CN114670347A - Processing method for silicon disc and silicon disc processing equipment - Google Patents
Processing method for silicon disc and silicon disc processing equipment Download PDFInfo
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- CN114670347A CN114670347A CN202210333827.9A CN202210333827A CN114670347A CN 114670347 A CN114670347 A CN 114670347A CN 202210333827 A CN202210333827 A CN 202210333827A CN 114670347 A CN114670347 A CN 114670347A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 257
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 257
- 239000010703 silicon Substances 0.000 title claims abstract description 257
- 238000012545 processing Methods 0.000 title claims abstract description 92
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- 238000000034 method Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
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- 239000004065 semiconductor Substances 0.000 description 5
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- 229910001220 stainless steel Inorganic materials 0.000 description 3
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- 235000012431 wafers Nutrition 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
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- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
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- 239000004020 conductor Substances 0.000 description 1
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- 239000002889 diamagnetic material Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
The invention relates to a processing method for a silicon disc and a silicon disc processing device. The processing method for the silicon disc comprises the following steps: fixing the silicon disc on a magnetic type working table surface by means of magnetic attraction; processing a first surface of the silicon disc, which is far away from the magnetic type working table surface, so that the processed first surface meets a first preset requirement; moving the silicon disc to a vacuum type worktable surface to enable the processed first surface to face the vacuum type worktable surface, and fixing the silicon disc on the vacuum type worktable surface by means of vacuum suction force; and processing a second surface of the silicon disc opposite to the first surface, so that the processed second surface meets a second preset requirement. According to the processing method, the magnetic type working table is adopted when the first surface of the silicon disc is processed, and the vacuum type working table is adopted when the second surface is processed, so that the effectiveness of fixing the silicon disc can be ensured, the processing precision is improved, and the processing efficiency is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a processing method and a processing device for a silicon disc.
Background
Integrated circuits (i.e., Integrated circuits) are the basis of modern information technology, which is a functional-specific Circuit that integrates a certain number of electronic components (e.g., resistors, capacitors, transistors, etc.) together through semiconductor fabrication processes (e.g., thin film fabrication, imprinting, etching, doping, etc.). The main raw materials of integrated circuits are semiconductors such as silicon, germanium, gallium arsenide, etc., wherein silicon has many advantages such as stable property, easy purification, huge reserves, etc., so that silicon has become the semiconductor material with the largest production scale and the most perfect production process.
Silicon disks (i.e., Silicon plates, also known as "Silicon wafers" or "wafers") are thin slices of high-purity single crystal Silicon that are important carriers for the fabrication of integrated circuits. With the rapid development of semiconductor manufacturing processes, the width of a scribe line of a silicon disc is required to be thinner and thinner, and the quality requirement on the surface layer of the silicon disc is also higher and higher.
At present, the processing of the silicon disc mainly comprises the working procedures of slicing, grinding, etching, polishing and the like. When the silicon disc is ground and polished, the silicon disc needs to be fixed on the working table of a machine tool and then correspondingly processed. The table of the machine tool can be roughly classified into various types such as a mechanical type, a magnetic type, and a vacuum type according to the fixing method. Wherein the mechanical workbench fixes the silicon disc by means of mechanical clamping; the magnetic force type workbench absorbs the magnetic force limiting piece on the workbench surface under the action of magnetic attraction force and then realizes radial fixation on the silicon disc by utilizing the magnetic force limiting piece; the vacuum type worktable adsorbs the silicon disc on the worktable surface by means of vacuum negative pressure, thereby realizing axial fixation.
In practice, the mechanical workbench is adopted, the clamping degree of the clamping block needs to be accurately adjusted, effective clamping of the silicon disc can be realized, the operation is very inconvenient, and the problems of edge breakage and the like are easily caused if the clamping force is too large. The magnetic type workbench and the vacuum workbench are convenient to operate and are more and more widely applied. However, the magnetic type worktable has small axial action, and the vacuum type worktable has small radial action, so that the effective fixation of the silicon disc cannot be ensured, and the requirement on the precision processing of the silicon disc is difficult to meet.
Therefore, there is a need in the art for a new solution to the above problems.
Disclosure of Invention
The invention provides a processing method for a silicon disc, which aims to solve the technical problem that a workbench in the prior art is difficult to realize precision processing of the silicon disc. The processing method comprises the following steps:
fixing the silicon disc on a magnetic type working table surface by means of magnetic attraction;
processing a first surface of the silicon disc, which is far away from the magnetic type working table surface, so that the processed first surface meets a first preset requirement;
moving the silicon disc to a vacuum type worktable surface to enable the processed first surface to face the vacuum type worktable surface, and fixing the silicon disc on the vacuum type worktable surface by means of vacuum suction force;
and processing a second surface of the silicon disc opposite to the first surface, so that the processed second surface meets a second preset requirement.
