CN114657528A - Temporary carrier plate for coating QFN packaging part and coating method of QFN packaging part - Google Patents
Temporary carrier plate for coating QFN packaging part and coating method of QFN packaging part Download PDFInfo
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- CN114657528A CN114657528A CN202011524230.XA CN202011524230A CN114657528A CN 114657528 A CN114657528 A CN 114657528A CN 202011524230 A CN202011524230 A CN 202011524230A CN 114657528 A CN114657528 A CN 114657528A
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- 238000000576 coating method Methods 0.000 title claims abstract description 33
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 239000011248 coating agent Substances 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000007888 film coating Substances 0.000 claims abstract description 7
- 238000009501 film coating Methods 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 239000012790 adhesive layer Substances 0.000 claims description 53
- 239000010410 layer Substances 0.000 claims description 35
- 239000004642 Polyimide Substances 0.000 claims description 6
- 239000003522 acrylic cement Substances 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 5
- 238000002203 pretreatment Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention provides a temporary carrier plate for coating a QFN (quad Flat No-lead) packaging piece and a coating method of the QFN packaging piece. Through using the temporary support plate and the flexible glue layer which are provided with the avoiding cavities, the electromagnetic shielding layer which is electrically connected with the grounding pin pad can be plated on the QFN packaging part only through one-time pressing and film coating operation, extra pre-treatment and post-plating treatment are not needed, the process flow is simple, the shielding effect of the electromagnetic shielding plating layer is excellent, and the reliability is high.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a temporary carrier plate for coating a QFN packaging piece and a coating method of the QFN packaging piece.
Background
When performing electromagnetic shielding on a QFN (Quad Flat No-leads) package, an electromagnetic shielding layer is usually plated on the surface of the QFN package, and the electromagnetic shielding layer needs to be electrically connected to a ground pin pad and avoid sputtering on a functional pin pad.
In order to solve the problem of sputtering, the current coating method comprises the steps of covering and shielding a functional pin bonding pad by a glue coating method before coating, and removing the glue after coating; and secondly, removing the plating layer covering the functional pin bonding pad in a grinding mode after plating. The two methods need complex and tedious pre-protection before plating and redundant plating removal treatment after plating, are easy to damage or leave residues on the packaging part, and have poor reliability.
Disclosure of Invention
The invention aims to provide a temporary carrier plate for coating a QFN packaging piece and a coating method of the QFN packaging piece.
The invention provides a temporary carrier plate for coating a QFN (quad Flat No-lead) packaging part, which temporarily bears the QFN packaging part in a coating process, wherein the QFN packaging part comprises a plurality of exposed grounding pin bonding pads and functional pin bonding pads, a plurality of avoiding cavities are formed on the temporary carrier plate at positions corresponding to the grounding pin bonding pads, at least part of projections of the grounding pin bonding pads and the corresponding avoiding cavities in the vertical direction are overlapped, and the projections of the functional pin bonding pads in the vertical direction are positioned outside the avoiding cavities;
and a complete flexible adhesive layer is attached to one surface of the temporary carrier plate, which bears the QFN packaging piece, and the flexible adhesive layer covers the avoiding cavity.
As a further improvement of the present invention, a projection of the ground pin pad in the vertical direction is completely located in the avoiding cavity.
As a further improvement of the invention, the avoiding cavity is a cylindrical through hole, the grounding pin pad and the through hole are coaxially arranged, the length of the grounding pin pad is M, the distance between the grounding pin pad and the functional pin pad is N, the inner diameter of the through hole is D, and R is not less than M and not more than M + 2N.
In a further improvement of the present invention, the through-hole has an inner diameter D of M + N.
As a further improvement of the invention, the flexible adhesive layer is a polyimide adhesive layer or an acrylic adhesive layer, and the thickness of the flexible adhesive layer is 100-800 μm.
