CN114654039A - Method for coating tin on nickel coating layer by adopting preformed soldering lug - Google Patents
Method for coating tin on nickel coating layer by adopting preformed soldering lug Download PDFInfo
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- CN114654039A CN114654039A CN202011539397.3A CN202011539397A CN114654039A CN 114654039 A CN114654039 A CN 114654039A CN 202011539397 A CN202011539397 A CN 202011539397A CN 114654039 A CN114654039 A CN 114654039A
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- CN
- China
- Prior art keywords
- nickel
- shell
- tin
- soldering lug
- hundred
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- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 68
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 239000011248 coating agent Substances 0.000 title claims abstract description 29
- 238000000576 coating method Methods 0.000 title claims abstract description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 26
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 25
- 239000011247 coating layer Substances 0.000 title description 2
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 238000004140 cleaning Methods 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 230000006978 adaptation Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000006071 cream Substances 0.000 abstract 2
- 238000004534 enameling Methods 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 description 27
- 239000010410 layer Substances 0.000 description 23
- 241001233242 Lontra Species 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010309 melting process Methods 0.000 description 2
- 150000002815 nickel Chemical class 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application provides a method for coating tin on a nickel-plated layer by adopting a preformed soldering lug, which is applied to the field of circuit processing and used for cleaning the surface of a tin-coated nickel-plated layer shell; manufacturing a preformed soldering lug matched with the size of the nickel-plated shell; attaching the preformed soldering lug to the nickel-plated shell; carrying out preheating treatment on the nickel-plated layer shell with the pre-formed soldering lug after being attached for 2min at one hundred ℃ to two hundred ℃; the method has the advantages that the method can not solve the problems of the existing nickel-plated shell treatment method and brings the following beneficial effects, the method replaces soldering paste to be smeared to carry out pre-tin-enameling on the shell, and improves the production efficiency and the product quality while ensuring the tin-enameling effect; the preforming soldering lug of adaptation nickel coating shell can full-automatic processing, realizes intelligent operation, makes the even unanimity of soldering tin volume on the nickel coating shell, and reciprocal mechanized processing avoids appearing each soldering tin cream of soldering tin cream manual operation and all has the condition of paining the error.
Description
Technical Field
The application relates to the technical field of circuit processing, in particular to a method for coating tin on a nickel coating by adopting a preformed soldering lug.
Background
In the process of assembly and production of the conventional thick film hybrid circuit, soldering paste is required to be applied to the nickel-plated shell to achieve pre-tin-coating so as to improve the welding reliability, when the soldering paste is applied to the nickel-plated shell, manual operation is usually adopted, the operation technical requirement is high, the soldering paste on a plurality of nickel-plated shells cannot be uniformly applied, and the soldering amount cannot be accurately controlled, so that the production efficiency is low;
chinese patent CN201910701201.7 discloses a high-reliability printed circuit board assembly QFN solder mounting pretreatment method, which records: printing soldering paste containing soldering flux on the support plate through the through hole arrays on the screen plate to form soldering paste which is distributed on the support plate and is consistent with the through hole arrays, and separating the support plate from the screen plate after the soldering paste is printed; this patent document is to brush the solder paste of scaling powder on the support plate, divide the solder paste volume equally through the through-hole array of otter board structure, in order to solve what has guaranteed that the solder paste on a plurality of nickel coating shells is paintd, can assemble on the support plate through the otter board when filling into the same dosage solder paste through the through-hole on the otter board and process, however, the otter board takes out after filling into the solder paste, make the support plate carry out high temperature processing with being columnar solder paste, exist after the solder paste fully melts and wash cleanly to be difficult to, the tin pearl is many, and the solder paste on the support plate is in the melting process, it is difficult to cover all positions on the support plate completely to become the liquid of diffusion form, and then lead to the incomplete tin yield on the support plate, low, the quality is poor. And some carrier plates are deep-cavity nickel-plated carrier plates, the bottom of a deep cavity needs to be tin-plated, and screen printing cannot adapt to the operation of the deep-cavity carrier plates.
Disclosure of Invention
This application aims at solving when paining the solder paste to nickel coating shell, is usually for manual operation, operation technical requirement high, can not guarantee that the solder paste on a plurality of nickel coating shells paints even, the unable accurate control of soldering tin volume to so that the technical problem that production efficiency is low, provides an adoption preforming soldering lug to the method of tin-plating of nickel coating.
