CN114670517B - Encapsulating material for organic electronic device and organic electronic device comprising same - Google Patents
Encapsulating material for organic electronic device and organic electronic device comprising same Download PDFInfo
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- CN114670517B CN114670517B CN202111579573.0A CN202111579573A CN114670517B CN 114670517 B CN114670517 B CN 114670517B CN 202111579573 A CN202111579573 A CN 202111579573A CN 114670517 B CN114670517 B CN 114670517B
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- China
- Prior art keywords
- resin layer
- encapsulating resin
- weight
- encapsulating
- electronic device
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- 239000000463 material Substances 0.000 title claims abstract description 68
- 239000000126 substance Substances 0.000 claims abstract description 64
- 238000005538 encapsulation Methods 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims description 200
- 239000011347 resin Substances 0.000 claims description 200
- 239000003795 chemical substances by application Substances 0.000 claims description 77
- 230000002745 absorbent Effects 0.000 claims description 39
- 239000002250 absorbent Substances 0.000 claims description 39
- -1 5-ethyl-1, 3-dioxane-5-yl Chemical group 0.000 claims description 36
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 34
- 239000003999 initiator Substances 0.000 claims description 33
- 150000001875 compounds Chemical class 0.000 claims description 24
- 238000012360 testing method Methods 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 13
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 9
- 239000005022 packaging material Substances 0.000 claims description 9
- 125000003342 alkenyl group Chemical group 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 claims description 5
- RZFODFPMOHAYIR-UHFFFAOYSA-N oxepan-2-one;prop-2-enoic acid Chemical compound OC(=O)C=C.O=C1CCCCCO1 RZFODFPMOHAYIR-UHFFFAOYSA-N 0.000 claims description 5
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 4
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 claims description 4
- CLHPBURJMZXHFZ-UHFFFAOYSA-N (1,2,2-trimethylcyclohexyl) prop-2-enoate Chemical compound CC1(C)CCCCC1(C)OC(=O)C=C CLHPBURJMZXHFZ-UHFFFAOYSA-N 0.000 claims description 3
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 claims description 3
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- 239000000523 sample Substances 0.000 claims description 3
- 125000005982 diphenylmethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 17
- 239000010409 thin film Substances 0.000 abstract description 11
- 239000012535 impurity Substances 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 9
- 239000011229 interlayer Substances 0.000 abstract description 4
- 238000013459 approach Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 152
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 22
- 239000010408 film Substances 0.000 description 21
- 239000011521 glass Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 229920000139 polyethylene terephthalate Polymers 0.000 description 19
- 239000005020 polyethylene terephthalate Substances 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 17
- 238000011156 evaluation Methods 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 13
- 239000000203 mixture Substances 0.000 description 12
- 239000002245 particle Substances 0.000 description 12
- 239000003566 sealing material Substances 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 9
- 230000007423 decrease Effects 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 238000001514 detection method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 4
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 4
- 206010027146 Melanoderma Diseases 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 150000002894 organic compounds Chemical class 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229920005604 random copolymer Polymers 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- 229920002943 EPDM rubber Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- LGEJUGBHYJDUJO-UHFFFAOYSA-N 1,1'-biphenyl;methyl prop-2-enoate Chemical compound COC(=O)C=C.C1=CC=CC=C1C1=CC=CC=C1 LGEJUGBHYJDUJO-UHFFFAOYSA-N 0.000 description 2
- OBOSXEWFRARQPU-UHFFFAOYSA-N 2-n,2-n-dimethylpyridine-2,5-diamine Chemical compound CN(C)C1=CC=C(N)C=N1 OBOSXEWFRARQPU-UHFFFAOYSA-N 0.000 description 2
- CXMYWOCYTPKBPP-UHFFFAOYSA-N 3-(3-hydroxypropylamino)propan-1-ol Chemical compound OCCCNCCCO CXMYWOCYTPKBPP-UHFFFAOYSA-N 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 2
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- SGUXGJPBTNFBAD-UHFFFAOYSA-L barium iodide Chemical compound [I-].[I-].[Ba+2] SGUXGJPBTNFBAD-UHFFFAOYSA-L 0.000 description 2
- 229910001638 barium iodide Inorganic materials 0.000 description 2
- 229940075444 barium iodide Drugs 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 2
- 229910001622 calcium bromide Inorganic materials 0.000 description 2
- 239000001110 calcium chloride Substances 0.000 description 2
- 229910001628 calcium chloride Inorganic materials 0.000 description 2
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 2
- 229910001623 magnesium bromide Inorganic materials 0.000 description 2
- 229910001629 magnesium chloride Inorganic materials 0.000 description 2
- BLQJIBCZHWBKSL-UHFFFAOYSA-L magnesium iodide Chemical compound [Mg+2].[I-].[I-] BLQJIBCZHWBKSL-UHFFFAOYSA-L 0.000 description 2
- 229910001641 magnesium iodide Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- AOLPZAHRYHXPLR-UHFFFAOYSA-I pentafluoroniobium Chemical compound F[Nb](F)(F)(F)F AOLPZAHRYHXPLR-UHFFFAOYSA-I 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001631 strontium chloride Inorganic materials 0.000 description 2
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 2
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- 238000004154 testing of material Methods 0.000 description 2
- ZOYIPGHJSALYPY-UHFFFAOYSA-K vanadium(iii) bromide Chemical compound [V+3].[Br-].[Br-].[Br-] ZOYIPGHJSALYPY-UHFFFAOYSA-K 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Natural products CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- 241001572615 Amorphus Species 0.000 description 1
- QDHXVXBPTVMIDP-UHFFFAOYSA-N C(C1=CC=CC=C1)C=C(C(=O)O)C.C(C(=C)C)(=O)OCC1=CC=CC=C1 Chemical compound C(C1=CC=CC=C1)C=C(C(=O)O)C.C(C(=C)C)(=O)OCC1=CC=CC=C1 QDHXVXBPTVMIDP-UHFFFAOYSA-N 0.000 description 1
- HICDDSFDZHUQGX-UHFFFAOYSA-N C(CCCCCCC(C)C)C(C(=O)O)=C.C(C=C)(=O)OCCCCCCCC(C)C Chemical compound C(CCCCCCC(C)C)C(C(=O)O)=C.C(C=C)(=O)OCCCCCCCC(C)C HICDDSFDZHUQGX-UHFFFAOYSA-N 0.000 description 1
- MPCRDALPQLDDFX-UHFFFAOYSA-L Magnesium perchlorate Chemical compound [Mg+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O MPCRDALPQLDDFX-UHFFFAOYSA-L 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- GVMYIWIPPADCPW-UHFFFAOYSA-N OC(=O)C(=C)Cc1ccccc1.C=CC(=O)OCc1ccccc1 Chemical compound OC(=O)C(=C)Cc1ccccc1.C=CC(=O)OCc1ccccc1 GVMYIWIPPADCPW-UHFFFAOYSA-N 0.000 description 1
- 241000233805 Phoenix Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- OOULUYZFLXDWDQ-UHFFFAOYSA-L barium perchlorate Chemical compound [Ba+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O OOULUYZFLXDWDQ-UHFFFAOYSA-L 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 1
- 229940044175 cobalt sulfate Drugs 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- VJMBENQIKAACCI-UHFFFAOYSA-N oxolan-2-ylmethyl prop-2-enoate 2-(oxolan-2-ylmethyl)prop-2-enoic acid Chemical compound C(C1CCCO1)C(C(=O)O)=C.C(C1CCCO1)OC(C=C)=O VJMBENQIKAACCI-UHFFFAOYSA-N 0.000 description 1
- DCKVFVYPWDKYDN-UHFFFAOYSA-L oxygen(2-);titanium(4+);sulfate Chemical compound [O-2].[Ti+4].[O-]S([O-])(=O)=O DCKVFVYPWDKYDN-UHFFFAOYSA-L 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
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Classifications
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- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
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- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
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- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
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Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to an encapsulating material for organic electronic devices and an organic electronic device including the same, and more particularly, to an encapsulating material for organic electronic devices and an organic electronic device including the same, which remove and block moisture, impurities, and other undesirable substances so as not to approach the organic electronic device, and which have excellent moisture resistance and heat resistance while not causing an interlayer peeling phenomenon occurring when moisture is removed, and which provide excellent adhesion between the organic electronic device and the encapsulating material even at normal temperature in a thin film encapsulation process.
