CN114682535B - Device for removing glue and method for removing glue by using same - Google Patents
Device for removing glue and method for removing glue by using same Download PDFInfo
- Publication number
- CN114682535B CN114682535B CN202011634922.XA CN202011634922A CN114682535B CN 114682535 B CN114682535 B CN 114682535B CN 202011634922 A CN202011634922 A CN 202011634922A CN 114682535 B CN114682535 B CN 114682535B
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- Prior art keywords
- glue
- blade
- fixing portion
- assembly
- outer edge
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Links
- 239000003292 glue Substances 0.000 title claims abstract description 211
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 51
- 230000008878 coupling Effects 0.000 claims abstract description 35
- 238000010168 coupling process Methods 0.000 claims abstract description 35
- 238000005859 coupling reaction Methods 0.000 claims abstract description 35
- 239000000853 adhesive Substances 0.000 claims description 33
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 238000003825 pressing Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 5
- 230000008602 contraction Effects 0.000 claims 2
- 229920002120 photoresistant polymer Polymers 0.000 description 15
- 230000008439 repair process Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/16—Rigid blades, e.g. scrapers; Flexible blades, e.g. wipers
- B08B1/165—Scrapers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2220/00—Type of materials or objects being removed
- B08B2220/01—Adhesive materials
Landscapes
- Coating Apparatus (AREA)
Abstract
The application provides a device for removing glue and a method for removing glue by using the device. The device for removing the glue comprises: a blade assembly including a blade for removing the glue material and a blade fixing portion configured to fix the blade; a rotatable assembly including a de-gumming station and a trajectory defining portion located below the de-gumming station, the device to be de-gummed being secured to the de-gumming station and exposing a material to be de-gummed disposed thereon, and the rotatable assembly being configured to be rotatable relative to the blade assembly to align and remove the material to be de-gummed with the blade; and a coupling device configured to be coupled to the blade fixing portion and to abut against an outer edge of the trajectory defining portion, the blade fixing portion being moved along a trajectory corresponding to a shape of the outer edge of the trajectory defining portion by the coupling device. The outer edge of the track defining portion is aligned with the outer edge of the glue to be removed and has the same shape as the glue to be removed when seen from the top.
Description
Technical Field
The application relates to a device for removing glue and a method for removing glue by using the device. More particularly, the present application relates to a device for removing a photoresist when a lens module is reworked and a method for removing a photoresist using the same.
Background
In the manufacturing process of the optical camera module, defective products with poor quality inevitably occur. In general, in order to reduce resource waste, manufacturers repair defective products screened during quality inspection so as to obtain a certain proportion of good products therefrom, so that the overall yield is improved, and the average production cost is reduced.
During repair operations of camera modules, in order to repair or replace parts therein, it is common to first separate the motor driving the lens and the circuit board from each other and then remove residual glue that is already useless on the circuit board and may interfere with subsequent repair operations.
However, at present, a traditional photoresist removing method is mostly adopted in repairing the camera module. In the traditional photoresist removing method, a common blade or an art doctor blade is generally utilized to manually scrape residual photoresist with a very small area. The manual photoresist removing process is difficult to operate, long in time consumption, high in time cost and huge in manpower and financial resources consumption. Meanwhile, the manual photoresist removing operation has strong uncontrollable factors, and other parts are easily scraped or cut carelessly to be scrapped due to misoperation of personnel. Even if the similar component accidental damage is not found on the spot, the image module of the damaged circuit board is more likely to be unusable due to the later misuse, so that besides the damage caused by the damage to the circuit board, more cost is wasted, including the cost caused by the misuse of the damaged circuit board as the assembly work of the components, other good components used in the assembly, the quality inspection work after the assembly, and the like.
Therefore, in order to increase the repair yield of the image module and reduce the risk possibly generated during repair, so as to avoid unnecessary waste caused by errors, the invention aims to improve the photoresist stripping difficulty problem and the corresponding part damage risk in the repair process of the camera module.
Disclosure of Invention
The application provides a device for removing glue, which can improve the glue removing efficiency and a method for removing glue by using the device.
According to an aspect of the present application, there is provided an apparatus for removing glue, comprising: a blade assembly including a blade for removing the adhesive and a blade fixing portion configured to fix the blade; a rotatable assembly including a de-glue station and a trajectory defining portion located below the de-glue station, a device to be de-glue being secured to the de-glue station and exposing glue material disposed thereon, and the rotatable assembly being configured to be rotatable relative to the blade assembly to align and remove the glue material with the blade; and a coupling device configured to be coupled to the blade fixing portion and to abut against an outer edge of the trajectory defining portion, the blade fixing portion being moved along a trajectory corresponding to a shape of the outer edge of the trajectory defining portion by the coupling device. The outer edge of the track defining portion is aligned with the outer edge of the glue to be removed and has the same shape as the glue to be removed when viewed from the top.
