663U (en) * | 2011-12-26 | 2012-09-05 | 苏州领创激光科技有限公司 | High-speed large-format laser cutting machine |
| CN202763279U (en) * | 2012-08-16 | 2013-03-06 | 杭州先临三维科技股份有限公司 | Large-size inner carven processing device |
| CN104249219B (en) * | 2013-06-28 | 2017-09-26 | 韦黛瑛 | A kind of method of big width laser engraving |
| CN204122928U (en) * | 2014-09-11 | 2015-01-28 | 苏州菲镭泰克激光技术有限公司 | A kind of big width laser engraving machine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109671146A (en) * | 2018-12-27 | 2019-04-23 | 东莞市誉铭新精密技术股份有限公司 | 3D pattern laser carving spraying process |
| CN109570779A (en) * | 2018-12-29 | 2019-04-05 | 大族激光科技产业集团股份有限公司 | A kind of laser processing and laser-processing system |
| CN109759718A (en) * | 2019-03-19 | 2019-05-17 | 无锡欣盛包装材料科技有限公司 | Using the method for laser engraving machine production super large printing surface version |
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Application publication date: 20180824 |