CN114647136B

CN114647136B - Video camera

Info

Publication number: CN114647136B
Application number: CN202011518538.3A
Authority: CN
Inventors: 周斌
Original assignee: Hangzhou Hikvision Digital Technology Co Ltd
Current assignee: Hangzhou Hikvision Digital Technology Co Ltd
Priority date: 2020-12-21
Filing date: 2020-12-21
Publication date: 2023-11-21
Anticipated expiration: 2040-12-21
Also published as: CN114647136A

Abstract

The invention discloses a camera. The camera comprises a shell, a main board assembly and a heat storage assembly (30), wherein the main board assembly is provided with an elastic element and an electromagnet (24); the heat storage assembly is provided with an iron part, one side of the heat storage assembly is provided with a first heat conduction pad (34), the side of the heat storage assembly is in abutting contact with the elastic element, and when no current is applied to the electromagnet (24), a first gap height larger than the thickness of the first heat conduction pad is arranged between the heat storage assembly and the main board assembly; when the electromagnet (24) is energized, there is a smaller second gap height between the motherboard assembly and the thermal storage assembly such that heat generated by the motherboard assembly is transferred to the thermal storage assembly via the first thermal pad (34). The camera of the invention utilizes the movable heat accumulator to radiate heat of the camera, which is beneficial to avoiding the phenomenon that the temperature of electronic elements in the camera is too high to work normally under intermittent high-temperature environment and is beneficial to realizing miniaturization of the camera.

Description

Video camera

Technical Field

The invention relates to the technical field of imaging, in particular to a camera.

Background

In the prior art, the camera adopting the heat storage material for heat dissipation is always in a heat conduction state with the heating element and the shell. In this way, under the high-temperature environment, the heat storage material absorbs the heat of the heating element and the shell at the same time, and the total heat quantity absorbed by the heat storage material from the heating element is reduced; when the ambient temperature is reduced, the heat storage material radiates heat to the shell, and simultaneously absorbs the heat of the heating element, so that the heat radiation effect is poor, and the time for the heat storage material to release the heat to be below the phase transition temperature is prolonged. Therefore, the heat storage material is not fully utilized to radiate heat from the camera.

Disclosure of Invention

The invention aims to provide a camera for further improving heat dissipation performance.

The invention provides a camera, which comprises a shell, a main board component and a heat storage component (30), wherein the main board component and the heat storage component are arranged in the shell,

an elastic element and an electromagnet are arranged on one surface of the main board assembly, and an electronic element is arranged on the main board assembly;

the heat storage assembly is provided with an iron part, a first heat conduction pad is arranged on one side of the heat storage assembly, which faces the main board assembly, the side of the heat storage assembly, which faces the main board assembly, is abutted against the elastic element, when no current is applied to the electromagnet, a first gap height is arranged between the heat storage assembly and the main board assembly, and the first gap height is larger than the thickness of the first heat conduction pad;

when the electromagnet is applied with current, the main board component and the heat storage component are attracted by the magnet, the gap height between the main board component and the heat storage component is reduced from the first gap height to the second gap height, the second gap height is smaller than the thickness of the first heat conduction pad, and when the gap height between the main board component and the heat storage component is the second gap height, heat generated by the electronic component arranged on the main board component is transferred to the heat storage component through the first heat conduction pad.

Preferably, the main board assembly comprises a main board and a main board fixing metal plate, the main board is fixedly connected with the main board fixing metal plate, the main board fixing metal plate is fixedly installed relative to the shell, and the elastic element is arranged between the main board fixing metal plate and the heat storage assembly.

Preferably, the electromagnet and the elastic element are arranged on one side of the main board fixing metal plate, which faces the main board, and when the main board and the main board fixing metal plate are fixedly connected, the elastic element and the electromagnet pass through corresponding penetrating holes arranged on the main board.

Preferably, the number of the electromagnets is two or more, and the electromagnets are symmetrically arranged with the CPU on the main board as a center; the number of the elastic elements is two or more, and the elastic elements are symmetrically arranged with the CPU on the main board as a center.

Preferably, a third heat conducting pad is arranged on one side, facing the main board, of the main board fixing metal plate, and the main board is in surface contact with the third heat conducting pad when the main board is fixedly connected with the main board fixing metal plate, wherein the position of the third heat conducting pad corresponds to the position of the CPU on the main board.