In the processing method for the silicon disc, firstly, the silicon disc is fixed on a magnetic type working table surface by means of magnetic attraction. And then, processing the first surface of the silicon disc, which is far away from the magnetic type working table surface, so that the processed first surface meets a first preset requirement. Because the surface of the silicon disc to be processed is not completely flat, if the unprocessed silicon disc is directly placed on the vacuum type working table surface, the uneven surface of the silicon disc can not completely seal the vent holes on the vacuum type working table surface, so that the vacuum adsorption effect is greatly reduced, and the radial displacement is easily generated in the process of processing the silicon disc to influence the processing precision. Therefore, when the first surface of the silicon disc is processed, the silicon disc is fixed on the magnetic type worktable surface instead of the vacuum type worktable surface, so that the silicon disc can be firmly (particularly in the radial direction) fixed on the magnetic type worktable surface by means of the magnetic attraction force to meet the processing requirement. And after the first surface of the silicon disc is processed, moving the silicon disc to the vacuum type worktable surface, and enabling the processed first surface to face the vacuum type worktable surface. The flatness of the first surface after processing (such as grinding, polishing and the like) is greatly improved, and the first surface is abutted against the vacuum type worktable surface to completely seal the vent hole so as to ensure the vacuum adsorption effect. Therefore, the silicon disc can be firmly and stably fixed on the vacuum type worktable surface when the second surface is processed, so as to meet the processing precision requirement. Furthermore, the silicon disc with the processed first surface is fixed on a vacuum type working table top (instead of a magnetic type working table top) to process the second surface, so that the axial displacement of the silicon disc caused by the over-small axial action of the magnetic type working table top can be prevented, and the processing precision and the product percent of pass are ensured. In addition, compared with a mechanical workbench, no matter the magnetic workbench or the vacuum workbench is adopted, the operation is very convenient in the process of clamping the silicon disc, and therefore, the processing efficiency can be obviously improved.
In a preferred embodiment of the above processing method for a silicon disk, the step of "fixing the silicon disk on the magnetic table by means of magnetic attraction" includes:
placing the silicon disc on the magnetic-type workbench surface so that the second surface faces the magnetic-type workbench surface;
arranging a plurality of magnetic force limiting pieces on the magnetic type working table surface at intervals along the periphery of the silicon disc, and enabling each magnetic force limiting piece to abut against the peripheral edge of the silicon disc; and
and controlling the electromagnet under the magnetic type working table to be opened so as to apply pre-applied magnetic attraction force to the magnetic force limiting piece. Through the arrangement, the magnetic force limiting pieces can be firmly fixed on the magnetic type working table top by utilizing the action of the magnetic force, and then the silicon disc is constrained on the magnetic type working table top by utilizing the matching of the magnetic force limiting pieces.
In the above-mentioned preferred technical solution for the processing method of a silicon disc, each magnetic force limiting member has an arc-shaped body extending along the peripheral edge, and a flexible limiting strip extending toward the peripheral edge and capable of abutting on the peripheral edge is formed on an arc-shaped side wall of the arc-shaped body facing the peripheral edge. The parts leaning against the peripheral edge of the silicon disc are arranged into the flexible limiting strips, so that the silicon disc can be prevented from being scratched, the phenomena of edge breakage and the like are reduced, and the processing quality is improved.
In the above-described preferred embodiment of the processing method for a silicon disk, a groove extending along the outer peripheral edge is formed in the arc-shaped side wall, and the groove is configured to receive the flexible stopper. Through foretell setting, can make flexible spacing strip assemble the arc lateral wall on conveniently, be convenient for dismouting and change.
In the preferable technical scheme of the processing method for the silicon disc, the flexible limiting strip is processed by a silica gel material or a rubber material. Through foretell setting, can guarantee that flexible spacing has moderate hardness, can satisfy the needs of centre gripping silicon dish, also can prevent fish tail silicon dish.
In a preferred embodiment of the above processing method for a silicon disk, a plurality of magnetic isolation layers that are parallel to each other and are uniformly spaced are further disposed in the magnetic type working table. Through the arrangement, magnetic lines of force uniformly passing through the magnetic force type working table surface are restrained by the magnetism isolating layers and are concentrated in the space between the magnetism isolating layers, and then the magnetic attraction effect is enhanced.
In the above preferred technical solution of the processing method for a silicon disk, the step of "fixing the silicon disk on the vacuum table top by vacuum suction" includes:
controlling the vacuum equipment connected with the vacuum type working table to be started;
maintaining the vacuum apparatus operating at a predetermined air pressure. Through the arrangement, the silicon disc can be firmly and stably fixed on the vacuum type worktable surface through the vacuum adsorption effect.
In a preferred embodiment of the above processing method for a silicon disk, the predetermined pressure is in a range of-80 Kpa to-65 Kpa. Through the arrangement, the vacuum equipment can provide moderate preset air pressure to meet the process requirement.
