CN114643720A

CN114643720A - Electronic device manufacturing method and device, storage medium and electronic device

Info

Publication number: CN114643720A
Application number: CN202011507497.8A
Authority: CN
Inventors: 戴威; 安忠玉
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-12-18
Filing date: 2020-12-18
Publication date: 2022-06-21

Abstract

The embodiment of the application provides a manufacturing method of electronic equipment, which comprises the following steps: manufacturing a first partial structure of the electronic equipment shell through three-dimensional (3D) printing; the first part structure is provided with a concave cavity used for mounting a Printed Circuit Board (PCB) of the electronic device; the PCB is used for realizing the corresponding function of the electronic equipment; and under the condition that the PCB is installed in the concave cavity, continuing to manufacture a second part structure of the electronic equipment shell through 3D printing, so that the shell wraps the PCB. The embodiment of the application also provides a manufacturing device of the electronic equipment, a storage medium and the electronic equipment.

Description

Electronic device manufacturing method and device, storage medium and electronic device

Technical Field

The present disclosure relates to the field of electronic technologies, and in particular, to a method and an apparatus for manufacturing an electronic device, a storage medium, and an electronic device.

Background

In practical application, the housing of the electronic product is composed of two parts, the housings of the two parts are respectively subjected to injection molding, and the two parts of housings after injection molding are fastened through a buckle, locked through a screw or fixed through adhesive bonding, so that a combination gap exists on the housing of the electronic equipment, and the attractiveness of the electronic equipment is affected.

Disclosure of Invention

The embodiment of the application provides a manufacturing method and device of electronic equipment, a storage medium and the electronic equipment.

The technical scheme of the application is realized as follows:

provided is a method of manufacturing an electronic device, the method including:

manufacturing a first partial structure of the electronic equipment shell through three-dimensional (3D) printing; the first part structure is provided with a concave cavity used for mounting a Printed Circuit Board (PCB) of the electronic device; the PCB is used for realizing the corresponding function of the electronic equipment;

and under the condition that the PCB is installed in the concave cavity, continuing to manufacture a second part structure of the electronic equipment shell through 3D printing, so that the shell wraps the PCB.

An apparatus for manufacturing an electronic device is provided, the apparatus comprising:

the first processing unit is used for manufacturing a first partial structure of the electronic equipment shell through three-dimensional (3D) printing; the first part structure is provided with a concave cavity used for mounting a Printed Circuit Board (PCB) of the electronic device; the PCB is used for realizing the corresponding function of the electronic equipment;

and the second processing unit is used for continuously manufacturing a second part structure of the electronic equipment shell through 3D printing under the condition that the PCB is installed in the concave cavity, so that the shell wraps the PCB.

There is provided an apparatus for manufacturing an electronic device, the apparatus comprising a processor and a memory for storing a computer program operable on the processor;

the processor, when executing the computer program stored in the memory, performs the steps of the method of manufacturing the electronic device.

There is provided a computer readable storage medium having stored thereon a computer program, the computer program being executable by a processor for performing steps of a method of manufacturing the electronic device.

There is provided an electronic device including: a Printed Circuit Board (PCB) and a housing; wherein the content of the first and second substances,

the housing comprises a first partial structure and a second partial structure;

the first partial structure is made by three-dimensional 3D printing; the first part structure is provided with a concave cavity, and the PCB is arranged in the concave cavity; the PCB is used for realizing the corresponding function of the electronic equipment;

the second partial structure is printed on the first partial structure by 3D printing after the PCB is mounted in the cavity in the first partial structure.

According to the electronic equipment manufacturing method provided by the embodiment of the application, the first part structure of the shell is manufactured through 3D printing, printing is stopped after the first part structure of the shell is obtained, and after the PCB is placed in the first part structure of the shell of the electronic equipment, the rest part of the shell is continuously printed; thus, the second partial structure of the electronic equipment shell is obtained through layered printing, layer-by-layer adhesion and layer-by-layer stacking, so that complete electronic equipment is obtained; the PCB of the electronic device can be wrapped in the first partial structure and the second partial structure of the shell, and the safety of the PCB is improved. In addition, the first partial structure and the second partial structure are both manufactured in a 3D printing mode, and the second partial structure of the shell is stacked on the first partial structure layer by layer through 3D printing, so that a combined gap of the shell of the electronic device can be avoided, and the appearance fineness of the electronic device is improved.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device in related art according to an embodiment of the present application;

fig. 2 is a first flowchart illustrating a manufacturing method of an electronic device according to an embodiment of the present disclosure;

fig. 3(a) is a first schematic structural diagram of a first portion of an electronic device housing according to an embodiment of the present disclosure;