Description
Technical Field
The present invention relates to an encapsulating material for an organic electronic device and an organic electronic device including the same, and more particularly, to an encapsulating material for an organic electronic device and an organic electronic device including the same, which remove and block moisture, impurities, and other undesirable substances so as not to approach the organic electronic device, and which have excellent moisture resistance and heat resistance while not causing an interlayer peeling phenomenon occurring when moisture is removed, and which provide excellent adhesion between the organic electronic device and the encapsulating material in a thin film encapsulation process (Thin Film Encapsulation) even at normal temperature.
Background
An organic light emitting diode (OLED: organic Light Emitting Diode) is a light emitting diode in which a light emitting layer is formed of a thin film of an organic compound, and utilizes an electroluminescence phenomenon in which light is emitted by passing a current through an organic fluorescent compound. Such organic light emitting diodes generally realize main colors by Red (Red), green (Green), blue (Blue) three-color independent pixel system, color conversion system (CCM), color filter system, and the like, and are classified into low-molecular organic light emitting diodes and high-molecular organic light emitting diodes according to the molecular weight of organic substances contained in a light emitting material used. Further, the driving method can be classified into a passive driving method and an active driving method.
The organic light emitting diode has the characteristics of high efficiency, low voltage driving, simple driving and the like based on self-luminescence, and has the advantage of being capable of displaying high-quality images. Further, the present invention can be expected to be applied to flexible displays and organic electronic devices using flexibility of organic materials.
The organic light emitting diode is prepared in a form of a thin film in which an organic compound as a light emitting layer is laminated on a substrate (substrate). However, the organic compounds used in the organic light emitting diode are very sensitive to impurities, oxygen and moisture, and have a problem of being easily deteriorated by exposure to the outside or permeation of moisture and oxygen. Such degradation of the organic material affects the light emission characteristics of the organic light emitting diode, and shortens the life thereof. In order to prevent this, a thin film encapsulation process for preventing oxygen, moisture, etc. from flowing into the inside of the organic light emitting diode is required.
As described above, the thin film Encapsulation step is to prevent degradation of an organic compound in an organic layer of an organic light emitting diode, and an object to be encapsulated (Encapsulation) is a display panel (display panel) of the organic light emitting diode, and a portion of the display panel to which an Encapsulation material is directly bonded is a substrate (substrate).
Conventionally, a metal can or glass is processed into a lid form having a groove, and a drying agent for absorbing moisture is mounted in the form of powder, but such a method cannot simultaneously block undesirable causative substances such as moisture and impurities from approaching an organic electronic device only by removing moisture at a desired level in an organic electronic device, and cannot simultaneously have the effects of preventing interlayer peeling phenomenon, excellent moisture resistance and excellent heat resistance which may occur when moisture is removed.
On the other hand, in order to bond (=package) the organic light-emitting diode and the packaging material for packaging the organic light-emitting diode, the thin film packaging process is generally performed at a relatively high temperature of about 40 to 60 ℃.
However, there is a problem that the process efficiency is poor, such as the need to raise the temperature to set the process temperature to about 40 to 60 ℃ and to re-lower the temperature to perform the subsequent process. Further, when the thin film packaging process is performed at a temperature of 40 to 60 ℃, bending occurs due to a difference in Coefficient of Thermal Expansion (CTE) between the substrates formed of the metal material bonded to the substrate to which the packaging material is bonded and the packaging material to impart rigidity.
Therefore, unlike the conventional techniques, it is necessary to develop a technique that can bond a sealing material to a substrate (glass) at normal temperature, and that exhibits excellent properties (moisture permeation length, volume expansion evaluation, heat resistance evaluation, durability evaluation) and adhesion of the sealing material so that the bonded sealing material functions as a sealing material at normal temperature.
Prior art literature
Patent literature
Patent document 1: korean laid-open patent No. 10-2006-0030718 (publication day: 2006, 04, 11)
Disclosure of Invention
Technical problem
The present invention has been made to solve the above problems, and an object of the present invention is to provide a packaging material for an organic electronic device and an organic electronic device including the same: the organic electronic device has excellent moisture resistance and heat resistance, and excellent adhesion between the organic electronic device and the packaging material even at normal temperature in the thin film packaging process.
Technical proposal
In order to solve the above problems, the encapsulating material for an organic electronic device of the present invention may include an encapsulating resin layer including an encapsulating resin, a tackifier and a moisture absorbent.
As a preferred embodiment of the present invention, the encapsulating resin layer of the present invention may satisfy the following relation 1:
relation 1
65≤A－B≤125
In the above-described relation 1, a represents a deionized water contact angle (°) of the cured encapsulating resin layer, and B represents wettability (mN/m) of the cured encapsulating resin layer.
As a preferred embodiment of the present invention, A in the above relation 1 may be 80 to 110℃and B may be-10 to 15mN/m.
As a preferred embodiment of the present invention, the encapsulating resin layer of the present invention also satisfies the following condition (1) and condition (2).
Condition (1): i is more than or equal to 100 and less than or equal to 300
Condition (2): 500 is less than or equal to J
In the above condition (1), I is the adhesion force (gf) of the cured encapsulating resin layer detected according to ASTM D2979 standard (Probe Tack Test).
In the above condition (2), J is the shear strength (gf/6 mm) of the cured encapsulating resin layer detected by the universal material testing apparatus.
As a preferred embodiment of the present invention, the encapsulation resin layer of the present invention may include: a first encapsulation resin layer; and a second encapsulating resin layer formed on one surface of the first encapsulating resin layer.
As a preferred embodiment of the present invention, the first encapsulating resin layer of the present invention may contain 70 to 176 parts by weight of the tackifier with respect to 100 parts by weight of the encapsulating resin.
As a preferred embodiment of the present invention, the second encapsulating resin layer of the present invention may contain 57 to 107 parts by weight of the tackifier and 110 to 205 parts by weight of the moisture absorbent with respect to 100 parts by weight of the encapsulating resin.
As a preferred embodiment of the present invention, the encapsulation resin of the present invention contains a compound represented by the following chemical formula 1.
Chemical formula 1
In the above chemical formula 1, R 1 Is hydrogen atom, C 3 ～C 10 Straight-chain alkenyl or C 4 ～C 10 N is a rational number satisfying a weight average molecular weight of 30000 ～ 1550000.
As a preferred embodiment of the present invention, the first encapsulating resin layer and the second encapsulating resin layer of the present invention may each contain one or more selected from a curing agent and an ultraviolet initiator.
As a preferred embodiment of the present invention, the first encapsulating resin layer of the present invention may contain 28 to 52 parts by weight of a curing agent and 1.64 to 3.06 parts by weight of an ultraviolet initiator with respect to 100 parts by weight of the encapsulating resin.
As a preferred embodiment of the present invention, the second encapsulating resin layer of the present invention may contain 6.36 to 11.82 parts by weight of a curing agent and 1.27 to 2.37 parts by weight of an ultraviolet initiator with respect to 100 parts by weight of the encapsulating resin.
As a preferred embodiment of the present invention, the curing agent of the first encapsulating resin layer of the present invention may include a difunctional acrylate curing agent and a monofunctional acrylate curing agent.
As a preferred embodiment of the present invention, the curing agent of the second encapsulating resin layer of the present invention may contain a difunctional acrylate curing agent.
As a preferred embodiment of the present invention, the difunctional acrylate curing agent may be a compound represented by the following chemical formula 2.
Chemical formula 2
In the above chemical formula 2, A 1 A is a 2 Respectively and independently-CH 2 -、-CH 2 CH 2 -、-CH 2 CH 2 CH 2 -、-CH 2 CH 2 CH 2 CH 2 -or-CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -。
As a preferred embodiment of the present invention, the monofunctional Acrylate curing agent may include one or more compounds selected from the group consisting of tetrahydrofurfuryl Acrylate (Tetrahydrofurfuryl Acrylate), caprolactone Acrylate (Caprolactone Acrylate), dodecyl Acrylate (laurylacrylate), isodecyl Acrylate (Isodecyl Acrylate), trimethylcyclohexyl Acrylate (Trimethyl cyclohexyl Acrylate), isobornyl Acrylate (Isobornyl Acrylate), ethyl 2- (2-Ethoxyethoxy) Acrylate (2- (2-ethoxymethoxy) Ethyl Acrylate), methyl (5-Ethyl-1, 3-dioxane-5-yl) Acrylate (5-Ethyl-1, 3-dioxane-5-yl) methyl Acrylate, 2- (o-Phenylphenoxy) Ethyl Acrylate (2- (o-phenyl phenoxy) Ethyl Acrylate), benzyl Acrylate (Benzyl Acrylate), benzyl methacrylate (Benzyl Methacrylate) and biphenyl methyl Acrylate (Biphenylmethyl Acrylate).