Preferably, one side of the main board fixing metal plate, which is away from the main board, is provided with a second heat conducting pad, and the main board fixing metal plate is in heat conduction with the shell through the second heat conducting pad, so that heat generated by the electronic element of the camera can be dissipated to the shell through the main board fixing metal plate and the second heat conducting pad.

Preferably, the two ends of the main board fixing metal plate are provided with bending end plates, and the bending end plates are provided with mounting holes for being fastened with the shell or a mounting bracket in the shell so that a second heat conduction pad on the main board fixing metal plate is in surface contact with the shell.

Preferably, a fourth thermal pad is disposed on the heat storage assembly facing away from the main plate assembly, and is in surface contact with the housing when the heat storage assembly and the main plate assembly are in a state corresponding to the first gap height, and is out of contact with the housing when the heat storage assembly and the main plate assembly are in a state corresponding to the second gap height.

Preferably, the iron portion in the heat storage assembly is provided at a position facing the electromagnet on the main plate fixing sheet metal.

Preferably, the resilient element is a spring, preferably a coil spring or a leaf spring.

Preferably, the camera includes a control unit and a temperature sensor that detects a temperature inside the camera and transmits detection information to the control unit, the control unit controlling the electromagnet according to the detection information,

when the detected temperature of the temperature sensor reaches and/or exceeds a first set temperature threshold value, the control unit controls power supply to the electromagnet, and enables the electromagnet to act so as to drive the heat storage assembly to the following positions: the gap height between the thermal storage assembly and the motherboard assembly is the second gap height,

when the detected temperature of the temperature sensor is lower than a second set temperature threshold value, the control unit controls the electromagnet to be powered off, so that the heat storage assembly is positioned at the following positions under the action of the elastic element: the gap height between the heat storage assembly and the motherboard assembly is the first gap height.

The camera of the invention uses the movable heat accumulator to radiate the camera, which is beneficial to avoiding the situation that the temperature of the electronic element in the camera is too high to work normally under intermittent high temperature environment and is beneficial to realizing the miniaturization of the camera, wherein the second set temperature threshold is 0-10 degrees lower than the first set temperature threshold.

Drawings

Fig. 1 is a schematic exploded view of a video camera according to a first embodiment of the invention.

Fig. 2 and 3 are schematic views of a main fixing assembly.

Fig. 4 is a schematic view of the main fixing assembly assembled with the main board.

Fig. 5 is a schematic view of a thermal storage assembly.

Fig. 6 is a schematic diagram of the entire heat storage assembly in an exothermic state.

Fig. 7 is a partial schematic view of the heat storage assembly in an exothermic state.

Fig. 8 is a schematic diagram of the whole heat storage assembly in a heat absorption state.

Fig. 9 is a partial schematic view of the heat storage assembly in the endothermic state.

Reference numerals:

11	front cylinder	24	Electromagnet
				12	Rear cylinder	25	Second heat conduction pad
13	Lens	26	CPU
				14	Lens fixing sheet metal	30	Heat storage assembly
15	Main board	31	Heat accumulator
				16	Front end plate	32	Iron block
20	Main fixing assembly	33	Buckle
				21	Sheet metal is fixed to mainboard	34	First heat conduction pad
22	Third heat conduction pad	35	Fourth heat conduction pad
				23	Spring	211	Bending end plate

Detailed Description

In the drawings, the same or similar reference numerals are used to denote the same or similar elements or elements having the same or similar functions. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

In the description of the present invention, the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate an orientation or a positional relationship based on that shown in the drawings, only for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of the present invention.

The monitoring camera is used for outdoor scenes, and the normal operation of the camera in the high-temperature environment in afternoon in summer needs to be considered. Most outdoor cameras are sealed products, and the heat inside the camera is dissipated to the environment through the camera housing. At present, the heat dissipation of the camera basically considers the steady-state heat dissipation process, and large heat dissipation power consumption necessarily corresponds to large heat dissipation area of the shell, which is contradictory with the miniaturization of the camera.

The outdoor environment is high in temperature and most frequently occurs at about 0-4 pm in summer, and the environment temperature is relatively low in other time periods. Therefore, the invention provides the camera with the heat accumulating type heat dissipation structure, which takes the intermittence of a high-temperature environment in the outdoor use process into consideration, so that the heat accumulating structure in the camera can absorb and release heat selectively, and good heat dissipation is realized, so that the camera can work continuously and normally.