The application adopts the following technical means for solving the technical problems:
the method for coating tin on the nickel-plated layer by adopting the preformed soldering lug comprises the following steps:
s1, performing surface cleaning on the nickel-plated layer shell for tin plating;
s2, manufacturing a preformed soldering lug matched with the size of the nickel-plated layer shell;
s3, attaching the preformed soldering lug to the nickel-plated shell;
s4, performing 2min preheating treatment on the nickel-plated layer shell with the pre-formed soldering lug after the nickel-plated layer shell is attached, wherein the temperature is one hundred ℃ to two hundred ℃;
s5, performing 3S-5S high-temperature melting treatment on the preheated nickel-plated layer shell with the preformed soldering lug at two hundred to three hundred ℃;
s6, taking out the nickel-plated layer shell to which the preformed soldering lug in the molten state is adhered, and cooling the nickel-plated layer shell to indoor temperature;
and S7, cleaning the nickel plating layer shell after cooling.
Further, in the step of performing 2min preheating treatment on the attached nickel-plated layer shell with the preformed soldering lug at one hundred to two hundred degrees centigrade, the specific preheating treatment temperature is one hundred and fifty degrees centigrade.
Further, in the step of performing 3 s-5 s high-temperature melting treatment on the preheated nickel-plated layer shell with the preformed soldering lug at two hundred to three hundred ℃, the specific high-temperature melting temperature is two hundred and forty degrees centigrade.
Further, the thickness of the preformed soldering lug is 0.05 mm.
Further, the content of the soldering flux in the preformed soldering flux is 1.5%.
The application provides a method for tin coating of a nickel coating layer by adopting a preformed soldering lug, which has the following beneficial effects:
1. the tin paste is replaced to be coated to pre-coat tin on the shell, so that the tin coating effect is ensured, and the production efficiency and the product quality are improved;
2. but full automatic processing of preforming soldering lug of adaptation nickel coating shell realizes intelligent operation, makes the solder paste material on the nickel coating shell paint evenly, and preforming soldering lug covers before the heating on the nickel coating shell, avoids appearing the solder paste and covers the incomplete condition, and reciprocal machining avoids appearing each solder paste of solder paste manual operation and all has the condition of paining the error.
Drawings
FIG. 1 is an overall flow chart of one embodiment of the present application method for tin plating a nickel plating layer using a pre-formed tab.
The implementation, functional features and advantages of the present application will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It is noted that the terms "comprises," "comprising," and "having" and any variations thereof in the description and claims of this application and the drawings described above are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus. In the claims, the description and the drawings of the specification of the present application, relational terms such as "first" and "second", and the like, may be used solely to distinguish one entity/action/object from another entity/action/object without necessarily requiring or implying any actual such relationship or order between such entities/actions/objects.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1, a flow chart of a method for tin plating a nickel plating layer by using a preformed soldering lug in an embodiment of the present application is shown;
the method for coating tin on the nickel-plated layer by adopting the preformed soldering lug comprises the following steps:
s1, performing surface cleaning on the nickel-plated layer shell for tin plating;
s2, manufacturing a preformed soldering lug matched with the size of the nickel-plated shell;
specifically, the prior art describes that through placing the same screen plates on a plurality of carrier plates, the sizes of through holes on the screen plates are the same, and injecting solder paste into the through holes of the screen plates on the plurality of carrier plates, the plurality of carrier plates which are processed simultaneously have the same solder paste amount, but after the solder paste is filled in, the screen plates are taken out, so that the carrier plates and the columnar solder paste are processed at high temperature, when the solder paste is fully melted, the solder paste is difficult to wash and clean, and a large number of solder balls exist, and the solder paste on the carrier plates is difficult to completely cover all positions on the carrier plates in a diffusion-shaped liquid in the melting process, so that the tin on the carrier plates is incomplete, the yield is low, and the quality is poor; and some carrier plates are deep-cavity carrier plates, the bottom of a deep cavity needs to be tin-plated, and screen printing cannot adapt to the operation of the deep-cavity carrier plates.
The method comprises the following improvement steps of measuring the size of a nickel-plated shell (carrier plate) needing tin plating, designing preformed soldering lugs (made of the same alloy components as soldering paste) adapted to the nickel-plated shell according to the size so as to completely cover the nickel-plated shell before the step of melting the soldering lugs, avoiding dead corners and vacuum areas, synchronously covering the nickel-plated shell in the subsequent step in the heating process, achieving the effect of complete oxide on the surface of a bonding pad, and further achieving the effect of high production quality.