As a preferred embodiment of the present invention, the curing agent of the first encapsulating resin layer of the present invention may contain the above-mentioned difunctional acrylate curing agent and the above-mentioned monofunctional acrylate curing agent in a weight ratio of 1:5.25 to 1:9.75. As described above, if the first encapsulating resin layer contains a monofunctional acrylate curing agent, the curing density is reduced more or less than in the case of using a difunctional acrylate curing agent alone, and therefore, it can be a factor for achieving the adhesion at normal temperature in the present invention.
As a preferred embodiment of the present invention, the first and second encapsulation resin layers of the present invention may have a thickness ratio of 1:2.8 to 1:5.2.
As a preferred embodiment of the present invention, the first encapsulation resin layer of the present invention may be formed to a thickness of 1 μm to 20 μm.
As a preferred embodiment of the present invention, the second encapsulation resin layer of the present invention may be formed to a thickness of 30 μm to 60 μm.
In another aspect, the organic electronic device of the present invention may include: a substrate; an organic electronic device formed on at least one surface of the substrate; and the encapsulating material for an organic electronic device of the present invention is used for encapsulating the above-mentioned organic electronic device.
Hereinafter, terms used in the present invention will be described in detail.
The term "moisture absorbent" used in the present invention can cause moisture to be adsorbed to the interface of the moisture absorbent by physical bonding or chemical bonding such as van der Waals force, and includes all moisture-adsorbing substances that do not change the substance composition due to moisture adsorption and moisture-adsorbing substances that adsorb moisture by chemical reaction and generate new substances.
Also, the term "normal temperature" as used in the present invention means a temperature of 10 to 40 ℃, preferably 15 to 35 ℃, more preferably 18 to 30 ℃.
ADVANTAGEOUS EFFECTS OF INVENTION
The encapsulating material for an organic electronic device according to the present invention exhibits excellent adhesion to an organic electronic device even at normal temperature, and therefore the process efficiency of encapsulating an organic electronic device with the encapsulating material is excellent.
The packaging material for the organic electronic device can effectively remove moisture while blocking oxygen, impurities and moisture, and obviously prevent moisture from reaching the organic electronic device, thereby obviously prolonging the service life and the durability of the organic electronic device.
In addition, the moisture-resistant and heat-resistant effects are obtained without causing interlayer peeling phenomenon which may occur when removing moisture.
Drawings
Fig. 1 is a cross-sectional view of an encapsulation material for an organic electronic device capable of being bonded at normal temperature according to a preferred embodiment of the present invention.
Fig. 2 is a cross-sectional view of an organic electronic device according to a preferred embodiment of the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can easily practice the present invention. The present invention may be practiced in a variety of different embodiments and is not limited to the examples described herein. For the purpose of illustrating the invention, there is no part in the drawings that is irrelevant to the description, and like or similar elements are designated by like reference numerals throughout the specification.
Referring to fig. 1, the encapsulation material for an organic electronic device of the present invention may include an encapsulation resin layer 10.
The encapsulating resin layer 10 of the present invention may be formed of a reduced pressure-sensitive adhesive composition including an encapsulating resin, a tackifier, and moisture absorbents 40', 40″.
The encapsulating resin layer 10 of the present invention is characterized by satisfying the following relational expression 1.
Relation 1:
65≤A－B≤125
in the above-described relation 1, a represents a deionized water contact angle (°) of the cured encapsulating resin layer, and B represents wettability (mN/m) of the cured encapsulating resin layer.
The contact angle a and wettability B of the above-described relation 1 represent the degree of hydrophilicity, the contact angle a is inversely proportional to the hydrophilicity, and the wettability B is proportional to the hydrophilicity.
More specifically, since the substrate of the organic electronic device generally has hydrophilicity, the greater the degree of hydrophilicity of the encapsulating resin layer, the higher the adhesion, and thus may exhibit a favorable tendency in achieving room temperature adhesion. On the other hand, if the adhesion is too high, bubbles are trapped in the encapsulating resin layer before the normal temperature lamination is completed, and thus a bubble trap (trap) phenomenon occurs, and when moisture or the like permeates into the organic electronic device from the outside, the bubbles become a permeation path for moisture or the like, and there is a problem that the encapsulating resin layer is lowered, so that it is necessary to appropriately adjust the adhesion.
In order to adjust the degree of hydrophilicity of the encapsulating resin layer, the present inventors have conducted many studies to derive the relation 1 relating to the relation between the contact angle a and the wettability B, and have confirmed that when the above relation 1 is satisfied, the desired room temperature adhesiveness of the encapsulating resin layer can be achieved, and further, excellent room temperature adhesive force after lamination at room temperature and excellent encapsulating material properties can be exhibited, thereby completing the present invention.
Specifically, when the normal temperature adhesion is evaluated in the present invention, it is preferable that the adhesion with the substrate of the organic electronic device at normal temperature may be 6000gf/25mm or more, more preferably 8000gf/25mm or more, and most preferably 10000gf/25mm or more (for specific evaluation, refer to the following experimental example).
As described above, in the present invention, when the value of the "contact angle a-wettability B" of the encapsulating resin layer satisfies the range of 65 to 125, the adhesion with the substrate and the room temperature adhesiveness and the room temperature adhesive force are improved, and at the same time, in order to prevent the bubble trapping phenomenon, it is preferable that the following relation 1 is satisfied. If a-B is less than 65, the life of the organic electronic device is reduced due to insufficient reliability of the panel, and if a-B is more than 125, the quality of the panel adhesion is poor.
Relation 1:
65≤A－B≤125
in the above relation 1, a may be 80 ° to 110 °, and if a is less than 80 °, the moisture resistance may be lowered, and if it is more than 110 °, the barrier effect may be poor when the adhesive is bonded to a Panel (Panel).
In the above-mentioned relation 1, B may be-10 mN/m to 15mN/m, and if B is less than-10 mN/m, the problem of lowering of adhesion to the panel occurs due to insufficient adhesion, and if B is more than 15mN/m, the problem of lowering of resistance to temperature and humidity changes occurs due to low curing density.
The encapsulating resin layer 10 of the present invention may satisfy the following conditions (1) and (2).
Condition (1): 100.ltoreq.I.ltoreq.300, preferably 150.ltoreq.I.ltoreq.250, more preferably 180.ltoreq.I.ltoreq.230.
In the condition (1), I is the adhesion force (gf) of the cured encapsulating resin layer detected according to ASTM D2979 standard (Probe Tack Test), and if I is less than 100, there is a problem that alignment (alignment) failure due to sliding occurs in the bonding step, and if it is more than 300, there is a problem that failure occurs in the bonding step due to high adhesion (Tack) of the encapsulating resin layer.
Condition (2): 500.ltoreq.J, preferably 1000.ltoreq.J.ltoreq.9000, more preferably 4000.ltoreq.J.ltoreq.7000.
In the condition (2), J is the shear strength (gf/6 mm) of the cured encapsulating resin layer detected by the universal material testing equipment, and if J is less than 500, problems of poor alignment and interfacial peeling occur due to a decrease in adhesion.
First, it is preferable that the sealing resin of the present invention is capable of achieving normal temperature adhesion already using a sealing resin having a not too high curing density at the time of curing. For example, it may be a polyolefin-based resin, which may contain poly (C) selected from polyethylene, polypropylene, polyisobutylene (Polyisobutene) and the like 2 ～C 6 ) One or more than 2 kinds of olefin resins and random copolymer resins obtained by copolymerizing ethylene, propylene and/or diene compounds.
As a preferred example, the encapsulation resin may include a compound represented by the following chemical formula 1.
Chemical formula 1:
in the above chemical formula 1, R 1 Can be hydrogen atom, C 3 ～C 10 Straight-chain alkenyl or C 4 ～C 10 Branched alkenyl of (2), preferably R 1 Can be hydrogen atom, C 4 ～C 8 Straight-chain alkenyl or C 4 ～C 8 Branched alkenyl of (a).
And, following R of chemical formula 1 1 Selected as hydrogen atoms, C 3 ～C 10 The linear alkenyl group or the branched alkenyl group having 4 to 10 carbon atoms can be more excellent in reliability.
In chemical formula 1, n may be a rational number satisfying a weight average molecular weight of 30000 ～ 1550000, and preferably may be a rational number satisfying a weight average molecular weight of 40000 ～ 1500000. If the weight average molecular weight is less than 30000, sagging of the panel due to a decrease in modulus, lowering of heat resistance, lowering of reliability due to a decrease in filling property of the moisture absorbent, lowering of mechanical properties, and tilting of the substrate due to volume expansion of the moisture absorbent caused by a decrease in elasticity are caused. Further, if the weight average molecular weight is larger than 1550000, there is a problem that the adhesion to the substrate is reduced due to the reduced wettability, and there is a problem that the adhesion to the panel is reduced due to the increased modulus.
