CN114671439A - Reduction furnace chassis cooling structure - Google Patents
Reduction furnace chassis cooling structure Download PDFInfo
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- CN114671439A CN114671439A CN202210269186.5A CN202210269186A CN114671439A CN 114671439 A CN114671439 A CN 114671439A CN 202210269186 A CN202210269186 A CN 202210269186A CN 114671439 A CN114671439 A CN 114671439A
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- tail gas
- cooling
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- 238000001816 cooling Methods 0.000 title claims abstract description 77
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 113
- 210000003437 trachea Anatomy 0.000 claims abstract description 24
- 239000000843 powder Substances 0.000 claims description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 19
- 229910052710 silicon Inorganic materials 0.000 abstract description 10
- 239000010703 silicon Substances 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000007599 discharging Methods 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 120
- 230000000694 effects Effects 0.000 description 22
- 239000000498 cooling water Substances 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 11
- 229920005591 polysilicon Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 4
- 239000005052 trichlorosilane Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
Abstract
The invention discloses a chassis cooling structure of a reduction furnace, relates to the technical field of polycrystalline silicon production equipment, and mainly aims to provide a chassis cooling structure of a reduction furnace, which can uniformly discharge tail gas, ensure that the temperature field and the velocity field in the reduction furnace are more uniformly distributed, and ensure that the growth rates of different positions of a silicon rod tend to be balanced. The main technical scheme of the invention is as follows: a reduction furnace chassis cooling structure includes: a base pan having a cooling duct and a plurality of exhaust holes; cooling unit, chassis sleeve pipe include inlet channel, tail gas pipeline and drainage pipe, and the inlet channel cover is in the outside of tail gas pipeline, and the inlet channel is connected in cooling pipe, and cooling pipe connects in drainage pipe, and the one end of tail gas pipeline is connected in a plurality of exhaust holes, and the exhaust sleeve pipe includes first trachea and first water pipe, and first trachea communicates each other with the other end of tail gas pipeline, and first water pipe box is in first tracheal outside. The invention is mainly used for discharging the tail gas of the cooling reduction furnace.
Description
Technical Field
The invention relates to the technical field of polycrystalline silicon production equipment, in particular to a chassis cooling structure of a reduction furnace.
Background
At present, polysilicon production enterprises mainly adopt an improved Siemens method to manufacture polysilicon, the production flow of the method is to synthesize trichlorosilane from hydrogen chloride and silicon powder at a certain temperature, then purify trichlorosilane fine stuffing, after the purified high-purity trichlorosilane is mixed with hydrogen according to a certain proportion, the mixture is introduced into a polysilicon reduction furnace at a certain temperature and pressure, gas-phase deposition reaction is carried out on an electrified high-temperature silicon core to generate polysilicon, unreacted tail gas is discharged from a tail gas outlet on a furnace disc and enters the next procedure, and when polysilicon is manufactured, the trichlorosilane and the hydrogen are sprayed into the reduction furnace by the pressure difference of the materials, return to the furnace top and are discharged from a tail gas hole on the furnace disc.
The gas inlet nozzles and the off-gas outlets of the existing reduction furnaces are located on the furnace plate of the reduction furnace, which results in the following disadvantages: firstly, part of the fed mixed gas is easy to be discharged from a tail gas outlet with low pressure by short circuit, so that the conversion rate of the polycrystalline silicon is reduced. Secondly, because the feeding gas has a high speed and a low temperature at the gas inlet, the reduction furnace must generate a concentration gradient and a temperature gradient in the vertical direction, so that the deposition reaction rate of the polycrystalline silicon at the root of the electrode is low, meanwhile, because the upward flow of the gas also has the tendency of driving the polycrystalline silicon on the surface of the electrode to move upwards, the growth rate of the lower part of the formed silicon core is slow under the combined action of the two, so that the upper part of the silicon core is thick, the root part is thin, and the safe and stable production of the polycrystalline silicon is not facilitated. Thirdly, the inlet gas speed of the reduction furnace is high due to the design of related structures of the reduction furnace, and the gas speed at the top of the reduction furnace is low, so that a backflow dead zone exists at the top of the reduction furnace, and the yield of polycrystalline silicon is reduced.
Disclosure of Invention
In view of this, embodiments of the present invention provide a chassis cooling structure for a reduction furnace, and mainly aim to provide a chassis cooling structure for a reduction furnace, which can uniformly discharge tail gas, and ensure that a temperature field and a velocity field in the reduction furnace are more uniformly distributed, so that growth rates of different positions of a silicon rod tend to be balanced.