The invention also provides a coating method of the QFN packaging piece, which comprises the following steps:
manufacturing an avoidance cavity corresponding to the position of a QFN package grounding pin pad on the temporary carrier plate;
attaching a complete flexible glue layer on the temporary carrier plate;
attaching the QFN packaging piece to the flexible adhesive layer, aligning a grounding pin pad on the avoiding cavity, wherein at least part of the projection of the grounding pin pad in the vertical direction is positioned in the avoiding cavity, and the projection of the functional pin pad in the vertical direction is positioned outside the avoiding cavity;
pressing the QFN packaging piece downwards, and embedding a functional pin bonding pad of the QFN packaging piece into a flexible adhesive layer;
coating the QFN package part;
and stripping the temporary carrier plate and the flexible adhesive layer.
As a further improvement of the present invention, a projection of the ground pin pad in the vertical direction is completely located in the avoiding cavity.
As a further improvement of the invention, the avoiding cavity is a cylindrical through hole, the grounding pin pad and the through hole are coaxially arranged, the length of the grounding pin pad is M, the distance between the grounding pin pad and the functional pin pad is N, the inner diameter of the through hole is D, and R is not less than M and not more than M + 2N.
In a further improvement of the present invention, the through-hole has an inner diameter D of M + N.
The improved structure is characterized in that the flexible adhesive layer is a polyimide adhesive layer or an acrylic adhesive layer, and the thickness of the flexible adhesive layer is 100-800 μm.
The invention has the beneficial effects that: according to the invention, by using the temporary carrier plate and the flexible adhesive layer which are provided with the avoiding cavities, the electromagnetic shielding layer which is electrically connected with the grounding pin bonding pad can be plated on the QFN packaging part only by one-time pressing and film coating operation, no extra pretreatment and post-plating treatment are needed, the process flow is simple, the shielding effect of the electromagnetic shielding plating layer is excellent, and the reliability is high.
Drawings
Fig. 1 is a schematic diagram of a QFN package according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a lead frame of a QFN package according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a temporary carrier carrying QFN packages according to an embodiment of the invention.
Fig. 4 is a schematic diagram of a QFN package and a temporary carrier under a downward pressing force according to an embodiment of the invention.
Fig. 5 is a process flow diagram of a QFN package coating method according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the technical solutions of the present application will be clearly and completely described below with reference to the detailed description of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
For convenience in explanation, the description herein uses terms indicating relative spatial positions, such as "upper," "lower," "rear," "front," and the like, to describe one element or feature's relationship to another element or feature as illustrated in the figures. The term spatially relative position may encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "above" other elements or features would then be oriented "below" or "above" the other elements or features. Thus, the exemplary term "below" can encompass both a spatial orientation of below and above.
As shown in fig. 1, 2 and 3, the present invention provides a temporary carrier 2 for coating a QFN package 1, wherein the QFN package 1 comprises a plurality of exposed ground pin pads 11 and functional pin pads 12.
Specifically, in the present embodiment, the lead frame 13 of the QFN package 1 includes four ground lead pads 11 disposed at four corners thereof and a plurality of functional lead pads 12 disposed on four sides thereof, and the ground lead pads 11 are electrically connected to the heat conducting pad 14 at the middle position of the lead frame 13 through wires to form a ground zero equipotential body.
In other embodiments, the number and relative positions of the ground pin pads 11 and the functional pin pads 12 can be adjusted according to the functional requirements of the chip.
The chip and other optional electronic components are arranged on the lead frame 13 and electrically connected with the functional pin bonding pad 12, the lead frame 13, the chip and other optional electronic components are covered by the plastic package layer, and the grounding pin bonding pad 11 and the functional pin bonding pad 12 are exposed on the side surface of the plastic package layer and are used for being electrically connected with a circuit board or other electronic components.
The QFN package 1 is plated with an electromagnetic shielding layer 15 on the side and top surfaces thereof, and the metal shielding layer is a continuous thin film plating layer for reducing the electromagnetic interference on the chip and other optional electronic components. The electromagnetic shielding layer 15 may be a sputtering interlayer metal thin film material such as copper, stainless steel, titanium, or the like, or a conductive composite material such as a conductive resin containing a high-density metal filler such as silver/copper, or a combination of at least two of the above materials, and may function to shield or absorb electromagnetic waves.