Further, the compound represented by the above chemical formula 1 may have a crystallization temperature of 100 to 140 ℃, preferably 110 to 130 ℃, more preferably 115 to 125 ℃ when detected by the detection method described below.
Detection method
The crystallization temperature (Tc) was determined by peak analysis of a heat flow cooling curve measured using a differential scanning calorimeter (Differential Scanning Calorimetry, DSC) during cooling of the temperature from 200 ℃ to-150 ℃ at a rate of 10 ℃/min.
Next, the tackifier may include, without limitation, a binder resin generally used for an encapsulating material for an organic electronic device, and preferably may include one or more selected from the group consisting of hydrogenated petroleum resin, hydrogenated rosin ester resin, hydrogenated terpene phenol resin, polymerized rosin resin, and polymerized rosin ester resin.
The moisture absorbent 40', 40″ may be used without limitation as a moisture absorbent generally used in the encapsulation of an organic electronic device, and preferably may include one or more of a moisture absorbent including a component such as zeolite, titanium dioxide, zirconium oxide, or montmorillonite, a metal salt, and a metal oxide, and more preferably may include a metal oxide.
The metal oxide may comprise silicon dioxide (SiO 2 ) Alumina (Al) 2 O 3 ) Lithium oxide (Li) 2 O), sodium oxide (Na 2 O), barium oxide (BaO), calcium oxide (CaO), magnesium oxide, or the like, and an organic metal oxide, or phosphorus pentoxide.
The metal salt may comprise lithium sulfate (Li 2 SO 4 ) Sodium sulfate (Na) 2 SO 4 ) Calcium sulfate (CaSO) 4 ) Magnesium sulfate (MgSO) 4 ) Cobalt sulfate (CoSO) 4 ) Sulfuric acid graft (Ga) 2 (SO 4 ) 3 ) Titanium sulfate (Ti (SO) 4 ) 2 ) Or nickel sulfate (NiSO) 4 ) Isosulfate, calcium chloride (CaCl) 2 ) Magnesium chloride (MgCl) 2 ) Strontium chloride (SrCl) 2 ) Yttrium chloride (YCl) 3 ) Copper chloride (CuCl) 2 ) Cesium fluoride (CsF), tantalum fluoride (TaF) 5 ) Niobium fluoride (NbF) 5 ) Lithium fluoride (LiBr), calcium bromide (CaBr) 2 ) Cesium bromide (CeBr) 3 ) Selenium bromide (SeBr) 4 ) Vanadium bromide (VBr) 3 ) Magnesium bromide (MgBr) 2 ) Barium iodide (BaI) 2 ) Or magnesium iodide (MgI) 2 ) Equimetal halide and barium perchlorate (Ba (ClO) 4 ) 2 ) Or magnesium perchlorate (Mg (ClO) 4 ) 2 ) And more than one of metal chlorate.
The moisture absorbent is preferably used with a purity of 95% or more, and if the purity is less than 95%, not only the moisture absorption function is reduced, but also the substance contained in the moisture absorbent may cause a defect in the adhesive film due to the effect of impurities, and may also affect the organic electronic device, but is not limited thereto.
On the other hand, the encapsulating resin layer 10 of the present invention may further contain one or more selected from a curing agent and an ultraviolet initiator.
The curing agent used in the present invention may be any commonly used curing agent, and for example, urethane acrylate curing agents having a weight average molecular weight of 100 to 1500 or acrylic curing agents having a weight average molecular weight of 100 to 1500 may be used. If the weight average molecular weight of the curing agent is less than 100, the adhesion of the panel and the adhesion to the substrate are reduced due to the increase in hardness, and the problem of Outgas (Outgas) of the unreacted curing agent occurs, whereas if the weight average molecular weight is more than 1500, the problem of decrease in mechanical properties due to the increase in flexibility (Softness) occurs.
More specifically, the curing agent of the first encapsulating resin layer can achieve a curing density capable of exhibiting a degree of normal temperature adhesiveness by mixing a monofunctional acrylate curing agent or a difunctional acrylate curing agent, while in the case of the second encapsulating resin layer, there is no relation even if the crosslinking density is high, and therefore only a difunctional acrylate curing agent may be used.
For example, the difunctional acrylate curing agent may be a compound represented by chemical formula 2.
Chemical formula 2
In the above chemical formula 2, A 1 A is a 2 Respectively and independently-CH 2 -、-CH 2 CH 2 -、-CH 2 CH 2 CH 2 -、-CH 2 CH 2 CH 2 CH 2 -or-CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -。
The monofunctional acrylate curing agent may contain one or more compounds selected from the group consisting of tetrahydrofurfuryl acrylate, caprolactone acrylate, dodecyl acrylate, isodecyl acrylate, trimethylcyclohexyl acrylate, isobornyl acrylate, ethyl 2- (2-ethoxyethoxy) acrylate, 5-ethyl-1, 3-dioxane-5-yl) methyl acrylate, 2- (o-phenylphenoxy) ethyl acrylate, benzyl methacrylate, and diphenyl methyl acrylate.
The ultraviolet initiator may include, without limitation, an ultraviolet initiator commonly used in the art to which the present invention pertains, and as a preferred example, may include one or more selected from monoacylphosphine (Mono Acyl Phosphine), bisacylphosphine (Bis Acyl Phosphine), α -Hydroxyketone (α -Hydroxyketone), α -Aminoketone (α -amino ketone), phenyloxyacetic acid (Phenylglyoxylate), and benzyl dimethyl ketal (benzyl dimethyl-ketone).
On the other hand, the encapsulating resin layer 10 of the present invention may include a first encapsulating resin layer 11 and a second encapsulating resin layer 12 formed on one side of the first encapsulating resin layer 11. In this case, since the first encapsulating resin layer 11 is a layer directly attached to the organic electronic device and the substrate, it is important that the first encapsulating resin layer 11 has adhesion at normal temperature and normal temperature adhesion.
The encapsulating material for an organic electronic device of the present invention may further include a release layer 30 formed on the other surface of the first encapsulating resin layer 11.
In order to impart rigidity (stiffness) to the encapsulating material for an organic electronic device of the present invention, the metal layer 20 may be formed on one surface of the second encapsulating resin layer 12 as needed.
First, the first encapsulating resin layer 11 may be formed by including an encapsulating resin, an adhesion promoter, and a moisture absorbent 40″ as a layer directly contacting an organic electronic device (not shown).
The encapsulating resin contained in the first encapsulating resin layer 11 may contain the same substance as the aforementioned encapsulating resin, the tackifier contained in the first encapsulating resin layer 11 may contain the same substance as the aforementioned tackifier, and the moisture absorbent 40″ contained in the first encapsulating resin layer 11 may contain the same substance as the aforementioned moisture absorbent, preferably, may contain silicon dioxide (SiO 2 ) This can provide excellent moisture removal performance, prevent separation of the organic electronic device from the packaging material, and significantly increase the durability of the organic electronic device. The shape and particle diameter of the moisture absorbent 40″ included in the first encapsulating resin layer 11 are not limited, and preferably the shape may be amorphous (amorphus) or spherical, and the average particle diameter may be 0.01 μm to 10 μm, preferably 0.1 μm to 5 μm, more preferably 0.2 μm to 1 μm, and if the average particle diameter is smaller than 0.01 μm, problems of lowering the reliability and the adhesion due to lowering the dispersion force may occur, and if it is larger than 10 μm, problems of generating black spots (Dark spots) in the light emitting layer due to damage (damage) due to protruding particles may occur in the bonding step.
Further, the moisture absorbent 40 "may be not included in the first encapsulating resin layer 11 directly contacting the organic electronic device according to circumstances.
On the other hand, the first encapsulating resin layer 11 of the present invention may contain 70 to 176 parts by weight of the tackifier with respect to 100 parts by weight of the encapsulating resin, and if it is less than 70 parts by weight, the moisture resistance may be poor, and if it is more than 176 parts by weight, the durability and moisture resistance may be lowered due to the lowering of elasticity (Brittle).
