CN114710889A - Brand-new fusion area design and manufacturing method based on PCB - Google Patents
Brand-new fusion area design and manufacturing method based on PCB Download PDFInfo
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- CN114710889A CN114710889A CN202111624867.0A CN202111624867A CN114710889A CN 114710889 A CN114710889 A CN 114710889A CN 202111624867 A CN202111624867 A CN 202111624867A CN 114710889 A CN114710889 A CN 114710889A
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- pcb
- copper
- plate
- fusion area
- copper plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a brand new fusion area design and manufacturing method based on a PCB (printed Circuit Board), which comprises the following steps of: s1: selecting a PCB substrate plate with good quality, and manufacturing CAM data on the basis of production process parameters; s2: arranging a copper plate at a certain position on one side surface of the PCB substrate plate, drawing diamond holes for copper on the copper plate, carrying out copper drawing treatment in a staggered manner from top to bottom, and inputting the arrangement position and the arrangement size of the copper plate into CAM data in the step S1; s3: and outputting the CAM data to complete the communication between the computer and the processing equipment. In the process of putting into use, the design and manufacture of the plate edges are not required to be increased, the utilization rate of the plate materials can be improved, glue is filled through the grid copper blocks designed in the fusion area during pressing, the loss of resin glue is reduced, the flatness of the fusion area is ensured, the generation of resin holes in the fusion area is reduced, the fusion area is not required to be processed and removed through a milling machine after pressing, and the working efficiency is improved.
Description
Technical Field
The invention relates to the technical field of PCB processing, in particular to a brand-new fusion area design and manufacturing method based on a PCB.
Background
Pcb (printed circuit board), i.e. printed wiring board, abbreviated as printed board, is one of the important parts in the electronic industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weapons systems, as long as there are electronic components such as integrated circuits, etc., printed boards are used for the electrical interconnection between the various components, which are composed of an insulating base plate, connecting wires and pads for mounting and soldering electronic components, and have the dual function of a conductive circuit and an insulating base plate.
In order to satisfy the operation requirement, can carry out the pressfitting with multilayer PCB board, wherein just involve the fusion district, in the fusion district of present design, there is the resin cavity in the fusion district after the pressfitting, and the face is sunken down, influences dry film and presses rumble life, current solution: the plate edge design is enlarged when the plate edge is designed, and a fusion area is arranged, and the whole fusion area is removed after pressing.
However, as described above, this process has the following 2 problems: 1. increasing board edge design wastes board material utilization rate, and 2, milling the fusion area by a milling machine to remove waste work efficiency, so that a brand new fusion area design and manufacturing method based on a PCB is provided for solving the problems.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a brand new fusion area design and manufacturing method based on a PCB.
In order to achieve the purpose, the invention adopts the following technical scheme:
a brand new fusion area design and manufacturing method based on a PCB comprises the following steps:
s1: selecting a PCB substrate plate with good quality, and manufacturing CAM data on the basis of production process parameters;
s2: arranging a copper plate at a certain position on one side surface of the PCB substrate plate, drawing diamond holes in the copper plate, carrying out copper drawing treatment in a staggered manner from top to bottom, and inputting the arrangement position and the arrangement size of the copper plate into CAM data in the step S1;
s3: outputting CAM data to complete the communication between the computer and the processing equipment;
s4: importing and modifying the graphic file about the copper plate in the step S2 through GENESIS software by using a photoplotting film technology, and finally outputting the graphic on the film;
s5: placing the board prepared in the step S4 into an exposure machine, carrying out inner layer exposure, and etching the exposed board to form a new PCB;
s6: completing the steps of S1-S6, a fused area is formed on the PCB board.
Preferably, in step S2, the size of the copper plate is determined by the size of the heating head of the hot melting machine, and the size parameters of the copper plate are as follows: 5 x 21 mm.
Preferably, the size of the diamond holes is 0.3mm, and the distance between every two diamond holes in the copper plate is 0.3 mm.