As shown, a camera according to an embodiment of the present invention includes: a housing, a motherboard assembly, and a thermal storage assembly 30. The motherboard assembly and the thermal storage assembly 30 are disposed within the housing. The main board assembly can generate heat in operation, and is a heating body. The camera of this embodiment is also provided with an electromagnet 24 as a drive unit. The driving unit can drive the heat storage assembly 30 or the heat storage body 31 thereof to selectively conduct heat with the heating body or the shell, thereby realizing selective heat absorption and heat release of the heat storage body. And the heat radiation performance is improved so as to ensure that the camera continuously and normally works.

The housing is sealed, or substantially closed. The shape, configuration, etc. of the housing is not limited to the illustrated embodiment, but may take any suitable shape and configuration. For example, the housing includes a front barrel 11 and a rear barrel 12 connected to each other. The lens 13 of the camera is disposed in the front barrel 11, and the heating element, the heat accumulator 31, and the driving unit are disposed in the rear barrel 12.

An elastic element and an electromagnet 24 are arranged on one surface or one side of the main board assembly, and an electronic element is arranged on the main board assembly.

The heat storage assembly 30 has an iron portion, a side of the heat storage assembly facing the main plate assembly is provided with a first thermal pad 34, and a side of the heat storage assembly 30 facing the main plate assembly abuts against the elastic element, and when no current is applied to the electromagnet 24, the heat storage assembly 30 and the main plate assembly have a first gap height therebetween, and the first gap height is greater than the thickness of the first thermal pad 34.

When the electromagnet 24 is applied with current, the magnetic iron attracts the main board assembly and the heat storage assembly 30, the gap height between the main board assembly and the heat storage assembly is reduced from the first gap height to a second gap height, the second gap height is smaller than the thickness of the first heat conducting pad 34, and when the gap height between the main board assembly and the heat storage assembly 30 is the second gap height, heat generated by the electronic component arranged on the main board assembly is transferred to the heat storage assembly 30 via the first heat conducting pad 34.

That is, the heat accumulator is disposed within the housing and is movable between a first operating position (corresponding to the second gap height) and a second operating position (corresponding to the first gap height). In the first working position, the heat accumulator is in thermal conduction with the heater body and is disconnected from thermal conduction with the shell; in the second operating position, the heat accumulator 31 is thermally connected to the casing, and is disconnected from the heat generator. The specific shape, structure, material, etc. of the heat accumulator can be set according to the needs, for example, the heat accumulator can be made of solid-liquid phase change material. When the ambient temperature is high, the latent heat of phase change of the heat accumulator is utilized to absorb a part of heat of the camera; when the ambient temperature is low, the heat accumulator releases heat to the external environment.

The electromagnet provides a driving force for the movement of the heat storage assembly 30 or the heat storage body 31 between the first operating position and the second operating position. The electromagnet can also be replaced by a driving unit such as a hydraulic cylinder, an air cylinder, a linear motor and the like.

The camera of the invention utilizes the movable heat accumulator or the heat accumulation assembly to radiate heat of the camera, thereby being beneficial to improving the utilization efficiency of the heat accumulator and better avoiding the phenomenon that the temperature in the camera is too high to work normally.

In the illustrated embodiment, the housing is composed of a front barrel 11 and a rear barrel 12, and components such as a lens 13, a lens fixing sheet metal 14, a front end plate 16, and the like are also provided in the housing. The lens 13 and the front end plate 16 are fixed on the lens fixing sheet metal 14; the lens fixing sheet metal 14 is attached to the camera front barrel 11 by screw locking.

It should be noted that the structure of the camera of the present invention is not limited to the illustrated embodiment, and for example, the camera of the present invention may be any suitable form such as a dome camera, a card machine, etc.

The main board assembly comprises a main board 15 and a main board fixing metal plate 21, wherein the main board 15 is fixedly connected with the main board fixing metal plate 21, for example, by adopting a screw member. The main board fixing metal plate 21 is fixedly installed relative to the shell, and is connected by a screw member. The elastic element is disposed between the main plate fixing sheet metal 21 and the heat storage assembly 30.

The electromagnet 24 and the elastic element are disposed on one side of the motherboard fixing metal plate 21 facing the motherboard 15, and when the motherboard 15 and the motherboard fixing metal plate 21 are fixedly connected, the elastic element and the electromagnet 24 pass through corresponding penetrating holes disposed on the motherboard 15.

The number of electromagnets 24 is two or more, and symmetrically arranged with the CPU on the main board 15 as the center; the number of the elastic members is two or more, and is symmetrically arranged centering on the CPU on the main board 15.