The invention provides silicon disc processing equipment, aiming at solving the technical problem that a workbench in the prior art is difficult to realize silicon disc precision processing. The silicon disc processing equipment comprises: the magnetic force type workbench is provided with a magnetic force type workbench surface used for bearing and fixing the silicon disc by means of magnetic attraction, and the magnetic force type workbench surface is suitable for being abutted against the unprocessed second surface of the silicon disc. Due to the poor flatness of the unprocessed second surface of the silicon disc, the air holes on the vacuum type worktable surface cannot be completely sealed by the rugged silicon disc surface. Therefore, the magnetic type worktable is selected to be abutted against the second surface of the silicon disc, so that the problems can be avoided, the requirements of the processing technology are met, and the processing precision of the silicon disc is improved.
In a preferred embodiment of the above silicon disc processing apparatus, a plurality of electromagnets which are spaced from each other and can be switched on and off are provided in the magnetic type table, and the silicon disc processing apparatus further includes: the silicon disc clamping device comprises a plurality of magnetic force limiting pieces, wherein the magnetic force limiting pieces are configured to be arranged on the magnetic force type working table top at intervals along the outer circumferential direction of the silicon disc, each magnetic force limiting piece can abut against the outer circumferential edge of the silicon disc, and therefore the electromagnet is controlled to be started, and magnetic attraction can be applied to the magnetic force limiting pieces to clamp the silicon disc. Through foretell setting, can make magnetic force locating part firmly adsorb on magnetic force formula table surface with the help of the magnetic attraction effect of electro-magnet, utilize the cooperation of a plurality of magnetic force locating parts then firmly retrain the silicon dish on magnetic force formula table surface.
The invention provides silicon disc processing equipment, aiming at solving the technical problem that a workbench in the prior art is difficult to realize silicon disc precision processing. The silicon disc processing equipment comprises: the vacuum type worktable is provided with a vacuum type worktable surface which is used for bearing and fixing the silicon disc by means of vacuum suction force, and the vacuum type worktable surface is used for abutting against the processed first surface of the processed silicon disc. Through foretell setting for the air vent on the vacuum type table surface can be sealed completely to the smooth first surface after the processing, guarantees the vacuum adsorption effect, can avoid adopting magnetic force formula workstation to lead to the axial displacement of silicon dish simultaneously, promotes the machining precision.
In a preferred embodiment of the above silicon disk processing apparatus, a plurality of vent holes radially arranged outward from the center of the vacuum table are formed on the vacuum table, and the vent holes are configured to be closed when the silicon disk is placed on the vacuum table; a vacuum chamber that is in air communication with each of the vent holes is provided below the vacuum table, and the silicon disk processing apparatus further includes a vacuum apparatus configured to be connected to the vacuum chamber, and a negative pressure action is formed in the vacuum chamber to adsorb the silicon disk by controlling the vacuum apparatus to operate at a predetermined air pressure when the silicon disk is placed on the vacuum table. The plurality of vent holes radially distributed outwards from the center of the vacuum workbench surface are arranged, so that the uniformity of the vacuum adsorption effect can be improved. In addition, the vacuum equipment is controlled to operate at preset air pressure, so that the vacuum adsorption of the silicon disc can be conveniently realized, and the operation is convenient.
Scheme 1:
1. a method of processing a silicon disk, the method comprising:
fixing the silicon disc on a magnetic type working table surface by means of magnetic attraction;
processing a first surface of the silicon disc, which is far away from the magnetic type working table surface, so that the processed first surface meets a first preset requirement;
moving the silicon disc to a vacuum type worktable surface to enable the processed first surface to face the vacuum type worktable surface, and fixing the silicon disc on the vacuum type worktable surface by means of vacuum suction force;
and processing a second surface of the silicon disc opposite to the first surface, so that the processed second surface meets a second preset requirement.
Scheme 2:
2. the processing method for the silicon disc according to the scheme 1 is characterized in that the step of fixing the silicon disc on the magnetic type working table surface by means of magnetic attraction comprises the following steps:
placing the silicon disc on the magnetic-type workbench surface so that the second surface faces the magnetic-type workbench surface;
arranging a plurality of magnetic force limiting pieces on the magnetic type working table surface at intervals along the periphery of the silicon disc, and enabling each magnetic force limiting piece to abut against the peripheral edge of the silicon disc; and
and controlling the electromagnet under the magnetic type working table to be opened so as to apply pre-applied magnetic attraction force to the magnetic force limiting piece.
Scheme 3:
3. the processing method for a silicon disc according to claim 2, wherein each magnetic force limiting member has an arc-shaped body extending along the peripheral edge, and a flexible limiting strip extending toward the peripheral edge and abuttable on the peripheral edge is formed on an arc-shaped side wall of the arc-shaped body facing the peripheral edge.
Scheme 4:
4. the processing method for a silicon disc according to claim 3, wherein a groove extending along the peripheral edge is formed on the arc-shaped side wall, and the groove is configured to receive the flexible stopper.
