CN114654608A - Electrolytic grinding wire cutting method for superfine diamond wire saw - Google Patents

Electrolytic grinding wire cutting method for superfine diamond wire saw Download PDF

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Publication number
CN114654608A
CN114654608A CN202210459781.5A CN202210459781A CN114654608A CN 114654608 A CN114654608 A CN 114654608A CN 202210459781 A CN202210459781 A CN 202210459781A CN 114654608 A CN114654608 A CN 114654608A
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wire
cutting
wire saw
diamond
saw
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刘勇
刘健
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Jiangsu Haihe Photoelectric New Material Co ltd
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Jiangsu Haihe Photoelectric New Material Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The invention discloses an electrolytic grinding wire cutting method for an ultrafine diamond wire saw, which comprises the following steps of S1, firstly, adopting the technological processes of paying off, rough wire drawing, fine wire drawing and wire winding to produce an ultrafine diamond bus with the diameter of 30 microns; s2, secondly, using the PLC as a logic control center to control an unreeling system, a transmission system, a swing rod system, a reeling system, a wire arranging system and a pneumatic system of the micro-drawing machine equipment, and realizing full automatic control; s3, then, on the basis of a diamond wire saw cutting machine, spraying electrolysis and cooling dual-purpose electrolyte at the wire cutting position; and S4, finally, cleaning the cut raw material. The invention combines the traditional diamond wire saw wire cutting process with the electrolysis electrochemical micro-machining process, solves the problems that the machining surface quality is lower and the metal-based silicon carbide reinforced material can not be cut when the traditional diamond wire saw cuts SiC, improves the surface quality of the cut SiC workpiece, improves the cutting efficiency and prolongs the service life of equipment.

Description

Electrolytic grinding wire cutting method for superfine diamond wire saw
Technical Field
The invention relates to the technical field of silicon carbide cutting, in particular to an electrolytic grinding wire cutting method for an ultrafine diamond wire saw.
Background
The hardness of the silicon carbide is extremely high, the Mohs hardness reaches 9.5, the silicon carbide is second to diamond, the cutting difficulty is high, and the silicon carbide belongs to a hard and brittle material. The processing flow of the silicon carbide chip comprises a plurality of procedures such as slicing, grinding, etching, polishing and the like, the slicing is used as a first procedure, and the processing quality of the slicing directly influences the final quality of the product. At present, the processing modes of the silicon carbide are mainly divided into two types: free abrasive cutting and fixed abrasive cutting. Free abrasive cutting comprises water jet cutting, free linear cutting and other modes, larger cracks and deeper damage layers can be generated on the surface of a processed workpiece, the loss is large, the efficiency is poor, the service life of equipment is short, and the method is not suitable for large-scale industrial production; the fixed abrasive machining fixes abrasive particles on a bus to manufacture a cutting tool, and the motor drives the wire saw to move so as to achieve the purpose of cutting a material to be machined. The fixed abrasive has high cutting efficiency and good quality of processed finished products, and becomes the first choice technology of most silicon carbide cutting procedures.
The main form of fixed abrasive cutting at this stage is diamond wire saw cutting. In the process of cutting silicon carbide materials by the diamond wire saw, the processing quality of a workpiece is directly related to the diameter of the diamond wire saw. On the premise of ensuring the mechanical property, the smaller the diameter of the wire saw, the larger the shearing stress, the higher the cutting efficiency, the lower the silicon wafer loss and the remarkable improvement of the processing quality. And a thinner bus is selected to be made into a diamond wire saw for cutting, so that the utilization rate of materials can be improved. How to reduce the diameter of the diamond bus on the premise of ensuring various mechanical properties of the diamond bus to further improve the cutting quality becomes one of the key technical problems to be solved urgently in the industry.
Although effective in processing silicon carbide, diamond wire saw cutting still has significant drawbacks: the product has low surface quality and is difficult to meet the requirements of precision parts; meanwhile, the traditional diamond wire saw can generate the graphitization phenomenon of the diamond coating when cutting metal, and the service life and the processing precision of the wire saw are sharply reduced, so that the metal-based silicon carbide reinforced material can not be cut. Therefore, finding a processing mode capable of precisely processing the silicon carbide material and directly processing the metal-based silicon carbide reinforced material is one of the research hotspots in the industry.
