CN218277338U - Pad repair equipment - Google Patents

Abstract

The present disclosure provides a pad repair apparatus, including: a pad pre-processing mechanism for performing pre-processing operations on a pad to be repaired and its neighboring pads, comprising: the method comprises the following steps of (1) desoldering the assembly, removing the insulating layer and cleaning the assembly; a pad coating mechanism for performing an initial pad forming operation, the pad coating mechanism including a coating assembly, and a curing assembly; and a pad packaging mechanism for performing packaging operation on the pads and circuits exposed at the periphery of the initial pad to form a new pad with a predetermined exposure pattern. The embodiment of the disclosure provides a pad repairing device, which can effectively repair the bad pads before and after die bonding so as to solve the problems of low product yield and high cost caused by the bad pads.

Description

Pad repair equipment

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a pad repair apparatus.

Background

SMT is a Surface mount Technology (abbreviated as Surface mount Technology) which is a Technology and process that is popular in the electronic assembly industry, and is a Technology that places an electronic component having pins on a Surface of a substrate having a circuit and pads, and performs soldering and assembly by a method such as reflow soldering or dip soldering.

SUMMERY OF THE UTILITY MODEL

The embodiment of the disclosure provides a pad repairing device, which can effectively repair the bad pad before and after die bonding so as to solve the problems of low product yield and high cost caused by the bad pad.

The technical scheme provided by the embodiment of the disclosure is as follows:

the embodiment of the disclosure provides a pad repairing device, which is used for repairing a pad to be repaired on a circuit board; the pad repair apparatus includes:

the pad pretreatment mechanism is used for executing pretreatment operation on a pad to be repaired and an adjacent pad thereof to obtain a region to be repaired;

the pad coating mechanism is used for forming an initial pad and comprises a coating component and a curing component, wherein the coating component is used for coating a conductive material on the area to be repaired, and the curing component is used for curing the coated conductive material to form the initial pad; and

the pad packaging mechanism is used for packaging at least the area where the initial pad is located to form a new pad with a preset exposure pattern;

wherein the pad pre-processing mechanism comprises:

the desoldering assembly is used for performing desoldering treatment on a bonding pad in an initial region, and the initial region comprises a bonding pad to be repaired and a bonding pad adjacent to the bonding pad to be repaired;

the insulating layer removing assembly is used for removing a part of insulating layer adjacent to the routing position on the periphery of the initial region so as to expose a part of routing and form a region to be repaired; and (c) a second step of,

and the cleaning assembly is used for cleaning the area to be repaired.

Illustratively, a table for holding the circuit board;

the workbench comprises different operation positions, and the pad pretreatment mechanism, the pad coating mechanism and the pad packaging mechanism are sequentially positioned at the different operation positions; or

The workbench is provided with at least one working position, and the pad preprocessing mechanism, the pad coating mechanism and the pad packaging mechanism can respectively move to the working position to execute corresponding operation.

Illustratively, the pad coating mechanism further comprises: a pad conditioning assembly for conditioning the initial pads to bring the initial pads to a predetermined standard, the predetermined standard comprising: the initial bonding pad has a predetermined thickness, a predetermined shape and a predetermined flatness.

Illustratively, the pad conditioning assembly includes a laser repair assembly for conditioning at least one of a thickness, a shape, and a flatness of the initial pad by a laser.

Illustratively, the pad packaging mechanism includes:

the packaging assembly is used for coating packaging materials on the exposed bonding pad and the exposed wire on the periphery of the initial bonding pad so as to package; and

and the trimming component is used for trimming the packaged pad periphery packaging layer to obtain a new pad with a preset exposed shape.

Illustratively, the package assembly includes a coating needle tube for coating an insulating resin material on the periphery of the initial pad; and/or the trimming assembly comprises a laser trimmer for cutting the encapsulating material by laser.

Illustratively, the desoldering assembly includes a fusion welding laser for fusion welding by emitting laser light, and/or an infrared fusion welding device for fusion welding by infrared rays;

the insulating layer removing assembly comprises an insulating layer removing laser for removing the insulating layer by emitting laser and/or a scraper for removing the insulating layer by mechanical cutting;

the cleaning assembly comprises a cleaning laser for cleaning foreign matters by emitting laser and/or a surface cleaning unit for blowing air to the area to be repaired to clean the foreign matters.

The fusion welding laser, the insulation layer removing laser and the cleaning laser respectively emit laser with different wavelengths.