Further, the first encapsulating resin layer 11 of the present invention may contain 6.0 to 11.2 parts by weight of the moisture absorbent 40% with respect to 100 parts by weight of the encapsulating resin. If the amount is less than 6.0 parts by weight, the desired effect of removing moisture in the first encapsulating resin layer 11 cannot be achieved, and thus, there is a problem that durability of the organic electronic device is lowered, and if it exceeds 11.2 parts by weight, there is a problem that adhesion to the organic electronic device is poor due to insufficient wettability, such as adhesion to the organic electronic device, peel strength, and the like, and reliability of the organic electronic device is lowered.
Further, the first sealing resin layer 11 of the present invention may contain one or more selected from a curing agent and an ultraviolet initiator, and preferably may also contain a curing agent and an ultraviolet initiator, in addition to the sealing resin, the thickener, and the moisture absorbent 40″.
The curing agent contained in the first encapsulating resin layer 11 may contain the same substance as the aforementioned curing agent, and preferably may contain one or more selected from the group consisting of a difunctional acrylate curing agent and a monofunctional acrylate curing agent, and more preferably may contain a difunctional acrylate curing agent and a monofunctional acrylate curing agent, whereby sufficient curing density can be ensured, and thus, there is an advantage that moisture resistance and heat resistance are excellent. Further, the adhesive composition has an advantage that it can be subjected to a room-temperature bonding process because of its excellent room-temperature wettability and adhesive strength.
The curing agent contained in the first encapsulating resin layer 11 may contain the difunctional acrylate curing agent and the monofunctional acrylate curing agent in a weight ratio of 1:5.25 to 1:9.75, preferably the weight ratio may be 1:6 to 1:9, more preferably the weight ratio may be 1:6.75 to 1:8.25, and even more preferably the weight ratio may be 1:7.12 to 1:7.88, and if the weight ratio of the difunctional acrylate curing agent to the monofunctional acrylate curing agent does not reach 1:5.25, the problem of lowering the reliability due to the decrease of the normal temperature adhesive force may occur, and if the weight ratio exceeds 1:9.75, the problem of the steam discharge and poor heat resistance of the encapsulating material may occur.
Further, the first encapsulating resin layer 11 of the present invention may contain 28 to 52 parts by weight of a curing agent with respect to 100 parts by weight of the encapsulating resin. If the amount is less than 28 parts by weight, the desired gelation ratio (modulus) and modulus (modulus) cannot be achieved, and if it exceeds 52 parts by weight, the adhesion of the panel will be poor and the wettability will be lowered due to the excessively high modulus and hardness, resulting in a problem of lowered adhesion.
The ultraviolet initiator contained in the first encapsulating resin layer 11 may contain the same substances as the aforementioned ultraviolet initiators.
Further, the first encapsulating resin layer 11 of the present invention may contain 1.64 to 3.06 parts by weight of an ultraviolet initiator with respect to 100 parts by weight of the encapsulating resin. If the amount is less than 1.64 parts by weight, the heat resistance is poor due to poor ultraviolet curing, and if it exceeds 3.06 parts by weight, the heat resistance is poor due to reduced curing density.
Next, the second encapsulating resin layer 12 may include an encapsulating resin, an adhesion promoter, and a moisture absorbent 40' as a layer in direct contact with the metal layer 20.
The encapsulation resin contained in the second encapsulation resin layer 12 may contain the same substances as the aforementioned encapsulation resin, the tackifier contained in the second encapsulation resin layer 12 may contain the same substances as the aforementioned tackifier, and the moisture absorbent 40' contained in the second encapsulation resin layer 12 may contain the same substances as the aforementioned moisture absorbent, preferably, calcium oxide (CaO), whereby there may be an advantage that moisture absorption can be stabilized by a chemical reaction that is not physical moisture absorption. The shape and particle diameter of the moisture absorbent 40' included in the second encapsulating resin layer 12 are not limited, and the shape may be preferably amorphous or spherical, and the average particle diameter may be 0.1 μm to 20 μm, preferably 0.5 μm to 10 μm, more preferably 1.5 μm to 4 μm, and if the average particle diameter is smaller than 0.1 μm, problems of lowering the reliability and the adhesive force due to lowering the dispersion force may occur, and if it is larger than 20 μm, problems of generating black spots due to damage caused by protruding particles may occur in the bonding step.
On the other hand, the second encapsulating resin layer 12 of the present invention may contain 57 to 107 parts by weight of the tackifier, preferably 65 to 99 parts by weight of the tackifier, more preferably 77 to 86 parts by weight of the tackifier, with respect to 100 parts by weight of the encapsulating resin, and if it is less than 57 parts by weight, the moisture resistance is poor, and if it is more than 107 parts by weight, the durability and moisture resistance are reduced due to the reduction in elasticity.
Further, the second encapsulating resin layer 12 of the present invention may contain 110 to 205 parts by weight of the moisture absorbent 40', preferably 126 to 190 parts by weight of the moisture absorbent 40', more preferably 141 to 174 parts by weight of the moisture absorbent 40', and even more preferably 149 to 166 parts by weight of the moisture absorbent 40', if less than 110 parts by weight, the desired moisture removal effect in the second encapsulating resin layer 12 may not be achieved, and thus the durability of the organic electronic device may be deteriorated, and if more than 205 parts by weight, the adhesive property (adhesive force) may be significantly deteriorated, and the first encapsulating resin layer 11 and the second encapsulating resin layer 12 and/or the encapsulating resin layer 10 including the second encapsulating resin layer 12 and the first encapsulating resin layer 11 may be raised from the organic electronic device and allow moisture to rapidly permeate therebetween due to excessive volume expansion upon absorbing the moisture, thereby shortening the life span of the organic electronic device.
Further, the second encapsulating resin layer 12 of the present invention may contain one or more selected from a curing agent and an ultraviolet initiator, and preferably may also contain a curing agent and an ultraviolet initiator, in addition to the encapsulating resin, the tackifier, and the moisture absorbent 40'.
The curing agent contained in the second encapsulating resin layer 12 may contain the same substance as the aforementioned curing agent, preferably may contain the above-mentioned difunctional acrylate curing agent, and more preferably may contain the compound represented by the above chemical formula 2.
Further, the second encapsulating resin layer 12 of the present invention may contain 6.36 to 11.82 parts by weight of a curing agent, preferably 7.27 to 11.0 parts by weight of a curing agent, more preferably 8.18 to 10.0 parts by weight of a curing agent, and even more preferably 8.63 to 9.55 parts by weight of a curing agent, and if it is less than 6.36 parts by weight, the desired gelation rate and modulus are not achieved, and if it is more than 11.82 parts by weight, the problem of lowering of the elastic force occurs, and if it is more than 11.82 parts by weight, the problem of lowering of the adhesive force due to poor adhesion of a panel and lowering of wettability due to excessively high modulus and hardness occurs.
The ultraviolet initiator contained in the second encapsulating resin layer 12 may contain the same substances as the aforementioned ultraviolet initiators.
Further, the second encapsulating resin layer 12 of the present invention may contain 1.27 to 2.37 parts by weight of an ultraviolet initiator with respect to 100 parts by weight of the encapsulating resin. If the amount is less than 1.27 parts by weight, the heat resistance is poor due to poor ultraviolet curing, and if it is more than 2.37 parts by weight, the heat resistance is poor due to reduced curing density.
On the other hand, the thickness ratio of the first encapsulating resin layer 11 and the second encapsulating resin layer 12 may be 1:2.8 to 1:5.2, preferably, the thickness ratio may be 1:3.2 to 1:4.8, more preferably, the thickness ratio may be 1:3.6 to 1:4.4, and still more preferably, the thickness ratio may be 1:3.8 to 1:4.2. If the thickness ratio between the first encapsulating resin layer 11 and the second encapsulating resin layer 12 is less than 1:2.8, a problem of poor reliability due to moisture occurs, and if it exceeds 1:5.2, the light curing efficiency decreases due to an increase in thickness, and there is a problem of a decrease in heat resistance and reliability due to a decrease in curing density.
The thickness of the first encapsulating resin layer 11 of the present invention may be 1 to 30 μm, preferably 7 to 13 μm, more preferably 8 to 12 μm, still more preferably 9 to 11 μm, and the thickness of the second encapsulating resin layer 12 of the present invention may be 15 to 70 μm, preferably 28 to 52 μm, more preferably 32 to 48 μm, still more preferably 36 to 44 μm.
The first sealing resin layer 11 and the second sealing resin layer 12 may be a dry sealing resin layer or a cured sealing resin layer.
The metal layer 20 of the present invention may contain one or more selected from iron (Fe), bismuth (Bi), tin (Sn), indium (In), silver (Ag), copper (Cu), zinc (Zn), antimony (Sb), nickel (Ni), chromium (Cr), and alloys thereof.