Electrochemical machining has been widely used in the production of various precision metal parts as a mature fine special machining technique. The electrochemical machining technology uses metal wires to connect with a cathode electrode, a workpiece to be machined is connected with an electrode anode, and the workpiece is subjected to electrochemical corrosion machining in electrolyte. The material processed by the method has the advantages of small kerf width, extremely low surface roughness and high surface processing quality. However, the electrochemical machining technology cannot directly machine the non-conductor material, and the electrochemical machining technology for the silicon carbide material is not formed yet. Therefore, the method for cutting the superfine diamond wire saw electrolytic grinding wire is provided by combining the diamond wire saw cutting technology and the electrochemical machining technology.
Disclosure of Invention
The invention adopts a modified technical scheme to solve the technical defects, and the method for cutting the superfine diamond wire saw electrolytic grinding wire comprises the following steps,
s1, firstly, producing an ultra-fine diamond bus by adopting the process flow of paying off, rough wire drawing, fine wire drawing and wire winding;
s2, secondly, the PLC is used as a logic control center to control the unreeling system, the transmission system, the swing rod system, the reeling system, the wire arranging system and the pneumatic system of the micro-drawing machine device, so as to realize full automatic control;
s3, then, on the basis of a diamond wire saw cutting machine, spraying electrolysis and cooling dual-purpose electrolyte at a wire cutting position, forming a current loop by the diamond wire saw, a workpiece to be processed and the electrolyte, and carrying out insulation treatment on a machine tool and the workpiece to be processed to realize the combination of electrolytic grinding and wire cutting;
and S4, finally, cleaning the cut raw materials, naturally cooling, and finishing the manufacturing after cooling.
As a further preferable aspect of the present invention, in step S1, the raw material is subjected to primary drawing by a water tank drawing machine to complete rough machining; and then, carrying out micro-drawing by using a precise micro-drawing machine to enable the diameter of the wire to reach the standard of the superfine diamond bus, and processing the surface of the wire by using a special grinding tool to ensure the surface flatness of the wire.
In a further preferred embodiment of the present invention, in step S3, an ac power supply is applied between the workpiece to be machined and the cutting wire, and electrochemical reaction occurs by utilizing conductivity of the electrolyte, thereby performing mechanical grinding and electrochemical passivation or corrosion.
In a further preferred embodiment of the present invention, in step S3, the electrolyte is NaOH solution, the spray conductivity is selected, the electrolyte is sprayed to the contact between the wire saw and the workpiece by a copper nozzle, and the electrode is held by the nozzle.
In a more preferred embodiment of the present invention, in step S3, the light tension control system for the diamond wire saw is composed of a pressure sensor, a PLC, an upper computer, and a motor.
In a more preferred embodiment of the present invention, in step S4, the cleaning solution includes a mixture of hydrochloric acid, hydrofluoric acid, and sodium bicarbonate, wherein the hydrochloric acid has a concentration of 0.5mol/L, the hydrofluoric acid has a concentration of 0.4mol/L, and the sodium bicarbonate has a concentration of 0.3 mol/L.
As a further preferable mode of the present invention, in step S1, the diameter of the ultra fine diamond wire saw is controlled to be 30-40 mm.
The invention has the following beneficial effects: the invention combines the traditional diamond wire saw wire cutting process with the electrochemical micro-machining process, solves the problems that the traditional diamond wire saw has lower processing surface quality and can not cut metal-based silicon carbide reinforced materials when cutting SiC, improves the surface quality of the cut SiC workpiece, improves the cutting efficiency and prolongs the service life of equipment.