According to another aspect of the present application, there is provided a method of removing glue using an apparatus for removing glue, the apparatus for removing glue comprising: a blade assembly including a blade for removing the adhesive and a blade fixing portion configured to fix the blade; a rotatable assembly configured to be rotatable relative to the blade assembly and including a de-glue station and a trajectory defining portion located below the de-glue station; and a coupling device configured to be coupled to the blade assembly and to abut against an outer edge of the trajectory defining part, the blade fixing part being moved by the coupling device along a trajectory corresponding to a shape of the outer edge of the trajectory defining part. The method comprises the following steps: fixing a device to be removed on the removing operation table, and positioning the device to be removed to: exposing a glue material to be removed disposed on the glue device to the outside, and when viewed from the top, an outer edge of the track defining section is aligned with an outer edge of the glue material to be removed; aligning and contacting the blade with the glue to be removed; rotating the rotatable assembly and removing the glue with the blade; and removing the device for removing the adhesive material from the adhesive removing operation table.
According to a further aspect of the present application there is provided an apparatus for removing glue comprising: a blade assembly including a blade for removing the adhesive and a blade fixing portion configured to fix the blade; a photoresist removing operation table, wherein a photoresist removing device is fixed on the photoresist removing operation table and exposes the photoresist material to be removed arranged on the photoresist removing operation table; and a blade control device configured to move the blade along the glue to be removed and remove the glue to be removed. The blade control device includes: a blade driving part configured to be coupled with the blade fixing part and to control positions of the blades in a plurality of directions to align the glue to be removed; a machine vision recognition part configured to recognize the glue material to be removed and output recognition information; and a central control section configured to receive the identification information from the machine vision identification section and control an operation of the blade driving section in accordance with the identification information.
Compared with the prior art, the device for removing the glue has at least one of the following technical effects when the lens module is reworked by using the device for removing the glue according to the embodiment of the application:
1) The glue removing efficiency is improved, and the automation degree is increased;
2) The damage to the circuit substrate is reduced while the complete glue removal is ensured; and
3) The repair yield of the image module is increased, unnecessary waste is avoided, and the cost efficiency is improved.
Drawings
Other features, objects and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings. In the drawings:
Fig. 1 is a perspective view showing an apparatus for removing glue according to one embodiment of the present application;
Fig. 2 is a plan view block diagram showing a photoresist remover according to an exemplary embodiment;
fig. 3 is an enlarged view exemplarily showing the blade fixing portion in which the blade is inserted;
FIG. 4 is a perspective view illustrating a rotatable assembly according to one exemplary embodiment;
FIG. 5 is a top view showing a glue removal station with a device to be removed installed therein according to one exemplary embodiment;
FIG. 6 is an assembled perspective view showing the blade assembly and the liftable assembly;
Fig. 7 is a perspective view showing an apparatus for removing glue according to an exemplary embodiment, as seen from the left side;
FIG. 8 shows a schematic cross-sectional view of the coupling device and related components coupled thereto, taken along line I-I' of FIG. 7;
FIG. 9 is a schematic top view showing the relative position of the adhesive removal device and the blade during one rotation of the rotatable assembly;
FIG. 10 is a flowchart illustrating a method of removing glue using an apparatus for removing glue according to an exemplary embodiment; and
Fig. 11 is a component configuration diagram showing an apparatus for removing glue according to another exemplary embodiment of the present application.
Detailed Description
For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the application and is not intended to limit the scope of the application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that in the present specification, the expressions of first, second, third, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature.
It will be further understood that the terms "comprises," "comprising," "includes," "including," "having," "containing," and/or "including," when used in this specification, specify the presence of stated features, elements, and/or components, but do not preclude the presence or addition of one or more other features, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of the following" appears after a list of features that are listed, the entire listed feature is modified instead of modifying a separate element in the list. Furthermore, when describing embodiments of the application, use of "may" means "one or more embodiments of the application. Also, the term "exemplary" is intended to refer to an example or illustration.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
The features, principles, and other aspects of the present application are described in detail below.
Fig. 1 is a perspective view illustrating an apparatus 10 for removing glue according to one embodiment of the application.
As shown in fig. 1, an apparatus 10 for removing glue according to an exemplary embodiment of the present application includes a blade assembly 100, a rotatable assembly 200, and a coupling device 300.
Specifically, the blade assembly 100 may include a blade 101 for removing the glue material and a blade fixing portion 103 configured to fix the blade 101. The rotatable assembly 200 may include a de-glue station 201 and a trajectory defining portion 203 located below the de-glue station 201, the device 20 to be de-glued is fixed to the de-glue station 201 and exposes the glue material to be removed disposed thereon, and the rotatable assembly 200 is configured to be rotatable relative to the blade assembly 100 to align and remove the glue material to be removed with the blade 101. The coupling device 300 may be configured to be coupled to the blade fixing portion 103 and to abut against an outer edge of the trajectory defining portion 203, the blade fixing portion 103 being moved along a trajectory corresponding to a shape of the outer edge of the trajectory defining portion 203 by the coupling device 300. Wherein the outer edge of the track defining section 203 is aligned with the outer edge of the glue to be removed and has the same shape as the glue to be removed when seen from the top.
