CN114710891A - Apparatus and method for printing circuit on transparent material - Google Patents
Apparatus and method for printing circuit on transparent material Download PDFInfo
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- CN114710891A CN114710891A CN202210350487.0A CN202210350487A CN114710891A CN 114710891 A CN114710891 A CN 114710891A CN 202210350487 A CN202210350487 A CN 202210350487A CN 114710891 A CN114710891 A CN 114710891A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the field of printed circuits, in particular to a device and a method for printing a circuit on a transparent material. The invention does not need any printing equipment or mask, has simple process, low cost, low equipment dependence, high automation degree and high yield, and is suitable for mass production.
Description
Technical Field
The present invention relates to the field of printed circuits, and to an apparatus and method for printing circuits on transparent materials.
Background
In the traditional processing technology, the printed circuit is mainly processed on the basis of a non-transparent substrate, the difficulty and the cost of printing the circuit on the surface of the transparent substrate are high, and with the development of the electronic industry, especially the development hotspots of flexible electronics and wearable electronics, the transparent printed circuit board has new market requirements.
At present, the method for printing the circuit on the transparent base material generally comprises the steps of coating a conductive film on a glass substrate, and then carrying out special treatment on the conductive film to form the conductive glass of the required circuit, but the steps for forming the conductive circuit by carrying out the special treatment are more complicated, and the processing time is longer. In addition, a photoetching machine is arranged on the glass substrate, and a photoetching process is adopted for circuit manufacturing, but when the circuit is manufactured by the traditional photoetching process, a photoresist is used as an insulating layer to control the shape of the circuit, the process has high requirements on the quality of the photoresist, the process is complicated, the cost is high, and the yield is low.
Photoelectric glass is used for the flexible electron and when wearing the electron, need be connected to outside drive circuit with the great photoelectric glass's of area circuit usually, need use electrically conductive double faced adhesive tape or soldering tin earlier, encapsulate flexible line way board in two-layer photoelectric glass and with photoelectric glass's line connection, be connected flexible line way board and outside drive circuit again, production efficiency is lower, in production, transportation, installation, in the use, a large amount of flexible line way boards of encapsulation in photoelectric glass inboard receive the damage easily, the flexible line way board is impaired will directly influence emitting diode's demonstration, and then lead to the bad emergence that the unable modification appears in the product, and the bad unable restoration of this type of bad.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides equipment and a method for printing a circuit on a transparent substrate, the method has simple process, does not need a conductive film or a mask plate, does not need to use printing equipment, and selectively strips off the conductive layer solidified on the surface of the transparent substrate after a laser beam passes through the back of the transparent substrate by combining with a laser etching technology to leave a required circuit, thereby obtaining the transparent substrate with the circuit.
The invention provides equipment for printing a circuit on a transparent substrate, which comprises a spraying mechanism and a laser processing mechanism, wherein the spraying mechanism comprises a spray head for spraying a solution, the laser processing mechanism comprises a control assembly and a laser, the control assembly is used for controlling the movement speed, the mechanism power and the movement track of the laser, and the laser is used for emitting laser to the transparent substrate for circuit etching.
According to the embodiment of the invention, the equipment further comprises a visual detection mechanism, wherein the visual detection mechanism comprises an imaging component and an identification judgment component, the imaging component is connected with the identification judgment component, and the imaging component is used for imaging the part to be detected and sending the image to the identification judgment component for identification and judgment.
According to an embodiment of the present invention, the visual inspection mechanism further comprises a feedback component, the feedback component is connected to the identification judgment component and is configured to feed back a judgment result, preferably, the feedback component comprises a display and/or an alarm, the display is configured to display the judgment result, and the alarm is configured to give an alarm when the detection result is abnormal.
According to an embodiment of the invention, the imaging assembly comprises a camera, preferably a high-definition camera.
According to an embodiment of the present invention, the identification and determination component includes a memory and a comparator, the memory is used for storing a normal result, the comparator traverses the image and determines whether an area different from the normal result exists on the image, if so, it is determined that the bit is abnormal, otherwise, it is determined that the image is normal.
According to the embodiment of the invention, the laser processing mechanism further comprises a cutting table and a position adjusting assembly, the position adjusting assembly is arranged above the cutting table, the laser and the imaging assembly are respectively arranged on the position adjusting assembly, and the control assembly is connected with the position adjusting assembly and used for controlling the movement of the position adjusting assembly so as to adjust the positions of the laser and the imaging assembly.
