CN114689119B - Chip package multi-parameter detection equipment and detection method - Google Patents
Chip package multi-parameter detection equipment and detection method Download PDFInfo
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- CN114689119B CN114689119B CN202210301140.7A CN202210301140A CN114689119B CN 114689119 B CN114689119 B CN 114689119B CN 202210301140 A CN202210301140 A CN 202210301140A CN 114689119 B CN114689119 B CN 114689119B
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- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
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Abstract
The application provides a chip packaging multi-parameter detection device, which comprises a detection table, wherein the detection table is provided with detection bits used for placing chips; the pressure detection assembly comprises a pressure regulator, a pressure cover and a pressure sensor; the pressure sensor is arranged in the accommodating cavity and is used for detecting the pressure value in the accommodating cavity; the temperature detection assembly comprises a heating device and a temperature sensor, and the temperature sensor is arranged in the accommodating cavity and is used for detecting the temperature value in the accommodating cavity; the humidity detection assembly comprises a humidifier and a humidity sensor, and the humidity sensor is arranged in the accommodating cavity and is used for detecting the humidity value in the accommodating cavity; the central control unit is arranged on the base. According to the method and the device, the chip internal parameters of the chip are tested under the conditions of different environment external parameters, so that whether the chip meets the use requirements or not is judged, the detection cost is reduced, the detection period is shortened, and the detection error is reduced.
Description
Technical Field
The application relates to the technical field of chip packaging, in particular to chip packaging multi-parameter detection equipment and a detection method.
Background
With the advancement of society, the chip is continuously designed with the requirements of higher speed, higher performance and higher integration, and the packaging of the chip is particularly important, when the chip is packaged, parameter detection needs to be performed on a sample chip which is randomly extracted, the detection includes chip internal parameters and environment external parameters, wherein the chip internal parameters include leakage current, signal to noise ratio, intermodulation distortion, jitter, phase noise and the like, and the environment external parameters mainly include temperature, pressure, humidity and the like so as to detect whether the chip meets the use requirement.
When the external parameters of the environment are changed, the internal parameters are detected at the same time so as to detect the change of the internal parameters of the chip under different environmental conditions, and whether the chip meets the use requirements under different environmental conditions is indirectly tested. However, the existing detection device generally can only detect a single external environment parameter, and when different external environment parameters are required to be used as target parameters, different detection devices are often required to be replaced for detection, so that the detection cost and the detection period are increased. In addition, when the external parameters of the target environment are changed, other external parameters of the environment may also be changed, so that it cannot be guaranteed that the change of the internal parameters of the chip corresponds to the change of the external parameters of the target environment, and the detection error is increased.
Disclosure of Invention
The embodiment of the application provides chip package multi-parameter detection equipment and a detection method, so as to improve the technical problems.
In a first aspect, an embodiment of the present application provides a chip package multi-parameter detection apparatus, including a detection stage, where the detection stage is provided with a detection bit, and the detection bit is used for placing a chip; the pressure detection assembly comprises a pressure regulator, a pressure cover and a pressure sensor, wherein the pressure cover is connected to the edge of the detection table and is used for sealing the detection table, and the pressure cover and the detection table enclose a containing cavity; the pressure regulator is communicated with the accommodating cavity to change the pressure of the accommodating cavity; the pressure sensor is arranged in the accommodating cavity and is used for detecting the pressure value in the accommodating cavity and generating a pressure signal; the temperature detection assembly comprises a heating device and a temperature sensor, and the heating device is arranged in the accommodating cavity so as to adjust the temperature in the accommodating cavity; the temperature sensor is arranged in the accommodating cavity and is used for detecting the temperature value in the accommodating cavity; the humidity detection assembly comprises a humidifier and a humidity sensor, and the humidifier is arranged in the accommodating cavity so as to adjust the humidity in the accommodating cavity; the humidity sensor is arranged in the accommodating cavity and is used for detecting the humidity value in the accommodating cavity; the central control unit is arranged on the detection table, and the chip, the pressure sensor, the temperature sensor and the humidity sensor are all electrically connected with the central control unit.
In some embodiments, the detection platform is provided with a mounting hole, and the mounting hole penetrates through the detection platform and is communicated with the accommodating cavity; the detection equipment further comprises a circuit board, the circuit board is located at one end of the mounting hole, the circuit board faces to one side surface of the accommodating cavity and is used for bearing a chip, the pressure sensor, the temperature sensor and the humidity sensor are electrically connected with the circuit board, and one side surface of the circuit board, which faces away from the accommodating cavity, is electrically connected with the central control unit.