Specifically, in the illustrated embodiment, a spring 23 (e.g., welded-in) and an electromagnet 24 (e.g., welded-in or screw-locked) are provided on the motherboard-securing sheet metal 21, forming a main securing assembly 20 (see fig. 2 and 3). A thermal storage assembly 30 (see fig. 5) is added to the back side of the main plate 15. The back side of the motherboard is the side facing away from the motherboard fixing sheet metal 21. The thermal storage assembly 30 includes the thermal storage body 31. The heat storage assembly 30 is fixedly connected with the spring 23 on the main fixing assembly 20 by a buckle 33. Wherein the electromagnet serves as a drive unit. The electromagnet 24 is fixed to the housing, and an iron block 32 corresponding to the electromagnet 24 is provided on the heat storage body 31.

The iron block 32 is one of the specific embodiments of the iron portion of the thermal storage assembly 30, but the iron portion of the present invention may take other forms, structures and installation positions, as long as the iron portion can cooperate with the electromagnet to perform magnetic attraction.

An iron block 32 is provided on a side of the heat storage body 31 facing the main plate 15. Alternatively, the iron portion (iron piece 32) in the heat storage assembly 30 is provided at a position facing the electromagnet 24 on the main plate fixing sheet metal 21.

As previously mentioned, the camera comprises an elastic unit which exerts an elastic force on the heat accumulator 31, so that the heat accumulator 31 is in the second operating position when the drive unit is not operating. The elastic unit may be in the form of a compression spring of the illustrated spring 23, may be in the form of a tension spring, may be in the form of a coil spring or a leaf spring, etc., and may be in any suitable structure such as a rubber washer, etc., as long as the elastic force can be applied. The drive unit is operated or activated so that the heat accumulator 31 is moved to the first operating position against the elastic force of the elastic unit.

The springs 23 and electromagnets 24 may be secured to the motherboard securing sheet metal 21 in any suitable manner of securement. In the illustrated embodiment, the spring 23 is welded; the electromagnet 24 is welded or screw locked. Specifically, one end of the spring 23 is fixedly connected to the motherboard fixing metal plate 21, and the other end of the spring 23 is connected with the heat accumulator 31 through a buckle 33. The spring 23 is provided on the side of the main board fixing sheet metal 21 facing the main board 15. The electromagnet 24 is also provided on the side of the motherboard fixing sheet metal 21 facing the motherboard 15. Correspondingly, a spring mounting hole and an electromagnet mounting hole are formed in the corresponding positions of the main board.

The main fixing assembly 20 comprises a main board fixing metal plate 21, a third heat conducting pad 22, a spring 23, an electromagnet 24 and a second heat conducting pad 25. The motherboard fixing sheet metal 21 is fixedly connected to the housing and is in thermal conduction with the housing. Specifically, the motherboard fixing metal plate 21 is provided with a third heat conductive pad 22 on a side thereof facing the motherboard 15, and a second heat conductive pad 25 on a side opposite to the third heat conductive pad 22.

Referring to fig. 2, the number of springs 23 is 4, and the springs 23 are distributed in a rectangular shape, and each spring 23 and the motherboard fixing sheet metal 21 are fixed by soldering. Accordingly, the number of electromagnets 24 is, for example, two, and is disposed symmetrically about the center of the rectangle. Thus, the stability of operation is improved.

The third heat conductive pad 22 and the second heat conductive pad 25 are attached to the motherboard fixing metal plate 21 by back adhesion. The third heat conductive pad 22 and the spring 23 are located on the same surface (same side) of the motherboard fixing metal plate 21. The third heat conductive pad 22 is located at the center position of four springs 23 arranged in a rectangular shape, the position corresponding to the position of the CPU 26 on the main board 15. That is, in the illustrated embodiment, the heat generating body is a main board 15, the main board 15 can be fixedly mounted to the main board fixing sheet metal 21 in any suitable manner such as screw connection, and a CPU 26 is provided on the main board 15, wherein the CPU 26 is provided at the center of the rectangle.

As shown in fig. 2, the electromagnet 24 is fixed to the motherboard fixing sheet metal 21 by screw locking, or fixing glue, or welding. The number of electromagnets 24 is two and symmetrically distributed about the third thermal pad 22. In the width direction of the main plate fixing sheet metal 21, the electromagnet 24 is located in the middle of the two springs 23.

Referring to fig. 3, the second heat-conducting pad 25 is adhered to the motherboard fixing metal plate 21 by back adhesive, and is distributed on different surfaces of the motherboard fixing metal plate 21 with the third heat-conducting pad 22, and the position corresponds to the third heat-conducting pad 22.