The electromagnetic shielding layer 15 is electrically connected with the grounding pin pad 11 exposed on the side of the plastic package layer to form a zero equipotential body so as to eliminate the interference of an electric field and a magnetic field and realize the shielding effect of the electromagnetic shielding layer 15. The electromagnetic shield layer 15 exposes the functional pin pad 12.
The metal shielding layer may be formed by plating on the QFN package 1 by physical vapor deposition or the like, specifically, by magnetron sputtering plating in the present embodiment.
The temporary carrier plate 2 is used for temporarily carrying the QFN package 1 in a coating process, so that the coating process is convenient to carry out.
The bottom plate 21 is a low-cost sacrificial substrate such as glass, silicon, composite polymer, etc., which has certain rigidity and is resistant to etching, so as to play a role in temporary bearing and structural support for the QFN package 1 in the coating process.
The bottom plate 21 is provided with a plurality of avoiding cavities 211 at positions corresponding to the grounding pin pads 11, the grounding pin pads 11 and the corresponding avoiding cavities 211 at least partially overlap in a vertical direction, the projections of the functional pin pads 12 in the vertical direction are located outside the avoiding cavities 211, a complete flexible adhesive layer 22 is attached to one surface of the temporary carrier plate 2 bearing the QFN package 1, and the flexible adhesive layer 22 covers the avoiding cavities 211.
As shown in fig. 4, QFN package 1 is attached to temporary carrier 2 by flexible adhesive layer 22, and QFN package 1 is pressed downward before film coating. Because the temporary carrier plate 2 is arranged below the functional pin bonding pad 12, the temporary carrier plate can support the functional pin bonding pad 12, the functional pin bonding pad 12 is completely embedded into the flexible adhesive layer 22 after downward pressure is applied to the functional pin bonding pad 12, and therefore the flexible adhesive layer 22 is used for covering the functional pin bonding pad 12 in a shielding mode. Since the ground pin pad 11 is located above the avoiding cavity 211, a part of the adhesive layer located below the ground pin pad 11 is not limited by the temporary carrier 2, and bends and deforms downward after being stressed, and the ground pin pad 11 is not buried in the adhesive layer, but is exposed on the flexible adhesive layer 22. Further, since the flexible adhesive layer 22 has adhesiveness, it adheres to the side surface of the QFN package 1, so that the QFN package 1 after the press-bonding is maintained in a state where the functional lead pad 12 is shielded and the ground lead pad 11 is exposed. Therefore, in the subsequent coating process, the electromagnetic shielding layer 15 coated on the surface of the QFN package 1 is only coated on the surface of the grounding pin pad 11, and is not sputtered on the surface of the functional pin, and by using the temporary carrier plate 2 with the avoiding cavity 211, extra pre-protection before coating and redundant plating removal after coating are not required, so that the coating process is simple and easy to operate.
The flexible adhesive layer 22 is a polyimide adhesive layer or an acrylic adhesive layer, the thickness of the flexible adhesive layer 22 is 100-800 μm, and the thickness of the flexible adhesive layer 22 is limited to be larger than 100 μm, so that the functional pin bonding pad 12 can be completely coated by the flexible adhesive layer 22 with a certain thickness after being stressed; the flexible adhesive layer 22 is limited to be smaller than 800 μm, so that the flexible adhesive layer 22 above the avoiding cavity 211 can deform downwards after being stressed, and the situations that the flexible adhesive layer 22 is too thick, the structural strength is too high, the deformation is insufficient, and the grounding pin pad 11 cannot be completely exposed are avoided. The coating process requirement can be met only through the matching of the flexible adhesive layer 22 and the avoiding cavity 211, extra grinding treatment is not needed, the damage to the QFN packaging part 1 is small, and the reliability is high.
Preferably, in the present embodiment, the thickness of the flexible glue layer 22 is 600 μm.
In other embodiments, the thickness of the flexible adhesive layer 22 can be adjusted according to the size parameters such as the number and height of the ground pad 11 and the functional pad 12 exposed to the side of the molding layer.