S3, attaching the preformed soldering lug to the nickel-plated shell;
specifically, the problems that an extra structure is needed to be arranged on the nickel-plated shell to keep equal distribution of the soldering paste in the prior art and whether the soldering paste is perfectly covered on the nickel-plated shell after being melted or not can be solved while the equal distribution is kept are solved.
S4, performing 2min preheating treatment on the nickel-plated layer shell with the pre-formed soldering lug after the nickel-plated layer shell is attached, wherein the temperature is one hundred ℃ to two hundred ℃;
specifically, one hundred degrees centigrade is too low, the preheating time is too long, and two hundred degrees centigrade is too high, so that the nickel-plated steel tube is preheated in one hundred-plated nickel.
S5, performing 3S-5S high-temperature melting treatment on the preheated nickel-plated layer shell with the preformed soldering lug at two hundred to three hundred ℃;
the high-temperature melting treatment is carried out at two hundred degrees centigrade, the temperature is too low, the melting degree is slower, the nickel-plated shell is easier to stack at a certain position of the nickel-plated shell and cannot be melted, the nickel-plated shell is melted too fast at three hundred degrees centigrade, the material of the solder paste of the nickel-plated shell in the central area is thin, and the solder paste is melted to achieve the best covering effect of the nickel-plated shell through the high-temperature treatment at two hundred and forty degrees centigrade.
S6, taking out the nickel-plated layer shell to which the preformed soldering lug in the molten state is adhered, and cooling the nickel-plated layer shell to indoor temperature;
and S7, cleaning the nickel plating layer shell after cooling.
Preferably, in the step of performing 2min preheating treatment on the attached nickel-plated layer shell with the preformed soldering lug within one hundred degrees centigrade to two hundred degrees centigrade, the specific preheating treatment temperature is one hundred and fifty degrees centigrade.
Preferably, in the step of performing the 3 s-5 s high-temperature melting treatment on the preheated nickel-plated shell with the preformed soldering lug at two hundred to three hundred degrees centigrade, the specific high-temperature melting temperature is two hundred and forty degrees centigrade.
Specifically, according to the size design of predetermined nickel coating shell, set for the preforming soldering lug of adaptation in this nickel coating shell, correspond this nickel coating shell through batch production, then place preforming soldering lug on nickel coating shell, through the preheating of two minutes one hundred fifty degrees centigrade to preforming soldering lug, further carry out two hundred forty degrees centigrade again and heat preforming soldering lug, make the soldering lug melt completely on nickel coating shell, clean again to reach the purpose that improves production efficiency and product quality.
In one embodiment, the preformed solder tabs have a thickness of 0.05 mm.
In one embodiment, the flux content in the pre-formed solder is 1.5%.
Although embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A method for coating tin on a nickel-plated layer by adopting a preformed soldering lug is characterized by comprising the following steps:
s1, performing surface cleaning on the nickel-plated layer shell for tin plating;
s2, manufacturing a preformed soldering lug matched with the size of the nickel-plated layer shell;
s3, attaching the preformed soldering lug to the nickel-plated shell;
s4, performing 2min preheating treatment on the nickel-plated layer shell with the pre-formed soldering lug after the nickel-plated layer shell is attached, wherein the temperature is one hundred ℃ to two hundred ℃;
s5, performing 3S-5S high-temperature melting treatment on the preheated nickel-plated layer shell with the preformed soldering lug at two hundred to three hundred ℃;
s6, taking out the nickel-plated layer shell to which the preformed soldering lug in the molten state is adhered, and cooling the nickel-plated layer shell to indoor temperature;
and S7, cleaning the nickel plating layer shell after cooling.
2. The method for tin-coating nickel-plated layer by using preformed soldering lug according to claim 1, wherein the specific preheating treatment temperature is one hundred and fifty degrees centigrade in the step of preheating the nickel-plated shell with preformed soldering lug after being attached for 2min within one hundred and two hundred degrees centigrade.
3. The method for coating tin on the nickel-plated layer by adopting the preformed soldering lug according to claim 1, wherein in the step of performing 3 s-5 s high-temperature melting treatment on the preheated nickel-plated shell with the preformed soldering lug at two hundred degrees centigrade to three hundred degrees centigrade, the specific high-temperature melting temperature is two hundred and forty degrees centigrade.