Illustratively, the surface cleaning unit includes:

the blowing pipe is positioned on one side of the area to be repaired and used for blowing air to the surface of the area to be repaired; and/or

The air suction pipe is positioned on the other side of the area to be repaired and is used for sucking air from the surface of the area to be repaired;

when the surface cleaning unit comprises the blowing pipe and the air suction pipe, the blowing opening of at least one blowing pipe is opposite to the air suction opening of at least one air suction pipe.

Illustratively, the air blowing port is in a necking shape, and the inner diameter of the air blowing port gradually shrinks from the side far away from the air port to the side close to the air port; and/or the air suction opening is in a flaring shape, and the inner diameter of the air suction opening is gradually enlarged from one side far away from the air opening to one side close to the air opening.

Illustratively, the blowing pipe is provided with a shielding member for shielding the blowing port to prevent the foreign matter from splashing.

Illustratively, the shielding member includes a half-shroud disposed circumferentially around the outer peripheral surface of the blow pipe, which shroud is disposed above the blow port.

Illustratively, the number of the desoldering assemblies is at least two, and when fusion welding is performed, the at least two desoldering assemblies are respectively positioned at two opposite sides of the pad to be repaired and the adjacent pad thereof, or at least one desoldering assembly is movable around the periphery of the pad to be repaired and the adjacent pad thereof.

Illustratively, the pad coating mechanism further comprises: and the electrical testing component is used for testing the electrical performance of the initial bonding pad.

Illustratively, the electrical measurement assembly includes an electrical measurement probe for conducting electrical contact with the initial pad.

Illustratively, the curing assembly includes a laser curing device.

The beneficial effects brought by the embodiment of the disclosure are as follows:

in the above scheme, the pad repairing equipment mainly comprises a pad preprocessing mechanism, a pad coating mechanism and a pad packaging mechanism. When repairing the bonding pad, firstly, the bonding pad of an initial region can be subjected to desoldering treatment through a desoldering assembly in the bonding pad pretreatment mechanism, and the initial region can comprise the bonding pad to be repaired and an adjacent bonding pad thereof; then, part of the insulating layer at the periphery of the initial region adjacent to the routing position can be removed through the insulating layer removing assembly to expose part of the routing, so that the contact area between the subsequent coated bonding pad and the original routing is increased to avoid the problem of overlarge resistance, and the region to be repaired is formed after the insulating layer is removed from the initial region; then, the area to be repaired can be cleaned through the cleaning assembly, so that residues, impurities and foreign matters at the area to be repaired can be cleaned and leveled, and pretreatment work is performed for coating a new bonding pad; then, coating a conductive material on the area to be repaired again through the coating assembly in the bonding pad coating mechanism, and curing the coated conductive material through the curing assembly to obtain a conductive initial bonding pad; and then packaging the exposed bonding pad and the trace on the periphery of the initial bonding pad to obtain a new bonding pad with a preset exposure pattern.

Through the scheme, the circuit board with the bad bonding pads can be effectively repaired, the yield of the circuit board is improved, and the loss caused by product scrapping is reduced.

Drawings

FIG. 1 is a schematic cross-sectional view of a circuit board having electronic components and pads;

FIG. 2 is a top view of a circuit board having electronic components and pads;

fig. 3 is a schematic structural diagram illustrating a pad preprocessing mechanism in a pad repair device according to an embodiment of the disclosure;

FIG. 4 is a schematic structural diagram of an initial region formed after a pad to be repaired and an adjacent pad are unsoldered;

fig. 5 is a schematic diagram illustrating a to-be-repaired area formed after the insulating layer removing assembly removes a portion of the insulating layer in the pad repairing apparatus according to the embodiment of the disclosure;

fig. 6 is a schematic structural diagram illustrating a pad coating mechanism in a pad repairing apparatus according to an embodiment of the disclosure;

fig. 7 is a schematic diagram illustrating an initial bonding pad formed by recoating a conductive material on a wiring board in a bonding pad repair apparatus provided by an embodiment of the disclosure;

fig. 8 is a schematic structural diagram illustrating a pad packaging mechanism in a pad repairing apparatus according to an embodiment of the disclosure packaging an exposed pad and a circuit around an initial pad;

fig. 9 shows a flowchart of a pad repair method provided in an embodiment of the disclosure.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without inventive step, are within the scope of protection of the disclosure.

Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

Before a detailed description of the pad repair apparatus provided by the embodiments of the present disclosure, it is necessary to make the following description of the related art:

in the SMT process, in order to complete the fixed connection between the electronic component and the pad, solder needs to be disposed on the pad to be electrically connected with the electronic component on the substrate, or solder needs to be disposed on the lead of the electronic component, and then the electronic component is aligned with and in contact with the pad, for example, the solder is melted and well wetted at a high temperature of 230 ℃ to 260 ℃, and then the electronic component and the pad are quickly cooled to achieve the fixed connection. The material of the bonding pad is generally copper, but copper is easily oxidized, so that the surface of the bonding pad needs to be treated for preventing oxidation. The surface treatment method for the bonding pad comprises nickel immersion gold and the like or silver paste coating and the like. In this way, the electronic component is directly soldered to the pad surface subjected to the oxidation preventing treatment by a solder (the solder is a metal including tin) by a reflow process.

In the reflow soldering process, an Intermetallic Compound (IMC) is formed between the solder and the copper alloy layer and the pad, the thickness and composition of the IMC are in a functional relationship with the time, temperature, application conditions, and the like of the soldering process, and the internal stress at the material joint changes, generally, the internal stress gradually increases with the increase of the thickness of the IMC, so that the contact part (soldering point) of the electronic component and the pad is cracked or even broken, and the connection strength and reliability of the electronic component and the pad are further affected.

In the manufacturing process, if the surface of the bonding pad is damaged or foreign matters exist, or if the electronic component is in a faulty soldering or a soldering position is deviated in the reflow soldering process, the electronic component needs to be removed by desoldering, and the electronic component needs to be soldered at the correct position again. However, in the process of removing the electronic component, the solder between the electronic component and the pad is inevitably removed, and the solder and the pad form an intermetallic compound, so that the pad may be damaged, and the pad cannot be reliably connected with the electronic component again, thereby seriously affecting the yield of the product and causing product rejection.

Aiming at the problems that products are scrapped due to the fact that related defects of a bonding pad in the manufacturing process of a circuit board in the related technology cause large loss to production, the bonding pad repairing equipment provided by the embodiment of the disclosure can repair the bonding pad to be repaired on the circuit board so as to solve the problems of low product yield and high cost caused by the defects of the bonding pad.

As shown in fig. 3 to 8, a pad repair apparatus provided by an embodiment of the present disclosure includes: a pad pre-processing mechanism 10, a pad coating mechanism 20, and a pad packaging mechanism 30.

The pad preprocessing mechanism 10 is configured to perform a preprocessing operation on the pad 1a to be repaired and the adjacent pad 1B thereof to obtain a region B to be repaired.

Specifically, the pad preprocessing mechanism 10 includes: a desoldering assembly 11, an insulation removal assembly 12 and a cleaning assembly 13. The desoldering assembly 11 is configured to perform a desoldering process on a pad in an initial region a, where the initial region a includes a pad 1a to be repaired and a pad 1b (shown in fig. 4) adjacent to the pad 1a to be repaired.

In the above solution, the purpose of the desoldering assembly 11 is to desolder the initial region a where the pad 1a to be repaired and the adjacent pad 1b are located. For some circuit boards, especially circuit boards with micro electronic components, with the increase of product resolution, the precision of electrodes and pads of the electronic components is higher and higher, the size is smaller and smaller, and the distance between adjacent electronic components is smaller and smaller. The utility model discloses a research discovery, when a certain electronic component's pad goes wrong, because the restriction of pad size, if only when restoreing to this pad, can influence the coating of the new pad of thickness and maintain, consequently, can also restore its adjacent electronic component's pad to avoid influencing the coating and the maintenance of follow-up new pad.

The electronic components may be light emitting diodes, each having two pins, corresponding to the two pads 1 one to one. In some embodiments, different colored leds may be included, such as red leds R, green leds G, and blue leds B. It should be noted here that, the pad 1a to be repaired and the adjacent pad 1b thereof specifically refer to: as shown in fig. 1 and 2, the other bonding pads whose distance from the bonding pad 1 is less than a certain value range are the bonding pads 1b adjacent to the bonding pad 1a to be repaired. In practical application, the numerical range may be determined according to the precision of the equipment such as the desoldering component and the coating component, the precision of the product of the circuit board, and the like.

For example, in some embodiments, taking an electronic element as an led as an example, a pixel unit includes a red led R, a green led G, and a blue led B, each led may be correspondingly connected to a plurality of pads, all the pads in a pixel unit may be regarded as a pad group, and when any one of the pads in the pad group is defective, all the pads in the pad group may be repaired by unsoldering.

It can be understood that, if the distance between the electronic components on the circuit board is relatively large, and correspondingly, the distance between the pads corresponding to the electronic components is relatively large, when a certain pad is defective, only the adjacent pad whose distance from the pad is smaller than a certain numerical range may be subjected to the desoldering repair, and the other pads adjacent to the pad but whose distance is greater than the numerical range may not be subjected to the desoldering repair.