Scheme 5:
5. the processing method for the silicon disc according to the scheme 3 or 4 is characterized in that the flexible limiting strip is processed by a silica gel material or a rubber material.
Scheme 6:
6. the processing method for the silicon disc according to the scheme 1 is characterized in that a plurality of magnetic isolation layers which are parallel to each other and are uniformly spaced are further arranged in the magnetic type working table.
Scheme 7:
7. the processing method for the silicon disc according to the scheme 1, wherein the step of fixing the silicon disc on the vacuum type worktable surface by vacuum suction comprises the following steps:
controlling the vacuum equipment connected with the vacuum type working table to be started;
maintaining the vacuum apparatus operating at a predetermined air pressure.
Scheme 8:
8. the processing method for a silicon disk according to claim 7, wherein the predetermined gas pressure ranges from-80 Kpa to-65 Kpa.
Scheme 9:
9. a silicon disc processing apparatus, characterized in that the silicon disc processing apparatus comprises:
the magnetic force type workbench is provided with a magnetic force type workbench surface used for bearing and fixing the silicon disc by means of magnetic attraction, and the magnetic force type workbench surface is suitable for being abutted against the unprocessed second surface of the silicon disc.
Scheme 10:
10. the silicon disc processing apparatus according to claim 9, wherein a plurality of electromagnets which are spaced from each other and can be switched on and off are provided in the magnetic force type table, and the silicon disc processing apparatus further comprises:
the silicon disc clamping device comprises a plurality of magnetic force limiting pieces, wherein the magnetic force limiting pieces are configured to be arranged on the magnetic force type working table top at intervals along the outer circumferential direction of the silicon disc, each magnetic force limiting piece can abut against the outer circumferential edge of the silicon disc, and therefore the electromagnet is controlled to be started, and magnetic attraction can be applied to the magnetic force limiting pieces to clamp the silicon disc.
Scheme 11:
11. a silicon disc processing apparatus, characterized in that the silicon disc processing apparatus comprises:
the vacuum type worktable is provided with a vacuum type worktable surface which is used for bearing and fixing the silicon disc by means of vacuum suction force, and the vacuum type worktable surface is used for abutting against the processed first surface of the silicon disc.
Scheme 12:
12. the silicon disc processing apparatus according to claim 11, characterized in that,
a plurality of vent holes radially arranged outwards from the center of the vacuum worktable surface are formed on the vacuum worktable surface, and the vent holes are configured to be closed when the silicon disc is placed on the vacuum worktable surface;
a vacuum chamber is provided below the vacuum table, and is capable of communicating with the air formed by each of the vent holes
The silicon disc processing equipment further comprises vacuum equipment, wherein the vacuum equipment is configured to be connected with the vacuum chamber, and when the silicon disc is placed on the vacuum type worktable, the vacuum equipment is controlled to operate at preset air pressure in the vacuum chamber to form negative pressure action so as to adsorb the silicon disc.
Drawings
Preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which:
FIG. 1 is a schematic view of an assembly structure of a magnetic type worktable and a silicon disc of a first embodiment of a silicon disc processing apparatus according to the present invention;
fig. 2 is a schematic structural diagram of an embodiment of a magnetic type workbench and a magnetic force limiting member of a first embodiment of a silicon disc processing apparatus according to the present invention;
FIG. 3 is a schematic structural diagram of a magnetic-type worktable according to a first embodiment of the silicon disc processing apparatus of the present invention;
FIG. 4 is a schematic structural diagram of a base of a magnetic-type worktable according to a first embodiment of the silicon disc processing apparatus of the present invention;
FIG. 5 is a schematic structural diagram of an electromagnet of a magnetic-type worktable according to a first embodiment of the silicon disc processing apparatus of the present invention;
FIG. 6 is a schematic structural diagram of an embodiment of a magnetic force limiting member of the first embodiment of the silicon disk processing apparatus according to the present invention;
FIG. 7 is a schematic view of a first configuration of an embodiment of a vacuum table of a second embodiment of the silicon disk processing apparatus of the present invention;
FIG. 8 is a second block diagram of an embodiment of a vacuum table of a second embodiment of the silicon disk processing apparatus of the present invention;
FIG. 9 is a top view of an embodiment of a vacuum table of a second embodiment of the silicon disk processing apparatus of the present invention;
FIG. 10 is a cross-sectional view of an embodiment of a vacuum table of a second embodiment of a silicon disc processing apparatus of the present invention, taken along section line A-A shown in FIG. 9;
FIG. 11 is a schematic flow chart of a processing method for a silicon disk of the present invention;
FIG. 12 is a first partial schematic flow chart diagram of an embodiment of a processing method for a silicon disk of the present invention;
FIG. 13 is a second partial flow chart of the embodiment of the processing method for a silicon disk of the present invention.
