CN114702927B - Epoxy thermosetting packaging adhesive for probe card and preparation method thereof - Google Patents
Epoxy thermosetting packaging adhesive for probe card and preparation method thereof Download PDFInfo
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- CN114702927B CN114702927B CN202210446648.6A CN202210446648A CN114702927B CN 114702927 B CN114702927 B CN 114702927B CN 202210446648 A CN202210446648 A CN 202210446648A CN 114702927 B CN114702927 B CN 114702927B
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- 239000000523 sample Substances 0.000 title claims abstract description 39
- 239000004593 Epoxy Substances 0.000 title claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 21
- 239000000853 adhesive Substances 0.000 title claims abstract description 18
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 18
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 66
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 66
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 23
- 238000006243 chemical reaction Methods 0.000 claims description 22
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 20
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 18
- 239000000377 silicon dioxide Substances 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 239000013530 defoamer Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- ZKXWKVVCCTZOLD-UHFFFAOYSA-N copper;4-hydroxypent-3-en-2-one Chemical compound [Cu].CC(O)=CC(C)=O.CC(O)=CC(C)=O ZKXWKVVCCTZOLD-UHFFFAOYSA-N 0.000 claims description 4
- 239000007822 coupling agent Substances 0.000 claims description 4
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 4
- 239000000049 pigment Substances 0.000 claims description 4
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical group [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 claims description 4
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 3
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000004643 cyanate ester Substances 0.000 claims 3
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 claims 1
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 125000002883 imidazolyl group Chemical group 0.000 claims 1
- 230000035484 reaction time Effects 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 3
- 229920006332 epoxy adhesive Polymers 0.000 abstract description 2
- 230000009477 glass transition Effects 0.000 abstract description 2
- 238000001723 curing Methods 0.000 description 34
- 238000003860 storage Methods 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 239000006229 carbon black Substances 0.000 description 10
- 235000012239 silicon dioxide Nutrition 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000006087 Silane Coupling Agent Substances 0.000 description 7
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 7
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- JWUJQDFVADABEY-UHFFFAOYSA-N 2-methyltetrahydrofuran Chemical compound CC1CCCO1 JWUJQDFVADABEY-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 150000002460 imidazoles Chemical group 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000010816 packaging waste Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention belongs to the technical field of chip packaging, and particularly relates to epoxy thermosetting packaging adhesive for a probe card and a preparation method thereof. The invention provides a single-component epoxy adhesive which is heated and cured, low in curing temperature, low in curing shrinkage rate and low in expansion shrinkage rate after curing, has certain toughness after curing, high body strength and high glass transition temperature, has high and low temperature impact resistance, moisture and heat resistance and low dielectric property, and meets the requirements of high-density pin needles and multilayer placement packaging; because the cyanate resin has excellent temperature resistance, ultralow dielectric property and extremely low water absorption, in order to overcome the defects of the epoxy resin in the market, the cyanate resin is creatively introduced into the epoxy resin to prepare the cyanate modified epoxy, so that the temperature resistance and the electrical property are greatly improved.
Description
Technical Field
The invention belongs to the technical field of chip packaging, and particularly relates to epoxy thermosetting packaging adhesive for a probe card and a preparation method thereof.
Background
The wafer probe card is also called a probe card, and is named as a probe card in English. The wafer test method is widely applied to wafer test of memory, logic, consumption, driving, communication IC and other technological products, and belongs to a very fine ring in the semiconductor industry. When IC design is completed, the IC is subjected to wafer foundry fabrication, and wafer electrical testing and analysis processes are performed to ensure wafer yield and avoid packaging waste when packages are not cut after wafer fabrication is completed. The probe card and the testing machine form a testing loop, and before the IC packaging, the probe is used for testing the crystal grains, and chips with bad electrical functions are screened out, so that the waste of the manufacturing cost of the rear section caused by defective products is avoided.
Working principle: the probes on the probe card are directly contacted with the welding spots or the convex blocks on the chip to lead out the chip signals, and then the purpose of automatic measurement is achieved by matching with peripheral test instruments and software control.