fig. 3(b) is a schematic structural diagram of a first part of an electronic device housing according to an embodiment of the present application;

fig. 4 is a schematic diagram of 3D printing programming according to an embodiment of the present disclosure;

fig. 5 is a first schematic structural diagram of an electronic device in a manufacturing process according to an embodiment of the present disclosure;

fig. 6 is a second flowchart illustrating a manufacturing method of an electronic device according to an embodiment of the present disclosure;

fig. 7 is a third schematic flowchart illustrating a manufacturing method of an electronic device according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of an electronic device in a manufacturing process according to an embodiment of the present application;

fig. 9 is a schematic structural diagram three of an electronic device in a manufacturing process according to an embodiment of the present application;

fig. 10(a) is a schematic cross-sectional structure diagram of an electronic device according to an embodiment of the present application;

fig. 10(b) is a schematic side view of an electronic device according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of an electronic device in a manufacturing process according to an embodiment of the present application;

fig. 12 is a schematic structural diagram of an electronic device in a manufacturing process according to an embodiment of the present application;

fig. 13 is a sixth schematic structural diagram of an electronic device in a manufacturing process according to an embodiment of the present application;

fig. 14 is a fourth schematic flowchart of a method for manufacturing an electronic device according to an embodiment of the present application;

fig. 15(a) is a schematic structural diagram seven of an electronic device in a manufacturing process according to an embodiment of the present application;

fig. 15(b) is a schematic structural diagram eight of an electronic device in a manufacturing process according to an embodiment of the present application;

fig. 15(c) is a schematic structural diagram nine of an electronic device in a manufacturing process according to an embodiment of the present application;

fig. 15(d) is a schematic structural diagram ten of an electronic device in a manufacturing process according to an embodiment of the present application;

fig. 15(e) is a schematic structural diagram eleven of an electronic device in a manufacturing process according to an embodiment of the present application;

fig. 15(f) is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 16 is a schematic structural diagram of an apparatus for manufacturing an electronic device according to an embodiment of the present application;

fig. 17 is a schematic diagram of a hardware structure of an electronic device manufacturing apparatus according to an embodiment of the present application.

Detailed Description

So that the manner in which the features and elements of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings.

It should be noted that the terms "first", "second", and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Referring to a schematic structural diagram of a related art electronic device shown in fig. 1, as shown in fig. 1, an electronic product includes a first housing 11, a second housing 12, and a Printed Circuit Board (PCB) 13; the first housing 11 and the second housing 12 are both made by injection molding, and the electronic device PCB 13 is disposed inside the first housing 11 and the second housing 12, and the first housing 11 and the second housing 12 are substantially fixed by snap-fit, screw-lock, or adhesive. That is to say, the first casing 11 and the second casing 12 of the conventional electronic device are respectively injection molded and then assembled, which inevitably brings a combination gap and affects the appearance of the electronic device.

In order to solve the above problems in the related art, an implementation subject of the method for manufacturing an electronic device according to the embodiments of the present application may be an electronic device manufacturing apparatus provided in the embodiments of the present application, the electronic device manufacturing apparatus may be implemented by combining hardware and software, and the electronic device manufacturing apparatus may be a three-dimensional printer or a device integrating a three-dimensional printing function.

Referring to fig. 2, a schematic flow chart of a manufacturing method of an electronic device is shown, as shown in fig. 2, the manufacturing method of the electronic device includes the following steps:

step 210, manufacturing a first part structure of the shell of the electronic equipment through 3D printing; the first part structure has a cavity for mounting a PCB of an electronic device.

The electronic device mentioned in the embodiment of the present application may be an electronic product such as an electronic tag, a keyboard, a wireless bluetooth headset, and the like, and the type of the electronic device is not limited in the embodiment of the present application.

The electronic device may include a PCB and a housing; the PCB of the electronic equipment is used for realizing the corresponding function of the electronic equipment. For example, the PCB of the keyboard is used to implement a key input function of a user.

In the embodiment of the application, the electronic device manufacturing apparatus firstly manufactures the electronic device shell by using a 3D printing technology, and after obtaining the first partial structure of the shell, the electronic device manufacturing apparatus suspends printing. The 3D printing technology is a technology for constructing an object by using a layer-by-layer printing mode by using adhesive materials such as powdered metal or plastic and the like on the basis of a digital model file.

Specifically, the manufacturing device of the electronic device can control the 3D printing nozzle to print the printing material layer by layer according to a preset path, and when each layer of printing material is printed, the current printed material and the previous printed material are solidified together by physical or chemical means such as illumination, polymerization, bonding, sintering and the like to form a first part structure of the electronic device housing.