The main plate 15 is fixed to the main fixing assembly 20 by screw fixing or other means. Specifically, as shown in fig. 6, the main board 15 is fixed on the main board fixing sheet metal 21.

The main plate 15 is provided with spring mounting holes, electromagnet mounting holes at positions corresponding to the four springs 23 and the two electromagnets 24. After the screws for fixing the main board 15 are locked, the CPU 26 on the main board 15 is in contact with the third heat conductive pad 22. For example, the compression amount of the third heat conduction pad 22 is between 10% and 30%, and the heat conduction is realized between the main board 15 and the main board fixing metal plate 21. The anode and cathode of the electromagnet 24 are connected to the main board 15 by wires. A control unit (e.g., a single-chip microcomputer) of the main board 15 intelligently controls whether the electromagnet 24 is powered on or not according to the temperature sensor data.

The main fixing assembly 20 is attached to the rear barrel 12 of the camera by means of a screw lock. The second thermal pad 25 in the main fixture assembly is in contact with the rear barrel 12, for example, such that the second thermal pad 25 compresses between 10% -30%, and the main fixture assembly 20 is in thermal communication with the rear barrel 12. Specifically, the two ends of the motherboard fixing metal plate 21 are provided with bending end plates 211, and the bending end plates 211 are provided with mounting holes for fastening with the housing or a mounting bracket in the housing, so that the second heat conduction pad 25 on the motherboard fixing metal plate 21 is in surface contact with the housing. The bending end plate 211 is bent at an angle of about 90 degrees with respect to the main body of the main plate fixing sheet metal 21, and the bending directions of the bending end plates at both ends are opposite. Thereby, the installation of the bending end plate is facilitated and the space in the housing is utilized.

Referring to fig. 5, the thermal storage assembly 30 includes a thermal storage body 31, an iron block 32, a buckle 33, a first thermal pad 34, and a fourth thermal pad 35.

The thermal mass 31 is filled with a thermal mass material that is in thermal communication with the thermal mass housing. The heat accumulating material is phase change material, and has the advantages of high heat accumulating density (200 kJ/kg), isothermal heat accumulating and releasing process, easy control, etc. The phase transition temperature may be set as desired, in an alternative embodiment, between 40-70 degrees celsius, or preferably, in the range of 45-65 degrees celsius.

The clasp 33 is secured to the heat reservoir 31, such as fixedly attached to the heat reservoir housing, by an integral molding, welding, or a fixing glue, or the like, as appropriate. In the illustrated embodiment, the number of the buckles 33 is four, and the buckles are distributed in a rectangular shape, and the positions of the buckles correspond to the springs 23.

The first thermal pad 34 is adhered to the heat accumulator 31 by a back adhesive, is located on the same side as the buckles 33, and is located at the center of four buckles 33 arranged in a rectangular shape, in other words, at the diagonal intersection of the rectangular shape. The position of the first thermal pad 34 corresponds to the position of the CPU 26 on the motherboard 15. That is, a first thermal pad 34 is provided on a side of the thermal mass 31 facing the main plate 15, and a fourth thermal pad 35 is provided on a side of the thermal mass 31 opposite to the first thermal pad 34.

The iron pieces 32 are fixed to the heat storage body 31 by welding, screwing, or the like in a suitable manner, and the positions of the iron pieces 32 are symmetrically distributed with respect to the first heat conductive pad 34. In one embodiment, the housing of the heat accumulator 31 is made of a ferrous material, so that no additional iron block 32 is required.

The fourth thermal pad 35 is adhered to the heat accumulator 31 by a suitable means such as a back adhesive, and is disposed opposite to the first thermal pad 34. The fourth thermal pad 35 is in surface contact with the housing when the thermal storage assembly 30 and the motherboard assembly are in a state corresponding to the first gap height, and the fourth thermal pad 35 is out of contact with the housing when the thermal storage assembly 30 and the motherboard assembly are in a state corresponding to the second gap height.

The two operating states of the thermal storage assembly 30 are an exothermic state and an endothermic state, respectively. The entire machine is schematically shown in fig. 6 in the exothermic state, and the positional relationship between the heat storage assembly 30 and the main fixing assembly 20 is schematically shown in fig. 7. The whole machine is schematically shown in fig. 8 in the endothermic state, and the positional relationship between the heat storage assembly 30 and the main fixing assembly 20 is schematically shown in fig. 9.