In some embodiments, the mounting holes are circular, the mounting holes comprise coaxial first mounting holes and second mounting holes, one end of each first mounting hole is communicated with the accommodating cavity, the other end of each first mounting hole is communicated with the second mounting hole, and the aperture of each first mounting hole is smaller than that of each second mounting hole; a first step surface is formed on the surface of the detection table, which is positioned in the second mounting hole; the detection equipment further comprises an installation table which is used for being embedded into the installation hole, the installation table comprises a first installation table and a second installation table which are coaxially connected in a superposition mode, a detection position is arranged on the surface, far away from the second installation table, of the first installation table, and a second step surface is formed on the surface, connected with the first installation table, of the second installation table; when the mounting table is embedded into the mounting hole, the first mounting table is embedded into the first mounting hole, the second mounting table is embedded into the second mounting hole, and the first step surface is overlapped with the second step surface.
In some embodiments, the first step surface is provided with an annular groove extending circumferentially around the axis of the first mounting hole; the second step surface is provided with a ring-shaped bulge which is used for being embedded into the ring-shaped groove; the side wall of the detection table, which is positioned in the second mounting hole, is provided with a first bearing table, the first bearing table circumferentially extends around the axis of the second mounting hole, and the surrounding angle of the first bearing table is smaller than or equal to 180 degrees; the side surface of the second installation table is provided with a second bearing table matched with the first bearing table, the second bearing table circumferentially extends around the axis of the second installation table, and the surrounding angle of the second bearing table is the same as that of the first bearing table; when the mounting table is embedded into the mounting hole, the annular protrusion is embedded into the annular groove, and the surface of the annular protrusion is attached to the inner wall of the annular groove; the first bearing table is positioned below the second bearing table and is abutted against the second bearing table.
In some embodiments, the mounting table is provided with a through hole, the through hole coincides with the axis of the mounting table, one end of the through hole penetrates through one end of the first mounting table far away from the second mounting table and is communicated with the detection position, and the other end of the through hole penetrates through one end of the second mounting table far away from the first mounting table; the circuit board is arranged at the detection position, one side surface of the circuit board, which is far away from the accommodating cavity, is electrically connected with a wire, and the other end of the wire extends out of the accommodating cavity through the through hole and is electrically connected with the central control unit.
In some embodiments, the pressure cover is provided with a pressure regulating port which is communicated with the accommodating cavity; the lateral surface of pressure cover is provided with the third plummer, and the third plummer is located the below of pressure regulating mouth, and the voltage regulator sets up on the third plummer, and voltage regulator intercommunication pressure regulating mouth to with hold the chamber intercommunication and adjust the pressure that holds the intracavity through the pressure regulating mouth.
In a second aspect, an embodiment of the present application provides a detection method, which is applied to the above-mentioned chip package multi-parameter detection device, including:
placing a chip at the detection position;
setting a pressure preset value, a temperature preset value and a humidity preset value through a central control unit, and respectively generating a pressure preset signal, a temperature preset signal and a humidity preset signal according to the pressure preset value, the temperature preset value and the humidity preset value;
the pressure sensor detects an actual pressure value, generates a corresponding pressure signal according to the actual pressure value and transmits the pressure signal to the central control unit; the temperature sensor detects an actual temperature value, generates a corresponding temperature signal according to the actual temperature value and transmits the temperature signal to the central control unit; the humidity sensor detects an actual humidity value, generates a corresponding humidity signal according to the actual humidity value and transmits the humidity signal to the central control unit;
the central control unit compares the pressure signal with a pressure preset signal, generates a pressure instruction according to the comparison result and transmits the pressure instruction to the pressure regulator, and the pressure regulator regulates the pressure in the accommodating cavity according to the pressure instruction so as to enable the actual pressure value in the accommodating cavity to be the same as the pressure preset value; after the preset time t, detecting the internal parameters of the chip by the central control unit, and judging whether the chip meets the use condition under the preset pressure value or not by the detected internal parameters;
the central control unit compares the temperature signal with a temperature preset signal, generates a temperature instruction according to the comparison result and transmits the temperature instruction to the heating device, and the heating device adjusts the temperature in the accommodating cavity according to the temperature instruction so that the actual temperature value in the accommodating cavity is the same as the temperature preset value; after the preset time t, detecting the internal parameters of the chip by the central control unit, and judging whether the chip meets the use conditions at the preset temperature value according to the detected internal parameters;
the central control unit compares the humidity signal with a humidity preset signal, generates a humidity instruction according to the comparison result and transmits the humidity instruction to the humidifier, and the humidifier adjusts the humidity in the accommodating cavity according to the humidity instruction so that the actual humidity value in the accommodating cavity is the same as the humidity preset value; after the preset time t, detecting the internal parameters of the chip by the central control unit, and judging whether the chip meets the use conditions under the humidity preset value according to the detected internal parameters.