Probe cards are one of the important processes in IC fabrication that have a considerable impact on fabrication costs, and with the rapid progress in semiconductor fabrication, conventional probe cards have faced with testing limitations, and probe card types have been developed to meet high-density testing. Cantilever and vertical probe cards are widely used in the market at present, and the manufacturing sequence of the cantilever probe card is fixed by epoxy resin according to a certain angle. The manufactured probe card has stable needle position; a plurality of probe sizes, a plurality of probe materials; the swing needle is flexible; single-layer and multi-layer; the manufacturing cost is low, and a single probe can be replaced; the method is used for high-current testing.
At present, probe cards are divided into pin needles: a small needle card below 1000 pin; 1000-2000pin is a middle needle card; and a large card above 2000 pin. Pin needles are placed at a minimum distance of 0.25mm, and Pin needles are placed at a minimum distance of 30 mu m; the materials and parameters of the pin needle are shown in fig. 1.
Aiming at the arrangement of the high-density probes of the probe card, the probes are slim, and electric signal transmission is required in the test process, so that the fixed epoxy resin has very strict requirements, such as: very low cure shrinkage, excellent electrical performance requirements, stable CTE, good temperature resistance, very low water absorption, etc.
At present, the epoxy resin commonly used in the market is generally insufficient in damp-heat resistance and impact resistance, and has high moisture absorption rate due to a large number of polar groups such as hydroxyl groups generated by reaction in the epoxy resin body structure, so that the electric property of a cured product is poor, and the dielectric constant is equal to or higher than 4. To reduce the degree of shrinkage and the expansion and shrinkage after curing, it is currently common practice to add a large amount of an inorganic filler having a small expansion coefficient. Research shows that on one hand, the curing shrinkage rate is quite related to the curing of the resin, and the reduction of the curing shrinkage rate needs to be studied from the aspects of resin modification and collocation; on the other hand, when a large amount of inorganic filler is added, the colloidal viscosity increases drastically when it is added to a certain amount, thereby affecting the operability of the encapsulation process.
Disclosure of Invention
The invention aims to overcome the defects, and provides the epoxy thermosetting packaging adhesive for the probe card, which has the advantages of single-component heating curing, low curing temperature, low curing shrinkage rate, low expansion shrinkage rate after curing, certain toughness, high body strength, high glass transition temperature, high-low temperature impact resistance, damp heat resistance and low dielectric property after curing, and meets the requirements of high-density pin needles and multilayer placement packaging; because the cyanate resin has excellent temperature resistance, ultralow dielectric property and extremely low water absorption, in order to overcome the defects of the epoxy resin in the market, the cyanate resin is creatively introduced into the epoxy resin, and the cyanate modified epoxy resin is prepared, so that the temperature resistance and the electrical property are greatly improved.
The invention provides an epoxy thermosetting packaging adhesive for a probe card, which comprises the following components in parts by weight:
preferably, the preparation method of the cyanate modified epoxy resin comprises the following steps:
(1) Mixing 20-40 parts of cyanate resin, 20-40 parts of epoxy resin II and 0.1-1 part of catalyst, and reacting to obtain a reaction material;
(2) And adding 40-60 parts of epoxy resin II into the reaction material, and reacting to obtain the cyanate modified epoxy resin.
Further, the temperature of the reaction is 125-135 ℃ and the time is 2-4h.
Further, the cyanate resin is one or more of bisphenol a cyanate resin, dicyclopentadiene cyanate resin and phenolic cyanate resin.
Further, the catalyst is stannous octoate, dibutyl tin dilaurate or copper acetylacetonate.
Preferably, the coupling agent is KH560 silane coupling agent and/or KH570 silane coupling agent.
Preferably, the epoxy resin I consists of 30-60 parts by weight of bisphenol F type epoxy resin, 20-30 parts by weight of bisphenol A type epoxy resin and 15-30 parts by weight of silica modified epoxy resin.
The system viscosity is reduced by bisphenol F type epoxy resin, the modified epoxy resin provides reduced curing shrinkage rate by adding 40% of spherical silica into the low viscosity epoxy resin, the bisphenol A type epoxy resin further provides curing low shrinkage, the imidazole adduct and the modified amine curing agent provide low temperature curing (anhydride curing accelerator) to shorten the curing time and provide proper toughness.
