CN114701076A - Diamond fretsaw cutting method based on ultrasonic atomization - Google Patents
Diamond fretsaw cutting method based on ultrasonic atomization Download PDFInfo
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- CN114701076A CN114701076A CN202210347013.0A CN202210347013A CN114701076A CN 114701076 A CN114701076 A CN 114701076A CN 202210347013 A CN202210347013 A CN 202210347013A CN 114701076 A CN114701076 A CN 114701076A
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- Prior art keywords
- cutting
- saw
- diamond
- wire
- liquid
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- 238000005520 cutting process Methods 0.000 title claims abstract description 86
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 71
- 239000010432 diamond Substances 0.000 title claims abstract description 71
- 238000000889 atomisation Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 55
- 239000002173 cutting fluid Substances 0.000 claims abstract description 10
- 238000005299 abrasion Methods 0.000 claims abstract description 6
- 230000035699 permeability Effects 0.000 claims abstract description 4
- 239000002245 particle Substances 0.000 claims description 10
- 239000006185 dispersion Substances 0.000 claims description 4
- 230000002035 prolonged effect Effects 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000001050 lubricating effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/06—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with reciprocating saw-blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by ultrasonic cutting
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
A diamond wire saw cutting method based on ultrasonic atomization comprises the following specific steps: step S1, enabling the workpiece to be cut to be close to the diamond wire saw, and cutting the workpiece; step S2, the ultrasonic vibration tool head applies ultrasonic vibration waves with certain amplitude and frequency to the diamond saw wire; step S3, the liquid supply nozzle drops the cutting liquid on the diamond saw wire, and the cutting liquid is atomized into fine liquid drops to be absorbed on the diamond saw wire through ultrasonic vibration wave acted on the diamond saw wire; and step S4, bringing the cutting fluid into the cutting area during the reciprocating motion of the diamond wire saw for cutting the workpiece. The invention improves the permeability of cutting liquid and the problem of uneven temperature distribution during cutting, thereby improving the quality of workpieces, improving the problem of workpiece warping, reducing the abrasion of saw wires and prolonging the service life of the saw wires.
Description
Technical Field
The invention belongs to the technical field of diamond wire saw cutting, and particularly relates to a diamond wire saw cutting method based on ultrasonic atomization.
Background
In the silicon wafer cutting, the diamond wire saw cutting becomes a main choice due to small kerf loss, high cutting speed and small machined surface cracks. With the large diameter and the thin slice of the silicon wafer, in the traditional cast diamond wire saw cutting the silicon wafer, cutting fluid is difficult to effectively enter narrow and deep cutting seams and reach the middle part of a cutting area, so that heat generated during cutting is difficult to timely eliminate, cutting heat is not uniformly distributed, the temperature is increased and is not uniformly distributed, a workpiece is further warped and deformed, and abrasive particles on the saw wire are easy to fall off; meanwhile, as the cutting liquid is difficult to enter, the lubricating effect in the cutting process is weakened, the quality of the cut surface of the workpiece is reduced, and the difficulty and the cost of the subsequent processing flow and the abrasion of the abrasive particles on the saw wire are increased. The service life of the diamond saw wire is reduced, and the cutting cost of the diamond wire saw is increased.
Disclosure of Invention
In view of the problems in the introduction of the background technology, the invention aims to provide a diamond wire saw cutting method based on ultrasonic atomization, which can effectively improve the cutting efficiency and the surface quality of a workpiece and reduce the cutting cost.