Here, the printing material may be a plastic, ceramic, or rubber-like material, and the printing material is not limited in this embodiment of the present application.

Referring to the schematic diagram of the first part of the electronic device shown in fig. 3(a) and 3(b), the first part of the electronic device housing may be a structure having a cavity. In one example, as shown in fig. 3(a), the first partial structure 31 of the electronic device case may be a half structure of the entire electronic device case. In another example, as shown in fig. 3(b), the first partial structure 31 of the electronic device case may also be a majority structure of the entire electronic device. The embodiments of the present application do not limit this. In fig. 3(a) and 3(b), the electronic device manufacturing apparatus may print and manufacture the housing on the print substrate 32, and may further provide a print supporting material 33 according to a required external configuration, so that a desired housing shape is completed by the print supporting material 33.

In embodiments provided herein, the cavity of the first partial structure is used to mount a PCB of an electronic device. Here, the size of the cavity is at least greater than or equal to the size of the PCB.

Specifically, the technician may perform 3D printing programming in advance according to a required structure, for example, the technician may perform 3D printing programming according to the structure shown in fig. 4, and set a printing path for each printing layer, so that the manufacturing apparatus of the electronic device may read a preset 3D printing program and perform 3D printing based on the 3D printing program.

And step 220, under the condition that the PCB is installed in the concave cavity, continuously manufacturing a second part structure of the electronic equipment shell through 3D printing, so that the shell wraps the PCB.

In the embodiment of the present application, referring to fig. 5, with the PCB34 installed in the cavity, the electronic device manufacturing apparatus continues to print the shell structure of the remaining part of the housing, i.e. the second partial structure 35 of the housing, on the first partial structure 31 of the housing.

Here, the electronic device manufacturing apparatus continues to manufacture the remaining structure of the housing by means of 3D printing. That is, the electronic device manufacturing apparatus controls the 3D printing nozzle to print the printing material on the first partial structure 31 manufactured in step 210 layer by layer according to a preset path, and when printing one layer of the printing material, the currently printed material and the previously printed material are solidified together by physical or chemical means such as illumination, polymerization, bonding, sintering, and the like, so as to form the second partial structure 35 of the electronic device housing.

In this way, the second partial structure 35 and the first partial structure 31 can form a complete electronic device housing, and the PCB34 is enclosed in the housing first partial structure 31 and the second partial structure 35. And, the second partial structure 35 is printed on the first partial structure 31 by 3D, and finally, the second partial structure is printed in layers, adhered layer by layer, and stacked layer by layer to form a complete shell. Therefore, the combination gap of the shell of the electronic equipment can be avoided, and the fineness of the appearance of the electronic equipment is improved.

It can be understood that, in the method for manufacturing an electronic device provided in the embodiment of the present application, the first partial structure 31 of the housing is first manufactured by 3D printing, the printing is stopped after the first partial structure of the housing is obtained, and the printing is continued on the remaining portion of the housing after the PCB34 is placed in the first partial structure 31 of the housing of the electronic device; thus, the second partial structure 35 of the electronic device shell is obtained through layered printing, layer-by-layer adhesion and layer-by-layer stacking, so that complete electronic devices are obtained; the PCB34 of the electronic device can be wrapped in the first partial structure 31 and the second partial structure 35 of the housing, so that the safety of the PCB34 is improved. In addition, the first partial structure 31 and the second partial structure 35 are both manufactured by 3D printing, and the second partial structure 35 of the housing is stacked on the first partial structure 31 layer by 3D printing, so that a combination gap of the housing of the electronic device can be avoided, and the fineness of the appearance of the electronic device is improved.

In the embodiment of the present invention, the PCB34 may be manually or manually installed in the cavity of the first housing part 31, or the PCB34 may be automatically installed in the cavity of the first housing part 31 by an installation component in the electronic device manufacturing apparatus, which is not limited in the embodiment of the present invention.

In an embodiment of the present application, referring to the flowchart shown in fig. 6, before continuing to fabricate the second partial structure of the electronic device housing by 3D printing with the PCB mounted in the cavity in step 220, the following steps may be further performed:

step 211, mounting the PCB into the cavity of the first partial structure by means of a mounting component.

It is understood that, in the embodiment of the present application, the electronic device manufacturing apparatus may further include a mounting component. After the first partial structure of the housing of the electronic device is obtained in step 210, the PCB is automatically mounted in the cavity of the first partial structure of the housing by means of the mounting component.