The insulating layer removing assembly 12 is configured to remove a portion of the insulating layer at a position adjacent to the trace 4 on the periphery of the initial region a, so as to expose a portion of the trace 4 close to the initial region a, where a region B to be repaired is formed after the portion of the insulating layer is removed in the initial region a (as shown in fig. 5).

In the above solution, the reason for setting the insulating layer removing assembly 12 is as follows:

as shown in fig. 1 and 2, the number of pads 1 of the electronic component 2 on the wiring board corresponds to the number of pins of the electronic component 2. Taking the electronic component 2 as an led as an example, the led has two pins, the number of the corresponding pads 1 is two, and one pin is correspondingly connected to one pad 1. The circuit board generally includes a substrate 3, traces 4 on the substrate 3, and an insulating layer 5 above the traces 4, wherein an opening 5a is formed on the insulating layer 5, and the portion of each trace 4 exposed by the opening 5a is the bonding pad 1. In the above scheme, in order to further ensure the binding reliability between the trace connected with the original pad and the new pad, reduce the contact resistance between the trace and the new pad, and ensure the function of the electronic element 2, the insulating layer removing component 12 is used to remove a part of the insulating layer 5 on one side of the periphery of the initial area a, which is adjacent to the trace 4, so that the area of the new pad coated subsequently is large enough, and the contact area with the peripheral trace 4 can be increased, thereby avoiding the problem of overlarge resistance. Wherein, after the insulating layer is removed from the initial region a, a region to be repaired B is formed (as shown in fig. 5).

The cleaning assembly 13 is used for cleaning the area B to be repaired, and is used for cleaning residues, impurities and foreign matters in the area B to be repaired so as to ensure the flatness of the area B to be repaired and perform pretreatment work for coating a new bonding pad.

The pad coating mechanism 20 is used for forming initial pads C, and the pad coating mechanism 20 includes a coating assembly 21 and a curing assembly 22. The coating assembly 21 is used for coating a conductive material on the area to be repaired B, wherein the conductive material may include silver paste, copper paste, and the like. The curing assembly 22 is used for curing the coated conductive material to form the initial bonding pad C. The curing assembly 22 may include a laser curing device or any other suitable device.

The pad packaging mechanism 30 is used for packaging at least the area where the initial pads C are located to form new pads with a predetermined exposure pattern. In the above-mentioned solution, the pad packaging mechanism 30 is provided to prevent oxidation and corrosion by packaging the exposed portion around the initial pad C and the circuit. The predetermined exposure pattern is a pattern of a region where a new pad to be finally formed is exposed outside the insulating layer. The area of the initial pad C may be larger than that of a new pad to be finally formed, and the shape of the initial pad C may be different from that of the new pad to be finally formed, that is, the current exposure pattern of the initial pad C is different from the predetermined exposure pattern, and therefore, it is necessary to say that the initial pad C is packaged so that the final exposure pattern thereof satisfies the predetermined exposure pattern. At least packaging the area where the initial pad C is located, namely packaging the area of the periphery of the initial pad C beyond the predetermined exposure pattern and the area where the trace is exposed.

Therefore, the pad repairing equipment provided by the embodiment of the disclosure can effectively repair the pads of the circuit board with poor pads, improve the yield of the circuit board and reduce the loss caused by product scrapping.

When the pad repairing equipment works, the corresponding operations of the pad preprocessing mechanism 10, the pad coating mechanism 20 and the pad packaging mechanism 30 are sequentially executed.

In some embodiments, the pad repair device may include a table for placing the circuit board; the work table may comprise different work positions and the circuit board may be transported on the work table to the different work positions. The pad preprocessing mechanism 10, the pad coating mechanism 20 and the pad encapsulating mechanism 30 are sequentially disposed at the different working positions along the transfer path of the table. In this way, the operations of pad pre-treatment, pad coating and pad packaging can be performed in sequence.

In other embodiments, the worktable has at least one working position to which the pad pre-processing mechanism 10, the pad coating mechanism 20, and the pad encapsulating mechanism 30 can be moved, respectively, to perform the corresponding operations.

It should be understood that the specific positions and the like of the respective mechanisms of the pad repair apparatus are not limited to the above examples.

Further, as an exemplary embodiment, the desoldering assembly 11 may be selected from one or both of a fusion welding laser that performs fusion welding by emitting laser light and an infrared fusion welding tool that performs fusion welding by infrared light. The fusion welding laser and the infrared fusion welding tool may be selected from commercially available fusion welding products, and the specific working principle thereof will not be described in detail herein.