Furthermore, the length of the inner diameter of the avoiding cavity 211 is greater than the length of the grounding pin bonding pad 11, and the projection of the grounding pin bonding pad 11 in the vertical direction is completely located in the avoiding cavity 211, so that the flexible adhesive layer 22 is deformed more fully under the stress, and the grounding pin bonding pad 11 can be exposed outside the flexible adhesive layer 22.
Further, the avoiding cavity 211 is a cylindrical through hole 211a, and the avoiding cavity 211 in the shape of the cylindrical through hole is convenient to realize in process and simple in manufacturing process. The ground pin pad 11 is coaxially disposed with the through hole to make the deformation of the flexible adhesive layer 22 under force more uniform.
Specifically, the length of the grounding pin pad 11 is M, the distance between the grounding pin pad 11 and the functional pin pad 12 is N, the inner diameter of the through hole is D, and R is not less than M and not more than M + 2N.
Preferably, the inner diameter D of the through hole is equal to M + N, that is, the boundary of the through hole is located at the central position between the ground lead pad 11 and the functional lead pad 12, so that while it is ensured that the flexible adhesive layer 22 below the ground lead pad 11 can be sufficiently deformed, the deformation of the flexible adhesive layer 22 does not extend to affect the flexible adhesive layer 22 below the functional lead pad 12, and the incomplete coating of the functional lead pad 12 is avoided. And, under the condition of guaranteeing the process reliability, the area covered by the plated electromagnetic shielding layer 15 is increased as much as possible, and the shielding effect is improved.
As shown in fig. 5, the present invention further provides a method for coating a QFN package 1, comprising the steps of:
s1: the QFN package 1 is attached to the temporary carrier plate 2, the ground pin pad 11 is arranged on the avoiding cavity 211 of the bottom plate 21 in an aligned mode, at least part of the projection of the ground pin pad in the vertical direction is located in the avoiding cavity 211, and the projection of the functional pin pad 22 in the vertical direction is located on the outer side of the avoiding cavity 21.
The flexible adhesive layer 22 is a polyimide adhesive layer or an acrylic adhesive layer, and the thickness of the flexible adhesive layer 22 is 100-800 μm.
Further, the projection of the ground pin pad 11 in the vertical direction is completely disposed in the avoiding cavity 211, and the projection of the functional pin pad 12 in the vertical direction is located outside the avoiding cavity 211.
Furthermore, the avoiding cavity 211 is a cylindrical through hole, the ground pin pad 11 and the through hole are coaxially arranged, the length of the ground pin pad 11 is M, the distance between the ground pin pad 11 and the functional pin pad 12 is N, the inner diameter of the through hole is D, and R is not less than M and not more than M + 2N.
Preferably, the through-hole has an inner diameter D equal to M + N.
S2: and pressing the QFN package 1 downwards until the functional pin pads 12 of the QFN package 1 are embedded into the flexible adhesive layer 22. Meanwhile, as the part of the adhesive layer below the ground pin pad 11 is stressed to bend and deform downwards along the avoiding cavity 211, the ground pin pad 11 is exposed on the adhesive layer.
The applied pressure is specifically adjusted according to the material type of the flexible adhesive layer 22 and the height of the functional lead pad 12 of the QFN package 1.
S3: and (3) carrying out film coating treatment on the QFN packaging piece 1.
A layer of electromagnetic shielding layer 15 is formed on the surface of the QFN package 1 in a plating mode, the electromagnetic shielding layer 15 covers the grounding pin pad 11 exposed outside the flexible adhesive layer 22 and is electrically connected with the grounding pin pad to form a zero equipotential body, and the electromagnetic shielding function is achieved.
The QFN package 1 is plated by physical vapor deposition or the like, and specifically, the electromagnetic shield layer 15 is formed by magnetron sputtering plating in the present embodiment.
S4: the temporary carrier 2 and the flexible glue layer 22 are peeled off.
In summary, the temporary carrier plate and the flexible adhesive layer with the avoiding cavity are used, the electromagnetic shielding layer electrically connected with the grounding pin pad can be plated on the QFN packaging part only through one-time pressing and film plating operation, extra pre-treatment and post-plating treatment are not needed, the process flow is simple, the shielding effect of the electromagnetic shielding plating layer is excellent, and the reliability is high.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention and is not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention are included in the scope of the present invention.