In an exemplary embodiment, as shown in fig. 1, the apparatus 10 for removing glue may further include a table 700, and the blade assembly 100, the rotatable assembly 200, and the coupling device 300 described above may be disposed on and supported by the table 700.
Further, the apparatus 10 for removing glue may also include a plurality of legs 800 supported between the ground and a ground platen (not shown).
Further, the apparatus 10 for removing glue may further comprise a liftable assembly 400 arranged above the blade fixing portion 103 and configured to drive the blade 101 and the blade fixing portion 103 to move downwards to align the blade 101 with the glue to be removed.
The adhesive removing device 20, the blade assembly 100, the rotatable assembly 200, the coupling device 300, the liftable assembly 400, etc. will be described in detail with reference to the accompanying drawings.
According to one exemplary embodiment, the glue removal device 20 may be part of a camera module having glue material arranged thereon in a regular shape.
Further, as an example, the glue removal device 20 may be part of, for example, a TOF (Time of flight) module. The TOF module may generally include a TOF circuit module and a lens assembly. In the repair process of the TOF module, it is generally required to separate the TOF circuit module and the lens assembly, which are packaged together, and remove the residual adhesive on the TOF circuit module to avoid the adhesive coated on the TOF circuit module from affecting the circuit performance of the circuit board. The residual adhesive may be, for example, an adhesive used when the circuit module and the package case are bonded, or an adhesive used when the circuit module and the lens assembly are bonded, which is not limited herein.
Hereinafter, for convenience of description, a circuit board of the TOF module is described as an example of the glue device 20 to be removed, but it will be understood by those skilled in the art that this is not a limitation of the glue device 20 to be removed, and the glue device 20 to be removed may be any other suitable element on which a glue material is arranged.
In fig. 2 is a plan view structural diagram showing the adhesive removing device 20 according to an exemplary embodiment. As shown in fig. 2, the photoresist remover 20 may include a substrate 20-1 and a flexible circuit board 20-2 extending outwardly from the substrate 20-1, a plurality of components 20-4 being disposed on the substrate 20-1, the flexible circuit board 20-2 having flexibility and a connector 20-3 being disposed on a side thereof not adjacent to the substrate 20-1.
As shown in fig. 2, for example, the glue material 30 to be removed may be arranged along the edge of the glue device 20 to be removed and may have a closed annular shape. The glue-removing device 20 may for example have a substantially quincuncial shape, i.e. with recesses at the four corners of a square, which are recessed towards the centre. Since the glue material 30 to be removed is arranged along the edge of the glue device 20, it may be arranged to have the same shape as the outer edge of the glue device 20, for example, a quincuncial shape.
Preferably, each corner portion of the glue device 20 and/or the glue material 30 to be removed may be rounded. This helps to facilitate more accurate operation of the coupling device 300, which will be described later, thereby ensuring that the blade assembly 100 is able to remove glue more accurately.
Although the shape of the glue to be removed device 20 and/or the glue to be removed 30 is shown as a quincuncial shape in fig. 2, this is only an example, and the glue to be removed device 20 and/or the glue to be removed 30 may have any other suitable shape, such as polygonal shape of square, rectangle, etc., irregular oval shape, regular circular shape, etc., depending on the actual requirements of the assembled module.
In addition, the glue material 30 to be removed may be coated at other suitable positions of the glue device 20 depending on the actual requirements of the assembled module, not limited to the edges of the glue device 20 as shown in fig. 2. Likewise, the shape of the glue material 30 to be removed may also be different from the shape of the outer edge of the glue device 20 to be removed.
Referring back to fig. 1, the blade assembly 100 may have a blade 101 and a blade securing portion 103 that receives and secures the blade 101. According to an exemplary embodiment, the blade 101 may be, for example, an art designer blade, a doctor blade, or the like. The blade fixing portion 103 may have a groove 109 defined therein, and the blade 101 is inserted in the groove 109, and a tip portion of the blade 101 is exposed to the outside of the groove 109 to be in contact with the adhesive.
Fig. 3 is an enlarged view exemplarily showing the blade fixing portion 103 in which the blade 101 is inserted.
Herein, the third direction DR3 may be a thickness direction (e.g., an upward/downward direction) of the insert-fixing portion 103, and may be perpendicular to a plane (e.g., a top surface) defined by the first direction DR1 and a second direction DR2 perpendicular to the first direction DR 1.
Referring to fig. 1 and 3, a groove 109 defined in the insert-fixing portion 103 may penetrate a side surface of the insert-fixing portion 103 in the second direction DR 2. The recess 109 may be inclined in a direction between the second direction DR2 and the third direction DR3 when seen from the side surface, whereby the blade 101 may be arranged inclined with respect to the top surface of the gumming console 201, i.e. the blade 101 may be made to be inserted obliquely into the gum material 30 to be removed, which helps to ensure complete gumming without damaging the die set.