When the desoldering component 11 selects a fusion welding laser, the purpose of desoldering is achieved by controlling the wavelength of emitted laser, and the desoldering component is high in precision and convenient to operate. It is of course understood that the desoldering assembly 11 may also be not limited to fusion welding lasers, infrared fusion welders.

Further, as an exemplary embodiment, the insulation-removal assembly 12 includes one or both of an insulation-removal laser, or a doctor blade. The insulating layer removing laser can remove the insulating layer by emitting laser, and the scraper removes the insulating layer by mechanical cutting. The laser for removing the insulating layer and the scraper can be selected from products on the market, and the specific working principle of the laser for removing the insulating layer and the scraper is not described in detail.

The insulating layer removing laser realizes the purpose of removing the insulating layer by controlling the wavelength of the emitted laser. The laser cutting mode is adopted to remove the insulating layer, compared with other modes of removing the insulating layer, the cutting precision is higher, and the operation is more convenient. It will of course be appreciated that the insulation removal assembly 12 may also not be limited to a laser or a doctor blade. In practical application, a proper device can be reasonably selected according to actual requirements to achieve the purpose of cutting the insulating layer.

Further, as an exemplary embodiment, the cleaning assembly 13 includes at least one of a cleaning laser 131 and a surface cleaning unit. The cleaning laser 131 is used to clean foreign matter by emitting laser light. The surface cleaning unit is used for blowing air to the area B to be repaired to clean foreign matters. The cleaning laser 131 controls the wavelength of the emitted laser to clean foreign matters, and is high in precision and convenient to operate.

As a preferred embodiment, the cleaning assembly 13 may include both a cleaning laser 131 and a surface cleaning unit, as shown in fig. 3. Thus, the surface cleaning unit can blow away the electronic component 2, the molten tin, and foreign matters and impurities, and prevent the coating process of the bonding pad from being affected.

It should be noted that the fusion welding laser, the insulation layer removing laser, and the cleaning laser 131 can respectively emit laser beams with different wavelengths to achieve different functions.

As an exemplary embodiment, as shown in fig. 3, the surface cleaning unit includes: at least one blowing pipe 1321 which is positioned at one side of the area B to be repaired and used for blowing air to the surface of the area B to be repaired; and at least one air suction pipe 1322 which is positioned at the other side of the area B to be repaired and is used for sucking air from the surface of the area B to be repaired; the blowing opening a of at least one blowing pipe 1321 is opposite to the suction opening b of at least one suction pipe 1322.

By adopting the scheme, the surface cleaning unit adopts the blowing pipe 1321 and the air suction pipe 1322, is oppositely arranged on two opposite sides of the surface of the area B to be repaired, can blow the electronic element 2 and the soldering tin to the air suction pipe 1322 by the blowing pipe 1321 after the soldering tin is dissolved so as to be sucked away by the air suction pipe 1322, and can blow away impurities and foreign matters generated by removing the insulating layer and cleaning the bonding pad, so that the coating process of the bonding pad is prevented from being influenced.

It should be noted that, in some embodiments, only the blowing pipe 1321 or only the air suction pipe 1322 may be provided.

Further, as some exemplary embodiments, as shown in fig. 3, the air blowing port a may be designed in a constricted shape, an inner diameter of which is gradually constricted from a side away from the tuyere to a side close to the tuyere. With this arrangement, the blowpipe 1321 is formed in a constricted shape, ensuring a sufficient blowing force.

As some exemplary embodiments, as shown in fig. 3, the suction opening b may be designed to be flared, and the inner diameter thereof is gradually enlarged from the side far from the tuyere to the side near the tuyere. With the arrangement, the air suction opening b is flared (namely trumpet-shaped), so that foreign matters, impurities and the like can be sucked more conveniently.

Further, as shown in fig. 3, as some exemplary embodiments, a shielding member 1323 for shielding the blowing port a to prevent the foreign matter from splashing is provided on the blowing pipe 1321. By providing the blocking piece 1323, it is possible to prevent the foreign matter in the area B to be repaired from splashing.

Illustratively, the shielding member includes a half-shroud disposed circumferentially along the outer peripheral surface of the blowpipe 1321, which shroud is disposed above the blowport a. With such an arrangement, the blowing pipe 1321 may have a brim shape at the blowing port a thereof, so as to effectively shield foreign matters. It should be understood that the specific structure of the blowpipe 1321 is not limited thereto in practical applications.