In some embodiments, when the central control unit compares the pressure signal with the pressure preset signal, the central control unit simultaneously compares the temperature signal with the temperature preset signal, generates a pressure instruction according to the comparison result and transmits the pressure instruction to the pressure regulator, and generates a temperature instruction and transmits the temperature instruction to the heating device, so that the actual pressure value in the accommodating cavity is the same as the pressure preset value, and the actual temperature value is the same as the temperature preset value; after the preset time t, detecting the internal parameters of the chip by the central control unit, and judging whether the chip meets the use condition under the preset pressure value or not by the detected internal parameters; the central control unit generates a plurality of new pressure preset values, a plurality of new pressure preset signals and a plurality of new pressure instructions under the condition of keeping the temperature preset signals unchanged, and the pressure regulator regulates the pressure in the accommodating cavity for a plurality of times according to the plurality of new pressure instructions so as to enable the actual pressure value in the accommodating cavity to be the same as the plurality of new pressure preset values for a plurality of times; after the preset time t, detecting the internal parameters of the chip for a plurality of times by the central control unit, and judging whether the chip meets the use conditions under a plurality of new pressure preset values according to the internal parameters detected for a plurality of times.
In some embodiments, when the central control unit compares the humidity signal with the humidity preset signal, the central control unit simultaneously compares the pressure signal with the pressure preset signal, generates a humidity command according to the comparison result and transmits the humidity command to the humidifier, and generates a pressure command and transmits the pressure command to the pressure regulator, so that the actual humidity value in the accommodating cavity is the same as the humidity preset value, and the actual pressure value is the same as the pressure preset value; after a plurality of times of preset time t, detecting the internal parameters of the chip by the central control unit, and judging whether the chip meets the use condition under the preset pressure value or not by the detected internal parameters; the central control unit generates a plurality of new humidity preset values, a plurality of new humidity preset signals and a plurality of new humidity instructions under the condition of keeping the pressure preset signals unchanged, and the humidifier adjusts the humidity in the accommodating cavity for a plurality of times according to the plurality of new humidity instructions so that the actual humidity value in the accommodating cavity is respectively the same as the plurality of new pressure preset values; after a plurality of times of preset time t, detecting the internal parameters of the chip for a plurality of times by the central control unit, and judging whether the chip meets the use conditions under a plurality of new humidity preset values according to the internal parameters detected for a plurality of times.
In some embodiments, when the central control unit compares the temperature signal with the temperature preset signal, the central control unit simultaneously compares the humidity signal with the humidity preset signal, generates a temperature instruction according to the comparison result and transmits the temperature instruction to the heating device, and generates a humidity instruction and transmits the humidity instruction to the humidifier, so that the actual temperature value in the accommodating cavity is the same as the temperature preset value, and the actual humidity value is the same as the humidity preset value; after a plurality of times of preset time t, detecting the internal parameters of the chip by the central control unit, and judging whether the chip meets the use condition under the preset pressure value or not by the detected internal parameters; the central control unit generates a plurality of new temperature preset values, a plurality of new temperature preset signals and a plurality of new temperature instructions under the condition of keeping the humidity preset signals unchanged, and the humidifier adjusts the temperature in the accommodating cavity for a plurality of times according to the plurality of new temperature instructions so that the actual temperature value in the accommodating cavity is respectively the same as the plurality of new pressure preset values; after a plurality of times of preset time t, detecting the internal parameters of the chip for a plurality of times by the central control unit, and judging whether the chip meets the use conditions under a plurality of new temperature preset values according to the internal parameters detected for a plurality of times.
According to the chip packaging multi-parameter detection equipment and the detection method, the pressure detection assembly, the temperature detection assembly and the humidity detection assembly are integrated on the same detection equipment, the internal parameters of the chip are detected through the central control unit, and meanwhile, the pressure value, the temperature value and the humidity value are adjusted through the central control unit, so that the external environment parameters of the chip during operation are changed, and the internal parameters of the chip are tested under the conditions of different external environment parameters, so that whether the chip meets the use requirement is judged, the detection cost is reduced, the detection period is shortened, and the detection error is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a detection device according to an embodiment of the present invention;
FIG. 2 is an enlarged view of FIG. 1 at A;
fig. 3 is a schematic view of an installation table according to an embodiment of the present invention.
Detailed Description
In order to enable those skilled in the art to better understand the present application, the following description will make clear and complete descriptions of the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, based on the embodiments herein, which are within the scope of the protection of the present application, will be within the skill of the art without undue effort.