4. The method for tin coating a nickel plating layer with a preformed lug according to claim 1, wherein the thickness of the preformed lug is 0.05 mm.
5. The method for tin coating a nickel plating layer by using a preformed soldering lug as claimed in claim 1, wherein the content of the soldering flux in the preformed soldering lug is 1.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011539397.3A CN114654039A (en) | 2020-12-23 | 2020-12-23 | Method for coating tin on nickel coating layer by adopting preformed soldering lug |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011539397.3A CN114654039A (en) | 2020-12-23 | 2020-12-23 | Method for coating tin on nickel coating layer by adopting preformed soldering lug |
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| Publication Number | Publication Date |
|---|---|
| CN114654039A true CN114654039A (en) | 2022-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011539397.3A Pending CN114654039A (en) | 2020-12-23 | 2020-12-23 | Method for coating tin on nickel coating layer by adopting preformed soldering lug |
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| CN (1) | CN114654039A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106134330B (en) * | 2010-11-02 | 2013-02-27 | 北京卫星制造厂 | A kind of high soldering rate vacuum welding method based on plasma cleaning |
| CN103934534A (en) * | 2014-04-15 | 2014-07-23 | 北京卫星制造厂 | Vacuum welding method for thick film substrate and power shell |
| CN105977173A (en) * | 2016-05-20 | 2016-09-28 | 北京华航无线电测量研究所 | High-penetration-rate semiconductor bare chip manual eutectic welding method |
| CN105965120A (en) * | 2016-06-03 | 2016-09-28 | 湖北三江航天险峰电子信息有限公司 | Semi-automatic eutectic soldering method of GaAs microwave power amplifier chip and product |
| CN107316820A (en) * | 2017-06-22 | 2017-11-03 | 中科迪高微波系统有限公司 | A kind of process of microwave chip eutectic welding |
| CN107433400A (en) * | 2017-07-28 | 2017-12-05 | 广州汉源新材料股份有限公司 | A kind of preformed solder for including scaling powder and preparation method thereof |
| CN208680800U (en) * | 2018-06-01 | 2019-04-02 | 广州汉源新材料股份有限公司 | A kind of low void fraction preformed soldering |
| CN110449683A (en) * | 2019-07-31 | 2019-11-15 | 嘉兴军胜电子科技有限公司 | A kind of highly reliable application printed circuit board assembly QFN welding equipment preprocess method |
| CN111112842A (en) * | 2019-12-24 | 2020-05-08 | 中国电子科技集团公司第三十八研究所 | Gold-removing tin-coating method and application |
| CN111168183A (en) * | 2020-01-06 | 2020-05-19 | 北京新雷能科技股份有限公司 | Welding method for components in cavity product |
-
2020
- 2020-12-23 CN CN202011539397.3A patent/CN114654039A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106134330B (en) * | 2010-11-02 | 2013-02-27 | 北京卫星制造厂 | A kind of high soldering rate vacuum welding method based on plasma cleaning |
| CN103934534A (en) * | 2014-04-15 | 2014-07-23 | 北京卫星制造厂 | Vacuum welding method for thick film substrate and power shell |
| CN105977173A (en) * | 2016-05-20 | 2016-09-28 | 北京华航无线电测量研究所 | High-penetration-rate semiconductor bare chip manual eutectic welding method |
| CN105965120A (en) * | 2016-06-03 | 2016-09-28 | 湖北三江航天险峰电子信息有限公司 | Semi-automatic eutectic soldering method of GaAs microwave power amplifier chip and product |
| CN107316820A (en) * | 2017-06-22 | 2017-11-03 | 中科迪高微波系统有限公司 | A kind of process of microwave chip eutectic welding |
| CN107433400A (en) * | 2017-07-28 | 2017-12-05 | 广州汉源新材料股份有限公司 | A kind of preformed solder for including scaling powder and preparation method thereof |
| CN208680800U (en) * | 2018-06-01 | 2019-04-02 | 广州汉源新材料股份有限公司 | A kind of low void fraction preformed soldering |
| CN110449683A (en) * | 2019-07-31 | 2019-11-15 | 嘉兴军胜电子科技有限公司 | A kind of highly reliable application printed circuit board assembly QFN welding equipment preprocess method |
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| CN111168183A (en) * | 2020-01-06 | 2020-05-19 | 北京新雷能科技股份有限公司 | Welding method for components in cavity product |
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