Preferably, in the stacking process of each PCB substrate board, the side surface of one side provided with the fusion area is close to the side surface of the other side not provided with the fusion area, the outer edges of each PCB substrate board are overlapped, and the outer edges of each PCB substrate board are consistent in size.
The brand new fusion area design and manufacturing method based on the PCB has the advantages that: the invention adopts a brand-new fusion area design and manufacture, does not need to enlarge the design and manufacture of plate edges, and can improve the utilization rate of plate materials;
in the hot pressing process, the heat melts the material of the PCB outside the fusion area, the melted material flows into the designed grid copper block for glue filling, and the loss of resin glue is reduced, so that the flatness of the fusion area is ensured, and the generation of resin cavities in the fusion area is reduced;
after the hot pressing process is completed, redundant leftover materials do not exist in the pressed plate, the fused area does not need to be machined and removed through a milling machine, and the working efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of a CAM design module of a fuse area of a brand new fuse area design and manufacturing method based on a PCB according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, which indicate orientations or positional relationships, are used based on the orientations or positional relationships shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Referring to fig. 1, a method for designing and manufacturing a brand new fusion area based on a PCB includes the steps of:
s1: selecting a PCB substrate plate with good quality, and manufacturing CAM data on the basis of production process parameters;
s2: arranging a copper plate at a certain position on one side surface of the PCB substrate plate, drawing diamond holes in the copper plate, carrying out copper drawing treatment in a staggered manner from top to bottom, and inputting the arrangement position and the arrangement size of the copper plate into CAM data in the step S1;
s3: outputting CAM data to complete the communication between the computer and the processing equipment;
s4: importing and modifying the graphic file about the copper plate in the step S2 through GENESIS software by using a photoplotting film technology, and finally outputting the graphic on the film;
s5: placing the board prepared in the step S4 into an exposure machine, carrying out inner layer exposure, and etching the exposed board to form a new PCB;
s6: completing the steps of S1-S6, a fused area is formed on the PCB board.
In step S2, the size of the copper plate is determined by the size of the heater head of the hot melting machine, and the dimensional parameters of the copper plate are as follows: 5 x 21 mm.
The size of the diamond holes is 0.3mm, and the distance between every two diamond holes in the copper plate is 0.3 mm.
In the stacking process of each PCB substrate board, the side face of one side provided with the fusion area is close to the side face of the other side not provided with the fusion area, the outer edges of each PCB substrate board are overlapped, and the outer edges of each PCB substrate board are consistent in size.
In the using process, a fusion area is designed on the cut PCB mainly, the fusion area only exists on one surface of the PCB, and the other surface of the PCB is not provided with the fusion area, so that the fusion area is close to the other surface of the combined PCB in the stacking process of each PCB, in the hot pressing process, when a hot melting head on a hot melting machine is in a downward pressing state, the hot melting head falls on a copper block which is used for picking copper, the position is kept not sunken due to pressure and is uniformly heated, materials at local positions of the PCB are melted in the heating process, uniformly flow into grid copper blocks among the PCBs and are filled with glue, the loss of resin glue is reduced, the flatness of the fusion area is ensured, the generation of resin holes in the fusion area is reduced, and the fusion area is not required to be processed and removed by a milling machine after the pressing;
in designing the fusion zone, the design flow is as follows:
I. firstly, manufacturing CAM data according to production process parameters, and designing a copper block with the size of 5 x 21mm at the edge of a PCB plate according to the size of a heating head of a hot melting machine in the process;
II. Diamond holes with copper of 0.3mm are dug in the copper block, are uniformly distributed at intervals of 0.3mm, and ensure that the upper row and the lower row of each diamond hole are uniformly staggered;
III, in the production process, outputting CAM design data to complete the connection between equipment and a computer, completing production preparation work, operating a photo-drawing film technology, importing and modifying a pattern file related to a copper plate through GENESIS software, finally outputting a pattern on the film, then carrying out inner layer exposure and etching on the upper part of the PCB plate, and finally forming a new fusion area on the prepared PCB plate;
and finally, stacking the PCB plates with different layers according to production requirements, and ensuring that a fusion area is arranged between every two PCB plates in the hot-pressing process.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (4)
1. A brand new fusion area design and manufacturing method based on a PCB comprises the following steps:
s1: selecting a PCB substrate plate with good quality, and manufacturing CAM data on the basis of production process parameters;
s2: arranging a copper plate at a certain position on one side surface of the PCB substrate plate, drawing diamond holes for copper on the copper plate, carrying out copper drawing treatment in a staggered manner from top to bottom, and inputting the arrangement position and the arrangement size of the copper plate into CAM data in the step S1;
s3: outputting CAM data to complete the communication between the computer and the processing equipment;
s4: importing and modifying the graphic file about the copper plate in the step S2 through GENESIS software by using a photoplotting film technology, and finally outputting the graphic on the film;
s5: placing the board prepared in the step S4 into an exposure machine, carrying out inner layer exposure, and etching the exposed board to form a new PCB;
s6: completing the steps of S1-S6, a fused area is formed on the PCB board.
