CN114656889A - Stripping liquid for polyimide adhesive film and preparation method thereof - Google Patents
Stripping liquid for polyimide adhesive film and preparation method thereof Download PDFInfo
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- CN114656889A CN114656889A CN202210494986.7A CN202210494986A CN114656889A CN 114656889 A CN114656889 A CN 114656889A CN 202210494986 A CN202210494986 A CN 202210494986A CN 114656889 A CN114656889 A CN 114656889A
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- Prior art keywords
- adhesive film
- polyimide adhesive
- polyimide
- stripping
- parts
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Detergent Compositions (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention relates to a stripping liquid for polyimide and a preparation method thereof, wherein aliphatic amine, alcohol solvent and ether organic solvent can swell and strip a polyimide adhesive film on a substrate, and incompletely reacted amide in the polyimide adhesive film can further react with inorganic base, so that the stripping speed can be accelerated, and the stripping effect can be improved. According to experimental data, the film stripping liquid for polyimide can strip the polyimide film on the base material in a short time, has no residue on the polyimide film on the base material, and has a good stripping effect.
Description
Technical Field
The invention belongs to the technical field of film stripping liquid, and particularly relates to a film stripping liquid for a polyimide adhesive film and a preparation method thereof.
Background
Polyimide (PI) is a high-performance polymer containing imide rings on a main chain, PI liquid is polymerized into a polyimide film through a coating or electrostatic spinning process under the action of heat treatment or chemistry, and the PI liquid is most widely applied to actual industrial production.
The PI liquid is difficult to avoid the bad phenomena of glue shortage, pollution, uneven thickness and the like in the coating process, in order to reduce the damage of the base material, the bad PI glue film needs to be removed, the recycling of the base material is realized, and the PI glue film cannot be completely removed by the existing stripping liquid, and the base material can be corroded.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the stripping liquid for the polyimide adhesive film and the preparation method thereof are provided, can have a good stripping effect, and cannot damage or corrode a base material.
The technical scheme adopted by the invention for solving the technical problems is as follows: the stripping liquid for the polyimide adhesive film comprises the following components in parts by weight:
ether organic solvent: 50-70 parts of a solvent;
fatty amine: 14-28 parts;
anionic surfactant: 1-2 parts;
alcohol solvent: 10-25 parts;
inorganic base: 1-2 parts.
Further, the ether organic solvent is one or more of tripropylene glycol methyl ether, ethylene glycol tertiary butyl ether, dipropylene glycol propyl ether and propylene glycol butyl ether.
Further, the aliphatic amine is one or more of 1, 4-butanediamine, hexamethylenediamine, 1, 2-dimethylpropylamine and 1, 2-propanediamine.
Further, the anionic surfactant is one or more of sodium dodecyl sulfate, sodium hexadecyl sulfate and sodium dodecyl benzene sulfonate.
Further, the alcohol solvent is one or more of isopropanol, methanol and n-propanol.
Further, the inorganic base is one or a mixture of sodium hydroxide and potassium hydroxide.
Further, the film stripping liquid for the polyimide adhesive film comprises the following steps:
firstly, sequentially adding the ether organic solvent, the fatty amine, the anionic surfactant, the alcohol solvent and the inorganic base into a container according to a proportion and mixing;
and then, stirring the substances in the container at normal temperature, and obtaining the film stripping liquid for the polyimide film after stirring.
Further, the rotating speed of the stirring is 400-600 revolutions per minute.
Further, the stirring time is 8-12 minutes.
The invention has the beneficial effects that:
according to the stripping liquid for polyimide and the preparation method thereof, disclosed by the invention, the aliphatic amine, the alcohol solvent and the ether organic solvent can swell and strip the polyimide adhesive film on the substrate, and the incompletely reacted amide in the polyimide adhesive film can further react with the inorganic base, so that the stripping speed can be accelerated, and the stripping effect can be improved. According to experimental data, the film stripping liquid for polyimide can strip the polyimide film on the base material in a short time, has no residue on the polyimide film on the base material, and has a good stripping effect.
Detailed Description
The present invention will be further described with reference to the following examples, but the present invention is not limited to these examples, and any modification is within the scope of the present invention without departing from the spirit of the present invention.