As a preferred example, the metal layer 20 may comprise a metal sheet made of stainless steel, and the metal sheet may comprise bismuth (Bi), tin (Sn), indium (In), silver (Ag), copper (Cu), zinc (Zn), antimony (Sb), nickel (Ni), chromium (Cr), etc., and more preferably, may comprise a metal sheet containing 34 to 38 weight percent of nickel and the balance of iron (unavoidable impurities except nickel and iron).
The thickness of the metal layer 20 may be 60 μm to 150 μm, preferably 70 μm to 120 μm, more preferably 75 μm to 105 μm.
The release layer 30 of the present invention may be a release sheet (liner sheet) material commonly used in the art, and may include one or more selected from polyethylene terephthalate (PET, polyethylene terephthalate), paper (Paper), polyimide (PI, poly Imide) and polyester (PE, poly Ester) as a preferred example.
The thickness of the release layer 30 may be 15 μm to 75 μm, preferably 25 μm to 60 μm, more preferably 35 μm to 55 μm.
Further, as described with reference to fig. 2, the organic electronic device of the present invention may include: a substrate 1; an organic electronic device 2 formed on at least one surface of the substrate 1; and the sealing material 10 for an organic electronic device, which can be bonded at normal temperature, is used for sealing the organic electronic device 2. As shown in fig. 2, the first encapsulation resin layer 11 of the encapsulation material 10 is a portion attached to the organic electronic device, and more specifically, the first encapsulation resin layer 11 is attached to the substrate 1 of the organic electronic device.
Preferably, the substrate 1 may be any of a glass substrate, a crystal substrate, a sapphire substrate, a plastic substrate, and a flexible polymer film that can be bent, and more preferably, a glass substrate may be used.
The organic electronic device 2 formed on at least one surface of the substrate 1 may be formed by: a thin film type lower electrode is formed on the substrate 1, and then an n-type semiconductor layer, an active layer, a p-type semiconductor layer, and an upper electrode are sequentially stacked thereon and then etched, or a separate substrate is manufactured and then disposed on the substrate 1. The specific method for forming the organic electronic device 2 on the substrate 1 may be based on a method known and used in the art to which the present invention pertains, and the organic electronic device 2 may be an organic light emitting diode without particular limitation in the present invention.
Next, the organic electronic device 2 is packaged with the packaging material 10 for an organic electronic device capable of being bonded at normal temperature according to the present invention, and the specific method of the above packaging may be based on a known conventional method, and is not particularly limited in the present invention. As a non-limiting example related thereto, in terms of the organic electronic device 2 formed on the substrate 1, the first encapsulating resin layer 11 of the encapsulating material 10 for an organic electronic device is brought into direct contact with the organic electronic device 2, and in this state, heat and/or pressure are applied using a vacuum laminator or the like. In the case of the encapsulating material containing the photo-curable encapsulating resin, the heat may be applied for curing the encapsulating material 10 for an organic electronic device, and the curing process may be performed through (chamber) movement to the chamber where the light is irradiated.
The present invention is illustrated by the following examples. In this case, the following examples are merely illustrative of the present invention, and the scope of the claimed invention is not limited to the following examples.
Preparation example
Example 1
(1) Preparing a first encapsulating resin layer
The mixture was prepared by mixing 82 parts by weight of a tackifier, 31 parts by weight of a curing agent, 2 parts by weight of an ultraviolet initiator, and 7 parts by weight of a moisture absorbent with respect to 100 parts by weight of an encapsulating resin.
In this case, a compound represented by the following chemical formula 1-1 was used as an encapsulating resin, SU-525 (kolon laminates) was used as a tackifier, a compound represented by the following chemical formula 2-1 and tetrahydrofurfuryl acrylate (M150, miwon) as a compound represented by the following chemical formula 3-1 were used as a curing agent, a photoinitiator (irgacure) TPO (Ciba) was used as an ultraviolet initiator, and silica having an average particle diameter of 0.5 μm was used as a moisture absorbent in a weight ratio of 1:7.5.
The viscosity of the prepared mixture was adjusted to 600cps at a temperature of 20 c, and after removing impurities through a capsule filter, it was applied to a middle-peeling anti-static polyethylene terephthalate (PET) release film (REL 382, toray company) having a thickness of 38 μm using a slit coater, and then dried at a temperature of 160 c to remove the solvent, to finally prepare a first encapsulation resin layer having a thickness of 10 μm.
Chemical formula 1-1
In the above chemical formula 1-1, R is as follows 1 The term "n" is a rational number for the weight average molecular weight of the compound represented by chemical formula 1-1 to satisfy 400000.
Chemical formula 2-1
Chemical formula 3-1
In the above chemical formula 3-1, A 3 is-CH 2 -。
(2) Preparing a second encapsulation resin layer
The mixture was prepared by mixing 82 parts by weight of a tackifier, 9 parts by weight of a curing agent, 2 parts by weight of an ultraviolet initiator, and 158 parts by weight of a moisture absorbent with respect to 100 parts by weight of an encapsulating resin.
In this case, the compound represented by the following chemical formula 1-1 was used as an encapsulating resin, SU-525 (kolon laminates) was used as a tackifier, the compound represented by the following chemical formula 2-1 was used as a curing agent, a photo initiator TPO (Ciba) was used as an ultraviolet initiator, and calcium oxide having an average particle diameter of 3 μm was used as a moisture absorbent.
The viscosity of the prepared mixture was adjusted to 600cps at a temperature of 20 c, and after removing impurities through a capsule filter, it was applied to a middle-peel antistatic polyethylene terephthalate release film (TG 65R, SKC company) having a thickness of 36 μm using a slit coater, and then dried at a temperature of 160 c to remove the solvent, and finally a second encapsulation resin layer having a thickness of 40 μm was prepared.
Chemical formula 1-1
In the above chemical formula 1-1, R is as follows 1 The term "n" is a rational number for the weight average molecular weight of the compound represented by chemical formula 1-1 to satisfy 400000.
Chemical formula 2-1
(3) Preparation of encapsulation materials
The second encapsulating resin layer was laminated to the prepared first encapsulating resin layer in an opposite manner, and passed through a laminating roller at a temperature of 70 c to prepare an encapsulating material of example 1.
Examples 2 to 12
In the first encapsulating resin layer, an encapsulating material was prepared in the same manner as in example 1 described above except that the following monofunctional acrylate curing agent was used instead of tetrahydrofurfuryl acrylate (M150, miwon corporation) as a monofunctional acrylate curing agent mixed with the compound represented by chemical formula 2-1 as a difunctional acrylate curing agent, respectively, to prepare an encapsulating material of examples 2 to 12.
Example 2: caprolactone acrylate (M100, miwon Co.)
Example 3: dodecyl acrylate (M122, miwon company)
Example 4: isodecyl acrylate (M130, miwon Co.)
Example 5: trimethylcyclohexyl acrylate (M1130, miwon Co.)
Example 6: isobornyl acrylate (M1140, miwon Co.)
Example 7:2- (2-ethoxyethoxy) acrylic acid ethyl ester (M170, miwon Co.)
Example 8: methyl acrylate (5-ethyl-1, 3-dioxan-5-yl) (M1110, miwon Co.)
Example 9:2- (o-phenylphenoxy) ethyl acrylate (M1142, miwon Co.)
Example 10: benzyl acrylate (M1182, miwon Co.)
Example 11: benzyl methacrylate (M1183, miwon Co.)
Example 12: biphenyl methyl acrylate (M1192, miwon company)
Comparative example 1
(1) Preparing a first encapsulating resin layer
For 100 parts by weight of the encapsulating resin, 43 parts by weight of a random copolymer (ethylene propylene diene monomer (EPDM)) derived from a diene compound tool, 265 parts by weight of a tackifier, 8 parts by weight of a curing agent, 4 parts by weight of an ultraviolet initiator, and 35 parts by weight of a moisture absorbent were mixed to prepare a mixture.
In this case, the compound represented by the above chemical formula 1-1 was used as an encapsulating resin, and SU-90 (kolon laminates) was used as a tackifier. The compound represented by the above chemical formula 2-1 was used as a curing agent, a photo initiator TPO (Ciba Co.) was used as an ultraviolet initiator, and silica having an average particle diameter of 0.5 μm was used as a moisture absorbent.
The prepared mixture was prepared into a first encapsulation resin layer in the same manner as in example 1.