Preferably, the epoxy resin II is bisphenol F type epoxy resin and/or bisphenol A type epoxy resin.
Preferably, the curing agent A is methyl tetrahydrophthalic anhydride and/or methyl hexahydrophthalic anhydride, and the curing agent B is modified imidazole and/or modified amine.
Preferably, the curing agent A is available from Weisu Fine chemical Co., ltd. And has a particle size of 3. Mu.m.
Preferably, the curing agent B is available from Roche (Shanghai) Inc., having a particle size of 10. Mu.m.
Preferably, the defoamer is BYK-530 from BYK Pick, germany.
Preferably, the pigment is Degussa carbon black T4.
Preferably, the filler consists of spherical silica having diameters of 10 μm, 5 μm and 1.0 μm; the weight ratio of the spherical silica having diameters of 10 μm, 5 μm and 1.0 μm is 50-90:10-30:0.1-1.
The aim of maximum filling is achieved by adopting the proportion of spherical fillers with different diameters, so that the expansion and shrinkage rate after curing is greatly reduced.
The invention provides a preparation method of the epoxy thermosetting packaging adhesive for the probe card, which comprises the following steps:
(1) Mixing the cyanate modified epoxy resin, the epoxy resin I, the defoamer, the coupling agent, the pigment and the filler to obtain a mixed material;
(2) And adding the curing agent A and the curing agent B into the mixed material, mixing, then carrying out vacuum defoamation, controlling the temperature of the material to be not more than 35 ℃, and then sub-packaging and storing at the storage temperature of minus 40 ℃ to obtain the epoxy thermosetting packaging adhesive for the probe card.
Compared with the prior art, the technical scheme of the invention has the following advantages:
(1) The low-shrinkage single-component epoxy thermosetting packaging adhesive for the probe card has the advantages of low curing temperature, high curing speed, low shrinkage after thermosetting, low linear expansion coefficient after curing, and low dielectric and low water absorption.
(2) The preparation method of the low-shrinkage single-component epoxy thermosetting packaging adhesive for the probe card has the advantages of simple process, low production cost, environmental friendliness and wide application prospect.
Drawings
Fig. 1 shows the materials and parameters of pin needles.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
Example 1
300g of bisphenol A cyanate resin, 300g of bisphenol F epoxy resin and 1g of stannous octoate are mixed, and after reaction for 2 hours at 130 ℃, 500g of bisphenol F epoxy resin is added into the reaction material, and reaction is carried out for 3 hours at 130 ℃ to obtain the cyanate modified epoxy resin.
50g of the cyanate modified epoxy resin, 30g of bisphenol F epoxy resin, 10g of bisphenol A epoxy resin, 15g of silicon dioxide modified epoxy resin, 0.2g of BYK-530 defoamer, 3g of KH560 silane coupling agent, 0.3g of carbon black T4 and 250g of spherical silicon dioxide are mixed, 65g of methyltetrahydrofuran and 5g of modified amine are added and mixed, then vacuum defoamation is carried out, the material temperature is controlled to be not more than 35 ℃, and then split charging and storage are carried out, wherein the storage temperature is-40 ℃.
Example 2
200g of dicyclopentadiene cyanate resin, 200g of bisphenol F type epoxy resin and 1g of dibutyltin dilaurate are mixed, and after reaction for 2 hours at 125 ℃, 400g of bisphenol A type epoxy resin is added into the reaction material, and reaction is carried out for 2 hours at 130 ℃ to obtain the cyanate modified epoxy resin.
40g of the cyanate modified epoxy resin, 40g of bisphenol F epoxy resin, 5g of bisphenol A epoxy resin, 10g of silicon dioxide modified epoxy resin, 0.1g of BYK-530 defoamer, 3g of KH560 silane coupling agent, 0.5g of carbon black T4 and 300g of spherical silicon dioxide are mixed, 80g of methyltetrahydrofuran and 8g of modified imidazole are added for mixing, then vacuum defoaming is carried out, the material temperature is controlled to be not higher than 35 ℃, and then split charging and storage are carried out, wherein the storage temperature is-40 ℃.