In a first aspect, embodiments of the present application provide a chip package multi-parameter testing apparatus 100, comprising a base; the detection platform 1, the detection platform 1 is set up in the base, the detection platform 1 has detection position 8, the detection position 8 is used for placing the chip, the chip is connected with electrical behavior of the central control unit 2; the pressure detection assembly 3, the pressure detection assembly 3 comprises a pressure regulator 31, a pressure cover 32 and a pressure sensor 33, the pressure cover 32 is connected to the edge of the detection table 1 and is used for sealing the detection table 1, and the pressure cover 32 and the detection table 1 enclose a containing cavity; the pressure regulator 31 communicates with the accommodating chamber to change the pressure of the accommodating chamber; the pressure sensor 33 is disposed in the accommodating cavity, and is used for detecting a pressure value in the accommodating cavity and generating a pressure signal; a temperature detecting assembly 4, the temperature detecting assembly 4 comprising a heating device 41 and a temperature sensor 42, the heating device 41 being disposed in the accommodating chamber to adjust the temperature in the accommodating chamber; the temperature sensor 42 is disposed in the accommodating cavity, and is used for detecting a temperature value in the accommodating cavity and generating a temperature signal; a humidity detection assembly 5, the humidity detection assembly 5 including a humidifier 51 and a humidity sensor 52, the humidifier 51 being disposed in the accommodating chamber to adjust the humidity in the accommodating chamber; the humidity sensor 52 is disposed in the accommodating cavity, and is configured to detect a humidity value in the accommodating cavity and generate a humidity signal; the central control unit 2, the central control unit 2 is disposed on the base, and the chip, the pressure sensor 33, the temperature sensor 42 and the humidity sensor 52 are all electrically connected to the central control unit 2 and receive the pressure signal, the temperature signal and the humidity signal.
In some embodiments, the detection bit 8 is provided with a mounting hole, and the mounting hole penetrates through the detection table 1 and is communicated with the accommodating cavity; the detection device 100 further includes a circuit board, the circuit board is located at one end of the communicating accommodating cavity of the mounting hole, a side surface of the circuit board facing the accommodating cavity is used for bearing a chip, the pressure sensor 33, the temperature sensor 42 and the humidity sensor 52 are electrically connected with the circuit board, and a side surface of the circuit board facing away from the accommodating cavity is electrically connected with the central control unit 2.
In some embodiments, the mounting holes are circular, the mounting holes comprise a first mounting hole 61 and a second mounting hole 62 which are coaxial, one end of the first mounting hole 61 is communicated with the accommodating cavity, the other end of the first mounting hole is communicated with the second mounting hole 62, and the aperture of the first mounting hole 61 is smaller than that of the second mounting hole 62; the surface of the detection table 1 located in the second mounting hole 62 forms a first step surface 63; the detection device 100 further comprises a mounting table 7 for being embedded in the mounting hole, wherein the mounting table 7 comprises a first mounting table 71 and a second mounting table 72 which are coaxially and overlapped and connected, a detection position 8 is arranged on the surface, far away from the second mounting table 72, of the first mounting table 71, and a second step surface 73 is formed on the surface, connected with the first mounting table 71, of the second mounting table 72; when the mount 7 is fitted into the mounting hole, the first mount 71 is fitted into the first mounting hole 61, the second mount 72 is fitted into the second mounting hole 62, and the first step surface 63 overlaps the second step surface 73.
In some embodiments, the first step surface 63 is provided with an annular groove 631, the annular groove 631 extending circumferentially around the axis of the first mounting hole 61; the second step surface 73 is provided with an annular projection 731 for fitting into the annular groove 631; the side wall of the detection table 1, which is positioned in the second mounting hole 62, is provided with a first bearing table 621, the first bearing table 621 extends circumferentially around the axis of the second mounting hole 62, and the surrounding angle of the first bearing table 621 is less than or equal to 180 degrees; the side surface of the second mounting table 72 is provided with a second bearing table 721 for being matched with the first bearing table 621, the second bearing table 721 extends circumferentially around the axis of the second mounting table 72, and the surrounding angle of the second bearing table 721 is the same as that of the first bearing table 621; when the mounting table 7 is embedded into the mounting hole, the annular protrusion 731 is embedded into the annular groove 631, and the surface of the annular protrusion 731 is attached to the inner wall of the annular groove; the first bearing table 621 is located below the second bearing table 721, and the first bearing table 621 abuts against the second bearing table 721.
In some embodiments, the mounting table 7 is provided with a through hole, the through hole coincides with the axis of the mounting table 7, one end of the through hole penetrates through one end of the first mounting table 71 far away from the second mounting table 72 and is communicated with the detection position 8, and the other end of the through hole penetrates through one end of the second mounting table 72 far away from the first mounting table 71; the circuit board sets up in examining position 8, and the one side surface electric connection who deviates from the holding chamber of circuit board has the wire, and the other end of wire stretches out the holding intracavity through the through-hole to with well accuse unit 2 electric connection.