In addition, providing the recess 109 to be inclined may also move the blade 101 inserted in the recess 109 at least in two directions, the third direction DR3 and the second direction DR 2. Further, the blade 101 may also adjust the length exposed outside the recess 109, in other words, the blade 101 may also move in the first direction DR 1. By controlling the position change of the blade 101 in a plurality of directions (the first direction DR1 to the third direction DR 3), the distance or contact angle between the blade 101 and the adhesive material can be finely adjusted so as to be at the optimal adhesive removing position.
In an exemplary embodiment, the blade fixing part 103 may further include a blade stopper 111 inserted in the groove 109. After trimming the blade 101 to the optimal position, the blade 101 may be fixed to the blade fixing portion 103 using the blade stopper 111.
Fig. 4 is a perspective view illustrating a rotatable assembly 200 according to an exemplary embodiment, and fig. 5 is a top view illustrating a glue removal station 201 in which a device 20 to be glue removed is mounted according to an exemplary embodiment.
Referring to fig. 1 and 4, the rotatable assembly 200 may include a de-glue station 201 and a trajectory defining portion 203 located below the de-glue station 201. The glue removing device 20 is fixed on the upper surface of the glue removing operation table 201 and exposes the glue material 30 to be removed disposed thereon.
In an exemplary embodiment, the rotatable assembly 200 is configured to be capable of relative movement, such as rotational, linear, or curvilinear movement, with respect to the blade assembly 100. The trajectory defining part 203 may be coupled with the gumming console 201 such that both are integrally movable.
In the present application, description will be made taking an example in which the rotatable assembly 200 performs a rotational motion, considering that the adhesive material arrangement of the camera module is mostly a closed ring shape (i.e., one turn is arranged along an edge).
However, it will be appreciated by those skilled in the art that the movement pattern of the rotatable assembly 200 may be adjusted according to the arrangement shape of the glue. For example, when the adhesive is disposed linearly on the surface of the adhesive device 20, the rotatable assembly 200 may be configured to perform a linear motion with respect to the blade assembly 100, which may be accomplished by a variety of means such as a slide rail.
According to an exemplary embodiment, as shown in fig. 1, the apparatus 10 for removing glue may further comprise a rotary drive 600. The rotary drive 600 may be configured to drive rotation of the rotatable assembly 200. The rotary drive 600 may be controlled, for example, by an electric motor, or may be manually controlled by a human, without limitation in the present application.
According to an exemplary embodiment, the trajectory defining part 203 may have approximately the same cross-sectional shape as the arrangement shape of the glue material 30 to be removed when viewed from the top surface. When the glue stock to be removed 30 is arranged in, for example, a quincuncial shape along the glue device 20 as shown in fig. 4, the cross-sectional shape of the trajectory defining part 203 may be correspondingly quincuncial shape. Likewise, the trajectory defining part 203 may be of other suitable shape such as polygonal shape such as square, rectangle, etc., irregular elliptical shape, regular circular shape, etc., as described above.
According to an exemplary embodiment, the trajectory defining part 203 and the gumming console 201 may be configured to be detachable so as to be differently selected and replaced according to the shape of the gumming material 30 to be removed and/or the gumming device 20 to be fitted to each other.
Further, the outer edges of the trajectory defining part 203 may be aligned with the outer edges of the glue material 30 to be removed, for example, to coincide with each other, when seen from the top surface.
According to an exemplary embodiment, the de-glue station 201 may include a slot 205 recessed downwardly from a top surface thereof configured to receive the device 20 to be de-glued and to conform to the shape of at least a portion of the device 20 to be de-glued. The slot 205 may include an opening 2051 at least one side thereof.
According to an exemplary embodiment, the de-glue station 201 may further comprise a fixing block 207 having a protruding part 2071 adapted to the shape of the opening 2051, the protruding part 2071 may be inserted into the opening 2051 to contact and fix the device 20 to be de-glued. By having both the groove 205 and the fixing block 207 shape-adapted to at least a portion of the device 20 to be glue removed, the device 20 to be glue removed can be fixed within the groove 205, whereby it can be ensured that no looseness is created during the glue removal process such that the position of the device 20 to be glue removed is changed.
Fig. 6 is an assembled perspective view showing the blade assembly 100 and the liftable assembly 400.
Referring to fig. 1 and 6, according to an exemplary embodiment, the blade assembly 100 may further include a first support plate 105 disposed under the blade fixing part 103 and a first elastic member 107 disposed between the first support plate 105 and the blade fixing part 103, in addition to the blade 101 and the blade fixing part 103.
According to an exemplary embodiment, the liftable assembly 400 may include a telescopic member 401, a driving motor 403, and a pressing member 405. The stretchable member 401 may be configured to extend or retract in the third direction DR 3. The drive motor 403 may be configured to control the extension or retraction of the retractable member 401. The hold-down member 405 may be coupled to the telescoping member 401 and may extend or retract with the telescoping member 401.