The invention relates to a film stripping liquid for a polyimide adhesive film, which comprises the following components in parts by weight:
ether organic solvent: 50-70 parts, preferably 60 parts, wherein the ether organic solvent can be one or a mixture of more of tripropylene glycol methyl ether, ethylene glycol tertiary butyl ether, dipropylene glycol propyl ether and propylene glycol butyl ether;
fatty amine: 14-28 parts, preferably 20 parts, wherein the aliphatic amine can be selected from one or a mixture of more of 1, 4-butanediamine, hexamethylene diamine, 1, 2-dimethylpropylamine and 1, 2-propane diamine;
anionic surfactant: 1-2 parts, preferably 1.5 parts, wherein the anionic surfactant can be one or a mixture of sodium dodecyl sulfate, sodium hexadecyl sulfate and sodium dodecyl benzene sulfonate;
alcohol solvent: 10-25 parts, preferably 15 parts, wherein the alcohol solvent can be one or a mixture of isopropanol, methanol and n-propanol;
inorganic base: 1-2 parts, preferably 1.5 parts, wherein the inorganic base can be one of sodium hydroxide or potassium hydroxide or a mixture of the sodium hydroxide and the potassium hydroxide.
The preparation method of the film stripping liquid for the polyimide adhesive film comprises the following steps:
firstly, adding 60 parts by weight of one or more ether organic solvents, 20 parts by weight of one or more aliphatic amines, 1.5 parts by weight of one or more anionic surfactants, 15 parts by weight of one or more alcohol solvents and 1.5 parts by weight of one or more inorganic bases into a container in sequence for mixing;
and then, stirring the substances in the container at normal temperature, adjusting the rotating speed of a stirrer to be 400-600 rpm, preferably 500 rpm, and the stirring time to be 8-12 min, preferably 10 min, and obtaining the stripping liquid for the polyimide adhesive film.
Example 1
50g of tripropylene glycol methyl ether, 13g of 1, 4-butanediamine, 14g of hexamethylenediamine, 1g of sodium dodecyl sulfate, 1g of sodium hexadecyl sulfate, 10g of isopropanol, 10g of n-propanol and 1g of sodium hydroxide are added into a container to be mixed, and then stirred for 10 minutes at normal temperature at a stirring speed of 500 revolutions per minute to obtain the stripping liquid # 1.
Example 2
Adding 30g of tripropylene glycol methyl ether, 40g of ethylene glycol tert-butyl ether, 10g of 1, 2-dimethylpropylamine, 8g of 1, 2-propylene diamine, 1g of sodium dodecyl benzene sulfonate, 5g of isopropanol, 5g of methanol and 1g of potassium hydroxide into a container, mixing, and stirring at the normal temperature at the stirring speed of 500 revolutions per minute for 10 minutes to obtain the stripping liquid # 2.
Example 3
Adding 30g of dipropylene glycol propyl ether, 40g of propylene glycol butyl ether, 12g of hexamethylene diamine, 1g of sodium dodecyl benzene sulfonate, 15g of isopropanol, 10g of n-propanol, 1g of sodium hydroxide and 1g of potassium hydroxide into a container, mixing, and stirring at normal temperature at a stirring speed of 500 revolutions per minute for 10 minutes to obtain the stripping liquid # 3.
Example 4
Adding 30g of ethylene glycol tert-butyl ether, 30g of propylene glycol butyl ether, 10g of 1, 4-butanediamine, 11g of 1, 2-dimethylpropylamine, 1g of sodium dodecyl sulfate, 1g of sodium dodecyl benzene sulfonate, 25g of methanol and 2g of sodium hydroxide into a container, mixing, and stirring at the normal temperature at the stirring speed of 500 revolutions per minute for 10 minutes to obtain the stripping liquid # 4.
Example 5
Adding 50g of dipropylene glycol propyl ether, 21g of 1, 2-propylene diamine, 1g of sodium dodecyl sulfate, 1g of sodium dodecyl benzene sulfonate, 15g of isopropanol, 10g of n-propanol and 2g of potassium hydroxide into a container, mixing, and stirring at normal temperature at a stirring speed of 500 revolutions per minute for 10 minutes to obtain the stripping solution No. 5.
Example 6
Adding 30g of dipropylene glycol propyl ether, 20g of propylene glycol butyl ether, 10g of hexamethylene diamine, 12g of 1, 2-dimethylpropylamine, 0.5g of sodium dodecyl sulfate, 0.5g of sodium dodecyl benzene sulfonate, 15g of isopropanol, 10g of n-propanol, 1g of sodium hydroxide and 1g of potassium hydroxide into a container, mixing, and stirring at the normal temperature at the stirring speed of 500 revolutions per minute for 10 minutes to obtain the stripping liquid 6 #.