Here, the mounting part may include a rotating arm and a mechanical gripper. Specifically, the electronic device manufacturing apparatus grabs the PCB at a preset position by the mechanical gripper, conveys the PCB to a position where the housing having completed the first partial structure is located by rotation of the rotating arm, and then installs the acquired PCB in the cavity of the first partial structure of the housing by the mechanical gripper. Therefore, the full automation of the electronic equipment manufacturing is realized.

In another embodiment of the present application, referring to the flowchart shown in fig. 7, in the case that the PCB is installed in the cavity, the step 220 continues to use 3D printing to fabricate the second partial structure of the electronic device housing, which may be implemented by the following steps:

step 2201, acquiring the installation state of the PCB through a first sensor;

and 2202, if the installation state represents that the PCB is installed in the first partial structure, continuing to adopt 3D printing to manufacture a second partial structure of the electronic equipment shell.

In an embodiment of the present application, the electronic device manufacturing apparatus may further include a first sensor; the first sensor may be disposed above the electronic device housing, and is configured to acquire a mounting state of the electronic device PCB, that is, detect whether the PCB is mounted in the cavity of the first partial structure. And if the first sensor detects that the PCB is installed in the cavity of the first partial structure, continuing to adopt 3D printing to manufacture a second partial structure of the electronic equipment shell.

In the embodiment provided by the present application, the first sensor may be an image acquisition device, an infrared distance measurement sensor, or a combination of an image sensor and an infrared distance measurement sensor, which is not limited in the embodiment of the present application.

In a possible implementation manner, when the first sensor is an image capturing device, the electronic device manufacturing apparatus controls the image capturing device to capture an image of the first partial structure of the housing according to a preset time period after the first partial structure of the housing is printed. And determining the installation state of the PCB by identifying and analyzing the acquired image.

In another possible implementation manner, when the first sensor is an infrared ranging sensor, the electronic device manufacturing apparatus controls the infrared ranging sensor to emit infrared rays to the first partial structure of the housing according to a preset time period after the first partial structure of the housing is printed, and determines the installation state of the PCB by analyzing the received infrared reflected signals.

According to the manufacturing method of the electronic equipment, the installation state of the PCB is determined through the first sensor, and the automation degree of the manufacturing method of the electronic equipment is further increased.

It is worth noting that in the 3D printing process, a support is required below each layer of material when each layer of material is printed; in the embodiment of the present application, when the second partial structure of the housing is printed, printing needs to be performed on a certain support, and two printing modes of the second partial structure are described in detail below.

In one embodiment of the present application, the size of the cavity matches the size of the PCB. Correspondingly, the step 220 of continuing to manufacture the second partial structure of the electronic device shell through 3D printing under the condition that the PCB is installed in the cavity can be realized through the following steps:

and step 220a, under the condition that the PCB is installed in the cavity of the first partial structure, on a plane formed by the PCB and the top of the side wall of the cavity, continuing to manufacture a second partial structure of the shell of the electronic device through 3D printing, so that the shell wraps the PCB.

In the embodiment of the present application, the size of the cavity may match the size of the PCB, that is, as shown in fig. 8, the cavity of the first partial structure 31 may just receive the PCB34, and the cavity may closely fit the PCB34, so that the top of the PCB34 and the top of the sidewall of the cavity form a complete plane.

Based on this, when the electronic device manufacturing apparatus determines that the PCB34 has been installed in the cavity of the first partial structure 31 through the first sensor, the 3D print head is controlled to continue printing the second partial structure of the housing of the electronic device on the plane formed by the PCB34 and the top of the sidewall of the cavity.

Thus, as shown in fig. 9, after the second partial structure is printed, the second partial structure and the first partial structure can form a complete electronic device housing 36, and the PCB34 is enclosed in the housing 36 formed by the first partial structure and the second partial structure of the housing. Further, after the substrate 32 is removed and the supporting material 33 attached to the electronic product is removed, the electronic device shown in fig. 10(a) and 10(b) is obtained; 10(a) is a cross-sectional view of an electronic device including a housing 36 and a PCB34, and 10(b) is a side view of the electronic device.

In the embodiment of the application, the second partial structure is printed on the first partial structure through 3D, and finally, the second partial structure is printed in a layered mode, adhered layer by layer and built layer by layer to form a complete shell. Therefore, the combination gap of the shell of the electronic equipment can be avoided, and the fineness of the appearance of the electronic equipment is improved.

In this application implementation, electronic equipment making devices can directly print the shell structure of remaining part on the plane that PCB and cavity lateral wall top formed, can accomplish electronic equipment's preparation fast.