According to an embodiment of the present invention, the spraying mechanism further comprises a receiving chamber for receiving a solution to be sprayed, such as a conductive ink.
According to an embodiment of the invention, the spray mechanism further comprises a controller for adjusting the spray velocity of the spray head, further for example adjusting the height of the spray head.
According to an embodiment of the present invention, the laser processing mechanism includes any laser processing system having a laser track writing function, a laser beam focusing function, and a laser beam displacement control function, such as a laser marking machine and a laser marking machine.
According to an embodiment of the invention, the laser comprises a fiber laser, a solid state laser, for example a solid state laser.
The invention provides a method for printing a circuit on a transparent substrate, which comprises the following steps:
1) spraying conductive ink on the surface of the transparent substrate and drying to obtain the transparent substrate with a cured layer;
2) and emitting laser to the transparent substrate from the surface opposite to the solidified layer, and etching the solidified layer to form a circuit to obtain the transparent substrate with the circuit structure.
According to an embodiment of the present invention, step 1) is preceded by: and cleaning the surface of the transparent substrate.
Optionally, the two side surfaces of the transparent substrate are cleaned by ethanol and/or acetone to remove dust, oil and other stains, so as to improve the adhesion of the circuit layer.
According to an embodiment of the present invention, the transparent substrate is made of a transparent material with a low absorption coefficient to laser light, such as K9 glass, quartz, sapphire, a transparent polymer film, and the like.
According to an embodiment of the present invention, the conductive ink in step 2) includes conductive particles and a solvent, and the conductive particles include one, two or more of nano silver, nano gold, nano copper, nano silver alloy and nano copper alloy, for example, nano silver conductive ink.
According to an embodiment of the present invention, the content of silver in the nano-silver conductive ink is 30 to 50 wt%, preferably the content of silver in the nano-silver conductive ink is 35 to 45 wt%, and further, the content of silver in the nano-silver conductive ink is 38 to 42 wt%.
According to the embodiment of the present invention, the conductive ink is a viscous solution or a non-viscous solution, preferably a viscous solution, for example, the viscosity of the conductive ink is 50-200pa.s, preferably the viscosity of the conductive ink is 80-150pa.s, further, the viscosity of the conductive ink is 100-120pa.s, for example, 60pa.s, 70pa.s, 80pa.s, 90pa.s, 110pa.s, 130pa.s, 140pa.s, 160pa.s, 180pa.s or any value in the range of any two points.
According to an embodiment of the present invention, the solvent in the conductive ink comprises deionized water.
According to an embodiment of the present invention, the drying of the conductive ink in step 1) is performed under constant temperature conditions.
Preferably, the constant temperature is 140-180 ℃, preferably 150-160 ℃, for example 150 ℃.
According to an embodiment of the invention, the conductive ink is dried for a time of more than 15 minutes, preferably more than 20 minutes, for example 20 minutes.
As an example, the drying is performed in a constant temperature oven at a temperature of 150 degrees celsius for 20 minutes.
According to an embodiment of the present invention, the following steps are further included between step 1) and step 2): the transparent substrate with the cured layer was inspected for acceptability.
According to an embodiment of the present invention, the inspecting whether the transparent substrate having the cured layer is acceptable comprises: the surface of the cured layer is observed for defects, preferably by a visual inspection mechanism and judged.
As an example, the imaging assembly images the surface of the cured layer and transmits the imaged surface to the visual inspection mechanism, and the visual inspection mechanism analyzes and judges the image and discards the transparent substrate currently having the cured layer when judging that the surface of the cured layer has defects.
According to an embodiment of the invention, the defects comprise bubbles having a diameter of more than 20 microns and/or cracks having a length/width of more than 20 microns.
According to the embodiment of the invention, the step 2) of etching the cured layer to form the circuit comprises the steps of presetting a circuit structure and inputting a control component, wherein the control component controls a laser to etch the cured layer on the transparent substrate according to the circuit structure to form the circuit.
According to an embodiment of the present invention, the etching includes forming a cutting line on the solidified layer in accordance with the circuit structure, and stripping and cleaning the solidified layer outside the circuit structure.