According to an exemplary embodiment, when the stretchable member 401 is stretched (e.g., lowered) by the driving of the driving motor 403, the pressing member 405 is stretched along with the stretching of the stretchable member 401 while applying downward pressure to the blade fixing portion 103 to move the blade fixing portion 103 downward along the third direction DR3 together with the blade 101. Thus, the blade 101 may be moved downward by the extension and retraction of the liftable assembly 400.
When the retractable component 401 is extended (e.g., lowered), the first resilient member 107 of the blade assembly 100 is in a compressed state. It will be appreciated that the downward force exerted by the liftable assembly 400 on the blade holding portion 103 at this time may be much greater than the upward force exerted by the first resilient member 107 on the blade holding portion 103 due to compression.
When the retractable member 401 is retracted (e.g., raised), the pressing member 405 no longer applies a downward pressure to the blade fixing portion 103, so that the first elastic member 107 of the blade assembly 100 tends to return to the original state, at which time the upward force applied to the blade fixing portion 103 by the first elastic member 107 allows the blade 101 to move upward in the third direction DR 3.
The position of the blade 103 in the third direction DR3 can also be finely adjusted by the telescopic cooperation of the liftable component 400 and the first elastic member 107, so that the blade is in an optimal glue removing position, thereby not only ensuring full and thorough glue removal, but also avoiding damage to the device 20 to be removed.
The glue application surface of the glue device 20 is not perfectly flat, but may have a certain thickness deviation at different locations due to, for example, process errors. If such thickness deviation is excessive and the blade is always at a high level for the removal of the glue, it may result in incomplete removal of the glue (there is still residual glue) or scratch and damage to the device 20 to be removed during the removal of the glue.
The apparatus 10 for removing glue according to the exemplary embodiment may also include an automatic ranging device 500 positioned above the glue removal station 201. The automatic ranging device 500 may be configured to measure in real time a change in height of the adhesive 30 to be removed at a position where it contacts the blade 101 (e.g., a change in height of the adhesive surface), and to feed back the measurement result to the liftable assembly 400. The liftable assembly 400 adjusts the position of the blade 101 in the third direction DR3 in real time according to the measurement result received from the automatic ranging device 500.
Through the position of the real-time regulation and control blade 101 in the third direction DR3, the incomplete removal of the glue or the damage to the device 20 to be removed can be effectively avoided, so that the precision of removing the glue is improved.
Fig. 7 is a perspective view showing the apparatus for removing glue 10 according to the exemplary embodiment, as seen from the left side. Fig. 8 shows a schematic cross-sectional view of the coupling device 300 and related components coupled thereto, taken along line I-I' of fig. 7.
Referring to fig. 1, 7 to 8, according to an exemplary embodiment, the coupling device 300 may include a second support plate 301, a second elastic member 303, a guide member 305, and a coupling rod 307. The second support plate 301 may be disposed on a first side of the blade assembly 100 and its position remains fixed. The second elastic member 303 may be coupled between the second support plate 301 and the first support plate 105. The guide member 305 may be disposed below the first support plate 105 and configured to extend in the second direction DR2 and guide the first support plate 105 to move in the second direction DR 2. The coupling rod 307 may be disposed between the first support plate 105 and the track defining portion 203, coupled with the first support plate 105, against an outer edge of the track defining portion 203, and maintained in contact with the outer edge of the track defining portion 203 as the rotatable assembly 200 rotates.
The coupling means 300 drive the blade 101 to remain in contact with the glue 30 to be removed at all times as the rotatable assembly 200 rotates.
In particular, the coupling device 300 according to the exemplary embodiment may be regarded as a cam mechanism integrally with the trajectory defining part 203 and the first support plate 105, which may enable the blade assembly 100 coupled with the coupling device 300 to move along a trajectory corresponding to the shape of the outer edge of the trajectory defining part 203 against which the coupling device 300 abuts. Since the trajectory defining part 203 has substantially the same shape as the glue 30 to be removed as described above, the cam-like coupling by the coupling device 300 enables the blade 101 to move along the glue 30 to be removed, thereby completing one complete turn of glue removal at a time.
Fig. 9 is a schematic top view showing the relative positional relationship of the adhesive removing device 20 and the blade 101 during one rotation of the rotatable assembly 200.
In fig. 9, an embodiment in which the glue apparatus 20 performs a clockwise rotation with the rotatable assembly 200 and the glue material 30 to be removed is arranged in a quincuncial shape is shown, but it should be understood that the scope of the present application is not limited thereto.
As shown in fig. 9, the glue material 30 to be removed has a quincuncial shape and includes a first surface S1, a first corner portion R1, a second surface S2, a second corner portion R2, a third surface S3, a third corner portion R3, a fourth surface S4, and a fourth corner portion R4 in this order in the clockwise direction.