In order to achieve the purpose, the invention mainly provides the following technical scheme:
the embodiment of the invention provides a chassis cooling structure of a reduction furnace, which comprises:
a base pan having a cooling duct and a plurality of exhaust vents;
cooling part, cooling part includes chassis sleeve pipe and exhaust casing, the chassis sleeve pipe includes inlet channel, tail gas pipeline and drainage pipe, the inlet channel cover is in the outside of tail gas pipeline, the inlet channel connect in the cooling channel, the cooling channel connect in drainage pipe, the one end of tail gas pipeline is connected in a plurality of the exhaust hole, exhaust casing includes first trachea and first water pipe, first trachea with the other end of tail gas pipeline communicates each other, first water pipe box is in first tracheal outside.
Further, first water pipe includes first circulating line and second circulating line, first circulating line has first drain pipe, first circulating line connect in the inlet channel, first circulating line with the separation flange has between the inlet channel, second circulating line has first inlet tube, second circulating line connect in first circulating line.
Further, the first air pipe is provided with a first exhaust pipe, and the first air pipe is communicated with the exhaust pipeline.
Furthermore, the water inlet pipeline comprises a second water pipe, a second water supply ring pipe and a plurality of second water supply straight pipes, the second water pipe is provided with a second water inlet pipe, the second water pipe is connected to the second water supply ring pipe, one end of each of the second water supply straight pipes is connected to the second water supply ring pipe, and the other end of each of the second water supply straight pipes is connected to the cooling pipeline.
Furthermore, the tail gas pipeline comprises a second gas pipe, a second exhaust ring pipe and a plurality of second exhaust straight pipes, the second gas pipe is arranged inside the second water pipe, one end of the second gas pipe is communicated with the first circulating pipeline, the other end of the second gas pipe is connected to the second exhaust ring pipe, the second exhaust ring pipe is arranged inside the second water supply ring pipe, the second exhaust straight pipes are arranged inside the second water supply straight pipes, one end of each second exhaust straight pipe is connected to the second exhaust ring pipe, and the other end of each second exhaust straight pipe is connected to the exhaust hole.
Furthermore, the second water supply ring pipe is of an arc-shaped structure, and two ends of the second water supply ring pipe are provided with plugging flanges.
Furthermore, the number of the chassis sleeves is multiple, and the second water supply ring pipes of the multiple chassis sleeves surround a circular ring structure.
Further, a plurality of exhaust holes are formed in the edge of one side of the chassis.
Furthermore, the feeding part comprises a feeding pipeline and a plurality of distributing pipelines, one end of each powder pipeline is connected to the feeding pipeline, and the other end of each powder pipeline is connected to the base plate.
Further, the feeding pipeline is of a circular ring-shaped structure.
Compared with the prior art, the invention has the following technical effects:
in the technical scheme provided by the embodiment of the invention, the base plate is used for providing a silicon rod reaction place and is provided with a cooling pipeline and a plurality of exhaust holes; cooling unit's effect is cooled off chassis and tail gas, cooling unit includes chassis sleeve pipe and exhaust casing, the chassis sleeve pipe includes the inlet channel, tail gas pipeline and drainage pipe, the inlet channel cover is in tail gas pipeline's outside, the inlet channel is connected in cooling pipeline, cooling pipeline connects in drainage pipe, tail gas pipeline's one end is connected in a plurality of exhaust holes, exhaust casing includes first trachea and first water pipe, first trachea communicates each other with tail gas pipeline's the other end, first water pipe box is in first tracheal outside, for prior art, the inlet nozzle and the tail gas export of reducing furnace all are located the reducing furnace stone or metal plate, this leads to following shortcoming: firstly, part of the feeding mixed gas is easy to be discharged from the tail gas outlet with low pressure by short circuit, and the conversion rate of the polysilicon is reduced. Secondly, because the feeding gas has higher speed and lower temperature at the gas inlet, a concentration gradient and a temperature gradient are generated in the vertical direction of the reduction furnace, so that the deposition reaction rate of the polycrystalline silicon at the root of the electrode is lower, meanwhile, because the upward flow of the gas also has the tendency of driving the polycrystalline silicon on the surface of the electrode to move upwards, the growth rate of the lower part of the formed silicon core is lower under the combined action of the two, so that the upper part of the silicon core is thicker, the root is thinner, and the safe and stable production of the polycrystalline silicon is not facilitated. Thirdly, the related structure of the reducing furnace design leads to high inlet gas velocity of the reducing furnace, the top gas velocity of the reducing furnace is low, a backflow dead zone exists at the top of the reducing furnace, and the yield of the polycrystalline silicon is reduced, in the technical scheme, a cooling pipeline and a plurality of exhaust holes are arranged on a chassis, a water inlet pipeline is sleeved outside a tail gas pipeline, the water inlet pipeline is connected to the cooling pipeline, the cooling pipeline is connected to a drainage pipeline, one end of the tail gas pipeline is connected to the exhaust