Example 3
400g of phenolic cyanate resin, 400g of bisphenol F epoxy resin and 10g of copper acetylacetonate are mixed, and 600g of bisphenol F epoxy resin is added into the reaction material after 3 hours of reaction at 135 ℃ to obtain the cyanate modified epoxy resin after 4 hours of reaction at 135 ℃.
60g of the cyanate modified epoxy resin, 20g of bisphenol F type epoxy resin, 5g of bisphenol A type epoxy resin, 10g of silicon dioxide modified epoxy resin, 0.2g of BYK-530 defoamer, 1g of KH560 silane coupling agent, 0.1g of carbon black T4 and 350g of spherical silicon dioxide are mixed, 60g of methyl hexahydrophthalic anhydride and 9g of modified amine are added, then the mixture is mixed, then vacuum defoamation is carried out, the material temperature is controlled to be not higher than 35 ℃, and then split charging and storage are carried out, wherein the storage temperature is-40 ℃.
Example 4
400g of bisphenol A cyanate resin, 200g of bisphenol A epoxy resin and 4g of stannous octoate are mixed, and after reaction for 3 hours at 132 ℃, 450g of bisphenol A epoxy resin is added into the reaction material, and reaction is carried out for 2 hours at 132 ℃ to obtain the cyanate modified epoxy resin.
50g of the cyanate modified epoxy resin, 20g of bisphenol F type epoxy resin, 15g of bisphenol A type epoxy resin, 15g of silicon dioxide modified epoxy resin, 0.2g of BYK-530 defoamer, 2g of KH560 silane coupling agent, 0.4g of carbon black T4 and 260g of spherical silicon dioxide are mixed, 70g of methyl hexahydrophthalic anhydride and 6g of modified imidazole are added and mixed, then vacuum defoamation is carried out, the material temperature is controlled to be not higher than 35 ℃, and then split charging and storage are carried out, wherein the storage temperature is-40 ℃.
Example 5
300g of dicyclopentadiene cyanate resin, 200g of bisphenol A type epoxy resin and 2g of copper acetylacetonate are mixed, and after reaction for 2 hours at 135 ℃, 500g of bisphenol F type epoxy resin is added into the reaction material for 2 hours at 125 ℃ to obtain cyanate modified epoxy resin.
50g of the cyanate modified epoxy resin, 28g of bisphenol F epoxy resin, 18g of bisphenol A epoxy resin, 16g of silicon dioxide modified epoxy resin, 0.2g of BYK-530 defoamer, 3g of KH570 silane coupling agent, 0.3g of carbon black T4 and 300g of spherical silicon dioxide are mixed, 80g of methyltetrahydrofuran and 5g of modified amine are added and mixed, then vacuum defoamation is carried out, the material temperature is controlled to be not higher than 35 ℃, and then split charging and storage are carried out, wherein the storage temperature is-40 ℃.
The low-shrinkage single-component epoxy thermosetting packaging adhesive for the probe card only needs 8-10min for curing at 150 ℃, and compared with the prior art, the low-shrinkage single-component epoxy thermosetting packaging adhesive for the probe card has low curing temperature and high curing speed; the shrinkage rate after thermosetting is low (the shrinkage rate is less than 0.2% by adopting a measuring method specific gravity method); the linear expansion coefficient after curing is low (using TMA test, a1 is 18 ppm/. Degree.C., a2 is 70 ppm/. Degree.C.); low dielectric, dielectric constant Dk (1 MHz): < 3; the water absorption is lower than 0.15%.
Comparative example 1
Pre-dispersing E51 epoxy resin, 692 epoxy diluent and dibutyl phthalate for 5min to be uniform according to the formula of the table 1; adding white carbon black, carbon black and calcium carbonate, uniformly dispersing, and vacuum defoaming; adding dicyandiamide curing agent and curing accelerator, dispersing uniformly, and vacuum defoaming to obtain the single-component epoxy adhesive for Type-C, and then subpackaging and storing at the storage temperature of 5 ℃. The temperature of the materials is controlled to be 20-35 ℃.