List of reference numbers:
100. a silicon disc; 110. a silicon disc body; 120. a first surface; 130. a peripheral edge; 200 of a carrier; a magnetic type work table; 210. a magnetic bearing part; 211. a magnetic type work table; 212. a magnetism isolating layer; 220. a base; 221. an accommodating chamber; 222. an electromagnet; 300. a magnetic force limiting block; 310. an arc-shaped body; 311. an arcuate sidewall; 312. a groove; 320. a flexible limiting strip; 321. an arc-shaped abutting surface; 400. a vacuum type work table; 410. a top wall; 411. a vacuum type work table; 4111. a vent hole; 4112. a fixing hole; 420. a bottom wall; 421. a shaft hole; 430. a side wall; 440. a vacuum chamber; 450. a skirt.
Detailed Description
Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention.
It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either directly or indirectly through intervening media, or through the communication between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In order to solve the technical problem that the precision machining of the silicon disc is difficult to realize by a workbench in the prior art, the invention provides a machining method for the silicon disc 100. The processing method comprises the following steps:
fixing the silicon disc 100 on the magnetic type work table 211 by means of magnetic attraction (step S1);
processing the first surface 120 of the silicon disc 100 far away from the magnetic type worktable 211 so that the processed first surface 120 meets a first predetermined requirement (step S2);
moving the silicon disk 100 to the vacuum table 411 such that the processed first surface 120 faces the vacuum table 411, and fixing the silicon disk 100 on the vacuum table 411 by means of vacuum suction (step S3);
a second surface of the silicon disc 100 opposite to the first surface 120 is processed such that the processed second surface satisfies a second predetermined requirement (step S4).
FIG. 1 is a schematic view of an assembly structure of a magnetic worktable and a silicon disk of a first embodiment of a silicon disk processing apparatus according to the present invention; fig. 2 is a schematic structural diagram of an embodiment of a magnetic type workbench and a magnetic force limiting member of a first embodiment of a silicon disc processing apparatus according to the present invention; FIG. 3 is a schematic structural diagram of a magnetic-type worktable according to a first embodiment of the silicon disc processing apparatus of the present invention; FIG. 4 is a schematic structural diagram of a base of a magnetic-type worktable according to a first embodiment of the silicon disc processing apparatus of the present invention; fig. 5 is a schematic structural diagram of an embodiment of an electromagnet of a magnetic-type workbench according to a first embodiment of a silicon disc processing apparatus of the present invention; fig. 6 is a schematic structural diagram of an embodiment of a magnetic force limiting member of the first embodiment of the silicon disk processing apparatus according to the present invention.
As shown in fig. 1, in one or more embodiments, the silicon disc processing apparatus of the present invention includes, but is not limited to, a magnetic-type work table 200 and a plurality of magnetic force stoppers 300 arranged on the magnetic-type work table 200 in a spaced-apart manner. The silicon tray 100 is horizontally placed on the magnetic type table 200. The plurality of magnetic force stoppers 300 are evenly spaced along the circumferential direction of the silicon disk 100. Each magnetic force limiter 300 tightly abuts against the outer peripheral edge 130 of the silicon disc 100. By applying a suitable magnetic attraction force to the magnetic force limiting member 300, the silicon disc 100 can be firmly restrained and fixed on the magnetic force type table 200 so as to be processed.
With continued reference to fig. 1, the silicon disk 100 has a generally disk-shaped silicon disk body 110. The silicon disk body 110 can be made of high-purity (e.g. 99.999999999%) single crystal silicon by outer diameter grinding, slicing and other processes. The silicon disk body 110 has opposing first and second surfaces 120 and (not shown). Based on the orientation shown in fig. 1, the first surface 120 is an upper surface of the silicon disk body 110, and the second surface is a lower surface of the silicon disk body 110. The silicon disk body 110 also has a peripheral edge 130 located between and substantially perpendicular to the first and second surfaces 120, 120.
With continued reference to fig. 2-4, in one or more embodiments, the magnetic workbench 200 includes a magnetic carrier 210 and a base 220 that interface with each other. The magnetic bearing portion 210 may be made of a suitable metal material, such as stainless steel. The magnetic bearing portion 210 has a substantially circular magnetic force type table surface 211. The magnetic-type worktable 211 has a flat surface and extends substantially in a horizontal direction so as to abut against the second surface of the unprocessed silicon disk 100, so that the silicon disk 100 can be horizontally supported when the silicon disk 100 is placed on the magnetic-type worktable 211, thereby ensuring the processing accuracy. The diameter of the magnetic type worktable 211 is larger than that of the silicon disc 100 to be processed, so as to bear the silicon disc 100 and the magnetic force limiting block 300 for fixing the silicon disc 100. In one or more embodiments, 9 magnetic isolation layers 212 are further disposed on the magnetic bearing portion 210 and uniformly spaced from each other to enhance the magnetic attraction of the electromagnet 222 in the base 220. Each of the magnetism isolating layers 212 extends from the magnetic force type table top 211 perpendicularly toward the inside of the magnetic force bearing part 210 along the thickness direction of the magnetic force bearing part 210 by a predetermined distance. Alternatively, the number of the magnetic shield layers 212 may be set to other suitable numbers more or less than 9, such as 8, 10, etc. In one or more embodiments, the magnetic barrier layer 212 is surrounded by a closed copper ring and extends parallel to each other in the magnetic force type work table 211. Alternatively, the magnetic isolation layer 212 may be made of other diamagnetic materials, such as bismuth, silver, etc.