2. The method as claimed in claim 1, wherein in step S2, the size of the copper plate is determined by the size of the heater head of the hot melting machine, and the size parameters of the copper plate are: 5 x 21 mm.
3. The method as claimed in claim 1, wherein the diamond holes have a size of 0.3mm, and the interval between the diamond holes inside the copper plate is 0.3 mm.
4. The method as claimed in claim 1, wherein during the stacking process, the side of each PCB substrate is close to the side of the other side without the fused region, and the outer edges of the PCB substrate are overlapped and the outer edges of the PCB substrate are identical in size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111624867.0A CN114710889A (en) | 2021-12-28 | 2021-12-28 | Brand-new fusion area design and manufacturing method based on PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111624867.0A CN114710889A (en) | 2021-12-28 | 2021-12-28 | Brand-new fusion area design and manufacturing method based on PCB |
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| Publication Number | Publication Date |
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| CN114710889A true CN114710889A (en) | 2022-07-05 |
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| CN202111624867.0A Pending CN114710889A (en) | 2021-12-28 | 2021-12-28 | Brand-new fusion area design and manufacturing method based on PCB |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205266033U (en) * | 2015-12-17 | 2016-05-25 | 景旺电子科技(龙川)有限公司 | Operation of high bed thickness copper PNL flange hot melting machine fuse piece |
| US20170013715A1 (en) * | 2015-07-10 | 2017-01-12 | Rohde & Schwarz Gmbh & Co. Kg | Printed circuit board and corresponding method for producing a printed circuit board |
| WO2018032634A1 (en) * | 2016-08-15 | 2018-02-22 | 建业科技电子（惠州）有限公司 | Fabrication process using semi-automated exposure machine to fabricate inner layer panel |
| CN111225509A (en) * | 2019-12-06 | 2020-06-02 | 中国电子科技集团公司第四十三研究所 | Etching method |
| CN112272454A (en) * | 2020-09-28 | 2021-01-26 | 江门崇达电路技术有限公司 | Method for preventing PCB (printed circuit board) from laminating, fusing and glue flowing |
-
2021
- 2021-12-28 CN CN202111624867.0A patent/CN114710889A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170013715A1 (en) * | 2015-07-10 | 2017-01-12 | Rohde & Schwarz Gmbh & Co. Kg | Printed circuit board and corresponding method for producing a printed circuit board |
| CN205266033U (en) * | 2015-12-17 | 2016-05-25 | 景旺电子科技(龙川)有限公司 | Operation of high bed thickness copper PNL flange hot melting machine fuse piece |
| WO2018032634A1 (en) * | 2016-08-15 | 2018-02-22 | 建业科技电子（惠州）有限公司 | Fabrication process using semi-automated exposure machine to fabricate inner layer panel |
| CN111225509A (en) * | 2019-12-06 | 2020-06-02 | 中国电子科技集团公司第四十三研究所 | Etching method |
| CN112272454A (en) * | 2020-09-28 | 2021-01-26 | 江门崇达电路技术有限公司 | Method for preventing PCB (printed circuit board) from laminating, fusing and glue flowing |
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