In another embodiment of the present application, the size of the cavity does not match the size of the PCB; correspondingly, the step 220 of continuing to manufacture the second partial structure of the electronic device shell through 3D printing under the condition that the PCB is installed in the cavity can be realized through the following steps:

step 220 a', under the condition that the PCB is installed in the concave cavity of the first partial structure, filling a liquid material into the concave cavity of the first partial structure, in which the PCB is installed, so that the liquid material fills a gap formed by the PCB and the first partial structure;

and step 220 b', after the liquid material is solidified, continuing to manufacture a second part structure of the shell of the electronic device through 3D printing on a plane formed by the solidified liquid material and the top of the side wall of the concave cavity, so that the shell wraps the PCB.

In the embodiment of the present application, as shown in fig. 11, the size of the cavity of the first partial structure 31 is not matched with the size of the PCB34, that is, the size of the cavity is larger than the size of the PCB34, so that when the PCB34 is installed inside the cavity, the PCB34 cannot form a complete plane with the first partial structure 31 for the electronic device manufacturing apparatus to print the remaining housing structure.

Based on this, as shown in fig. 12, after the PCB is mounted in the cavity of the first partial structure, the electronic device manufacturing apparatus controls the 3D printing nozzle 37 to fill the cavity with the liquid material so as to fill the gap formed between the PCB34 and the first partial structure 31, and enable the liquid material to form a complete plane with the top of the sidewall of the cavity.

In a possible implementation, the electronic device manufacturing apparatus may obtain the installation state of the PCB34 through the first sensor, and control the 3D print head 37 to fill the cavity with the liquid material if the installation state indicates that the PCB34 is already installed in the cavity.

In the present embodiment, the liquid material is a liquid material sensitive to Ultraviolet (UV) light; i.e. the liquid material is capable of curing under UV light irradiation.

Here, the liquid material may be the same as the printing material of the first partial structure and the second partial structure, or may be different from the printing material of the first partial structure and the second partial structure, and the embodiment of the present application is not limited herein.

Correspondingly, after the step 220 a' of filling the cavity with the liquid material of the first partial structure mounted with the PCB34, the following steps may be further included:

and irradiating the liquid material with UV light within a preset time period to cure the liquid material.

In the embodiment of the present application, as shown in fig. 13, after the liquid material is filled into the cavity, the electronic device manufacturing apparatus may irradiate the liquid material filled into the cavity with the UV lamp 38, so as to cure the liquid material. After the liquid material is solidified, the liquid material can form a complete plane with the top of the side wall of the concave cavity.

Further, after the liquid material is solidified, the electronic device manufacturing apparatus controls the 3D printing head to continue printing the second partial structure of the housing of the electronic device on the plane formed by the PCB and the top of the sidewall of the cavity, so that, as shown in fig. 9, after the second partial structure is printed, the second partial structure and the first partial structure can form a complete electronic device housing 36, and the PCB34 is enclosed in the housing 36 formed by the first partial structure and the second partial structure of the housing. Further, after removing the substrate and removing the supporting material attached to the electronic product, the electronic device shown in fig. 10(a) and 10(b) is obtained; fig. 10(a) is a cross-sectional view of an electronic device, and fig. 10(b) is a side view of the electronic device.

The embodiment that this application provided, can ignore PCB's size, install in the cavity at PCB after, electronic equipment making devices can fill liquid material in the cavity of first partial structure, can form a complete plane with cavity lateral wall top after the liquid material solidification, and like this, on the plane that liquid material after the solidification and cavity lateral wall top formed, continue to print the second partial structure of preparation electronic equipment's shell through 3D, so, the flexibility ratio of electronic equipment preparation has been improved.

In a possible implementation manner, the electronic device manufacturing apparatus may further include a second sensor, and the second sensor may be an infrared ranging sensor.

In the process of filling the liquid material, detecting whether the height of the liquid material is consistent with that of the top of the side wall of the concave cavity or not through a second sensor;

if the liquid material is consistent with the height of the top of the side wall of the concave cavity, the filling of the liquid material is stopped.

It is understood that the electronic device manufacturing apparatus may further include a second sensor, the second sensor is configured to detect a filling state of the liquid seasoning, and when it is detected that the filling height of the liquid material is the same as the height of the top of the sidewall of the cavity, it is determined that the liquid material and the top of the sidewall of the cavity may form a plane, and the electronic device manufacturing apparatus stops filling the liquid material. Therefore, the automation of the manufacturing process of the electronic equipment can be improved.

It should be noted that, when the first sensor is an infrared distance measuring sensor, the second sensor can detect whether the liquid material is consistent with the top of the side wall of the cavity or not by multiplexing the first sensor. That is, the electronic device manufacturing apparatus can detect not only the installation state of the PCB but also the filling state of the liquid seasoning by only one infrared ranging sensor. Thus, the detection of two states is realized through one infrared distance measuring sensor.