At normal temperature, the camera is in a heat-releasing state of the heat storage component. The temperature sensor on the main board 15 detects a temperature less than the first set temperature threshold or the aforementioned second set temperature threshold (which is less than the first set temperature threshold). The control unit of the main board 15 determines that the execution electromagnet is not electrified at this time; the spring 23 is in a first compressed state (the amount of compression is small), see fig. 6. The heat storage assembly 30 is disengaged from the main plate 15 by the springs 23, and the thermal path between the heat storage body 31 and the main plate 15 is disconnected. Meanwhile, under the action of the spring 23, the fourth heat conduction pad 4 on the heat storage component 30 is in good contact with the rear barrel 12 of the camera, the compression amount of the fourth heat conduction pad 35 is between 10% and 30%, and the heat storage component 30 is in thermal conduction with the rear barrel 12 of the camera. The heat storage assembly 30 radiates heat to the outside of the camera through the rear cylinder 12. This state is an exothermic state of the thermal storage assembly 30.

In one embodiment, the phase change temperature is set to be greater than the first set temperature threshold, e.g., preferably the phase change temperature is set to be between 5-20 degrees different from the first set temperature threshold.

The first set temperature threshold is, for example, 50 degrees, and the phase transition temperature is 55 degrees (at this time, the temperature of the main board is, for example, 60 degrees), so that the CPU can be cooled and the CPU is prevented from further increasing in temperature. That is, the camera interior air temperature is 50 degrees at this time. In the case of stable operation, the camera interior air temperature is, for example, generally about 10 degrees higher than the air temperature of the external environment. That is, the normal temperature state refers to a non-high temperature state, for example, an environment temperature of less than 40 degrees or not more than 40 degrees. It is understood that the temperature upper limit value of the normal temperature state is exemplary.

In one embodiment of the invention, the camera comprises a control unit and a temperature sensor, which detects the temperature inside the camera and transmits detection information to the control unit, which controls the electromagnet 24 based on the detection information,

in the case where the detected temperature of the temperature sensor reaches and/or exceeds a first set temperature threshold, the control unit controls the power supply to the electromagnet 24 and causes the electromagnet 24 to operate, driving the heat storage assembly 30 to the following position: the gap height between the thermal storage assembly and the motherboard assembly is the second gap height,

in the case where the detected temperature of the temperature sensor is lower than a second set temperature threshold, the control unit controls the interruption of the power supply to the electromagnet 24 so that the heat storage assembly 30 is in the following position under the action of the elastic element: the gap height between the heat storage assembly and the motherboard assembly is the first gap height.

Wherein the second set temperature threshold is equal to or lower than the first set temperature threshold by 0-10 degrees.

Specifically, the temperature sensor detects the temperature inside the camera and transmits detection information to the control unit, and the control unit controls the driving unit according to the detection information. For example, a temperature sensor detects the temperature of air inside the camera, or detects the temperature of the CPU. It should be noted that the specific temperature measurement locations will be different, such that the corresponding control temperatures will be correspondingly different. And the detected internal air temperature is not the temperature of the main board but may be lower than the temperature of the main board. In one embodiment, both the control unit and the temperature sensor are provided on the motherboard 15.

The control unit (specifically, the CPU 26 or the single-chip microcomputer) on the main board 15 reads the temperature sensor data in real time and autonomously makes logic judgment according to the data, and performs power-on or power-off operation on the electromagnet 24, so that two position states of the heat storage component 30 relative to the main fixed component 20 are correspondingly changed, two working states of the camera are intelligently switched, and the requirement of short-time high-temperature working of the camera is met.

When the detected temperature of the temperature sensor reaches and/or exceeds a first set temperature threshold, the control unit controls the driving unit to supply power, and enables the driving unit to act so as to drive the heat accumulator 31 to the first working position. It may be further configured that the control unit controls the interruption of the power supply to the driving unit to drive the heat accumulator 31 to the second operation position by an elastic member in a case where the detected temperature of the temperature sensor is lower than a first set temperature threshold.

In another control manner, when the detected temperature of the temperature sensor reaches and/or exceeds a first set temperature threshold, the control unit controls the driving unit to supply power, and makes the driving unit operate to drive the heat accumulator 31 to the first working position. It may be further configured that the control unit controls the interruption of the power supply to the driving unit to drive the heat accumulator 31 to the second operation position by an elastic member in a case where the detected temperature of the temperature sensor is lower than a second set temperature threshold. Wherein the second set temperature threshold is less than the first set temperature threshold.