According to an embodiment of the present invention, the laser comprises a pulsed laser having a wavelength in the ultraviolet to mid-infrared band, the laser having a wavelength in the range of 200-2000nm, such as 1064 nm.
Preferably, the power of the laser is 2-40W, such as 5-30W near infrared pulse laser or 2-8W ultraviolet laser.
Preferably, the cutting speed of the etching is set to 1-7m/s, preferably 2-5 m/s.
According to the embodiment of the invention, the cured layer outside the circuit structure is cleaned, for example, the surface of the transparent substrate after cutting is blown by high-pressure air.
According to an embodiment of the invention, step 2) is followed by step 3): and detecting whether the transparent substrate with the circuit is qualified.
According to an embodiment of the present invention, detecting whether the transparent substrate with circuitry is acceptable comprises a): and obtaining a circuit pattern on the surface of the transparent substrate, comparing the circuit pattern with a preset circuit structure, and judging whether a disconnection area and/or an incompatible area exist or not, wherein if yes, the circuit structure is unqualified, and otherwise, the circuit structure is qualified.
According to an embodiment of the present invention, the non-conforming region includes whether the edge of the circuit structure has a burr larger than 15% of the set width of the circuit, and whether the circuit structure has a width smaller than the set width.
According to the embodiment of the invention, after the circuit structure is judged to be qualified, the method further comprises the following step b): and carrying out power-on short-circuit detection on the circuit structure, if the detection is passed, the transparent base material with the circuit is qualified, and otherwise, the transparent base material with the circuit is abandoned.
According to the embodiment of the invention, after the circuit structure is judged to be qualified, the method further comprises the following steps: and detecting whether the electrical parameters of the circuit structure are consistent with preset values, if so, determining that the product is qualified, and otherwise, discarding the product.
According to the embodiment of the invention, after the transparent substrate with the circuit is judged to be unqualified, the method further comprises the step of correcting the circuit structure on the unqualified transparent substrate with the circuit, for example, correcting the circuit structure with the burr on the edge of the circuit structure larger than 15% of the set width of the circuit.
According to an embodiment of the invention, the modifying comprises: and emitting laser from the surface back to the solidified layer to the transparent substrate, and etching the unqualified area on the circuit again.
According to the embodiment of the invention, after the circuit is modified, the method further comprises the step of detecting whether the modified circuit structure is qualified, and the detection step is the same as the step 3).
The invention also provides a transparent substrate with a circuit, which is prepared by the method.
The invention also provides application of the transparent substrate with the circuit in electronic products, such as flexible screens and wearable electronics.
Advantageous effects
The invention combines with laser etching technology, adopts a high-speed vibrating mirror to control laser beams, selectively strips off the conducting layer solidified on the transparent substrate by penetrating through the transparent substrate from the back, leaves a required circuit line, and uses laser to carry out secondary correction on the circuit line after visual detection so as to ensure the 100 percent yield of the circuit.
Compared with the traditional process, the method provided by the invention does not need any printing equipment or mask, is simple in process, low in cost, low in equipment dependence, high in automation degree and high in yield, and is very suitable for mass production. The method of the invention can prepare good circuit and simultaneously ensure high light transmission of the base material.
Drawings
FIG. 1 is a schematic illustration of the spraying of conductive ink in step b according to an embodiment of the present invention;
FIG. 2 is a schematic view of step d of detecting whether the surface of the transparent substrate with the cured layer is defective according to the embodiment of the present invention;
FIG. 3 is a schematic illustration of laser etching in step f according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of the visual inspection in step g in the embodiment of the present invention.
The device comprises a transparent base material 1, a conductive ink 2, a spray head 3, a cured layer 4, an imaging assembly 5, a position adjusting assembly 6, a display and/or an alarm 7, a laser 8, a light beam motion control focusing mechanism 9 and a circuit structure 10.
Detailed Description
The method and application of the present invention will be described in further detail with reference to specific examples. It is to be understood that the following examples are only illustrative and explanatory of the present invention and should not be construed as limiting the scope of the present invention. All the technologies realized based on the above-mentioned contents of the present invention are covered in the protection scope of the present invention.
Unless otherwise indicated, the raw materials and reagents used in the following examples are all commercially available products or can be prepared by known methods.