In embodiments provided herein, the electronic device may be an electronic tag. The electronic tag can be a passive electronic device, and the electronic tag and the reader realize spatial (contactless) coupling of radio frequency signals through a coupling element; and in the coupling channel, energy transfer and data exchange are realized according to a time sequence relation. The electronic tag is gradually and widely applied to industrial automation, commercial automation, traffic control and management, traffic monitoring of automobiles, trains and the like due to the unique advantages of the electronic tag; an automatic toll collection system for highways; a parking lot management system; managing articles; the production line production is automated; checking the safe access; warehousing management; managing animals; vehicle theft protection, etc.

Based on the foregoing embodiments, an embodiment of the present application provides a method for manufacturing an electronic device, as shown in a flowchart of fig. 14, the method for manufacturing an electronic device includes the following steps:

step 1, reading a 3D printing program.

Here, the technician may perform 3D printing programming according to a desired configuration, and the electronic device creating apparatus reads a 3D printing program written in advance before creating the electronic device, and creates the electronic device according to the read 3D printing program.

And 2, printing a first partial structure of the electronic equipment shell.

Here, the first partial structure of the housing may be printed according to the 3D printing program read in step 1.

Referring to fig. 15(a), the electronic device manufacturing apparatus may print the first partial structure 31 of the electronic device housing on the printing substrate 32 and the 3D printing support material 33 according to the read 3D printing program.

And 3, installing the PCB through the installation component.

Referring to fig. 15(b), the electronic device manufacturing apparatus may mount the PCB34 in the cavity of the first partial structure 31 by mounting the component.

And 4, filling a liquid material into the first part of the shell.

Here, referring to fig. 15(c), the electronic device manufacturing apparatus may fill the liquid material into the case first partial structure 31 through the 3D printing head 37.

And 5, irradiating the liquid material by using UV light within a preset time period.

Here, referring to fig. 15(d), the electronic device manufacturing apparatus irradiates the liquid material through the UV lamp 38 to cure the liquid material, and the cured liquid material can form a complete plane with the top of the side wall of the cavity of the first partial structure.

Step 6, continuously printing the second part structure of the shell of the electronic equipment

Here, referring to fig. 15(e), the electronic device manufacturing apparatus continues to print the second partial structure of the housing according to the 3D printing procedure on the plane formed by the solidified liquid material and the top of the sidewall of the cavity of the first partial structure, so as to form the complete housing 36.

And 7, removing the substrate and the supporting material to obtain the electronic equipment.

Here, referring to fig. 15(f), the substrate 32 and the 3D printing support material 33 are removed, resulting in an electronic apparatus.

According to the electronic equipment manufacturing method provided by the embodiment of the application, the first part structure of the shell is manufactured through 3D printing, printing is stopped after the first part structure of the shell is obtained, and after the PCB is placed in the first part structure of the shell of the electronic equipment, the rest part of the shell is continuously printed; the second partial structure of the electronic equipment shell is obtained through layered printing, layer-by-layer adhesion and layer-by-layer stacking, so that complete electronic equipment is formed; therefore, the PCB of the electronic device can be wrapped in the first partial structure and the second partial structure of the shell, and the safety of the PCB is improved. In addition, the first partial structure and the second partial structure are both manufactured in a 3D printing mode, and the second partial structure of the shell is stacked on the first partial structure layer by layer through 3D printing, so that a combined gap of the shell of the electronic device can be avoided, and the appearance fineness of the electronic device is improved.

Based on the foregoing embodiments, an electronic device manufacturing apparatus is provided in an embodiment of the present application. Fig. 16 is a schematic structural component diagram of an electronic device manufacturing apparatus according to an embodiment of the present application, and as shown in fig. 16, the apparatus includes:

a first processing unit 1601 configured to fabricate a first partial structure of the electronic device case by three-dimensional 3D printing; the first part structure is provided with a concave cavity used for mounting a Printed Circuit Board (PCB) of the electronic device; the PCB is used for realizing the corresponding function of the electronic equipment;

a second processing unit 1602, configured to continue to fabricate a second partial structure of the electronic device housing by 3D printing under the condition that the PCB is installed in the cavity, so that the housing wraps around the PCB.

In an embodiment of the present application, a size of the cavity does not match a size of the PCB;

the second processing unit 1602 is specifically configured to, when the PCB is installed in the cavity of the first partial structure, fill a liquid material into the cavity of the first partial structure where the PCB is installed, so that the liquid material fills a gap formed between the PCB and the first partial structure; and after the liquid material is solidified, continuously manufacturing a second part structure of the shell of the electronic equipment through 3D printing on a plane formed by the solidified liquid material and the top of the side wall of the concave cavity, so that the shell wraps the PCB.