In addition, as some exemplary embodiments, as shown in fig. 3, the number of the desoldering assemblies 11 is at least two, and at least two of the desoldering assemblies 11 are respectively located on two opposite sides of the pad 1a to be repaired and the adjacent pad 1b thereof, or at least one of the desoldering assemblies 11 is movable around the periphery of the pad 1a to be repaired and the adjacent pad 1b thereof when performing fusion welding. With such an arrangement, it is convenient to perform fusion welding by emitting laser or infrared rays from the opposite sides or peripheries of the pad 1a to be repaired and its adjacent pad 1b, so as to achieve a better desoldering effect.

It is understood that the specific number of the desoldering assemblies 11 is not limited, and only one may be provided, or none may be moved.

Further, in some exemplary embodiments, as shown in fig. 6, the pad coating mechanism 20 further includes a pad conditioning assembly 24, the pad conditioning assembly 24 being configured to condition the initial pads C to meet predetermined criteria including: the initial bonding pad C has a predetermined thickness, a predetermined shape and a predetermined flatness.

By adopting the above scheme, after the conductive material is recoated on the area to be repaired B to obtain the initial pad C, the shape of the initial pad C may not meet the requirements of precision and subsequent alignment, and therefore, in this embodiment, the pad repairing apparatus may further include a pad trimming component 24 for trimming the thickness, shape, flatness, and the like of the initial pad C to reach a predetermined standard.

Wherein the pad trimming component 24 may be a pad trimming laser for trimming at least one of the thickness, shape and flatness of the initial pad C by laser.

It will be appreciated, of course, that the pad conditioning assembly 24 may alternatively be implemented in other ways. Further, as some exemplary embodiments, as shown in fig. 6, the pad coating mechanism 20 may further include: an electrical measurement assembly 23 for testing the electrical properties of the initial pads C.

By adopting the scheme, the electrical measurement assembly 23 is arranged to test the electrical properties such as conductivity, resistance and the like of the trimmed initial bonding pad C, so that whether the electrical properties of the initial bonding pad C are qualified or not can be tested, and the unqualified (NG) product is prevented from flowing to the next procedure. For example, the electrical measurement assembly 23 may include an electrical measurement probe for making electrical contact with the initial pad C.

Specifically, when the electrical performance of the initial pad C is tested, it may be determined whether the electrical performance of the initial pad C reaches a predetermined parameter; and when the electrical property of the initial bonding pad C is judged not to reach the preset parameter, trimming the initial bonding pad C until the electrical property of the initial bonding pad C reaches the preset parameter.

As an exemplary embodiment, when it is determined that the electrical property of the initial pad C does not reach the predetermined parameter, trimming the initial pad C means adjusting at least one of a size, a shape, or a flatness of the initial pad C, testing the electrical property of the initial pad C after adjustment, and determining whether the electrical property of the initial pad C reaches the predetermined parameter; if the predetermined parameter is not reached yet, the initial bonding pad C may be desoldered, coated and cured again, and the electrical test may be performed again until the electrical property of the initial bonding pad C reaches the predetermined parameter.

In addition, the pad coating mechanism 20 may further include a surface treatment component for performing oxidation-preventing treatment on the surface of the initial pad, for example, the surface treatment component may be treated with nickel-gold or silver-coated slurry.

As shown in fig. 8, as some exemplary embodiments, the pad packaging mechanism 30 may further include: a packaging component 31 and a finishing component 32, wherein the packaging component 31 is used for coating packaging materials on exposed pads and circuits on the periphery of the initial pad C for packaging; the trimming component 32 is used to trim the encapsulated pad periphery encapsulation layer to obtain new pads with a predetermined exposed shape (as shown in fig. 2).

By adopting the scheme, after the initial bonding pad C is packaged, if the coating range of the packaging material exceeds the precision specification, the packaging part which exceeds the specification can be trimmed, such as cutting, through the arranged trimming component 32, so that the influence of the packaging part on the subsequent processes is prevented.

Wherein, encapsulation subassembly 31 can select for use can be in initial pad C periphery coating insulating resin material's coating needle tubing, accessible 3D printing mode are in initial pad C periphery prints insulating resin material's at least one of them 3D printer, and the encapsulation precision is high, and convenient operation. The trimming component 32 can be cut by laser, the laser trimmer of the packaging material is high in cutting precision and convenient to operate, at the moment, the packaging component 31 can further comprise an insulating resin curing component 33, and the insulating resin curing component 33 can be a curing laser. It is of course to be understood that the specific implementation of the packaging assembly 31 and the trimming assembly 32 is not limited thereto.