Description of the drawings:
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a schematic diagram of an electrolytic grinding system for a diamond wire saw according to the present invention;
fig. 3 is a schematic diagram of the removal of the electrolytic grinding material of the diamond wire saw of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: an electrolytic grinding wire cutting method of an ultrafine diamond wire saw comprises the following steps,
s1, firstly, producing an ultra-fine diamond bus with the diameter of 30 microns by adopting the process flow of paying off, rough wire drawing, fine wire drawing and take-up;
s2, secondly, using the PLC as a logic control center to control an unreeling system, a transmission system, a swing rod system, a reeling system, a wire arranging system and a pneumatic system of the micro-drawing machine equipment, and realizing full automatic control;
s3, then, on the basis of a diamond wire saw cutting machine, spraying electrolysis and cooling dual-purpose electrolyte at the wire cutting position, forming a current loop by the diamond wire saw, the workpiece to be processed and the electrolyte, and carrying out insulation treatment on the machine tool and the workpiece to be processed to realize the combination of electrolytic grinding and wire cutting;
and S4, finally, cleaning the cut raw materials, naturally cooling, and finishing the manufacturing after cooling.
In step S1, performing primary drawing on the raw material through a water tank wire drawing machine to finish rough machining; and then, performing micro drawing by using a precise micro drawing machine to enable the diameter of the wire rod to reach the standard of the superfine diamond bus, and processing the surface of the wire rod by using a special grinding tool to ensure the surface flatness of the wire rod.
In step S3, an ac power supply is applied between the workpiece to be machined and the cutting line, and electrochemical reaction occurs by utilizing the conductivity of the electrolyte, thereby performing combined electrochemical passivation or corrosion at the same time of mechanical grinding.
In step S3, the electrolyte is NaOH solution, a spray conduction method is selected, the electrolyte is sprayed to the contact position of the wire saw and the workpiece to be processed by using a copper nozzle, and the electrode is clamped on the nozzle.
In step S3, a light tension control system of the diamond wire saw is composed of a pressure sensor, a PLC, an upper computer, and a motor.
In step S4, the cleaning solution includes a mixture of hydrochloric acid, hydrofluoric acid, and sodium bicarbonate, where the hydrochloric acid has a concentration of 0.5mol/L, the hydrofluoric acid has a concentration of 0.4mol/L, and the sodium bicarbonate has a concentration of 0.3 mol/L.
Firstly, the superfine diamond bus with the diameter of 30 microns is produced through the process flows of paying off, rough wire drawing, fine wire drawing and take up. Compared with the traditional diamond bus on the market, the diamond bus produced by the company has the advantages of thinner diameter, better performance, long service life and high cost performance.
The production line of the superfine diamond bus consists of an AM600 type PLC controller to form a control system, the transmission of a tension swing rod and a traction rod is controlled, the synchronous operation of light tension control and the whole machine is realized, the tension is ensured to be controllable at any time within 0.3-3N, and the superfine diamond bus can be produced for a long time without breaking; meanwhile, on the premise of ensuring the production quality, the production line can run at a higher speed, the average production speed can reach 800m/min, the high-yield and high-quality production of the superfine diamond bus is realized, and the raw material is subjected to primary drawing through a water tank wire drawing machine to finish rough machining; then, performing micro drawing by using a precise micro drawing machine to enable the diameter of the wire to reach the standard of a superfine diamond bus, and processing the surface of the wire by using a special grinding tool to ensure the surface flatness of the wire; in the processing process, an MES monitoring system is used for detecting the processing conditions of all processing links and automatically adjusting abnormal conditions.
Secondly, the PLC is used as a logic control center to control an unreeling system, a transmission system, a swing rod system, a reeling system, a wire arranging system and a pneumatic system of the micro-drawing machine, so that full-automatic control is realized, and the field operation cost is reduced; the IS620N server IS used for making adjustment aiming at different environments, so that the servo responsiveness and stability are improved, and high-precision and high-speed wire drawing operation can be realized; meanwhile, system balance PID algorithm optimization is adopted, two-stage linear processing is carried out on PID parameters, and integral suspension processing is carried out on integral saturation and overshoot running conditions reaching the target value. When the deviation is large, the system is controlled in a fast integral mode, and the influence of tension fluctuation caused by integral overshoot is solved. Under the condition of strengthening the proportional action and the integral action, the system can be ensured not to generate the integral overshoot phenomenon. If the numerical deviation is too large, the integral can be released, namely when the position deviation is too large, the static and quickly approaching integral signals are quickly integrated and accumulated to achieve the purpose of quickly returning to the right
Finally, based on the diamond wire saw cutting machine, dual-purpose electrolyte for electrolysis and cooling is sprayed at the linear cutting position, a current loop is formed by the diamond wire saw, the workpiece to be processed and the electrolyte, and the machine tool and the workpiece to be processed are subjected to insulation treatment, so that the combination of electrolytic grinding and linear cutting is realized, the cutting difficulty of silicon carbide materials is reduced, the cutting quality is optimized, and the cutting efficiency is improved; meanwhile, a light tension control system of the diamond wire saw is designed and installed, the light tension control system is composed of a pressure sensor, a PLC, an upper computer and a motor, the pressure sensor detects real-time tension signals during working, the real-time tension signals are input into the PLC and the upper computer, the tension signals are compared, the motor is adjusted and controlled to rotate, the tension floating is controlled in a small range, long-time stable cutting of the superfine diamond wire saw is achieved, the wire breakage during machining is guaranteed, and the service life of the device is prolonged.