Example 1 an apparatus for printing circuits on a transparent substrate
The utility model provides an equipment of printing circuit on transparent substrate, includes spraying mechanism, laser beam machining mechanism and visual inspection mechanism, and spraying mechanism is including the shower nozzle 3 that is used for spraying solution, and laser beam machining mechanism includes control assembly and laser instrument, and control assembly is used for controlling the velocity of motion, mechanism power and the movement track of laser instrument, and laser instrument 9 is used for emitting laser 8 to carry out circuit etching on the transparent substrate 1.
The visual detection mechanism comprises an imaging component 5, a recognition judgment component and a feedback component, wherein the imaging component 5 is connected with the recognition judgment component, and the imaging component 5 is used for imaging the part to be detected and sending the image to the recognition judgment component for recognition and judgment; the feedback component is connected with the identification judgment component and used for feeding back a judgment result, the preferable feedback component comprises a display and/or an alarm 7, the display is used for displaying the judgment result, and the alarm is used for giving an alarm when the detection result is abnormal.
Wherein, the imaging component 5 comprises a camera, for example, a high-definition camera; the identification and judgment component comprises a memory and a comparator, wherein the memory is used for storing a normal result, the comparator traverses the image and judges whether an area which is different from the normal result exists on the image, if so, the judgment bit is abnormal, otherwise, the judgment bit is normal.
The laser processing mechanism further comprises a cutting table and a position adjusting assembly 6, the position adjusting assembly 6 is arranged above the cutting table, the laser 9 and the imaging assembly 5 are both connected with the position adjusting assembly 6, and the control assembly is connected with the position adjusting assembly 6 and used for controlling the movement of the position adjusting assembly 6 and further adjusting the positions of the laser 9 and the imaging assembly 5.
The spraying mechanism further comprises a containing cavity for containing a solution to be sprayed, such as conductive ink.
The spray mechanism further includes a controller for adjusting the spray velocity of the spray head, and for example, adjusting the height of the spray head.
The laser processing mechanism comprises any laser processing system with a laser track compiling function, a laser beam focusing function and a laser beam walking control function, such as a laser marking machine and a laser marking machine.
In practical use, the laser may be a commercially available laser, such as a fiber laser or a solid-state laser, and in the following embodiments, the solid-state laser is used, and the laser emitted by the laser may be a pulsed laser with a wavelength in the ultraviolet to mid-infrared band.
Example 2 a method of printing an electrical circuit on a transparent substrate using the apparatus of example 1
A method of printing an electrical circuit on a transparent substrate comprising the steps of:
step a, preprocessing a transparent substrate 1 needing a printed circuit: cleaning both sides of the transparent substrate 1 with ethanol or acetone to remove dust, oil stain and other stains, thereby improving the adhesion of the circuit layer.
Step b, uniformly spraying conductive ink on the surface of the transparent substrate 1, wherein the existing spraying equipment is adopted, and the spraying conditions are as follows: the minimum ink drop is 3.5pl, the number of nozzles is more than 1000, the humidity of the working environment is 40-60%, and the thickness of a film structure formed by the sprayed conductive ink is less than 1 micron.
And c, transferring the transparent substrate 1 sprayed with the conductive ink into a constant temperature furnace, and heating at the constant temperature of 150 ℃ for 20 minutes until the conductive ink is cured on the surface of the transparent substrate to form a cured layer 4, so as to obtain the transparent substrate 1 with the cured layer 4.
Step d, detecting whether the surface of the transparent substrate 1 with the solidified layer 4 has defects, namely bubbles with the diameter larger than 20 microns and/or cracks with the length/width exceeding 20 microns, if the surface has no defects, transferring to the step e, otherwise, discarding the defective substrate.
Step e. the transparent substrate 1 with the cured layer 4 without defects on the surface is transferred to a laser processing system where the shape of the circuitry and the desired stripping area are set.
And f, according to the set circuit shape and the required stripping area, selectively stripping the surface of the transparent substrate with the cured layer by using laser and removing residues, wherein the unremoved part is the circuit structure 10.
Specifically, the laser is generally a near infrared pulse laser (with low cost) with a power of 5W-15W, or an ultraviolet laser (with high cost) with a power of 2-8W, and the distance between the laser and the curing layer depends on the focal length of the field lens, usually the focal length is set to be 100-165mm, and the cutting speed is set to be 1-7 m/s; and blowing by using high-pressure air after cutting.