holes, cooling water in the water inlet pipeline can exchange heat with heat of the tail gas pipeline and the chassis, meanwhile, a first air pipe is mutually communicated with the other end of the tail gas pipeline, a first water pipe is sleeved outside the first air pipe, the tail gas enters the first air pipe through the tail gas pipeline, the first water pipe exchanges heat with the tail gas in the first air pipe, the pressure difference between every two gas holes is reduced, and the tail gas is discharged more uniformly, the mobility of tail gas has been reinforceed to reach the effect that improves the homogeneity of the interior gas field of reducing furnace, make silicon rod more even that grows, simultaneously, first trachea and inlet channel do not communicate with each other, can design the partition position between first trachea and the inlet channel according to the heat demand, make wantonly bright exchange more balanced of cooling water, thereby reach energy-conserving technological effect.
Drawings
Fig. 1 is a schematic perspective view of a chassis cooling structure of a reduction furnace according to an embodiment of the present invention;
fig. 2 is a schematic front view of a cooling structure of a chassis of a reduction furnace according to an embodiment of the present invention;
fig. 3 is a schematic top view of a cooling component according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples.
As shown in fig. 1 to 3, an embodiment of the present invention provides a cooling structure for a reduction furnace chassis, including:
a chassis 1, the chassis 1 having a cooling duct and a plurality of exhaust holes 12;
cooling unit, cooling unit includes chassis sleeve pipe and exhaust casing, and the chassis sleeve pipe includes inlet channel, tail gas pipeline and drainage pipe 23, and the inlet channel cover is in the outside of tail gas pipeline, and the inlet channel is connected in cooling pipe, and cooling pipe connects in drainage pipe 23, and the one end of tail gas pipeline is connected in a plurality of exhaust holes 12, and exhaust casing includes first trachea 24 and first water pipe 25, and first trachea 24 communicates each other with the other end of tail gas pipeline, and first water pipe 25 covers in first trachea 24's outside.
In the technical scheme provided by the embodiment of the invention, the base plate 1 is used for providing a silicon rod reaction place, and the base plate 1 is provided with a cooling pipeline and a plurality of exhaust holes 12; cooling unit's effect is cooled off chassis 1 and tail gas, cooling unit includes chassis sleeve pipe and exhaust casing, the chassis sleeve pipe includes the inlet channel, tail gas pipeline and drainage pipe 23, the inlet channel cover is in the outside of tail gas pipeline, the inlet channel is connected in cooling pipe, cooling pipe connects in drainage pipe 23, the one end of tail gas pipeline is connected in a plurality of exhaust holes 12, exhaust casing includes first trachea 24 and first water pipe 25, first trachea 24 communicates each other with the other end of tail gas pipeline, first water pipe 25 covers in first trachea 24's outside, for prior art, the inlet nozzle and the tail gas export of reduction furnace all are located the reduction furnace stone or metal plate, this leads to following shortcoming: firstly, part of the feeding mixed gas is easy to be discharged from the tail gas outlet with low pressure by short circuit, and the conversion rate of the polysilicon is reduced. Secondly, because the feeding gas has a high speed and a low temperature at the gas inlet, the reduction furnace must generate a concentration gradient and a temperature gradient in the vertical direction, so that the deposition reaction rate of the polycrystalline silicon at the root of the electrode is low, meanwhile, because the upward flow of the gas also has the tendency of driving the polycrystalline silicon on the surface of the electrode to move upwards, the growth rate of the lower part of the formed silicon core is slow under the combined action of the two, so that the upper part of the silicon core is thick, the root part is thin, and the safe and stable production of the polycrystalline silicon is not facilitated. Thirdly, the related structure of the design of the reduction furnace leads to high inlet gas velocity of the reduction furnace, and the top gas velocity of the reduction furnace is low, thus causing the existence of backflow dead zone at the top of the reduction furnace and reducing the yield of polysilicon, in the technical scheme, a cooling pipeline and a plurality of exhaust holes 12 are arranged on a chassis 1, a water inlet pipeline is sleeved outside a tail gas pipeline, the water inlet pipeline is connected to the cooling pipeline, the cooling pipeline is connected to a water drainage pipeline 23, one end of the tail gas pipeline is connected to the exhaust holes 12, cooling water in the water inlet pipeline can exchange heat with the heat of the tail gas pipeline and the chassis 1, meanwhile, a first gas pipe 24 is mutually communicated with the other end of the tail gas pipeline, a first water pipe 25 is sleeved outside the first gas pipe 24, the tail gas enters the first gas pipe 24 through the tail gas pipeline, the first water pipe 25 exchanges heat with the tail gas in the first gas pipe 24, thus reducing the pressure difference between every two gas holes, make tail gas exhaust more even, strengthened the mobility of tail gas to reach the effect that improves the homogeneity of the interior gas field of reducing furnace, make more even that the silicon rod is grown, simultaneously, first trachea 24 and inlet channel do not communicate each other, can design the partition position between first trachea 24 and the inlet channel according to the heat demand, make the bright exchange of wantonly of cooling water more balanced, thereby reach energy-conserving technological effect.