The method is based on the existing diamond wire saw cutting system, an alternating current power supply is added between a processed workpiece and a cutting line, electrochemical reaction is generated by utilizing the conductivity of electrolyte, and electrochemical passivation or corrosion is compounded while mechanical grinding.
The test system principle is shown in fig. 2.
In the cutting process, the processed workpiece is an anode and is connected with the anode of a power supply, and the cutting line is a cathode and is connected with the cathode of the power supply. Under the action of an anode electric field, the machined workpiece is subjected to anodic oxidation and corrosion to form a passivation corrosion layer, the passivation layer is continuously scraped by the diamond abrasive particles on the cutting line, after a fresh surface is exposed, the electrochemical action is continuously performed, the removal process is continuously repeated, and the material removal mechanism is shown in figure 3.
During the processing, NaOH solution is used as electrolyte. Because a layer of diamond particles is uniformly adhered to the surface of the diamond fretsaw, the conductivity of the diamond fretsaw is poor, and the contact type conducting mode is not suitable; and because the reciprocating cutting operation is carried out by the wire saw, the abrasion of the carbon brush is increased rapidly by using the carbon brush for conducting electricity, and the working efficiency is reduced, so the method is not suitable. The project group selects a liquid spraying conduction mode, a copper nozzle is utilized to spray electrolyte to the contact position of the wire saw and a workpiece to be machined, an electrode is clamped on the nozzle, and current flows to a machining area along with the electrolyte so as to achieve the purpose of applying the current.
When the electrolytic reaction starts, the electrochemical reaction that takes place at the workpiece anode and the cutting wire cathode is:
and (3) anode reaction: 4OH--4e-→2H2O+O2↑
And (3) cathode reaction: 2H2O+2e-→H2↑+2OH-
After the electrolytic reaction, ionized OH in the solution-And h+The whole electrolyte atmosphere is filled. Since SiC has a positive potential difference with respect to the tool electrode at this time, ions are carried around SiC and oxidize SiC, at which the following reaction occurs:
SiC+4OH-+4h+→SiO+2H2O+CO↑
SiC+8OH-+8h+→SiO2+4H2O+CO2↑
SiO generated during cuttingxThe oxide may continue to react with NaOH in the electrolyte as follows:
SiO+2NaOH→Na2SiO3+H2↑
SiO2+2NaOH→Na2SiO3+H2O
reaction product Na2SiO3The water glass is a compound which is easy to dissolve in water, so that products generated by electrolytic reaction are all substances or gases which are easy to dissolve in water, and the wire cutting cannot be influenced by impurity deposition.
From the reaction equation, it can be concluded that SiC is electrolyzed to form SiO during processingxIn the main form of SiO and SiO2. SiO is unstable and is easily oxidized to form SiO2，SiO2Has a Mohs hardness of 6.5 which is less than that of SiC of 9.5, and is difficult to cutMuch smaller than SiC, so that SiC which is a material difficult to cut can be converted into SiO which is easier to cut through electrolytic reaction2And the cutting efficiency and the material processing quality are greatly improved.