And g, visually detecting the circuit structure 10 left after stripping, detecting electrical parameters if necessary according to customer requirements, judging whether the indexes are met, if so, judging whether the circuit structure is qualified, otherwise, judging whether the circuit structure is a correctable product, and if so, turning to the step h.
The visual detection can be a camera and an image processing system driven by a robot arm or a displacement mechanism, whether an area which is inconsistent or an area which is disconnected exists is judged by comparing an image obtained by the camera with a set circuit, specifically, whether the circuit is disconnected exists, whether burrs on the edge of the circuit are larger than 15% of the set width of the circuit, and whether the width of the circuit is smaller than the set width is judged, wherein the circuit structure with disconnected circuit or too small width needs to be abandoned, and the circuit structure with too large burrs can be re-corrected to be a correctable circuit structure.
And detecting whether the electrical parameters such as the resistance value of the detection circuit reach a preset value, if not, determining that the product is unqualified and needing to be abandoned.
Step h, performing secondary correction on the correctable circuit structure 10 using a laser and removing residues.
And i, carrying out secondary power-on short-circuit detection on the corrected circuit structure 10, wherein the circuit structure can flow into a subsequent processing flow if qualified.
The transparent substrate 1 to which the present invention is directed may be any transparent material having a low absorption coefficient for the laser light used, such as K9 glass, quartz, sapphire, transparent polymer films, and the like.
The conductive ink in the step b contains conductive particles, and the conductive particles can be one or more of nano silver, nano gold, nano copper, nano silver alloy or nano copper alloy; the conductive ink can be viscous or non-viscous, in this embodiment, the conductive ink is nano silver conductive ink with viscosity of 50-200pa.s, the content of silver in the nano silver conductive ink is 30-50 wt%, and the spraying of the conductive ink refers to a viscous liquid spraying process.
The laser processing system in step e may be any laser processing system with laser track compiling function, laser beam focusing function and laser beam displacement control function, such as a laser marking machine and a laser marking machine.
Optionally, the qualified product in step i may flow into a subsequent processing flow, and the subsequent processing flow may be any application of a circuit used on a transparent substrate, such as light emitting diode (led) mounting, multilayer composite circuit printing, and the like.
The embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiment. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides an equipment of printing circuit on transparent substrate, includes spraying mechanism and laser beam machining mechanism, its characterized in that, spraying mechanism is including the shower nozzle that is used for spraying solution, laser beam machining mechanism is including control assembly and laser instrument, control assembly is used for controlling the velocity of motion, mechanism power and the motion trail of laser instrument, the laser instrument is used for transmitting laser and carries out the circuit sculpture to transparent substrate on.
Preferably, the equipment further comprises a visual detection mechanism, the visual detection mechanism comprises an imaging component and an identification judgment component, the imaging component is connected with the identification judgment component, and the imaging component is used for imaging the part to be detected and sending the image to the identification judgment component for identification and judgment.
2. An apparatus for printing an electrical circuit on a transparent substrate according to claim 1 wherein: the visual detection mechanism further comprises a feedback assembly, and the feedback assembly is connected with the recognition judgment assembly and used for feeding back a judgment result.
Preferably, the identification and judgment component includes a memory and a comparator, the memory is used for storing a normal result, the comparator traverses the image and judges whether an area different from the normal result exists on the image, if so, the judgment bit is abnormal, otherwise, the judgment bit is normal.
Preferably, the laser processing mechanism further comprises a cutting table and a position adjusting assembly, the position adjusting assembly is arranged above the cutting table, the laser and the imaging assembly are respectively arranged on the position adjusting assembly, and the control assembly is connected with the position adjusting assembly and used for controlling the movement of the position adjusting assembly and further adjusting the positions of the laser and the imaging assembly.
3. An apparatus for printing an electrical circuit on a transparent substrate according to claim 1 or 2, wherein: the spraying mechanism further comprises an accommodating cavity, and the accommodating cavity is used for accommodating a solution to be sprayed.
Preferably, the spraying mechanism further comprises a controller for adjusting the spraying speed of the spray head.
Preferably, the laser processing mechanism comprises any laser processing system with a laser track compiling function, a laser beam focusing function and a laser beam walking control function, such as a laser marking machine and a laser marking machine.