Positions (a) to (d) correspond to positions where the glue 30 is to be removed when the rotatable assembly 200 is rotated 0 degrees, 45 degrees, 90 degrees, and 360 degrees in the clockwise direction from an initial position (e.g., position (a)), respectively.
In position (a), the blade 101 is in contact with the first surface S1. As the rotatable assembly 200 rotates in a clockwise direction, the glue 30 to be removed moves to the left in the first direction DR1, at which time the coupling rod 307 abuts against the edge of the trajectory defining part 203 extending in the first direction DR1, the position of which remains unchanged, thereby keeping the blade 101 stationary. In position (a), the second resilient member 303 of the coupling device 300 is in a compressed state.
During the rotation of the glue 30 to be removed from position (a) to position (b), the blade 101 may move in the second direction DR2 towards the glue 30 to be removed due to the cam action of the coupling device 300. At this time, the blade 101 gradually comes into contact with the fourth corner portion R4.
Referring to fig. 1 and 7, in this process, the specific operation of the coupling device 300 is as follows: since the first corner portion R1 is recessed toward the center of the glue apparatus 20 in the second direction DR2, the corresponding edge of the trajectory defining portion 203 is gradually separated from the coupling rod 307 as the rotatable assembly 200 rotates, so that the second elastic member 303 is gradually released from the compressed state and applies a rightward force to the first support plate 105 in the second direction DR2, thereby pushing the first support plate 105 to slide rightward in the second direction DR2 along the guide member 305, thereby driving the blade 101 to move toward the glue material 30 to be removed in the second direction DR 2. Thereby, it is achieved that the blade 101 is always in contact with the glue 30 to be removed during rotation of the rotatable assembly 200.
Similarly, during the rotation of the glue 30 to be removed from position (b) to position (c), the blade 101 can move in a direction opposite to the second direction DR2 (to the left in fig. 7) due to the cam action of the coupling means 300. At this point the blade 101 comes into contact with the fourth surface S4.
After completing one rotation of the rotatable assembly 200, the glue material 30 to be removed is at the position (d), the blade 101 ends the glue removal operation, and the blade 101 is lifted to a certain position by lifting of the liftable assembly 400 to be out of contact with the glue device 20, so that the glue device 20 to be removed is taken out of the glue removal operation table 201.
According to another aspect of the present application, there is also provided a method of removing glue using the apparatus for removing glue 10. The description of the device 10 for removing glue will not be repeated here, and only the relevant glue removing process steps will be described.
Fig. 10 is a flowchart illustrating a method 1000 of removing glue using the apparatus 10 for removing glue according to an exemplary embodiment.
Referring to fig. 10, the method 1000 includes:
step S10: the device 20 to be removed is fixed on the removing stage 201, and the device 20 to be removed is positioned so that: exposing the glue material to be removed 30 arranged on the glue device to be removed 20 to the outside, and when viewed from the top, the outer edge of the track defining section 203 is aligned with the outer edge of the glue material to be removed;
Step S20: aligning and contacting the blade 101 with the glue 30 to be removed;
step S30: rotating the rotatable assembly 200 and removing the glue using the blade 101; and
Step S40: the device from which the glue is removed from the glue removal station 201.
Further, step S20 may further include: the blade 101 is driven by the liftable assembly 400 to move downward in the third direction DR3 to align the blade 101 with the glue material 30 to be removed.
Further, step S20 may further include: the extensible member 401 is extended in the third direction DR3 together with the pressing member 405 by the driving motor 403; and applying pressure to the blade fixing portion 103 by the pressing member 405 to move the blade 101 in the third direction DR 3.
Further, step S10 may further include: after the device 20 to be removed is placed on the removal table 201, the boss 2071 is inserted into the opening 2051 to contact and fix the device 20 to be removed.
Further, the method 1000 may further include: after the device to be gummed 20 is placed on the gumming console 201, the flexible circuit board 20-2 is bent from the substrate 20-1 in the third direction DR3, for example, bent downward.
Further, each of step S20 and step S30 may further include: the liftable assembly 400 adjusts the position of the blade 101 in the third direction DR3 according to the measurement result of the automatic ranging device 500.
Further, step S40 may further include: the retractable member 401 is controlled to retract (e.g., retract upward) in a direction opposite to the third direction DR3 so as to be separated from the blade fixing portion 103; and the first elastic member 107 resets the blade fixing portion and the blade in the third direction DR 3.
In the above embodiments, the blade 101 is described as being kept relatively stationary while the device 20 to be gummed is moved during gumming, however the application is not limited thereto. In another embodiment according to the application, the blade may be moved during the de-gluing process and the device to be de-glued may remain relatively stationary.
Fig. 11 is a component configuration diagram showing an apparatus for removing glue 10_1 according to another exemplary embodiment of the present application.