The technical indexes of the diamond wire saw electrolytic grinding wire cutting machine tool are as follows:
the overall size precision of SiC finishing processing is better than that of the following steps: 2 μm
The processing surface roughness of the SiC parts is better than that of the SiC parts: ra 0.4 μm
Thirdly, the integral thickness deviation TTV of the SiC slice is less than or equal to 15 mu m, the warping degree BOW is less than or equal to 10 mu m, and the bending degree (Warp) is less than or equal to 10 mu m.
Equipment technical indexes are as follows:
wiresaw speed Vs: 0.1-3000mm/s
Workpiece feeding speed Vx: 0-15mm/min
Cutting operation period T: 1050 times 2700s
Fourthly, normal cutting force Fn: 1.4-2.5N
Tangential cutting force Ft: 0.6-1.0N
Wire saw tension F: 15N-50N
Seventhly, diameter D of the diamond wire saw: 30-250 μm
Voltage V: 20V
Ninthly, current I: 0.1A-0.28A
Electrolyte r: NaOH solution.
Figure BDA0003620118480000071
Figure BDA0003620118480000081
。
While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.

Claims (7)

1. An electrolytic grinding wire cutting method for an ultrafine diamond wire saw is characterized by comprising the following steps: comprises the following steps of (a) carrying out,
s1, firstly, producing an ultra-fine diamond bus by adopting the process flow of paying off, rough wire drawing, fine wire drawing and wire winding;
s2, secondly, using the PLC as a logic control center to control an unreeling system, a transmission system, a swing rod system, a reeling system, a wire arranging system and a pneumatic system of the micro-drawing machine equipment, and realizing full automatic control;
s3, then, on the basis of a diamond wire saw cutting machine, spraying electrolysis and cooling dual-purpose electrolyte at the wire cutting position, forming a current loop by the diamond wire saw, the workpiece to be processed and the electrolyte, and carrying out insulation treatment on the machine tool and the workpiece to be processed to realize the combination of electrolytic grinding and wire cutting;
and S4, finally, cleaning the cut raw materials, naturally cooling, and finishing the manufacturing after cooling.
2. The method for cutting the ultrafine diamond wire saw electrolytic grinding wire according to claim 1, wherein in step S1, the raw material is subjected to primary drawing by a water tank wire drawing machine to finish rough machining; and then, carrying out micro-drawing by using a precise micro-drawing machine to enable the diameter of the wire to reach the standard of the superfine diamond bus, and processing the surface of the wire by using a special grinding tool.
3. The method as claimed in claim 1, wherein an ac power is applied between the workpiece and the cutting wire in step S3, and electrochemical reaction occurs by using conductivity of the electrolyte, thereby performing electrochemical passivation or corrosion simultaneously with the mechanical grinding.
4. The method as claimed in claim 1, wherein the electrolyte solution is NaOH solution, the spray conductivity is selected, the electrolyte solution is sprayed to the contact between the wire saw and the workpiece by a copper nozzle, and the electrode is clamped on the nozzle in step S3.
5. The method for cutting the ultrafine diamond wire saw by using the electrolytic grinding wire as claimed in claim 1, wherein in step S3, the diamond wire saw is provided with a light tension control system, and the light tension control system comprises a pressure sensor, a PLC, an upper computer and a motor.
6. The method for preparing the ultrafine diamond wire saw electrolytic grinding wire cutting method according to claim 1, wherein in step S4, the cleaning solution comprises a mixture of hydrochloric acid, hydrofluoric acid and sodium bicarbonate, wherein the hydrochloric acid has a concentration of 0.5mol/L, the hydrofluoric acid has a concentration of 0.4mol/L, and the sodium bicarbonate has a concentration of 0.3 mol/L.
7. The method for cutting an ultrafine diamond wire saw electrolytically ground wire according to claim 1, wherein the diameter of the ultrafine diamond wire saw is controlled to be 30-40mm at step S1.
CN202210459781.5A 2022-04-24 2022-04-24 Electrolytic grinding wire cutting method for superfine diamond wire saw Withdrawn CN114654608A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117443983A (en) * 2023-11-20 2024-01-26 江苏海川光电新材料有限公司 Super-hard steel wire alloy wire cutting wire processing system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117443983A (en) * 2023-11-20 2024-01-26 江苏海川光电新材料有限公司 Super-hard steel wire alloy wire cutting wire processing system

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Application publication date: 20220624