In some embodiments, the pressure cap 32 is provided with a pressure regulating port that communicates with the receiving chamber; the lateral surface of pressure cover 32 is provided with the third plummer, and the third plummer is located the below of pressure regulating mouth, and voltage regulator 31 sets up on the third plummer, and voltage regulator 31 intercommunication pressure regulating mouth to with hold the chamber intercommunication and adjust the pressure that holds the intracavity through the pressure regulating mouth.
In a second aspect, an embodiment of the present application provides a detection method, which is applied to the chip package multi-parameter detection apparatus 100 described above, including:
placing a chip at the detection position 8;
setting a pressure preset value, a temperature preset value and a humidity preset value through the central control unit 2, and respectively generating a pressure preset signal, a temperature preset signal and a humidity preset signal according to the pressure preset value, the temperature preset value and the humidity preset value;
the pressure sensor 33 detects the actual pressure value, and generates a corresponding pressure signal according to the actual pressure value and transmits the pressure signal to the central control unit 2; the temperature sensor 42 detects an actual temperature value, and generates a corresponding temperature signal according to the actual temperature value and transmits the temperature signal to the central control unit 2; the humidity sensor 52 detects an actual humidity value, and generates a corresponding humidity signal according to the actual humidity value and transmits the humidity signal to the central control unit 2;
the central control unit 2 compares the pressure signal with a pressure preset signal, generates a pressure instruction according to the comparison result and transmits the pressure instruction to the pressure regulator 31, and the pressure regulator 31 regulates the pressure in the accommodating cavity according to the pressure instruction so as to enable the actual pressure value in the accommodating cavity to be the same as the pressure preset value; after the preset time t, detecting the internal parameters of the chip by the central control unit 2, and judging whether the chip meets the use condition under the preset pressure value by the detected internal parameters;
the central control unit 2 compares the temperature signal with a temperature preset signal, generates a temperature instruction according to the comparison result and transmits the temperature instruction to the heating device 41, and the heating device 41 adjusts the temperature in the accommodating cavity according to the temperature instruction so as to enable the actual temperature value in the accommodating cavity to be the same as the temperature preset value; after the preset time t, detecting the internal parameters of the chip by the central control unit 2, and judging whether the chip meets the use conditions at the preset temperature value according to the detected internal parameters;
the central control unit 2 compares the humidity signal with a humidity preset signal, generates a humidity instruction according to the comparison result and transmits the humidity instruction to the humidifier 51, and the humidifier 51 adjusts the humidity in the accommodating cavity according to the humidity instruction so that the actual humidity value in the accommodating cavity is the same as the humidity preset value; after the preset time t, detecting the internal parameters of the chip by the central control unit 2, and judging whether the chip meets the use conditions under the humidity preset value according to the detected internal parameters.
In some embodiments, when the central control unit 2 compares the pressure signal with the pressure preset signal, the central control unit 2 compares the temperature signal with the temperature preset signal at the same time, generates a pressure command according to the comparison result and transmits the pressure command to the pressure regulator 31, and generates a temperature command and transmits the temperature command to the heating device 41, so that the actual pressure value in the accommodating cavity is the same as the pressure preset value, and the actual temperature value is the same as the temperature preset value; after the preset time t, detecting the internal parameters of the chip by the central control unit 2, and judging whether the chip meets the use condition under the preset pressure value by the detected internal parameters; the central control unit 2 generates a plurality of new pressure preset values, a plurality of new pressure preset signals and a plurality of new pressure instructions under the condition that the temperature preset signals are kept unchanged, and the pressure regulator 31 regulates the pressure in the accommodating cavity for a plurality of times according to the plurality of new pressure instructions so that the actual pressure value in the accommodating cavity is the same as the plurality of new pressure preset values for a plurality of times; after the preset time t, detecting the internal parameters of the chip for a plurality of times by the central control unit 2, and judging whether the chip meets the use conditions under a plurality of new pressure preset values according to the internal parameters detected for a plurality of times.