Comparative example 1
The stripping solution 1 is prepared from (by weight parts) N-butanol 48%, diethanolamine 14%, tetrapropylammonium hydroxide 10% and N-alkylpyrrolidone 1.8%, and pure water for balance by mixing and stirring to obtain stripping solution 7 #.
Comparative example 2
The stripping solution 2 is prepared by mixing and stirring 60% isopropanol, 10% diethanolamine, 6% tetraethylammonium hydroxide and 1.2% alkylolamide in parts by weight until the balance is made up with pure water to obtain stripping solution 8 #.
Comparative example 3
The stripping solution 3 is prepared by mixing and stirring the main components of 60% of glycerol, 16% of isopropanolamine, 9% of tetraethylammonium hydroxide and 0.8% of sodium alkyl benzene sulfonate, and the balance being pure water, and then uniformly stirring to obtain the stripping solution 9 #.
Comparative example 4
The stripping solution 4 is prepared by mixing and stirring 54 wt% of n-butanol, 22 wt% of triethanolamine, 10 wt% of diethyldimethylammonium hydroxide and 1.2 wt% of polyoxyethyleneamine, and adding pure water to balance.
The stripping solutions prepared in examples 1 to 6 and comparative examples 1 to 4 were subjected to performance tests, which were carried out according to the following procedures:
1) preparation of polyimide adhesive films for film stripping liquid tests prepared in examples 1 to 6 and comparative examples 1 to 4
Preparing 10 DuPont polyimide base materials, cleaning the surfaces of the base materials, uniformly coating a polyimide adhesive layer on the surfaces of the 10 DuPont polyimide base materials, and heating at 80 ℃ for 10 minutes to form a polyimide adhesive film on the surface of the DuPont polyimide base material;
2) coating the stripping solution on the surface of DuPont polyimide substrate coated with polyimide adhesive film
Firstly, placing 10 DuPont polyimide substrates coated with polyimide adhesive films on a heating platform to be heated, setting the temperature to be 60 ℃, then respectively and uniformly coating film stripping solutions prepared in examples 1-6 and comparative examples 1-4 on the surfaces of the prepared 10 DuPont polyimide substrates coated with polyimide adhesive films, then covering dust-free cloth on the surfaces of the DuPont polyimide substrates, and continuing to heat;
3) observe the test results
After heating for 10 minutes, taking off the dust-free cloth, lightly wiping the surface of the DuPont polyimide substrate, then flushing with water, and observing whether a polyimide adhesive film is remained on the surface of the DuPont polyimide substrate or not and the corrosion condition of the DuPont polyimide substrate by the stripping liquid, wherein the specific results are shown in Table 1;
TABLE 1 statistical tables of peeling effects of the peeling liquids obtained in examples 1 to 6
As can be seen from Table 1, after testing, the surface of the DuPont polyimide substrate coated with the stripping solution prepared in examples 1-6 had no polyimide film residue after 10 minutes, and the DuPont polyimide substrate itself had no corrosion or damage, the surface of the DuPont polyimide substrate coated with the stripping solution 7# prepared in comparative example 1 had 30% of the polyimide film residue, the DuPont polyimide substrate itself had no corrosion or damage, the surface of the DuPont polyimide substrate coated with the stripping solution 8# prepared in comparative example 2 had 10% of the polyimide film residue, the DuPont polyimide substrate itself had slight corrosion or damage, the surface of the DuPont polyimide substrate coated with the stripping solution 9# prepared in comparative example 3 had 10% of the polyimide film residue, and the DuPont polyimide substrate itself had no corrosion or damage, the surface of the dupont polyimide substrate coated with the stripping solution 10# prepared in the comparative example 4 has no polyimide adhesive film residue, but the dupont polyimide substrate itself has serious corrosion or damage.
Therefore, the stripping liquid for polyimide can strip the polyimide adhesive film on the base material in a short time, has no residue on the polyimide adhesive film on the base material, and has a good stripping effect.
In light of the foregoing description of preferred embodiments in accordance with the invention, it is to be understood that numerous changes and modifications may be made by those skilled in the art without departing from the scope of the invention. The technical scope of the present invention is not limited to the contents of the specification, and must be determined according to the scope of the claims.
Claims (9)
1. The stripping liquid for the polyimide adhesive film comprises the following components in parts by weight:
ether organic solvent: 50-70 parts of a solvent;
fatty amine: 14-28 parts;
anionic surfactant: 1-2 parts;
alcohol solvent: 10-25 parts;
inorganic base: 1-2 parts.