According to another exemplary embodiment of the present application, the apparatus for removing glue 10_1 includes: blade assembly 100_1, gumming console 200_1, and blade control device 300_1. Wherein the blade assembly 100_1 may include a blade for removing the glue material and a blade fixing part configured to fix the blade; the glue removing device is fixed on the glue removing operation table 200_1 and exposes the glue material to be removed arranged on the glue removing device; the blade control device 300_1 is configured to move the blade along the glue to be removed and remove the glue to be removed.
Further, the blade control device 300_1 may include a blade driving part 300_2, a machine vision recognition part 300_4, and a central control part 300_3. Wherein the blade driving part 300_2 is configured to be coupled with the blade fixing part and control the position of the blade in a plurality of directions to align the glue to be removed; the machine vision recognition portion 300_4 is configured to recognize the glue material to be removed and output recognition information; the central control section 300_3 is configured to receive the identification information from the machine vision identifying section 300_4 and control the operation of the blade driving section 300_2 according to the identification information.
Unlike the adhesive removing apparatus 10, the adhesive removing apparatus 10_1 for removing adhesive having different patterns does not need to perform an adhesive removing process by detaching the corresponding elements, but an arbitrary shape of adhesive can be recognized by the machine vision recognition part 300_4 and the blade assembly 100_1 can be made to be predetermined to a designated position by the blade driving part 300_2. The blade driving portion 300_2 may be, for example, an electrically controlled straight rail of multiple degrees of freedom. Thus, the apparatus for removing glue 10_1 has higher product compatibility and the degree of convenience is increased.
In addition, the apparatus for removing glue 10_1 may perform batch processing on the tray on which the plurality of devices to be removed are arranged, and is not limited to the single-material processing mode as the apparatus for removing glue 10. Therefore, the degree of automation can be improved, manpower is liberated to a greater extent, and the working efficiency is improved.
In addition, another method for removing the adhesive by using the device 10_1 for removing the adhesive is also provided in the application. The method may include:
a first step of: fixing a material tray provided with a plurality of glue removing devices on a glue removing operation table 200_1, and exposing a plurality of glue materials to be removed;
And a second step of: in response to the identification instruction from the central control section 300_3, the machine vision identification section 300_4 identifies the position on the gumming console 200_1 from which the gum material is to be removed, and transmits the identified position coordinates to the central control section 300_3; and
And a third step of: in response to the position coordinates, the central control portion 300_3 transmits a control instruction to the blade driving portion 300_2 to cause the blade driving portion 300_2 to control the blade assembly 100_1 to move along the plurality of glue materials to be removed one by one to remove the glue materials to be removed.
The above description is only illustrative of the preferred embodiments of the present application and of the principles of the technology employed. It will be appreciated by persons skilled in the art that the scope of the application referred to in the present application is not limited to the specific combinations of the technical features described above, but also covers other technical features formed by any combination of the technical features described above or their equivalents without departing from the inventive concept. Such as the above-mentioned features and the technical features disclosed in the present application (but not limited to) having similar functions are replaced with each other.
Claims (17)
1. An apparatus for removing glue comprising:
A blade assembly including a blade for removing the adhesive and a blade fixing portion configured to fix the blade;
A liftable assembly disposed above the blade fixing portion and configured to drive the blade and the blade fixing portion to move in a first direction;
A rotatable assembly including a de-glue station and a trajectory defining portion located below the de-glue station, a device to be de-glue being secured to the de-glue station and exposing glue material disposed thereon, and the rotatable assembly being configured to be rotatable relative to the blade assembly to align and remove the glue material with the blade; and
A coupling device configured to be coupled to the blade fixing portion and to abut against an outer edge of the trajectory defining portion, the blade fixing portion being moved by the coupling device along a trajectory corresponding to a shape of the outer edge of the trajectory defining portion;
wherein the outer edge of the track defining portion is aligned with the outer edge of the glue to be removed and has the same shape as the glue to be removed when viewed from the top;
The blade fixing portion has a groove defined therein in which the blade is inserted, the groove being inclined in a direction between the first direction and a third direction perpendicular to the first direction, through which the blade is movable in the first direction and the third direction, and is arranged to be inclined with respect to a top surface of the gumming console so that the blade is inserted obliquely to the gumming material to be removed.
2. The apparatus for removing glue of claim 1, wherein the liftable assembly comprises:
a retractable member configured to extend or retract in the first direction;
a driving motor configured to control extension or contraction of the telescopic member; and
A pressing member coupled to the telescopic member and extended or contracted together with the telescopic member,
Wherein when the extensible member is extended, a pressure is applied to the blade fixing portion by the pressing member to move the blade fixing portion together with the blade in the first direction.
3. The apparatus for removing glue of claim 2, wherein the blade assembly further comprises:
a first support plate disposed below the blade fixing portion; and
A first elastic member disposed between the first support plate and the blade fixing portion,
Wherein when the retractable member is retracted, the blade fixing portion and the blade are moved in a direction opposite to the first direction by the first elastic member.