As described previously, the thermal storage assembly 30 has the first operating position and the second operating position, and is movable between the first operating position and the second operating position. In the first operating position, the heat accumulator 31 is in thermal conduction with the heat generating unit and is disconnected from thermal conduction with the housing, and this state is an endothermic state of the heat accumulating module 30 or the heat accumulator 31. In the heat absorbing state, the heat storage assembly 30 is capable of absorbing heat from the heat generating unit. In the second operating position, the heat accumulator 31 is in thermal communication with the housing and is disconnected from thermal communication with the housing, which is the exothermic state of the heat storage assembly 30. In the heat release state, the heat storage assembly 30 can release heat to the outside of the camera through the rear tube 12.

When the ambient temperature rises, the control unit of the main board 15 sends a control signal to energize the electromagnet 24 when the detected temperature of the temperature sensor on the main board 15 exceeds the first set temperature threshold. When the electromagnet 24 is energized, the iron block 32 on the heat storage assembly 30 is attracted, and the attraction compresses the spring 23 further, so that the spring is in the second compressed state. At this time, the electromagnet 24 is in contact with the iron piece 32, see fig. 8 and 9. At this time, the first thermal pad 34 on the thermal storage assembly 30 is in good contact with the main plate 15, the compression amount is between 10% and 30%, thermal conduction is achieved, and the main plate 15 transfers heat to the thermal storage assembly 30. The fourth thermal pad 35 on the thermal storage assembly 30 is disengaged from the camera housing (e.g., specifically, the rear barrel 12), and the thermal path is broken. This state is the endothermic state of the thermal storage assembly 30.

In the endothermic state of the heat storage assembly 30, a part of the heat of the CPU 26 of the main board 15 is transferred to the camera rear barrel by the main fixing assembly 20 through the main board front face (upper side of the main board in fig. 8) to dissipate the heat. A part of the heat of the CPU 26 of the main board 15 is also transferred to the heat storage assembly 30 through the back surface of the main board (the lower side of the main board in 8); the heat storage body 31 in the heat storage assembly 30 contains a heat storage material, has a large latent heat of phase change, and can keep the CPU 26 at a low temperature for a long time. That is, in a high temperature state, the main plate 15 releases heat to both the ambient air and the heat accumulator 31.

When the ambient temperature is reduced and the temperature detected by the temperature sensor on the main board 15 is lower than the set value B, the control unit logic of the main board 15 judges that the executive electromagnet is not electrified; the attractive force between the electromagnet and the iron block disappears, the heat storage component is separated from the main board under the action of the spring, and the heat storage component returns to a heat release state; the heat storage component radiates heat through the rear barrel of the camera, and the temperature of the heat storage component is reduced below the phase transition temperature of the heat storage material, so that preparation is made for the next heat absorption state.

The second set temperature threshold may be equal to the first set temperature threshold, for example, all 50 degrees. Advantageously, the second set temperature threshold may be set to be slightly less than the first set temperature threshold, such as 0-10 degrees less. For example, the first set temperature threshold is 50 degrees and the second set temperature threshold is 45 degrees. This advantageously avoids frequent actuation of the electromagnet.

According to the embodiment of the invention, the springs and the electromagnets are added on the fixing sheet metal of the main board to form the main fixing assembly; a spring mounting hole and an electromagnet mounting hole are reserved at the corresponding position of the main board; the heat storage component is arranged on the back side of the main board and is fixedly connected with a spring on the main fixing component through a buckle; according to the invention, the singlechip on the main board reads the data of the main board temperature sensor in real time, automatically makes logic judgment according to the data, and performs power-on or power-off operation on the electromagnet, so that two position states of the heat storage component relative to the main fixed component are correspondingly changed, two working states of the camera are intelligently switched, and the requirement of short-time high-temperature working of the camera is met.