(2) Preparing a second encapsulation resin layer
For 100 parts by weight of the encapsulating resin, 43 parts by weight of a random copolymer (ethylene propylene diene monomer) copolymerized with a diene compound, 333 parts by weight of a tackifier, 24 parts by weight of a curing agent, 5 parts by weight of an ultraviolet initiator, and 505 parts by weight of a moisture absorbent were mixed to prepare a mixture.
In this case, the compound represented by the above chemical formula 1-1 was used as an encapsulating resin, and SU-90 (kolon laminates) was used as a tackifier. The compound represented by the above chemical formula 2-1 was used as a curing agent, a photo initiator TPO (Ciba Co.) was used as an ultraviolet initiator, and calcium oxide having an average particle diameter of 3 μm was used as a moisture absorbent.
The prepared mixture was prepared into a second encapsulation resin layer in the same manner as in example 1.
Comparative example 2
(1) Preparing a first encapsulating resin layer
A mixture was prepared by mixing 233 parts by weight of a tackifier, 50 parts by weight of a curing agent, and 7 parts by weight of an ultraviolet initiator with respect to 100 parts by weight of a random copolymer copolymerized with a diene compound.
In this case, SU-640 (kolon chemicals) was used as a tackifier, the compound represented by the above chemical formula 2-1 was used as a curing agent, and a photo initiator TPO (Ciba) was used as an ultraviolet initiator.
(2) Preparing a second encapsulation resin layer
An encapsulating material was prepared in the same manner as in comparative example 1.
Experimental example 1
The following physical properties were measured for the encapsulating materials prepared in the examples and comparative examples, and the results are shown in tables 1 to 4 below.
1-1 evaluation of moisture penetration of the encapsulation Material
The sealing materials prepared in examples and comparative examples were cut to a size of 95mm×95mm, and after the release film was removed from the alkali-free glass of 100mm×100mm, the test piece was placed on the alkali-free glass so as to be spaced inward by 2.5mm from the edge portions of the four sides of the alkali-free glass, and then attached by a roll press heated to 65 ℃. After removing the remaining release film on the attached test piece, another 100mm×100mm alkali-free glass was covered and laminated at 25 ℃ (normal temperature) for 1 minute using a vacuum laminator to produce a sample attached in a bubble-free manner. The attached samples were subjected to observation of the moisture permeation length by a microscope in units of 1000 hours in a reliability chamber set at a temperature of 85 ℃ and a relative humidity of 85%.
1-2 evaluation of the volume expansion of the encapsulation Material
After removing the release film of the encapsulation material prepared according to examples and comparative examples, it was attached to a stainless steel (SUS) plate cut to a thickness of 50 μm in a size of 30mm×20mm using a roll laminator heated to 65 ℃. After the attached test piece was cut into a size matching that of stainless steel (SUS, stainless Use Steel) using a blade, it was attached to 0.5T alkali-free glass of 40mm×30mm using a roll laminator heated to 65 ℃. After confirming that the test piece was adhered between glass and stainless steel without voids (Void), the test piece was observed at intervals of 100 hours in a reliability chamber set at a temperature of 85 ℃ and a relative humidity of 85% for 1000 hours, and the change in the height of the test piece based on stainless steel was observed at the site of moisture absorption by an optical microscope.
As a result, it was observed that the change in height at the moisture absorption site was represented by +.f. when the change in height at the moisture absorption site was less than 12 μm and less than 14 μm, by ∈circle when the change in height at the moisture absorption site was greater than or equal to 14 μm and less than 16 μm, by +.f. when the change in height at the moisture absorption site was 16 μm or more, by +.o. when the change in height at the moisture absorption site was greater than or equal to 14 μm.
1-3 evaluation of Heat resistance of the encapsulation Material
The encapsulation materials prepared according to examples and comparative examples were cut to a size of 50mm×80mm, and a second encapsulation resin layer from which a polyethylene terephthalate release film was removed was attached to a nickel (Ni) alloy of 0.08T having a size of 60mm×150mm using a roll laminator at a temperature of 80 ℃. The first encapsulating resin layer of the polyethylene terephthalate release film from which the residual test piece attached was removed was attached to 0.5T alkali-free glass of 30mm×70mm size using a roll laminator at a temperature of 25 ℃. After vertically fixing a test piece attached to glass in a chamber at 100 ℃, a 1kg damper was hung and whether or not there was a flow was grasped. In this case, the case where the evaluation result is not abnormal is indicated as "o", and the case where the flow is slightly observed is indicated as "x".
1-4 evaluation of glass adhesion
For the sealing materials prepared according to examples and comparative examples, an adhesive force test tape (7475, tesa corporation) was laminated on the sealing material by a 2kg hand roller, the sealing material was cut to a width of 25mm and a length of 120mm, the sealing material was laminated on an alkali-free glass under the sealing material at a temperature of 80 c, and the test piece was left at normal temperature for 30 minutes, and the adhesive force of the glass was tested at a speed of 300mm/min by a universal material tester (UTM).
1-5 evaluation of Metal adhesion
For the encapsulating materials prepared according to examples and comparative examples, a second encapsulating resin layer from which a polyethylene terephthalate release film was removed was laminated on a nickel (Ni) alloy sheet (metal layer) having a thickness of 80 μm at a temperature of 80 ℃, an adhesion force detecting tape (7475, tesa company) was laminated on the first encapsulating resin layer from which a polyethylene terephthalate release film was removed, after the encapsulating materials were cut into a width of 25mm and a length of 120mm, the prepared encapsulating materials were left at a temperature of 25 ℃ for 30 minutes, and adhesion force to the metal layer was detected at a speed of 300mm/min by a universal material tester.
Experimental example 2
Vapor deposition of stacked organic light emitting devices (hole transport layer NPD/thickness) on Indium Tin Oxide (ITO) textured substrates Light emitting layer Alq 3 Thickness->Electron injection layer LiF/thickness->Cathode Al+Liq/thickness->) After that, after the devices prepared by laminating the encapsulating materials of examples and comparative examples at normal temperature (25 ℃) were prepared, organic light emitting diode unit test pieces emitting green light were prepared. The following properties of the test pieces were evaluated, and the results are shown in tables 1 to 4.
2-1 evaluation of durability of organic light emitting device based on moisture permeation of encapsulation material
The time required for the Pixel shrinkage to occur by 50% or more and/or to the generation of black dots was measured by observing the Pixel shrinkage (Pixel shrink) and the generation and/or growth of black dots in various periods of time of the encapsulation materials prepared according to examples and comparative examples using a digital microscope of x 100 in units of 100 hours at a temperature of 85 ℃ under an environment of 85% relative humidity.
In this case, when the time required for the pixel shrinkage to occur 50% or more and the black spot generation is 1000 or more, it is expressed as × when the time required for the pixel shrinkage to occur 50% or more and the black spot generation is 800 hours or more and less than 1000 hours, it is expressed as × when the time required for the pixel shrinkage to occur 50% or more and the black spot generation is 600 hours or more and less than 800 hours, it is expressed as × when the time required for the pixel shrinkage to occur 50% or more and the black spot generation is less than 600 hours.
2-2 evaluation of durability of the encapsulation Material
The encapsulating materials prepared according to examples and comparative examples were observed for 1000 hours in 100 hours at a reliability chamber set at a temperature of 85 ℃ and a relative humidity of 85%, and whether there was physical damage was evaluated by observing interfacial separation between the organic electronic device and the encapsulating material, generation of cracks or bubbles in the encapsulating film, separation between the encapsulating layers, and the like by an optical microscope. If the evaluation result is not abnormal, it is indicated as "o", and if any abnormality such as interfacial separation, cracking, generation of bubbles in the sealing material, separation between the first sealing resin layer and the second sealing resin layer, etc. occurs, it is indicated as "x".
Experimental example 3
The encapsulation materials having a thickness of up to 50 μm prepared by the above examples and comparative examples were cut into a size of 40mm in the transverse direction and 90mm in the longitudinal direction, and a second encapsulation resin layer from which the polyethylene terephthalate release film was removed was attached to glass using a roll laminator at a temperature of 60 ℃. Then, using a contact angle measuring apparatus (Phoenix 150, c.e.o.), 4.9 μl to 6.3 μl of deionized water (Di water) was dropped onto the surface of the first encapsulating resin layer from which the encapsulating material of the polyethylene terephthalate release film was removed under the following measurement conditions, and the contact angle and wettability of the deionized water were measured according to ASTM D5946 within 5 seconds, and the measurement results are shown in tables 1 to 4 below.