In an embodiment of the present application, the size of the cavity matches the size of the PCB;

the second processing unit 1602 is further configured to continue to fabricate a second partial structure of the housing of the electronic device by 3D printing on a plane formed by the PCB and the top of the sidewall of the cavity when the PCB is mounted in the cavity of the first partial structure, so that the housing wraps the PCB.

In an embodiment of the present application, the second processing unit 1602 is further configured to obtain a mounting state of the PCB through a first sensor; and if the installation state represents that the PCB is installed in the concave cavity, continuously manufacturing a second part structure of the electronic equipment shell by adopting 3D printing.

In an embodiment of the present application, the first sensor includes an image capture device and/or an infrared distance measurement sensor.

In an embodiment of the application, the electronic device manufacturing apparatus further includes a third processing unit, and the third processing unit is configured to mount the PCB into the cavity of the first partial structure through a mounting component.

In one embodiment of the present application, the liquid material is a liquid material sensitive to ultraviolet light,

the second processing unit 1602 is further configured to irradiate the liquid material with ultraviolet light within a preset time period, so that the liquid material is cured.

In an embodiment of the present application, the second processing unit 1602 is further configured to detect whether the liquid material is consistent with the top of the sidewall of the cavity by a second sensor during the filling process of the liquid material; and stopping filling the liquid material if the liquid material is consistent with the height of the top of the side wall of the concave cavity.

In an embodiment of the present application, the electronic device includes an electronic tag.

In the embodiment of the present application, functions implemented by each unit in the electronic device manufacturing apparatus may be understood by referring to the related description of the electronic device manufacturing method. In a specific implementation, the first Processing Unit 1601 and the second Processing Unit 1602 in the electronic device manufacturing apparatus may be implemented by a Processor in the electronic device manufacturing apparatus, such as a Central Processing Unit (CPU), a Digital Signal Processor (DSP), a Micro Control Unit (MCU), or a Programmable Gate Array (FPGA).

It should be noted that: the division of the units is only exemplary, and in practical applications, the internal structure of the electronic device manufacturing apparatus may be divided into different units to complete all or part of the functions described above. In addition, the electronic device manufacturing apparatus provided in the above embodiment and the electronic device manufacturing method embodiment belong to the same concept, and specific implementation processes thereof are described in the method embodiment and are not described herein again.

Based on the above hardware implementation of the electronic device manufacturing apparatus, an embodiment of the present application further provides an electronic device manufacturing apparatus, and fig. 17 is a schematic diagram of a hardware composition structure of the electronic device manufacturing apparatus according to the embodiment of the present application, as shown in fig. 17, the apparatus includes a processor 1701 and a memory 1702 storing a computer program.

Further, the apparatus also includes a communication bus 1703; the various components in the device are coupled together by a communication bus 1703. It will be appreciated that communication between the processor 1701 and the memory 1702 in the electronic device fabrication apparatus may be via a communication bus 1703.

In the present embodiment, the processor 1701, when executing the computer program in the memory 1702, is configured to implement the following steps:

It will be appreciated that the memory in this embodiment can be either volatile memory or nonvolatile memory, or can include both volatile and nonvolatile memory. The nonvolatile Memory may be a Read Only Memory (ROM), a Programmable Read Only Memory (PROM), an Erasable Programmable Read Only Memory (EPROM), an Electrically Erasable Programmable Read Only Memory (EEPROM), a magnetic Random Access Memory (FRAM), a Flash Memory (Flash Memory), a magnetic surface Memory, an optical Disc, or a Compact Disc Read-Only Memory (CD-ROM); the magnetic surface storage may be disk storage or tape storage. Volatile Memory can be Random Access Memory (RAM), which acts as external cache Memory. By way of illustration and not limitation, many forms of RAM are available, such as Static Random Access Memory (SRAM), Synchronous Static Random Access Memory (SSRAM), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SDRAM), Double Data Rate Synchronous Dynamic Random Access Memory (DDRSDRAM), Enhanced Synchronous Dynamic Random Access Memory (Enhanced Synchronous DRAM), Direct Memory Access (DRAM), and Direct Memory Access (DRDRU). The memories described in the embodiments of the present application are intended to comprise, without being limited to, these and any other suitable types of memory.