In addition, the embodiment of the present disclosure further provides a pad repairing method, which is used for repairing a pad 1a to be repaired on a circuit board by using the pad repairing device in the embodiment of the present disclosure, as shown in fig. 9, the method includes the following steps that are sequentially executed:

step S01, preprocessing the pad 1a to be repaired and the adjacent pad 1b thereof, specifically including:

step S011, performing desoldering processing on a bonding pad in an initial region A, wherein the initial region comprises a bonding pad 1a to be repaired and an adjacent bonding pad 1b thereof (shown in FIG. 4);

step S012, removing a portion of the insulating layer at a position adjacent to the circuit on the periphery of the initial region a to expose a portion of the circuit, thereby forming a region B to be repaired (as shown in fig. 5);

step S013, cleaning the region B to be repaired;

step S02, forming an initial bonding pad C in the area B to be repaired, which specifically comprises the following steps:

s021, coating a conductive material on the area B to be repaired;

step S022, curing the coated conductive material to form the initial pad C (shown in fig. 7);

and S03, packaging at least the area where the initial pad C is located to form a new pad with a preset exposure pattern.

As an exemplary embodiment, in the above steps, the circuit board is sequentially conveyed to different working positions of the workbench according to the above step sequence; or, the wiring board is placed at the working position, and the pad preprocessing mechanism 10, the pad coating mechanism 20, and the pad encapsulating mechanism 30 are moved to the working position, respectively, according to the above sequence of steps, to perform the corresponding operations.

As an exemplary embodiment, the step S011 specifically includes: performing fusion welding by emitting laser and/or infrared rays to the pad 1a to be repaired and the adjacent pad 1b thereof;

the step S012 specifically includes: removing the insulating layer by emitting laser and/or mechanical cutting;

step S013 specifically includes: and emitting laser and/or blowing air to the area B to be repaired to clean foreign matters.

As an exemplary embodiment, in the step S02, after the step S022, the method further includes:

step S023, trimming the initial pad C to make the initial pad C reach a pad trimming component 3222 of a predetermined standard, where the predetermined standard includes: the initial bonding pad C has a predetermined thickness, a predetermined shape and a predetermined flatness.

As an exemplary embodiment, step S02, after step S022, further includes:

step S023, testing the electrical performance of the initial bonding pad C and judging whether the electrical performance of the initial bonding pad C reaches a preset parameter;

and S024, if not, trimming the initial bonding pad C until the electrical property of the initial bonding pad C reaches a preset parameter.

As an exemplary embodiment, step S024 specifically includes:

s0241, adjusting at least one of the size, the shape and the flatness of the initial bonding pad C, testing the electrical performance of the adjusted initial bonding pad C, and judging whether the electrical performance of the initial bonding pad C reaches a preset parameter;

and S0242, if not, repeating the step S01 and the step S02 until the electrical property of the initial bonding pad C reaches a preset parameter.

As an exemplary embodiment, the step S03 specifically includes:

and trimming at least one of the thickness, the shape and the flatness of the initial bonding pad C by laser.

As an exemplary embodiment, the step S03 specifically includes:

step 031, coating packaging material on the exposed bonding pad and circuit of the initial bonding pad C periphery for packaging;

step S032, trimming the packaging layer around the packaged pad to obtain a new pad with a predetermined exposed shape.

The following points need to be explained:

(1) The drawings of the embodiments of the disclosure only relate to the structures related to the embodiments of the disclosure, and other structures can refer to the common design.

(2) In the drawings used to describe embodiments of the disclosure, the thickness of layers or regions are exaggerated or reduced for clarity, i.e., the drawings are not necessarily to scale. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.

(3) Without conflict, embodiments of the present disclosure and features of the embodiments may be combined with each other to arrive at new embodiments.

The above is only a specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and the scope of the present disclosure should be determined by the scope of the claims.

Claims (15)

1. A pad repairing device is used for repairing a pad to be repaired on a circuit board; characterized in that the pad repair device comprises:

the pad pretreatment mechanism is used for carrying out pretreatment operation on a pad to be repaired and an adjacent pad thereof to obtain a region to be repaired;

the pad coating mechanism is used for forming an initial pad and comprises a coating component and a curing component, wherein the coating component is used for coating a conductive material on the area to be repaired, and the curing component is used for curing the coated conductive material to form the initial pad; and

the pad packaging mechanism is used for packaging at least the area where the initial pad is located to form a new pad with a preset exposure pattern;

wherein, the pad pre-processing mechanism comprises:

the desoldering assembly is used for performing desoldering treatment on a bonding pad of an initial region, and the initial region comprises a bonding pad to be repaired and a bonding pad adjacent to the bonding pad to be repaired;

the insulating layer removing assembly is used for removing part of the insulating layer at the periphery of the initial region, which is adjacent to the wiring position, so as to expose part of the wiring and form a region to be repaired; and the number of the first and second groups,

and the cleaning assembly is used for cleaning the area to be repaired.