Table 1 comparative example formulation of the amount of each component added
| Component name | Parts by mass/kg |
| E51 epoxy resin | 100 |
| 692 epoxy diluent | 9 |
| Dibutyl phthalate | 7 |
| White carbon black | 1.5 |
| Carbon black T4 | 0.2 |
| 1003 calcium carbonate | 150 |
| 3060 dicyandiamide curing agent | 8 |
| 1020 curing accelerator | 2 |
The encapsulation compound test was performed on comparative example 1, which required 45 minutes for curing at 150 ℃ and shrinkage after heat curing (also using the measurement method specific gravity method, shrinkage was 0.7%); linear expansion coefficient after curing (a 1 is 40 ppm/. Degree.C., a2 is 150 ppm/. Degree.C.); the dielectric constant Dk (1 MHz) is 4.5; the water absorption was about 0.55%.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present invention will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.
Claims (6)
1. The epoxy thermosetting packaging adhesive for the probe card is characterized by comprising the following components in parts by weight:
35-70 parts of cyanate modified epoxy resin;
50-80 parts of epoxy resin I;
60-90 parts of curing agent A;
5-10 parts of curing agent B;
0.1-0.3 part of defoaming agent;
1-4 parts of a coupling agent;
pigment 0.1-0.5 parts;
150-350 parts of filler;
the preparation method of the cyanate modified epoxy resin comprises the following steps:
(1) Mixing 20-40 parts of cyanate resin, 20-40 parts of epoxy resin II and 0.1-1 part of catalyst by weight for reaction to obtain a reaction material;
(2) Adding 40-60 parts of epoxy resin II into the reaction material, and reacting to obtain the cyanate modified epoxy resin; in the steps (1) and (2), the reaction temperature is 125-135 ℃ and the reaction time is 2-4 hours; the catalyst is stannous octoate, dibutyl tin dilaurate or copper acetylacetonate; the curing agent A is methyl tetrahydrophthalic anhydride and/or methyl hexahydrophthalic anhydride, and the curing agent B is modified imidazole and/or modified amine.
2. The epoxy thermosetting encapsulating adhesive for a probe card of claim 1, wherein the cyanate ester resin is one or more of bisphenol a cyanate ester resin, dicyclopentadiene cyanate ester resin, and phenolic cyanate ester resin.
3. The epoxy thermosetting packaging adhesive for a probe card according to claim 1, wherein the epoxy resin II is bisphenol F type epoxy resin and/or bisphenol A type epoxy resin.
4. The epoxy thermosetting encapsulating adhesive for a probe card according to claim 1, wherein the epoxy resin i is composed of 30 to 60 parts by weight of bisphenol F type epoxy resin, 20 to 30 parts by weight of bisphenol a type epoxy resin and 15 to 30 parts by weight of silica modified epoxy resin.
5. The epoxy thermosetting encapsulating compound for a probe card according to claim 1, wherein the filler is composed of spherical silica having diameters of 10 μm, 5 μm and 1.0 μm; the weight ratio of the spherical silica having diameters of 10 μm, 5 μm and 1.0 μm is 50-90:10-30:0.1-1.
6. The method for preparing the epoxy thermosetting packaging adhesive for the probe card according to any one of claims 1 to 5, comprising the following steps:
(1) Mixing the cyanate modified epoxy resin, the epoxy resin I, the defoamer, the coupling agent, the pigment and the filler to obtain a mixed material;
(2) And adding the curing agent A and the curing agent B into the mixed material at the temperature of 30-40 ℃ and mixing to obtain the epoxy thermosetting packaging adhesive for the probe card.
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| CN113528071A (en) * | 2021-08-23 | 2021-10-22 | 黑龙江省科学院石油化学研究院 | Low-dielectric epoxy adhesive and preparation method thereof |
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| CN113528071A (en) * | 2021-08-23 | 2021-10-22 | 黑龙江省科学院石油化学研究院 | Low-dielectric epoxy adhesive and preparation method thereof |
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