4. A device for removing glue according to claim 3, wherein the coupling means comprises:
A second support plate disposed on a first side of the blade assembly and held stationary in place;
A second elastic member coupled between the second support plate and the first support plate;
a guide member disposed below the first support plate and configured to guide the first support plate to move in a second direction, wherein the second direction is perpendicular to a plane defined by the first direction and the third direction; and
A coupling rod disposed at a second side of the blade assembly opposite the first side thereof, one end of the coupling rod being coupled to the first support plate, and the other end of the coupling rod abutting against and remaining in contact with an outer edge of the track defining portion when the rotatable assembly is rotated.
5. The apparatus for removing glue of claim 1, wherein the means for removing glue is part of a camera module.
6. The apparatus for removing glue according to claim 5, wherein the shape of the glue material to be removed is any one of square, oval, quincuncial and circular.
7. The apparatus for removing glue of any one of claims 1-6, further comprising a rotary drive configured to drive rotation of the rotatable assembly.
8. The apparatus for removing glue of claim 7, wherein the rotary drive is controlled by driving an electric motor or manually.
9. The apparatus for removing glue of any one of claims 1 to 6, wherein the glue removal station comprises: a groove adapted in shape to at least a portion of the device and accommodating the device and opening at least one side thereof; and
And the fixing block is provided with a protruding part which is matched with the shape of the opening, and the protruding part is inserted into the opening to contact and fix the device to be removed.
10. A device for removing glue according to any one of claims 1 to 3, whereby the blade is further movable in a second direction by means of the recess, wherein the second direction is perpendicular to a plane defined by the first direction and the third direction.
11. The apparatus for removing glue according to any one of claims 1 to 6, further comprising an automatic ranging device positioned above the glue to be removed and configured to measure in real time the change in height of the glue to be removed at the contact position with the blade, and
The liftable component adjusts the position of the blade in the first direction in real time according to the measurement result of the automatic ranging device.
12. A method of removing glue using the apparatus for removing glue of claim 1, the method comprising:
Fixing a device to be removed on the removing operation table, and positioning the device to be removed to: exposing a glue material to be removed disposed on the glue device to the outside, and when viewed from the top, an outer edge of the track defining section is aligned with an outer edge of the glue material to be removed;
aligning and contacting the blade with the glue to be removed, wherein the blade is arranged inclined with respect to the top surface of the glue removal station such that the blade is inserted obliquely to the glue to be removed;
Rotating the rotatable assembly and removing the glue with the blade; and
And removing the device for removing the adhesive material from the adhesive removing operation table.
13. The method of claim 12, wherein the liftable assembly comprises:
a retractable member configured to extend or retract in the first direction;
a driving motor configured to control extension or contraction of the telescopic member; and
A pressing member coupled to the stretchable member and stretched or contracted together with the stretchable member, and
Wherein, in the step of aligning and contacting the blade with the glue to be removed, the method further comprises:
elongating the extensible member together with the pressing member in the first direction by the driving motor, and
And applying pressure to the blade fixing portion by the pressing member to move the blade in the first direction.
14. The method of claim 12, wherein,
The adhesive removing operation table comprises:
a groove adapted in shape to at least a portion of the device to be stripped and open at least one side thereof; and
A fixed block having a convex portion adapted to the shape of the opening; and
Wherein, in the step of fixing the device to be removed on the removing operation table, the method further comprises: after the device to be removed is placed on the removal table, the boss is inserted into the opening to contact and fix the device to be removed.
15. The method of claim 14, wherein the device to be de-glued is a camera module and comprises a substrate and a flexible circuit board extending from the substrate, and
After the device to be removed is placed on the removing operation table, the flexible circuit board is bent in the first direction or a direction opposite to the first direction.
16. The method of claim 13, wherein,
The blade assembly further comprises:
a first support plate disposed below the blade fixing portion; and
A first elastic member disposed between the first support plate and the blade fixing portion, and
Wherein, in the step of removing the device of removing the gum material from the gum removing operation table, further comprising:
Controlling the retractable member to retract in a direction opposite to the first direction to depart from the blade fixing portion; and
The first elastic member moves the blade fixing portion and the blade in a direction opposite to the first direction.
17. The method of claim 12, wherein the means for removing glue further comprises: an automatic ranging device positioned above the glue to be removed and configured to measure in real time the change in height of the contact position of the glue to be removed with the blade, and
In the step of aligning and contacting the blade with the glue to be removed and the step of rotating the rotatable assembly, further comprising: the liftable component adjusts the position of the blade in the first direction in real time according to the measurement result of the automatic ranging device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011634922.XA CN114682535B (en) | 2020-12-31 | 2020-12-31 | Device for removing glue and method for removing glue by using same |
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| CN202011634922.XA CN114682535B (en) | 2020-12-31 | 2020-12-31 | Device for removing glue and method for removing glue by using same |
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| CN114682535B true CN114682535B (en) | 2024-04-26 |
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| CN114682535A (en) | 2022-07-01 |
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