Finally, it should be pointed out that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting. Those of ordinary skill in the art will appreciate that: the technical schemes described in the foregoing embodiments may be modified or some of the technical features may be replaced equivalently; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A camera, characterized in that the camera comprises a shell, a main board component and a heat storage component (30), wherein the main board component and the heat storage component (30) are arranged in the shell,

an elastic element and an electromagnet (24) are arranged on one surface of the main board assembly, and an electronic element is arranged on the main board assembly;

the heat storage assembly (30) has an iron portion, a side of the heat storage assembly facing the main plate assembly is provided with a first thermal pad (34), and a side of the heat storage assembly (30) facing the main plate assembly is abutted against the elastic element, when no current is applied to the electromagnet (24), a first gap height is provided between the heat storage assembly (30) and the main plate assembly, and the first gap height is greater than the thickness of the first thermal pad (34);

when the electromagnet (24) is applied with current, the main board component and the heat storage component (30) are attracted by the magnet, the gap height between the main board component and the heat storage component is reduced from the first gap height to a second gap height, the second gap height is smaller than the thickness of the first heat conduction pad (34), and when the gap height between the main board component and the heat storage component (30) is the second gap height, heat generated by an electronic element arranged on the main board component is transferred to the heat storage component (30) through the first heat conduction pad (34);

the camera comprises a control unit and a temperature sensor, the temperature sensor detects the temperature in the camera and transmits detection information to the control unit, the control unit controls the electromagnet (24) according to the detection information,

when the detected temperature of the temperature sensor reaches and/or exceeds a first set temperature threshold value, the control unit controls power supply to the electromagnet (24) and enables the electromagnet (24) to act so as to drive the heat storage assembly (30) to the following positions: the gap height between the thermal storage assembly and the motherboard assembly is the second gap height,

in the event that the temperature detected by the temperature sensor is lower than a second set temperature threshold, the control unit controls the interruption of the power supply to the electromagnet (24) so that, under the action of the elastic element, the thermal storage assembly (30) is in the following position: the gap height between the heat storage assembly and the main plate assembly is the first gap height at which the heat storage assembly (30) is in contact with the housing of the camera to release heat to the external environment.

2. The camera according to claim 1, characterized in that the motherboard assembly comprises a motherboard (15) and a motherboard fixing sheet metal (21), the motherboard (15) is fixedly connected with the motherboard fixing sheet metal (21), the motherboard fixing sheet metal (21) is fixedly mounted relative to the housing, and the elastic element is arranged between the motherboard fixing sheet metal (21) and the heat storage assembly (30).

3. The camera according to claim 2, characterized in that the electromagnet (24) and the elastic element are arranged on the side of the motherboard fixing sheet metal (21) facing the motherboard (15), and that the elastic element and the electromagnet (24) pass through corresponding penetration holes arranged on the motherboard (15) when the motherboard (15) and the motherboard fixing sheet metal (21) are fixedly connected.

4. The camera according to claim 2, wherein the number of electromagnets (24) is two or more and symmetrically arranged centering on the CPU on the main board (15); the number of the elastic elements is two or more, and the elastic elements are symmetrically arranged with the CPU on the main board (15) as a center.

5. A camera according to claim 3, characterized in that a side of the motherboard fixing sheet metal (21) facing the motherboard (15) is provided with a third heat conducting pad (22), and that the motherboard (15) is in surface contact with the third heat conducting pad (22) when the motherboard (15) is fixedly connected with the motherboard fixing sheet metal (21), wherein the position of the third heat conducting pad (22) corresponds to the position of the CPU on the motherboard (15).

6. The camera according to claim 5, characterized in that a side of the motherboard fixing sheet metal (21) facing away from the motherboard (15) is provided with a second heat conducting pad (25), and the motherboard fixing sheet metal (21) is in heat conduction with the housing via the second heat conducting pad (25), so that heat generated by electronic components of the camera can be dissipated to the housing via the motherboard fixing sheet metal (21) and the second heat conducting pad (25).

7. The camera according to claim 6, wherein bent end plates (211) are provided at both ends of the main board fixing sheet metal (21), and mounting holes are provided on the bent end plates (211) for fastening with the housing or a mounting bracket in the housing so that a second heat conduction pad (25) on the main board fixing sheet metal (21) is in surface contact with the housing.

8. The camera according to any one of claims 1-7, wherein a fourth thermal pad (35) is provided of the thermal storage assembly (30) facing away from the main plate assembly, the fourth thermal pad (35) being in surface contact with the housing when the thermal storage assembly (30) is in a state corresponding to the first gap height, and the fourth thermal pad (35) being out of contact with the housing when the thermal storage assembly (30) is in a state corresponding to the second gap height.

9. The camera according to any one of claims 1-7, characterized in that the ferrous part of the heat storage assembly (30) is arranged at a position facing the electromagnet (24) on the motherboard fixing sheet metal (21).

10. The camera of claim 1, wherein the second set temperature threshold is equal to or lower than the first set temperature threshold by 0-10 degrees.