2. The pad repair apparatus according to claim 1,

the workbench is used for placing the circuit board;

the workbench comprises different operation positions, and the pad pretreatment mechanism, the pad coating mechanism and the pad packaging mechanism are sequentially positioned at the different operation positions; or

The workbench is provided with at least one working position, and the pad preprocessing mechanism, the pad coating mechanism and the pad packaging mechanism can respectively move to the working position to execute corresponding operation.

3. The pad repair apparatus according to claim 1,

the pad coating mechanism further includes: a pad conditioning assembly for conditioning the initial pads to bring the initial pads to a predetermined standard, the predetermined standard comprising: the initial bonding pad has a preset thickness, a preset shape and a preset flatness.

4. The pad repair apparatus according to claim 3,

the pad trimming assembly includes a laser repair assembly for trimming at least one of a thickness, a shape and a flatness of the initial pad by a laser.

5. The pad repair apparatus according to claim 1,

the pad packaging mechanism includes:

the packaging assembly is used for coating packaging materials on at least the area where the initial bonding pad is located so as to carry out packaging; and

and the trimming component is used for trimming the packaged pad periphery packaging layer to obtain a new pad with a preset exposed shape.

6. The pad repair apparatus according to claim 5,

the packaging assembly comprises a coating needle tube for coating an insulating resin material on the periphery of the initial pad and/or a 3D printer for printing the insulating resin material on the periphery of the initial pad in a 3D printing mode; and/or

The trimming assembly includes a laser trimmer for cutting the encapsulation material by laser.

7. The pad repair apparatus according to claim 1,

the desoldering assembly comprises a fusion welding laser for fusion welding by emitting laser light, and/or an infrared fusion welding device for fusion welding by infrared rays;

the insulating layer removing assembly comprises an insulating layer removing laser for removing an insulating layer by emitting laser and/or a scraper for removing the insulating layer by mechanical cutting;

the cleaning assembly comprises a cleaning laser for cleaning foreign matters by emitting laser and/or a surface cleaning unit for blowing air to the area to be repaired to clean the foreign matters;

the fusion welding laser, the insulation layer removing laser and the cleaning laser respectively emit laser with different wavelengths.

8. The pad repair apparatus according to claim 7,

the surface cleaning unit includes:

the blowing pipe is positioned on one side of the area to be repaired and used for blowing air to the surface of the area to be repaired; and/or

The air suction pipe is positioned on the other side of the area to be repaired and is used for sucking air from the surface of the area to be repaired;

when the surface cleaning unit comprises the blowing pipe and the air suction pipe, the blowing opening of at least one blowing pipe is opposite to the air suction opening of at least one air suction pipe.

9. The pad repair apparatus according to claim 8,

the air blowing port is in a necking shape, and the inner diameter of the air blowing port gradually shrinks from one side far away from the air port to one side close to the air port; and/or the air suction opening is in a flaring shape, and the inner diameter of the air suction opening is gradually enlarged from one side far away from the air opening to one side close to the air opening.

10. The pad repair apparatus according to claim 8,

the blowing pipe is provided with a shielding piece for shielding the blowing opening to prevent the foreign matters from splashing.

11. The pad repair apparatus according to claim 10,

the shielding piece comprises a semi-surrounding cover which is arranged along the peripheral surface of the blowing pipe in a surrounding mode, and the semi-surrounding cover is arranged above the blowing opening in a covering mode.

12. The pad repair apparatus according to claim 7,

the number of the desoldering components is at least two, and when fusion welding is carried out, the at least two desoldering components are respectively positioned on two opposite sides of the pad to be repaired and the adjacent pad thereof, or the at least one desoldering component can move around the periphery of the pad to be repaired and the adjacent pad thereof.

13. The pad repair apparatus according to claim 1,

the pad coating mechanism further includes: an electrical measurement assembly for testing electrical properties of the initial pad.

14. The pad repair device of claim 13, wherein the electrical measurement assembly includes an electrical measurement probe for conducting electrical contact with the initial pad.

15. The pad repair apparatus according to claim 1,

the curing assembly includes a laser curing device.

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