4. A method of printing an electrical circuit on a transparent substrate using the apparatus of any one of claims 1 to 3, comprising the steps of:
1) spraying conductive ink on the surface of the transparent substrate and drying to obtain the transparent substrate with a cured layer;
2) and emitting laser to the transparent substrate from the surface opposite to the solidified layer, and etching the solidified layer to form a circuit to obtain the transparent substrate with the circuit structure.
5. The method of claim 4, wherein: the transparent base material is made of a transparent material with low laser absorption coefficient.
Preferably, the conductive ink in step 2) includes conductive particles and a solvent, and the conductive particles include one, two or more of nano silver, nano gold, nano copper, nano silver alloy and nano copper alloy.
Preferably, the content of silver in the nano-silver conductive ink is 30-50 wt%, preferably the content of silver in the nano-silver conductive ink is 35-45 wt%, and further the content of silver in the nano-silver conductive ink is 38-42 wt%.
Preferably, the conductive ink is a viscous solution or a non-viscous solution.
Preferably, the drying of the conductive ink in step 1) is performed under constant temperature conditions.
Preferably, the constant temperature is 140-180 ℃.
Preferably, the conductive ink is dried for a time greater than 15 minutes.
6. A method of printing an electrical circuit on a transparent substrate according to claim 4 or 5, wherein: the method also comprises the following steps between the step 1) and the step 2): the transparent substrate with the cured layer was inspected for acceptability.
Preferably, the inspecting whether the transparent substrate having the cured layer is acceptable comprises: the surface of the cured layer is observed for defects, preferably by a visual inspection mechanism and judged.
For example, the imaging assembly images the surface of the cured layer and transmits the image to the visual inspection mechanism, and the visual inspection mechanism analyzes and judges the image and discards the transparent substrate currently having the cured layer when the surface of the cured layer is judged to have defects.
Preferably, the defects comprise bubbles having a diameter greater than 20 microns and/or cracks having a length/width in excess of 20 microns.
7. A method of printing an electrical circuit on a transparent substrate according to claim 4 or 5, wherein: and 2) etching the solidified layer to form a circuit, wherein the circuit structure is preset and is input into a control assembly, and the control assembly controls a laser to etch the solidified layer on the transparent substrate according to the circuit structure to form the circuit.
Preferably, the etching includes forming cutting lines on the solidified layer according to the circuit structures, and stripping and cleaning the solidified layer outside the circuit structures.
According to an embodiment of the present invention, the laser includes a pulsed laser having a wavelength in the ultraviolet to mid-infrared band, the laser having a wavelength in the range of 200-2000 nm.
Preferably, the power of the laser is 2-40W.
8. A method of printing an electrical circuit on a transparent substrate according to claim 4 or 5, wherein: step 2) is followed by step 3): and detecting whether the transparent substrate with the circuit is qualified.
Preferably, the step of detecting whether the transparent substrate with circuitry is acceptable comprises a): and obtaining a circuit pattern on the surface of the transparent substrate, comparing the circuit pattern with a preset circuit structure, and judging whether a disconnection area and/or an incompatible area exist or not, wherein if yes, the circuit structure is unqualified, and otherwise, the circuit structure is qualified.
Preferably, the non-conforming region includes whether the edge of the circuit structure has a burr larger than 15% of the set width of the circuit and whether the circuit structure has a width smaller than the set width.
Preferably, after the circuit structure is judged to be qualified, the method further comprises the following step b): and carrying out power-on short-circuit detection on the circuit structure, if the detection is passed, the transparent base material with the circuit is qualified, and if not, the transparent base material with the circuit is abandoned.
Preferably, after the circuit structure is judged to be qualified, the method further comprises the following steps: and detecting whether the electrical parameters of the circuit structure are consistent with preset values, if so, determining that the product is qualified, and otherwise, discarding the product.
Preferably, the method further comprises the step of correcting the circuit structure on the failed transparent substrate with circuit after determining that the transparent substrate with circuit is failed.
Preferably, the laser is emitted from the side facing away from the cured layer towards the transparent substrate, and the defective areas on the circuit are etched again.
Preferably, after the circuit is corrected, the method further comprises detecting whether the corrected circuit structure is qualified, and the detecting step is the same as the step 3).
9. A transparent substrate having an electrical circuit, prepared by the method of any one of claims 4-8.
10. Use of the transparent substrate with circuitry prepared by the method of any one of claims 4-8 or the transparent substrate with circuitry of claim 9 in an electronic product, such as a flexible screen, wearable electronics.
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