The base plate 1 is used for providing a silicon rod reaction place, the base plate 1 is provided with a cooling pipeline and a plurality of exhaust holes 12, the base plate 1 is one of the existing reduction furnace devices, the cooling pipeline for cooling water to flow is arranged in the base plate 1, the exhaust holes 12 are formed in the edge position of one side, facing a silicon core, of the base plate 1, the exhaust holes 12 are multiple, the exhaust flow of tail gas can be improved, meanwhile, the tail gas can flow out more uniformly, the cooling pipeline is provided with an inlet connected with the cooling water, the inlet is formed in the side face of the exhaust holes 12, and sleeve installation and connection can be facilitated; the cooling part is used for cooling the chassis 1 and tail gas, the cooling part comprises a chassis sleeve and an exhaust sleeve, the chassis sleeve comprises a water inlet pipeline, a tail gas pipeline and a drainage pipeline 23, the water inlet pipeline is sleeved outside the tail gas pipeline, the water inlet pipeline is connected to the cooling pipeline, the cooling pipeline is connected to the drainage pipeline 23, one end of the tail gas pipeline is connected to the exhaust holes 12, the tail gas pipeline is used for discharging the tail gas generated in the reduction furnace, one end of the tail gas pipeline is connected to each exhaust hole 12, the water inlet pipeline is arranged outside the tail gas pipeline, cooling water is introduced into the water inlet pipeline, the cooling water is conveyed to the cooling pipeline in the process of cooling, the tail gas in the tail gas pipeline is cooled, after the cooling water enters the chassis 1, the cooling water continues to cool equipment such as electrodes arranged on the chassis 1 and then is discharged through the drainage pipeline 23, the exhaust sleeve comprises a first air pipe 24 and a first water pipe 25, the first water pipe 25 is sleeved outside the first air pipe 24, the first air pipe 24 is communicated with the other end of the tail gas pipeline, the first water pipe 25 is not communicated with the water inlet pipeline, so that tail gas can enter the first air pipe 24 through the tail gas pipeline, in the exhaust process, the water inlet pipeline and the first water pipe 25 can cool the tail gas and then discharge the tail gas, in the technical scheme, the cooling pipeline and the exhaust holes 12 are arranged on the chassis 1, the water inlet pipeline is sleeved outside the tail gas pipeline, the water inlet pipeline is connected to the cooling pipeline, the cooling pipeline is connected to the water discharge pipeline 23, one end of the tail gas pipeline is connected to the exhaust holes 12, cooling water in the water inlet pipeline can exchange heat with heat of the tail gas pipeline and the chassis 1, meanwhile, the first air pipe 24 is communicated with the other end of the tail gas pipeline, the first water pipe 25 is sleeved outside the first air pipe 24, tail gas passes through the tail gas pipeline and gets into first trachea 24, first water pipe 25 carries out the heat exchange to the tail gas in the first trachea 24 again, it is every to the pressure differential between the gas pocket to have reduced, make tail gas exhaust more even, the mobility of tail gas has been reinforceed, thereby reach the effect that improves the homogeneity of the interior gas field of reducing furnace, make the silicon rod more even that grows, simultaneously, first trachea 24 and inlet channel do not communicate each other, can design the partition position between first trachea 24 and the inlet channel according to the heat demand, make the bright exchange of wanting of cooling water more balanced, thereby reach energy-conserving technological effect.