Detection conditions
Temperature: 25+ -5 DEG C
Humidity: 50+ -10%
Experimental example 4
The second encapsulation resin layer of the polyethylene terephthalate-removed release film of the encapsulation material having a thickness of up to 50 μm prepared by the above examples and comparative examples was attached to glass using a roll laminator at a temperature of 60 ℃. The adhesion force (gf) of the first encapsulating resin layer of the polyethylene terephthalate release film was then measured using a Probe Tack Test (Probe Tack Test) apparatus (SurTA, chemilab company) under the following conditions, and the measurement results are shown in tables 1 to 4 below.
Detection conditions
Probe size (Probe Tip size): 12.7mm
Load speed (Load speed): 0.1mm/sec (hold applied Load (Load) value 50gf for 5 seconds (sec))
Retraction speed (Return speed): 0.5mm/sec
Experimental example 5
The encapsulating material having a thickness of up to 50 μm prepared by the above examples and comparative examples was punched into a circular shape having a diameter of up to 6 mm. The polyethylene terephthalate release film attached to the second encapsulating resin layer of the encapsulating material was removed, and attached to a metal sheet (metal layer) cut to a thickness of 40mm in the transverse direction and 150mm in the longitudinal direction to 0.08mm using a roll laminator at a temperature of 60 ℃.
The polyethylene terephthalate release film attached to the first encapsulating resin layer of the encapsulating material was removed, and attached to alkali-free glass (dimensions: 50mm in the transverse direction and 100mm in the longitudinal direction) using a roll laminator at a temperature of 25 ℃. Next, a universal materials tester (OTT-0006, oriental TM ) To pull up a metal foil (metal layer) after fixing the glass and to examine the shear strength under the following examination conditions, the examination results are shown in tables 1 to 4.
Detection conditions
Stripping mode: 180 DEG pel
Detection speed: 5mm/sec
Peel length: 50mm (10 sec)
Experimental example 6
6-1. Evaluation of Normal temperature adhesion
For the encapsulating materials prepared according to examples and comparative examples, a second encapsulating resin layer from which a polyethylene terephthalate release film was removed was laminated to a nickel (Ni) alloy sheet (metal layer) having a thickness of 0.08mm using a roll laminator at a temperature of 80 ℃. The attached test piece was cut into pieces 25mm wide and 150mm long, and then a first encapsulating resin layer from which a polyethylene terephthalate release film was removed was attached to alkali-free glass using a roll press at a temperature of 25 ℃, and then left to stand at a temperature of normal temperature (=25 ℃) for 30 minutes, and then the normal temperature adhesion was measured at a speed of 300mm/min by a universal material tester, and the measurement results are shown in tables 1 to 4. If the adhesive strength is evaluated to be excellent at normal temperature, the measured value of the adhesive strength should be 6000gf/25mm or more.
6-2. Evaluating the normal temperature adhesion
For the encapsulating materials prepared according to examples and comparative examples, a second encapsulating resin layer from which a polyethylene terephthalate release film was removed was laminated to a nickel (Ni) alloy sheet (metal layer) having a thickness of 0.08mm using a roll laminator at a temperature of 80 ℃. After cutting the attached test piece into a width of 95mm and a length of 95mm, the first encapsulating resin layer from which the polyethylene terephthalate release film was removed was attached to alkali-free glass using a roll laminator at a temperature of 25 ℃, and then whether or not bubble trapping occurred was evaluated by observation with an optical microscope, and the detection results are shown in tables 1 to 4. If the evaluation result is not abnormal, the result is indicated as "o" and if the bubble trap occurs, the result is indicated as "x".
TABLE 1
TABLE 2
TABLE 3 Table 3
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TABLE 4 Table 4
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Simple modifications and variations of the invention may be readily implemented by those skilled in the art, and all such modifications and variations are intended to be included within the scope of the invention.
Claims (10)
1. A packaging material for an organic electronic device, characterized in that,
an encapsulation resin layer including a first encapsulation resin layer and a second encapsulation resin layer formed on one surface of the first encapsulation resin layer,
the first and second encapsulating resin layers each independently comprise an encapsulating resin, a tackifier, a moisture absorbent and a curing agent,
Wherein the encapsulating resin is a polyolefin resin having a weight average molecular weight of 30000 ～ 1550000,
the first encapsulating resin layer contains 28 to 52 parts by weight of a curing agent and 6.0 to 11.2 parts by weight of a moisture absorbent per 100 parts by weight of an encapsulating resin,
the second encapsulating resin layer contains 6.36 to 11.82 parts by weight of a curing agent and 110 to 205 parts by weight of a moisture absorbent per 100 parts by weight of an encapsulating resin,
the curing agent of the first packaging resin layer comprises a difunctional acrylate curing agent and a monofunctional acrylate curing agent,
the curing agent of the second encapsulating resin layer comprises a difunctional acrylate curing agent,
the difunctional acrylate curing agent is a compound represented by the following chemical formula 2,
chemical formula 2:
in the above chemical formula 2, A 1 A is a 2 Respectively and independently-CH 2 -、-CH 2 CH 2 -、-CH 2 CH 2 CH 2 -、-CH 2 CH 2 CH 2 CH 2 -or-CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 -，
The monofunctional acrylate curing agent comprises at least one compound selected from the group consisting of tetrahydrofurfuryl acrylate, caprolactone acrylate, dodecyl acrylate, isodecyl acrylate, trimethylcyclohexyl acrylate, isobornyl acrylate, ethyl 2- (2-ethoxyethoxy) acrylate, 5-ethyl-1, 3-dioxane-5-yl) methyl acrylate, 2- (o-phenylphenoxy) ethyl acrylate, benzyl methacrylate and diphenyl methyl acrylate,
The curing agent of the first encapsulating resin layer comprises the difunctional acrylate curing agent and the monofunctional acrylate curing agent in a weight ratio of 1:5.25-1:9.75,
the encapsulating resin layer satisfies the following relationship 1,
relation 1:
65≤A－B≤125，
in the above-mentioned relation 1, a represents the deionized water contact angle of the cured encapsulating resin layer in units of ° and B represents the wettability of the cured encapsulating resin layer in units of mN/m.
2. The encapsulating material for an organic electronic device according to claim 1, wherein a is 80 ° to 110 °, and B is-10 mN/m to 15mN/m.
3. The encapsulating material for an organic electronic device according to claim 1, wherein the encapsulating resin layer satisfies the following conditions (1) and (2),
condition (1): i is more than or equal to 100 and less than or equal to 300
Condition (2): 500 is less than or equal to J
In the above condition (1), I is the adhesion of the cured encapsulating resin layer measured according to the probe tack test of ASTM D2979 in gf,
in the above condition (2), J is the shear strength of the cured encapsulating resin layer measured by a universal material tester in gf/6mm.
4. The encapsulating material for an organic electronic device according to claim 1, wherein,
The first encapsulating resin layer contains 70 to 176 parts by weight of a tackifier with respect to 100 parts by weight of an encapsulating resin,
the second sealing resin layer contains 57 to 107 parts by weight of a tackifier with respect to 100 parts by weight of a sealing resin.
5. The encapsulating material for an organic electronic device according to claim 1, wherein the encapsulating resin contains a compound represented by the following chemical formula 1,
chemical formula 1:
in the above chemical formula 1, R 1 Is hydrogen atom, C 3 ～C 10 Straight-chain alkenyl or C 4 ～C 10 N is a rational number for the encapsulating resin to satisfy a weight average molecular weight of 30000 ～ 1550000.
6. The encapsulating material for an organic electronic device according to claim 4, wherein the first encapsulating resin layer and the second encapsulating resin layer each independently contain an ultraviolet initiator.
7. The encapsulating material for an organic electronic device according to claim 6, wherein,
the first encapsulating resin layer contains 1.64 to 3.06 parts by weight of an ultraviolet initiator with respect to 100 parts by weight of the encapsulating resin,
the second encapsulating resin layer contains 1.27 to 2.37 parts by weight of an ultraviolet initiator with respect to 100 parts by weight of the encapsulating resin.
8. The encapsulating material for an organic electronic device according to claim 4, wherein the first encapsulating resin layer and the second encapsulating resin layer have a thickness ratio of 1:2.8 to 1:5.2.
9. The encapsulating material for an organic electronic device according to claim 8, wherein,
the first encapsulating resin layer is formed to a thickness of 1 μm to 30 μm,
the second encapsulating resin layer is formed to a thickness of 15-70 μm.
10. An organic electronic device, comprising:
a substrate;
an organic electronic device formed on at least one surface of the substrate; and
the encapsulating material for an organic electronic device according to any one of claims 1 to 9, for encapsulating the above-mentioned organic electronic device.
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