2. The stripping solution for the polyimide adhesive film according to claim 1, wherein the ether organic solvent is one or more of tripropylene glycol methyl ether, ethylene glycol tertiary butyl ether, dipropylene glycol propyl ether and propylene glycol butyl ether.
3. The stripping solution for polyimide adhesive film according to claim 1, wherein the aliphatic amine is one or more of 1, 4-butanediamine, hexamethylenediamine, 1, 2-dimethylpropylamine and 1, 2-propanediamine.
4. The stripping solution for polyimide adhesive film according to claim 1, wherein the anionic surfactant is one or more of sodium dodecyl sulfate, sodium hexadecyl sulfate and sodium dodecyl benzene sulfonate.
5. The stripping solution for polyimide adhesive film according to claim 1, wherein the alcohol solvent is one or more of isopropanol, methanol and n-propanol.
6. The stripping solution for polyimide adhesive film according to claim 1, wherein the inorganic base is one or a mixture of sodium hydroxide and potassium hydroxide.
7. A preparation method of a stripping liquid for a polyimide adhesive film, which comprises the stripping liquid for the polyimide adhesive film of any one of claims 1 to 6, comprises the following steps:
firstly, sequentially adding the ether organic solvent, the fatty amine, the anionic surfactant, the alcohol solvent and the inorganic base into a container according to a proportion and mixing;
and then stirring the substances in the container at normal temperature, and obtaining the film stripping liquid for the polyimide adhesive film after stirring.
8. The preparation method of the stripping solution for polyimide adhesive film according to claim 7, wherein the stirring speed is 400-600 rpm.
9. The method for preparing the stripping liquid for the polyimide adhesive film according to claim 7, wherein the stirring time is 8-12 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210494986.7A CN114656889A (en) | 2022-05-07 | 2022-05-07 | Stripping liquid for polyimide adhesive film and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210494986.7A CN114656889A (en) | 2022-05-07 | 2022-05-07 | Stripping liquid for polyimide adhesive film and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114656889A true CN114656889A (en) | 2022-06-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210494986.7A Pending CN114656889A (en) | 2022-05-07 | 2022-05-07 | Stripping liquid for polyimide adhesive film and preparation method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07311469A (en) * | 1994-05-17 | 1995-11-28 | Hitachi Chem Co Ltd | Removing solution for residue of resist after removal on polyimide resin film and production of pattern of polyimide resin film |
| JPH09283508A (en) * | 1996-04-18 | 1997-10-31 | Fujitsu Ltd | Release solution and manufacture of semiconductor device using that |
| CN108008606A (en) * | 2017-12-25 | 2018-05-08 | 宜昌南玻显示器件有限公司 | It is a kind of for the stripper solution and its production method of photosensitive dry film and application |
| CN108319118A (en) * | 2018-03-15 | 2018-07-24 | 昆山长优电子材料有限公司 | Organic stripper solution |
| CN113176718A (en) * | 2021-05-06 | 2021-07-27 | 肇庆微纳芯材料科技有限公司 | Polyimide stripping liquid, preparation method thereof and cleaning method of polyimide film |
| CN113741159A (en) * | 2021-08-27 | 2021-12-03 | 漳州思美科新材料有限公司 | PI film stripping liquid and preparation method and stripping method thereof |
-
2022
- 2022-05-07 CN CN202210494986.7A patent/CN114656889A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07311469A (en) * | 1994-05-17 | 1995-11-28 | Hitachi Chem Co Ltd | Removing solution for residue of resist after removal on polyimide resin film and production of pattern of polyimide resin film |
| JPH09283508A (en) * | 1996-04-18 | 1997-10-31 | Fujitsu Ltd | Release solution and manufacture of semiconductor device using that |
| CN108008606A (en) * | 2017-12-25 | 2018-05-08 | 宜昌南玻显示器件有限公司 | It is a kind of for the stripper solution and its production method of photosensitive dry film and application |
| CN108319118A (en) * | 2018-03-15 | 2018-07-24 | 昆山长优电子材料有限公司 | Organic stripper solution |
| CN113176718A (en) * | 2021-05-06 | 2021-07-27 | 肇庆微纳芯材料科技有限公司 | Polyimide stripping liquid, preparation method thereof and cleaning method of polyimide film |
| CN113741159A (en) * | 2021-08-27 | 2021-12-03 | 漳州思美科新材料有限公司 | PI film stripping liquid and preparation method and stripping method thereof |
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