With continued reference to fig. 4 and 5, in one or more embodiments, the base 220 is secured below the magnetic bearing 210. The base 220 may also be made of a suitable metal material, such as stainless steel. In the base 220, 37 receiving cavities 221 are provided, which are uniformly spaced from each other. Each receiving cavity 221 is a substantially cylindrical cavity. Based on the orientation shown in fig. 4, each accommodation chamber 221 extends substantially in the vertical direction and has an opening facing upward. An electromagnet 222 is disposed in each of the receiving chambers 221 to control opening and closing. Preferably, the 37 electromagnets 222 are configured to be controlled to be turned on simultaneously or turned off simultaneously for ease of operation. Alternatively, the number of the accommodating cavities 221 and the electromagnets 222 may be set to other suitable numbers with more or less walls 37, such as 36, 38, etc., as long as sufficient magnetic attraction force can be provided to effectively fix the silicon disc 100.
With continued reference to fig. 1, in one or more embodiments, the magnetic force limiters 300 include 4 magnetic force limiters 300 spaced apart from each other. Each of the magnetic force stoppers 300 has the same structure. Alternatively, the number of the magnetic force stoppers 300 may be set to other suitable numbers more or less than 4. With continued reference to fig. 6, in one or more embodiments, each magnetic stop 300 has a generally arc-shaped arcuate body 310. The arc-shaped body 310 may be a magnetic conductor (i.e., an object with magnetic permeability), such as iron, cobalt, nickel, etc., or a magnetic body (i.e., an object with magnetic property), such as neodymium iron boron magnet, ferrite magnet, etc., as long as the magnetic body can cooperate with the electromagnet 222 to form a magnetic attraction force. The arc-shaped body 310 has an arc-shaped sidewall 311 opposite the peripheral edge 130 of the silicon disk 100 and substantially parallel to the peripheral edge 130. In one or more embodiments, a groove 312 extending vertically inward is formed on the curved sidewall 311, and a flexible stopper 320 protruding outward from the curved sidewall 311 is disposed within the groove 312. In the assembled state, the groove 312 extends substantially along the peripheral edge 130 such that the flexible stopper 320 disposed therein can fit snugly against the peripheral edge 130 of the silicon disc 100. The flexible limiting strip 320 can be made of silica gel or rubber materials, so that the flexible limiting strip has moderate hardness.
It should be noted that the silicon disc processing apparatus of the present invention further includes other components for processing the silicon disc 100, such as a grinding disc, a polishing disc, a cutting fluid adding mechanism, etc., which are well known in the art and therefore will not be described herein.
FIG. 7 is a schematic view of a first configuration of an embodiment of a vacuum table of a second embodiment of the silicon disk processing apparatus of the present invention; FIG. 8 is a second schematic structural view of an embodiment of a vacuum table of a second embodiment of the silicon disk processing apparatus of the present invention; FIG. 9 is a top view of an embodiment of a vacuum table of a second embodiment of the silicon disk processing apparatus of the present invention; fig. 10 is a sectional view of an embodiment of a vacuum type table of a second embodiment of a silicon disc processing apparatus according to the present invention, taken along the line a-a shown in fig. 9.
As shown in fig. 7-10, in one or more embodiments, the processing tool of the present invention includes a vacuum table 400. The vacuum table 400 may be manufactured by a casting process using a suitable metal material (e.g., stainless steel). Based on the orientation shown in FIG. 7, the vacuum table 400 has a generally circular top wall 410, a bottom wall 420 below the top wall 410 and parallel to the top wall 410, and a side wall 430 extending perpendicularly from a peripheral edge of the top wall 410 to the bottom wall 420. Together, the top wall 410, bottom wall 420, and side walls 430 define a vacuum chamber 440 that creates a negative pressure effect. The top wall 410 has a horizontal vacuum table 411 for carrying the silicon disk 100 to be processed. Vent holes 4111 are formed in the vacuum table 411 in a radial arrangement from the center thereof outward in the radial direction. Specifically, 20 radial vent hole groups (not shown) are formed on the whole vacuum table 411 and are uniformly distributed along the circumferential direction; 26 vent holes 4111 are uniformly distributed in each radial vent hole group; each vent hole 4111 has a substantially circular shape. Alternatively, the number of sets of vent holes may be provided in other suitable numbers, such as 18, 22, etc., more or less than 20. Alternatively, the number of vent holes 4111 in each radial vent hole group may be set to other suitable numbers that are more or less than 26. Alternatively, each vent hole 4111 may be provided in other suitable shapes, such as square, oval, and the like. Each vent 4111 is in air communication with the vacuum chamber 440 for adsorbing the silicon tray 100. Near the center of the vacuum table 411, there are 4 fixing holes 4112 evenly spaced apart from each other (at the four corners of the square). Each of the fixing holes 4112 may be matched with a corresponding fastener to fix the vacuum table 400 to a rotating shaft (not shown). In one or more embodiments, a skirt 450 extending vertically downward from the lower surface of the bottom wall 420 is also provided on the bottom wall 420 to improve the stability of the vacuum table 400.