Further, the first water pipe 25 includes a first circulation pipe 251 and a second circulation pipe 252, the first circulation pipe 251 has a first drain pipe 253, the first circulation pipe 251 is connected to the water inlet pipe, a separation flange 242 is provided between the first circulation pipe 251 and the water inlet pipe, the second circulation pipe 252 has a first inlet pipe 254, and the second circulation pipe 252 is connected to the first circulation pipe 251. In this embodiment, the first water pipe 25 is further defined, the first circulating pipe 251 has a first exhaust pipe 253, the first circulating pipe 251 is connected to the water inlet pipe, a separation flange 242 is provided between the first circulating pipe 251 and the water inlet pipe, and the position of the separation flange 242 can be adjusted according to different reduction furnaces, so as to recover heat generated by the exhaust gas with maximum efficiency, thereby achieving the technical effect of improving the utilization rate of heat; specifically, first water pipe 25 cover sets up first inlet tube 254 in the outside of first trachea 24 on first water pipe 25 for during cooling water can get into first water pipe 25 through first inlet tube 254, then cools off the tail gas in the first trachea 24, thereby reaches the effect that reduces the tail gas temperature, and then reaches the technological effect that improves thermal utilization efficiency.
Further, the water inlet pipe includes a second water pipe 211, a second water supply loop 212, and a plurality of second water supply straight pipes 213, the second water pipe 211 has a second water inlet pipe 2111, the second water pipe 211 is connected to the second water supply loop 212, and one end of the plurality of second water supply straight pipes 213 is connected to the second water supply loop 212, and the other end is connected to the cooling pipe. In this embodiment, a water inlet channel is further defined, the second water pipe 211 has a second water inlet pipe 2111, cooling water enters the second water supply loop 212 from the second water inlet pipe 2111 and then enters the chassis sleeve through a plurality of second water supply straight pipes 213, thereby achieving the technical effect of cooling the exhaust gas and the chassis 1, the second water pipe 211 is connected to the second water supply loop 212, one end of each of the plurality of second water supply straight pipes 213 is connected to the second water supply loop 212, the other end is connected to the cooling channel, the second water supply loop 212 adopts a semi-circular arc structure, the exhaust gas channel includes a second gas pipe 221, a second exhaust loop 222 and a plurality of second exhaust straight pipes 223, the second gas pipe 221 is disposed inside the second water pipe 211, one end of the second gas pipe 221 is mutually communicated with the first circulation channel 251, the other end is connected to the second exhaust loop 222, the second exhaust loop 222 is disposed inside the second water supply loop 212, the second exhaust straight pipe 223 is arranged inside the second water supply straight pipe 213, one end of the second exhaust straight pipe 223 is connected to the second exhaust ring pipe 222, the other end is connected to the exhaust hole 12, the second exhaust ring pipe 222 also adopts a semi-circular structure, so that the second exhaust ring pipe 222 can be arranged inside the second water supply ring pipe 212, and then the problem of an air flow dead zone can be solved through air field simulation, so that the exhaust gas is more uniformly distributed, the effect of optimizing the distribution of an air field in the reduction furnace is achieved, and the technical effect of enabling the silicon rod to grow more uniformly is achieved; specifically, the two ends of the second water supply ring pipe 212 are provided with the blocking flanges 224, the blocking flanges 224 can be detachably connected to the second water supply ring pipe 212, and the blocking flanges 224 can also block the second exhaust ring pipe 222, so that impurities in the tail gas can stay in the second exhaust ring pipe 222, when the impurities need to be cleaned, the blocking flanges 224 are removed, and then the second exhaust ring pipe 222 is cleaned, thereby achieving the technical effect of conveniently cleaning the second exhaust ring pipe 222, specifically, the number of the chassis sleeves is multiple, the second water supply ring pipes 212 of the multiple chassis sleeves form a circular ring structure, thereby eliminating dead zones in the chassis sleeves, strengthening the fluidity of the tail gas, enabling the gas outlet distribution of the tail gas to be more uniform, further achieving the effect of optimizing the gas field distribution in the reduction furnace, and further achieving the technical effect of enabling the silicon rods to grow more uniformly.