In some embodiments, when the central control unit 2 compares the humidity signal with the humidity preset signal, the central control unit 2 compares the pressure signal with the pressure preset signal at the same time, generates a humidity command according to the comparison result and transmits the humidity command to the humidifier 51, and generates a pressure command and transmits the pressure command to the pressure regulator 31, so that the actual humidity value in the accommodating cavity is the same as the humidity preset value, and the actual pressure value is the same as the pressure preset value; after a plurality of times of preset time t, detecting the internal parameters of the chip by the central control unit 2, and judging whether the chip meets the use condition under the preset pressure value or not by the detected internal parameters; the central control unit 2 generates a plurality of new humidity preset values, a plurality of new humidity preset signals and a plurality of new humidity instructions under the condition that the pressure preset signals are kept unchanged, and the humidifier 51 adjusts the humidity in the accommodating cavity for a plurality of times according to the plurality of new humidity instructions so that the actual humidity value in the accommodating cavity is respectively the same as the plurality of new pressure preset values; after a plurality of times of preset time t, detecting internal parameters of the chip for a plurality of times by the central control unit 2, and judging whether the chip meets the use conditions under a plurality of new humidity preset values according to the internal parameters detected for a plurality of times.
In some embodiments, when the central control unit 2 compares the temperature signal with the temperature preset signal, the central control unit 2 compares the humidity signal with the humidity preset signal at the same time, generates a temperature instruction according to the comparison result and transmits the temperature instruction to the heating device 41, and generates a humidity instruction and transmits the humidity instruction to the humidifier 51, so that the actual temperature value in the accommodating cavity is the same as the temperature preset value, and the actual humidity value is the same as the humidity preset value; after a plurality of times of preset time t, detecting the internal parameters of the chip by the central control unit 2, and judging whether the chip meets the use condition under the preset pressure value or not by the detected internal parameters; the central control unit 2 generates a plurality of new temperature preset values, a plurality of new temperature preset signals and a plurality of new temperature instructions under the condition that the humidity preset signals are kept unchanged, and the humidifier 51 adjusts the temperature in the accommodating cavity for a plurality of times according to the plurality of new temperature instructions so that the actual temperature value in the accommodating cavity is respectively the same as the plurality of new pressure preset values; after a plurality of times of preset time t, detecting internal parameters of the chip for a plurality of times by the central control unit 2, and judging whether the chip meets the use conditions under a plurality of new temperature preset values according to the internal parameters detected for a plurality of times.
In this application, the terms "mounted," "connected," "secured," and the like are to be construed broadly unless otherwise specifically indicated or defined. For example, the connection can be fixed connection, detachable connection or integral connection; can be mechanically or electrically connected; the connection may be direct, indirect, or internal, or may be surface contact only, or may be surface contact via an intermediate medium. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for understanding as a specific or particular structure. The description of the terms "some embodiments," "other embodiments," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this application, the schematic representations of the above terms are not necessarily for the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described herein, as well as features of various embodiments or examples, may be combined and combined by those skilled in the art without conflict.
The above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present application, and are intended to be included within the scope of the present application.
Claims (8)
1. A chip package multiparameter detection device, comprising:
the detection platform is provided with a circular mounting hole, and the mounting hole penetrates through the detection platform; the detection table is provided with detection bits, and the detection bits are used for placing chips;
the pressure detection assembly comprises a pressure regulator, a pressure cover and a pressure sensor, wherein the pressure cover is connected to the edge of the detection table and is used for sealing the detection table, the pressure cover and the detection table enclose a containing cavity, the mounting hole is communicated with the containing cavity, the mounting hole comprises a first mounting hole and a second mounting hole which are coaxial, one end of the first mounting hole is communicated with the containing cavity, the other end of the first mounting hole is communicated with the second mounting hole, and the aperture of the first mounting hole is smaller than that of the second mounting hole; a first step surface is formed on the surface of the detection table, which is positioned in the second mounting hole;
the detection equipment further comprises an installation table which is used for being embedded into the installation hole, the installation table comprises a first installation table and a second installation table which are coaxially and overlapped and connected, the surface, far away from the second installation table, of the first installation table is provided with a detection position, and the surface, connected with the first installation table, of the second installation table forms a second step surface; when the mounting table is embedded into the mounting hole, the first mounting table is embedded into the first mounting hole, the second mounting table is embedded into the second mounting hole, the first step surface is overlapped with the second step surface, and the pressure regulator is communicated with the accommodating cavity to change the pressure of the accommodating cavity; the pressure sensor is arranged in the accommodating cavity and is used for detecting the pressure value in the accommodating cavity; the first step surface is provided with an annular groove which circumferentially extends around the axis of the first mounting hole; the second step surface is provided with a ring-shaped bulge which is used for being embedded into the ring-shaped groove;
the side wall of the detection table, which is positioned in the second mounting hole, is provided with a first bearing table, the first bearing table circumferentially extends around the axis of the second mounting hole, and the surrounding angle of the first bearing table is smaller than or equal to 180 degrees; the side surface of the second installation table is provided with a second bearing table matched with the first bearing table, the second bearing table circumferentially extends around the axis of the second installation table, and the surrounding angle of the second bearing table is the same as that of the first bearing table;
when the mounting table is embedded into the mounting hole, the annular protrusion is embedded into the annular groove, and the surface of the annular protrusion is attached to the inner wall of the annular groove; the first bearing table is positioned below the second bearing table and is abutted against the second bearing table;
the temperature detection assembly comprises a heating device and a temperature sensor, and the heating device is arranged in the accommodating cavity so as to adjust the temperature in the accommodating cavity; the temperature sensor is arranged in the accommodating cavity and is used for detecting the temperature value in the accommodating cavity;
the humidity detection assembly comprises a humidifier and a humidity sensor, and the humidifier is arranged in the accommodating cavity so as to adjust the humidity in the accommodating cavity; the humidity sensor is arranged in the accommodating cavity and used for detecting the humidity value in the accommodating cavity;
the central control unit is arranged on the detection table, and the chip, the pressure sensor, the temperature sensor and the humidity sensor are all electrically connected with the central control unit;
the pressure detection component, the temperature detection component and the humidity detection component are integrated on the chip packaging multi-parameter detection equipment at the same time to test the internal parameters of the chip, so that the internal parameters of the chip are tested under the condition of different external environment parameters.