It should be noted that the silicon disk processing apparatus of the present invention further includes other components for processing the silicon disk 100, such as a vacuum apparatus communicating with the vacuum chamber to generate a negative pressure effect, a motor for driving the vacuum table 400 to rotate, an abrasive disk, a polishing disk, a cutting fluid adding mechanism, and the like. These mechanisms are well known in the art and therefore will not be described in detail herein. In addition, in one or more embodiments, the silicon disk processing apparatus having the vacuum type table 400 is integrated with the silicon disk processing apparatus having the magnetic type table 200, i.e., is the same silicon disk processing apparatus. Alternatively, the silicon disc processing apparatus having the vacuum type worktable 400 and the silicon disc processing apparatus having the magnetic type worktable 200 may be separated, that is, two independent processing apparatuses.
Hereinafter, the processing method for the silicon disk 100 of the present invention will be described in detail with reference to the above-described embodiments of the silicon disk processing apparatus. It should be noted that the processing method for the silicon disk 100 of the present invention is also applicable to other suitable silicon disk processing apparatuses.
FIG. 11 is a schematic flow chart of a processing method for a silicon disk of the present invention. As shown in fig. 11, in one or more embodiments, after the processing method for the silicon disc 100 of the present invention is started, step S1 is first performed, in which the silicon disc 100 is fixed on the magnetic-type work table 211 by means of magnetic attraction. Next, step S2 is executed to machine the first surface 120 of the silicon disc 100 away from the magnetic-type worktable 211, so that the machined first surface 120 meets the first predetermined requirement. Then, step S3 is performed, the silicon disk 100 is moved to the vacuum table 411 so that the processed first surface 120 faces the vacuum table 411, and the silicon disk 100 is fixed on the vacuum table 411 by vacuum suction. When step S3 is completed, the processing method proceeds to step S4, i.e., a second surface of the silicon disc 100 opposite to the first surface 120 is processed, so that the processed second surface satisfies a second predetermined requirement.
FIG. 12 is a first partial schematic flow chart diagram of an embodiment of a processing method for a silicon disk of the present invention. As shown in fig. 12, in one or more embodiments, when the processing method for the silicon disc 100 of the present invention is started, step S11 is first performed to place the silicon disc 100 on the magnetic-type work table 211 so that the second surface faces the magnetic-type work table 211. Next, a plurality of magnetic force stoppers 300 are arranged on the magnetic force type table surface 211 along the outer circumference of the silicon disc 100 at intervals from each other, and each of the magnetic force stoppers 300 abuts on the outer circumferential edge 130 of the silicon disc 100. Then, the electromagnet under the magnetic type table 211 is controlled to be turned on, so as to apply a pre-applied magnetic attraction force to the magnetic force limiting member 300 (step S12). It should be noted that the predetermined magnetic attraction force can be adjusted according to actual needs. The adjustment method may be to control the number and arrangement of the magnetic force limiting members 300 and the electromagnets 222, and to control the current, the number of turns of the coil, etc. of the electromagnets 222. When step S12 is completed, the processing method proceeds to step S21, where the first surface 120 of the silicon disc 100 away from the magnetic-type table 211 is processed. The processing mode comprises grinding, polishing and the like. Next, step S22 is performed to detect the quality of the first surface 120 of the silicon disc 100. The quality of the first surface 120 includes, but is not limited to, flatness, and thickness of the processed silicon disc 100. Then, step S23 is executed to determine whether the quality of the first surface 120 meets the first predetermined requirement. The first predetermined requirement may be to select a suitable index according to actual needs. If the determination result is negative, which indicates that the first surface 120 is not completely processed at this time, step S21 is repeated, that is, the first surface 120 of the silicon disc 100 away from the magnetic-type worktable 211 is continuously processed until the quality of the first surface 120 meets the first predetermined requirement. If the determination result is yes, which indicates that the first surface 120 is machined completely, and the machining design requirement is met, step S24 is executed, i.e., the electromagnet 222 is controlled to be turned off.