Further, the feeding part comprises a feeding pipeline 31 and a plurality of powder pipelines 32, one end of each powder pipeline is connected to the feeding pipeline 31, and the other end of each powder pipeline is connected to the chassis 1. In this embodiment, the feeding part has been increased, and the effect of feeding part is in letting in the material of production polycrystalline silicon to the reduction furnace, and charge-in pipeline 31 adopts the ring annular structure, and rethread powder pipeline 32 improves material deposit effect with even transport of material in the reduction furnace, and is concrete, sets up air inlet nozzle 33 on every powder pipeline 32, and air inlet nozzle 33 can spout the material into the reduction furnace to improve the deposit effect of material, and then reach the technological effect who improves the conversion of material.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A reduction furnace chassis cooling structure is characterized by comprising:
a base pan having a cooling duct and a plurality of exhaust vents;
Cooling part, cooling part includes chassis sleeve pipe and exhaust casing, the chassis sleeve pipe includes inlet channel, tail gas pipeline and drainage pipe, the inlet channel cover is in the outside of tail gas pipeline, the inlet channel connect in the cooling channel, the cooling channel connect in drainage pipe, the one end of tail gas pipeline is connected in a plurality of the exhaust hole, exhaust casing includes first trachea and first water pipe, first trachea with the other end of tail gas pipeline communicates each other, first water pipe box is in first tracheal outside.
2. The reduction furnace floor cooling structure according to claim 1,
first water pipe includes first circulating line and second circulating line, first circulating line has first drain pipe, first circulating line connect in inlet channel, first circulating line with separate the flange between the inlet channel, second circulating line has first inlet tube, second circulating line connect in first circulating line.
3. The reduction furnace hearth cooling structure according to claim 2,
The first air pipe is provided with a first exhaust pipe, and the first air pipe is communicated with the exhaust pipeline.
4. The reduction furnace floor cooling structure according to claim 2,
the water inlet pipeline comprises a second water pipe, a second water supply ring pipe and a plurality of second water supply straight pipes, the second water pipe is provided with a second water inlet pipe, the second water pipe is connected to the second water supply ring pipe, one end of each of the second water supply straight pipes is connected to the second water supply ring pipe, and the other end of each of the second water supply straight pipes is connected to the cooling pipeline.
5. The reduction furnace hearth cooling structure according to claim 4,
the tail gas pipeline comprises a second gas pipe, a second exhaust ring pipe and a plurality of second exhaust straight pipes, the second gas pipe is arranged inside the second water pipe, one end of the second gas pipe is communicated with the first circulating pipeline, the other end of the second gas pipe is connected to the second exhaust ring pipe, the second exhaust ring pipe is arranged inside the second water supply ring pipe, the second exhaust straight pipes are arranged inside the second water supply straight pipes, one end of each second exhaust straight pipe is connected to the second exhaust ring pipe, and the other end of each second exhaust straight pipe is connected to the exhaust hole.
6. The reduction furnace hearth cooling structure according to claim 4,
the second water supply ring pipe is of an arc-shaped structure, and two ends of the second water supply ring pipe are provided with plugging flanges.
7. The reduction furnace hearth cooling structure according to claim 6,
the number of the chassis sleeves is multiple, and the second water supply ring pipes of the multiple chassis sleeves surround a circular ring structure.
8. The reduction furnace hearth cooling structure according to any one of claims 1 to 7,
the plurality of exhaust holes are arranged at the edge position of one side of the chassis.
9. The reduction furnace floor cooling structure according to any one of claims 1 to 7, further comprising:
the feeding part comprises a feeding pipeline and a plurality of distributing pipelines, one end of each powder pipeline is connected to the feeding pipeline, and the other end of each powder pipeline is connected to the base plate.
10. The reduction furnace hearth cooling structure according to claim 9,
the feeding pipeline is of a circular ring structure.
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CN216946232U (en) * | 2022-03-18 | 2022-07-12 | 新疆大全新能源股份有限公司 | Reduction furnace chassis cooling structure |
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2022
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CN203904000U (en) * | 2014-05-04 | 2014-10-29 | 上海森松化工成套装备有限公司 | Novel polycrystalline silicon reduction furnace adopting air feeding and discharging structure |
CN109437207A (en) * | 2018-11-12 | 2019-03-08 | 河南硅烷科技发展股份有限公司 | A kind of thermal decomposition of silane furnace that silicon rod growth quality can be improved |
CN216946232U (en) * | 2022-03-18 | 2022-07-12 | 新疆大全新能源股份有限公司 | Reduction furnace chassis cooling structure |
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