2. The chip package multi-parameter testing apparatus according to claim 1, further comprising a circuit board, wherein the circuit board is located at one end of the mounting hole, which is communicated with the accommodating cavity, a side surface of the circuit board facing the accommodating cavity is used for carrying the chip, the pressure sensor, the temperature sensor and the humidity sensor are all electrically connected with the circuit board, and a side surface of the circuit board facing away from the accommodating cavity is electrically connected with the central control unit.
3. The chip package multi-parameter inspection apparatus according to claim 2, wherein the mounting table is provided with a through hole, the through hole coincides with an axis of the mounting table, and one end of the through hole penetrates through one end of the first mounting table far away from the second mounting table and is communicated with the inspection position, and the other end of the through hole penetrates through one end of the second mounting table far away from the first mounting table; the circuit board set up in the position of detecting, just the circuit board deviate from one side surface electric connection who holds the chamber has the wire, the other end of wire stretches out through the through-hole hold in the intracavity to with well accuse unit electric connection.
4. The chip package multi-parameter testing apparatus according to claim 1, wherein the pressure cover is provided with a pressure regulating port, and the pressure regulating port is communicated with the accommodating cavity; the lateral surface of pressure cover is provided with the third plummer, the third plummer is located the below of pressure regulating mouth, the voltage regulator set up in on the third plummer, just the voltage regulator intercommunication the pressure regulating mouth, in order to with hold the chamber intercommunication and pass through the pressure regulating mouth is adjusted hold the intracavity pressure.
5. A test method applied to the chip package multi-parameter test apparatus of any one of claims 1 to 4, comprising:
placing the chip at the detection position;
setting a pressure preset value, a temperature preset value and a humidity preset value through the central control unit, and respectively generating a pressure preset signal, a temperature preset signal and a humidity preset signal according to the pressure preset value, the temperature preset value and the humidity preset value;
the pressure sensor detects an actual pressure value, generates a corresponding pressure signal according to the actual pressure value and transmits the corresponding pressure signal to the central control unit; the temperature sensor detects an actual temperature value, generates a corresponding temperature signal according to the actual temperature value and transmits the temperature signal to the central control unit; the humidity sensor detects an actual humidity value, generates a corresponding humidity signal according to the actual humidity value and transmits the humidity signal to the central control unit;
the central control unit compares the pressure signal with the pressure preset signal, generates a pressure instruction according to the comparison result and transmits the pressure instruction to the pressure regulator, and the pressure regulator regulates the pressure in the accommodating cavity according to the pressure instruction so as to enable the actual pressure value in the accommodating cavity to be the same as the pressure preset value; after a preset time t, detecting the internal parameters of the chip by the central control unit, and judging whether the chip meets the use condition under the preset pressure value according to the detected internal parameters;
the central control unit compares the temperature signal with the temperature preset signal, generates a temperature instruction according to the comparison result and transmits the temperature instruction to the heating device, and the heating device adjusts the temperature in the accommodating cavity according to the temperature instruction so that the actual temperature value in the accommodating cavity is the same as the temperature preset value; after a preset time t, detecting the internal parameters of the chip by the central control unit, and judging whether the chip meets the use conditions at the preset temperature value according to the detected internal parameters;
the central control unit compares the humidity signal with the humidity preset signal, generates a humidity instruction according to the comparison result and transmits the humidity instruction to the humidifier, and the humidifier adjusts the humidity in the accommodating cavity according to the humidity instruction so that the actual humidity value in the accommodating cavity is the same as the humidity preset value; after the preset time t, detecting the internal parameters of the chip by the central control unit, and judging whether the chip meets the use condition under the humidity preset value according to the detected internal parameters.