The technical scheme adopted by the invention is as follows:
a diamond wire saw cutting method based on ultrasonic atomization comprises the following specific steps:
step S1, enabling the workpiece to be cut to be close to the diamond wire saw, and cutting the workpiece;
step S2, the ultrasonic vibration tool head applies ultrasonic vibration waves with certain amplitude and frequency to the diamond saw wire;
step S3, the liquid supply nozzle drops the cutting liquid on the diamond saw wire, and the cutting liquid is atomized into fine liquid drops by ultrasonic vibration wave acting on the diamond saw wire and absorbed on the diamond saw wire;
and step S4, bringing the cutting fluid into the cutting area during the reciprocating motion of the diamond wire saw for cutting the workpiece. The invention introduces the ultrasonic atomization technology into the cutting field of a diamond wire saw, ultrasonic waves generated by an ultrasonic generator are transmitted to a diamond saw wire through a vibration tool head and are transmitted to atomized medium cutting liquid, surface tension waves are formed at a gas-liquid interface, liquid molecular acting force is destroyed due to ultrasonic cavitation, liquid drops with uniform dispersion and extremely small particle size are formed, the liquid drops are adsorbed on the surface of the diamond saw wire and are brought into a cutting area by the saw wire, the permeability of the cutting liquid is improved, the problem of uneven temperature distribution during cutting is solved, the quality of a workpiece is improved, the warping problem of the workpiece is improved, the abrasion of the saw wire is reduced, and the service life of the saw wire is prolonged.
Furthermore, the diamond saw wire is electroplated diamond saw wire, diamond abrasive particles are uniformly fixed on the bus in an electroplating mode, and the diamond saw wire has good conductivity.
Further, the ultrasonic vibration tool head is connected to an ultrasonic generator that outputs ultrasonic waves in step S2.
Further, the ultrasonic vibration tool head in step S2 is disposed perpendicular to the wire moving direction.
Further, in step S3, the liquid supply nozzle is connected to a cutting liquid storage device in which the cutting liquid dedicated for the diamond wire saw is stored.
Compared with the prior art, the invention has the following remarkable advantages: the ultrasonic atomization technology is introduced into the field of cutting of diamond wire saws, ultrasonic waves generated by an ultrasonic generator are transmitted to diamond saw wires through a vibration tool head and are transmitted to atomized medium cutting liquid, surface tension waves are formed at a gas-liquid interface, liquid molecular acting force is destroyed due to ultrasonic cavitation, liquid drops with uniform dispersion and extremely small particle size are formed, the liquid drops are adsorbed on the surfaces of the diamond saw wires and are brought into a cutting area by the saw wires, the permeability of the cutting liquid is improved, the problem of uneven temperature distribution during cutting is solved, the quality of workpieces is improved, the problem of workpiece warping is solved, the abrasion of the saw wires is reduced, and the service life of the saw wires is prolonged.
Drawings
FIG. 1 is a schematic cut-away view of the present invention.
In the figure, a diamond saw wire 1, a liquid supply nozzle 2, a cutting liquid storage device 3, a workpiece 4, an ultrasonic generator 5, an ultrasonic vibration tool head 6 and cutting liquid 7 are shown.
Detailed Description
The present invention is further illustrated by the following examples, which are not intended to limit the invention to these embodiments. It will be appreciated by those skilled in the art that the present invention encompasses all alternatives, modifications and equivalents as may be included within the scope of the claims.
Referring to fig. 1, the present embodiment provides a diamond wire saw cutting method based on ultrasonic atomization, comprising the following steps:
step S1, enabling the workpiece 4 to be cut to be close to the cutting part of the diamond wire saw cutting machine, and cutting the workpiece 4 by the cutting part;
step S2, the ultrasonic vibration tool head 6 is connected with the ultrasonic generator 5, is close to the diamond saw wire 1 and is vertical to the motion direction of the saw wire, and applies ultrasonic vibration waves with certain amplitude and frequency to the saw wire;
step S3, connecting the liquid supply nozzle 2 with the cutting liquid storage device 3, dripping the cutting liquid 7 into the diamond saw wire 1 by the liquid supply nozzle 2, and atomizing the cutting liquid 7 into fine liquid drops through ultrasonic vibration to be adsorbed on the diamond saw wire 1;
in step S4, the cutting fluid 7 is brought into the cutting region while the diamond wire saw 1 is reciprocating to cut the workpiece 4.
In the embodiment, the diamond saw wire 1 is an electroplated diamond saw wire, diamond abrasive particles are uniformly fixed on a bus in an electroplating mode, and the diamond saw wire has good conductivity.