Claims (10)
1. A temporary carrier plate for coating a QFN package, which is used for temporarily carrying the QFN package in a coating process,
the temporary carrier plate comprises a bottom plate and a flexible glue layer covering the bottom plate, at least one avoiding cavity penetrating through the bottom plate is formed in the bottom plate and used for being matched with a grounding pin pad of the QFN packaging piece during film coating, and the part, outside the avoiding cavity, of the bottom plate is used for bearing a main body part of the QFN packaging piece and a functional pin pad of the QFN packaging piece.
2. The temporary carrier of claim 1, wherein the length of the inner diameter of the relief cavity is greater than the length of the ground pin pad.
3. The temporary carrier of claim 2, wherein the avoiding cavity is a cylindrical through hole, the length of the ground pin pad is M, the distance between the ground pin pad and the functional pin pad is N, the inner diameter of the through hole is D, and M is greater than or equal to D and less than or equal to M + 2N.
4. The temporary carrier of claim 3 wherein the through hole has an inner diameter D ═ M + N.
5. The temporary carrier plate according to any one of claims 1 to 4, wherein the flexible adhesive layer is a polyimide adhesive layer or an acrylic adhesive layer, and the thickness of the flexible adhesive layer is 100 to 800 μm.
6. A film coating method for a QFN package is characterized by comprising the following steps:
attaching the QFN package part on a temporary carrier plate, aligning a grounding pin pad on an avoidance cavity of a bottom plate, wherein at least part of the projection of the grounding pin pad in the vertical direction is positioned in the avoidance cavity, and the projection of a functional pin pad in the vertical direction is positioned outside the avoidance cavity;
pressing the QFN packaging piece downwards until the functional pin bonding pad is embedded into the flexible adhesive layer;
carrying out film coating treatment on the QFN packaging piece;
and stripping the temporary carrier plate.
7. The method as claimed in claim 6, wherein the projection of the ground lead pad in the vertical direction is completely disposed in the avoiding cavity.
8. The method as claimed in claim 7, wherein the avoiding cavity is a cylindrical through hole, the ground lead pad is coaxially disposed with the through hole, the ground lead pad has a length M, a distance between the ground lead pad and the functional lead pad is N, an inner diameter of the through hole is D, and M is not less than R and not more than M + 2N.
9. The method as claimed in claim 8, wherein an inner diameter D of the through hole is M + N.
10. The method for coating a QFN package as claimed in any of claims 6 to 9, wherein the flexible adhesive layer is a polyimide adhesive layer or an acrylic adhesive layer, and the thickness of the flexible adhesive layer is 100 to 800 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011524230.XA CN114657528B (en) | 2020-12-22 | 2020-12-22 | Temporary carrier plate for coating QFN package and QFN package coating method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011524230.XA CN114657528B (en) | 2020-12-22 | 2020-12-22 | Temporary carrier plate for coating QFN package and QFN package coating method |
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| CN114657528A true CN114657528A (en) | 2022-06-24 |
| CN114657528B CN114657528B (en) | 2023-12-05 |
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| JP2017220654A (en) * | 2016-06-11 | 2017-12-14 | 新日本無線株式会社 | Semiconductor device comprising electromagnetic shield, and method of manufacturing the same |
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2020
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| JP2012164798A (en) * | 2011-02-07 | 2012-08-30 | Semiconductor Components Industries Llc | Semiconductor device and manufacturing method of the same |
| CN104064553A (en) * | 2013-03-19 | 2014-09-24 | 株式会社东芝 | Semiconductor Device And Manufacturing Method Of The Semiconductor Device |
| US20170213797A1 (en) * | 2015-07-22 | 2017-07-27 | Nxp B.V. | Shielded qfn package and method of making |
| JP2017220654A (en) * | 2016-06-11 | 2017-12-14 | 新日本無線株式会社 | Semiconductor device comprising electromagnetic shield, and method of manufacturing the same |
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