6. The detecting method according to claim 5, wherein when the central control unit compares the pressure signal with the pressure preset signal, the central control unit simultaneously compares the temperature signal with the temperature preset signal, generates a pressure command according to the comparison result and transmits the pressure command to the pressure regulator, and generates a temperature command and transmits the temperature command to the heating device, so that the actual pressure value in the accommodating chamber is the same as the pressure preset value, and the actual temperature value is the same as the temperature preset value; after a preset time t, detecting the internal parameters of the chip by the central control unit, and judging whether the chip meets the use condition under the preset pressure value according to the detected internal parameters;
the central control unit generates a plurality of new pressure preset values, a plurality of new pressure preset signals and a plurality of new pressure instructions under the condition that the temperature preset signals are kept unchanged, and the pressure regulator regulates the pressure in the accommodating cavity for a plurality of times according to the plurality of new pressure instructions so as to enable the actual pressure value in the accommodating cavity to be the same as the plurality of new pressure preset values correspondingly; after a plurality of times of preset time t, detecting internal parameters of the chip for a plurality of times by the central control unit, and judging whether the chip meets the use condition under a plurality of new pressure preset values according to the internal parameters detected for a plurality of times.
7. The detecting method according to claim 6, wherein when the central control unit compares the humidity signal with the humidity preset signal, the central control unit simultaneously compares the pressure signal with the pressure preset signal, generates a humidity command according to the comparison result and transmits the humidity command to the humidifier, and generates a pressure command and transmits the pressure command to the pressure regulator, so that the actual humidity value in the accommodating chamber is the same as the humidity preset value, and the actual pressure value is the same as the pressure preset value; after a preset time t, detecting the internal parameters of the chip by the central control unit, and judging whether the chip meets the use condition under the humidity preset value according to the detected internal parameters;
the central control unit generates a plurality of new humidity preset values, a plurality of new humidity preset signals and a plurality of new humidity instructions under the condition that the pressure preset signals are kept unchanged, and the humidifier adjusts the humidity in the accommodating cavity for a plurality of times according to the plurality of new humidity instructions so as to enable the actual humidity value in the accommodating cavity to be the same as the plurality of new humidity preset values correspondingly; after a plurality of times of preset time t, detecting internal parameters of the chip for a plurality of times by the central control unit, and judging whether the chip meets the use condition under a plurality of new humidity preset values according to the internal parameters detected for a plurality of times.
8. The detecting method according to claim 7, wherein when the central control unit compares the temperature signal with the temperature preset signal, the central control unit simultaneously compares the humidity signal with the humidity preset signal, generates a temperature instruction according to the comparison result and transmits the temperature instruction to the heating device, and generates a humidity instruction and transmits the humidity instruction to the humidifier, so that the actual temperature value in the accommodating chamber is the same as the temperature preset value, and the actual humidity value is the same as the humidity preset value; after a preset time t, detecting the internal parameters of the chip by the central control unit, and judging whether the chip meets the use conditions at the preset temperature value according to the detected internal parameters;
the central control unit generates a plurality of new temperature preset values, a plurality of new temperature preset signals and a plurality of new temperature instructions under the condition that the humidity preset signals are kept unchanged, and the heating device adjusts the temperature in the accommodating cavity for a plurality of times according to the plurality of new temperature instructions so that the actual temperature value in the accommodating cavity is the same as the plurality of new temperature preset values correspondingly; after a plurality of times of preset time t, detecting internal parameters of the chip for a plurality of times by the central control unit, and judging whether the chip meets the use condition under a plurality of new temperature preset values according to the internal parameters detected for a plurality of times.
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| CN101705184B (en) * | 2009-11-26 | 2012-01-11 | 浙江大学 | Full-automatic cell physiological parameter analyzer based on multi-parameter detection integrated chip |
| CN109933113A (en) * | 2019-04-16 | 2019-06-25 | 苏州浦立特电子科技有限公司 | A kind of high-accuracy temperature-humidity regulating system |
| CN211401276U (en) * | 2019-09-16 | 2020-09-01 | 湖南博远翔电子科技有限公司 | Humidity detection device for integrated circuit chip |
| CN212059994U (en) * | 2019-12-06 | 2020-12-01 | 海光信息技术有限公司 | Processor chip surface temperature testing arrangement |
| CN112665811A (en) * | 2020-12-18 | 2021-04-16 | 泉州装备制造研究所 | Comprehensive environment simulation test machine |
| CN114153255A (en) * | 2021-12-07 | 2022-03-08 | 南京理工大学 | Temperature and humidity pressure test box control method and system |
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