In the embodiment, the cutting fluid 7 is a cutting fluid special for a diamond wire saw, is stored in the cutting fluid storage device 3, and is dripped on the diamond wire saw 1 through the liquid supply nozzle 2. The ultrasonic vibration tool head 6 is connected with an ultrasonic generator 5, ultrasonic waves generated by the generator are transmitted through an atomizing medium to be transmitted, surface tension waves are formed at a gas-liquid interface, liquid molecule acting force is destroyed due to the ultrasonic cavitation effect, liquid drops with uniform dispersion and extremely small grain sizes are formed, and the liquid drops are adsorbed on the diamond saw wire 1 and then enter a cutting area.
In the cutting process of the traditional diamond wire saw, the cutting fluid 7 has no ultrasonic atomization effect. In the cutting process, the cutting fluid 7 is large in usage amount and difficult to effectively enter the middle position of the large-size workpiece 4 area, so that the heat generated by the saw wire 1 and the workpiece 4 is difficult to effectively reduce during cutting, the temperature rises and is not uniformly distributed, the workpiece 4 is warped and deformed, the cutting quality and the cutting efficiency are affected, the difficulty and the cost of the subsequent processing flow are increased, meanwhile, the diamond saw wire 1 is seriously worn, the service life is reduced, and the cutting cost of the diamond wire saw is increased.
In the cutting process of the diamond wire saw, the particle size of the cutting liquid 7 is extremely small and is uniformly distributed by adopting an ultrasonic atomization technology, the cutting liquid 7 entering a cutting area of the workpiece 4 is increased, the heat generated in the cutting area is effectively reduced, the temperature is uniformly distributed, the warping deformation condition of the workpiece 4 is improved, and meanwhile, diamond abrasive particles are not easy to fall off; the increase of the cutting liquid 7 in the cutting area strengthens the lubricating effect on the saw wire 1 and the workpiece 4, thereby improving the surface quality of the workpiece 4, reducing the abrasion of diamond abrasive particles and prolonging the service life of the saw wire.
Claims (5)
1. A diamond wire saw cutting method based on ultrasonic atomization comprises the following specific steps:
step S1, enabling the workpiece to be cut to be close to the diamond wire saw, and cutting the workpiece;
step S2, the ultrasonic vibration tool head applies ultrasonic vibration waves with certain amplitude and frequency to the diamond saw wire;
step S3, the liquid supply nozzle drops the cutting liquid on the diamond saw wire, and the cutting liquid is atomized into fine liquid drops by ultrasonic vibration wave acting on the diamond saw wire and absorbed on the diamond saw wire;
and step S4, bringing the cutting fluid into the cutting area during the reciprocating motion of the diamond wire saw for cutting the workpiece. The invention introduces the ultrasonic atomization technology into the cutting field of a diamond wire saw, ultrasonic waves generated by an ultrasonic generator are transmitted to a diamond saw wire through a vibration tool head and are transmitted to atomized medium cutting liquid, surface tension waves are formed at a gas-liquid interface, liquid molecular acting force is destroyed due to ultrasonic cavitation, liquid drops with uniform dispersion and extremely small particle size are formed, the liquid drops are adsorbed on the surface of the diamond saw wire and are brought into a cutting area by the saw wire, the permeability of the cutting liquid is improved, the problem of uneven temperature distribution during cutting is solved, the quality of a workpiece is improved, the warping problem of the workpiece is improved, the abrasion of the saw wire is reduced, and the service life of the saw wire is prolonged.
2. The diamond wire saw cutting method based on ultrasonic atomization according to claim 1, characterized in that: the diamond saw wire is an electroplated diamond saw wire.
3. The diamond wire saw cutting method based on ultrasonic atomization according to claim 1, characterized in that: the ultrasonic vibration tool head is connected to an ultrasonic generator that outputs ultrasonic waves in step S2.