FIG. 13 is a second partial flow chart of the embodiment of the processing method for a silicon disk of the present invention. As shown in fig. 13, when step S24 is completed, the processing method proceeds to step S31, in which the silicon wafer 100 is moved to the vacuum table 400 so that the processed first surface 120 faces the vacuum table 400. The machined first surface 120 is flat and therefore can be tightly attached to the vacuum table 400, thereby completely sealing the vent holes 4111 on the vacuum table 400. The movement of the silicon disk 100 may be implemented using a vacuum chuck or an electrostatic chuck to prevent damage to the silicon disk 100 during the movement. Next, step S32 is executed to control the vacuum device connected to the vacuum table 411 to be turned on. Then, the vacuum apparatus is kept operating at a predetermined air pressure (step S33). In one or more embodiments, the predetermined pressure ranges from-80 KPa to-65 KPa, so that a stable negative pressure is generated in the vacuum chamber 440, and the silicon disk 100 is firmly and stably attached to the vacuum table 400. After completion of step S33, the processing method proceeds to step S41, where the second surface member of the silicon disc 100 is processed. The processing mode comprises grinding, polishing and the like. Next, step S42 is performed to detect the quality of the second surface of the silicon disc 100. The quality of the second surface includes, but is not limited to, flatness, and thickness of the processed silicon disk 100. Then, step S43 is executed to determine whether the quality of the second surface satisfies a second predetermined requirement. The second predetermined requirement may be to select a suitable index according to actual needs. If the determination result is negative, which indicates that the second surface is not completely processed, step S41 is repeated, that is, the second surface of the silicon disc 100 is processed continuously until the quality of the second surface meets the second predetermined requirement. If the judgment result is yes, the quality of the second surface is finished, and the vacuum equipment is controlled to be closed if the quality of the second surface meets the design requirement of processing (step S44). When step S44 is completed, the processing method ends.
So far, the technical solutions of the present invention have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the invention, and the technical scheme after the changes or substitutions can fall into the protection scope of the invention.
Claims (10)
1. A method of processing a silicon disk, the method comprising:
fixing the silicon disc on a magnetic type working table surface by means of magnetic attraction;
processing a first surface of the silicon disc, which is far away from the magnetic type working table surface, so that the processed first surface meets a first preset requirement;
moving the silicon disc to a vacuum type worktable surface to enable the processed first surface to face the vacuum type worktable surface, and fixing the silicon disc on the vacuum type worktable surface by means of vacuum suction force;
and processing a second surface of the silicon disc opposite to the first surface, so that the processed second surface meets a second preset requirement.
2. The method as claimed in claim 1, wherein the step of fixing the silicon disc on the magnetic type table top by means of magnetic attraction comprises:
placing the silicon disc on the magnetic-type workbench surface so that the second surface faces the magnetic-type workbench surface;
arranging a plurality of magnetic force limiting pieces on the magnetic type working table surface at intervals along the periphery of the silicon disc, and enabling each magnetic force limiting piece to abut against the peripheral edge of the silicon disc; and
and controlling the electromagnet under the magnetic type working table to be opened so as to apply pre-applied magnetic attraction force to the magnetic force limiting piece.
3. The processing method for a silicon disc as set forth in claim 2, wherein each magnetic force limiting member has an arc-shaped body extending along the peripheral edge, and a flexible limiting strip extending toward the peripheral edge and abuttable against the peripheral edge is formed on an arc-shaped side wall of the arc-shaped body facing the peripheral edge.
4. The processing method for a silicon disc as set forth in claim 3, wherein a groove extending along the peripheral edge is formed on the arc-shaped side wall, and the groove is configured to receive the flexible stopper.
5. The processing method for the silicon disc as claimed in claim 3 or 4, wherein the flexible limiting strip is processed by silica gel material or rubber material.
6. The processing method for the silicon disk as claimed in claim 1, wherein a plurality of magnetic isolating layers are provided in the magnetic force type table top in parallel and at regular intervals.
7. The processing method for silicon disks according to claim 1, wherein the step of "fixing the silicon disk on the vacuum table top by vacuum suction" comprises:
controlling the vacuum equipment connected with the vacuum type working table to be started;
maintaining the vacuum apparatus operating at a predetermined air pressure.
8. The processing method for a silicon disk as set forth in claim 7, wherein the predetermined gas pressure ranges from-80 Kpa to-65 Kpa.
9. A silicon disc processing apparatus, comprising:
the magnetic force type workbench is provided with a magnetic force type workbench surface used for bearing and fixing the silicon disc by means of magnetic attraction, and the magnetic force type workbench surface is suitable for being abutted against the unprocessed second surface of the silicon disc.
10. A silicon disc processing apparatus, characterized in that the silicon disc processing apparatus comprises:
the vacuum type worktable is provided with a vacuum type worktable surface which is used for bearing and fixing the silicon disc by means of vacuum suction force, and the vacuum type worktable surface is used for abutting against the processed first surface of the silicon disc.
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