4. The diamond wire saw cutting method based on ultrasonic atomization according to claim 1, characterized in that: the ultrasonic vibration tool head in step S2 is disposed perpendicular to the direction of the wire movement.
5. The ultrasonic atomization based diamond wire saw cutting method according to any one of claims 1 to 4, wherein: and in the step S3, the liquid supply nozzle is connected with a cutting liquid storage device for storing the cutting liquid special for the diamond wire saw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210347013.0A CN114701076A (en) | 2022-04-01 | 2022-04-01 | Diamond fretsaw cutting method based on ultrasonic atomization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210347013.0A CN114701076A (en) | 2022-04-01 | 2022-04-01 | Diamond fretsaw cutting method based on ultrasonic atomization |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114701076A true CN114701076A (en) | 2022-07-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210347013.0A Pending CN114701076A (en) | 2022-04-01 | 2022-04-01 | Diamond fretsaw cutting method based on ultrasonic atomization |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114701076A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011224761A (en) * | 2010-04-19 | 2011-11-10 | Kazumasa Onishi | Wire saw apparatus and cutting method using the same |
| CN202137674U (en) * | 2011-06-07 | 2012-02-08 | 西安理工大学 | High-speed ultrasonic vibration scroll saw device for cutting hard and brittle materials |
| CN103551682A (en) * | 2013-11-13 | 2014-02-05 | 安徽工业大学 | Using method of portable wire cutting saw |
| CN107020417A (en) * | 2017-06-08 | 2017-08-08 | 浙江阿波罗工具有限公司 | A kind of cutting machine clamp port frock and its application method |
| CN108177261A (en) * | 2017-12-28 | 2018-06-19 | 上海理工大学 | Oblique ultrasonic vibration auxiliary diamond wire saw cutting device and method |
| CN109465728A (en) * | 2018-12-10 | 2019-03-15 | 宁波职业技术学院 | A kind of electrostatic spray diamond wire saw cutting process |
| CN109732411A (en) * | 2019-01-16 | 2019-05-10 | 上海理工大学 | The device and its application method of cutting monocrystalline silicon are assisted using lateral ultrasonic vibration |
| CN112549334A (en) * | 2020-11-12 | 2021-03-26 | 浙江工业大学 | Cutting method of diamond wire saw with charged adsorption of saw wire |
| CN112706298A (en) * | 2020-12-31 | 2021-04-27 | 北京航空航天大学 | Ultrasonic vibration composite atomization knife handle |
-
2022
- 2022-04-01 CN CN202210347013.0A patent/CN114701076A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011224761A (en) * | 2010-04-19 | 2011-11-10 | Kazumasa Onishi | Wire saw apparatus and cutting method using the same |
| CN202137674U (en) * | 2011-06-07 | 2012-02-08 | 西安理工大学 | High-speed ultrasonic vibration scroll saw device for cutting hard and brittle materials |
| CN103551682A (en) * | 2013-11-13 | 2014-02-05 | 安徽工业大学 | Using method of portable wire cutting saw |
| CN107020417A (en) * | 2017-06-08 | 2017-08-08 | 浙江阿波罗工具有限公司 | A kind of cutting machine clamp port frock and its application method |
| CN108177261A (en) * | 2017-12-28 | 2018-06-19 | 上海理工大学 | Oblique ultrasonic vibration auxiliary diamond wire saw cutting device and method |
| CN109465728A (en) * | 2018-12-10 | 2019-03-15 | 宁波职业技术学院 | A kind of electrostatic spray diamond wire saw cutting process |
| CN109732411A (en) * | 2019-01-16 | 2019-05-10 | 上海理工大学 | The device and its application method of cutting monocrystalline silicon are assisted using lateral ultrasonic vibration |
| CN112549334A (en) * | 2020-11-12 | 2021-03-26 | 浙江工业大学 | Cutting method of diamond wire saw with charged adsorption of saw wire |
| CN112706298A (en) * | 2020-12-31 | 2021-04-27 | 北京航空航天大学 | Ultrasonic vibration composite atomization knife handle |
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