The method disclosed in the embodiments of the present application may be applied to a processor, or may be implemented by a processor. The processor may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the above method may be performed by integrated logic circuits of hardware in a processor or instructions in the form of software. The processor described above may be a general purpose processor, a DSP, or other programmable logic device, discrete gate or transistor logic device, discrete hardware components, or the like. The processor may implement or perform the methods, steps, and logic blocks disclosed in the embodiments of the present application. A general purpose processor may be a microprocessor or any conventional processor or the like. The steps of the method disclosed in the embodiments of the present application may be directly implemented by a hardware decoding processor, or implemented by a combination of hardware and software modules in the decoding processor. The software modules may be located in a storage medium that is located in a memory and that is read by a processor to perform the steps of the method described above in connection with its hardware.

Based on the above embodiments, embodiments of the present application further provide an electronic device, as shown in fig. 10(a) and 10(b), the electronic device includes a PCB and a housing; wherein, the first and the second end of the pipe are connected with each other,

the housing comprises a first partial structure and a second partial structure;

The electronic device provided by the embodiment of the application comprises a PCB and a shell, wherein the shell comprises a first partial structure and a second partial structure; the first part structure is provided with a concave cavity, and the PCB is arranged in the concave cavity; the second partial structure is printed on the first partial structure through 3D printing after the PCB is installed in the cavity in the first partial structure; in this way, finally, the second partial structure of the electronic equipment shell is obtained through layered printing, layer-by-layer adhesion and layer-by-layer stacking, so that complete electronic equipment is obtained; therefore, the PCB of the electronic device can be wrapped in the first partial structure and the second partial structure of the shell, and the safety of the PCB is improved. In addition, the first partial structure and the second partial structure are both manufactured in a 3D printing mode, and the second partial structure of the shell is stacked on the first partial structure layer by layer through 3D printing, so that a combined gap of the shell of the electronic device can be avoided, and the appearance fineness of the electronic device is improved.

The embodiment of the application also provides a computer storage medium, in particular a computer readable storage medium. The computer storage medium has stored thereon computer instructions, and when the computer storage medium is located in the electronic device manufacturing apparatus, the computer instructions, when executed by the processor, implement any step in the above-mentioned electronic device manufacturing method according to the embodiment of the present application.

In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described device embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or other forms.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed on a plurality of network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, all functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may be separately regarded as one unit, or at least two units may be integrated into one unit; the integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.

Those of ordinary skill in the art will understand that: all or part of the steps for implementing the method embodiments may be implemented by hardware related to program instructions, and the program may be stored in a computer readable storage medium, and when executed, the program performs the steps including the method embodiments; and the aforementioned storage medium includes: a removable storage device, a ROM, a RAM, a magnetic or optical disk, or various other media that can store program code.

Alternatively, the integrated units described above in the present application may be stored in a computer-readable storage medium if they are implemented in the form of software functional modules and sold or used as independent products. Based on such understanding, the technical solutions of the embodiments of the present application or portions thereof that contribute to the prior art may be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for enabling a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a removable storage device, a ROM, a RAM, a magnetic or optical disk, or various other media that can store program code.

It should be noted that: the technical solutions described in the embodiments of the present application can be arbitrarily combined without conflict.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A method of making an electronic device, the method comprising:

2. The method of claim 1, wherein the size of the cavity does not match the size of the PCB;

the continuing to fabricate a second partial structure of the electronic device housing by the 3D printing with the PCB installed in the cavity comprises:

under the condition that the PCB is installed in the cavity of the first partial structure, filling a liquid material into the cavity of the first partial structure, on which the PCB is installed, so that the liquid material fills a gap formed by the PCB and the first partial structure;

and after the liquid material is solidified, continuously manufacturing a second part structure of the shell of the electronic equipment through 3D printing on a plane formed by the solidified liquid material and the top of the side wall of the concave cavity, so that the shell wraps the PCB.

3. The method of claim 1, wherein the size of the cavity matches the size of the PCB;

and under the condition that the PCB is installed in the first partial structure cavity, continuing to manufacture a second partial structure of the shell of the electronic device through 3D printing on a plane formed by the PCB and the top of the side wall of the cavity, so that the shell wraps the PCB.

4. The method according to any one of claims 1-3, wherein continuing to fabricate the second partial structure of the electronic device housing by 3D printing with the PCB mounted in the cavity comprises:

acquiring the installation state of the PCB through a first sensor;

and if the installation state represents that the PCB is installed in the concave cavity, continuously manufacturing a second part structure of the electronic equipment shell by adopting 3D printing.

5. The method of claim 4, wherein the first sensor comprises an image capture device and/or an infrared ranging sensor.

6. The method according to any one of claims 1-3, further comprising, before continuing to fabricate the second partial structure of the electronic device housing by 3D printing with the PCB mounted in the cavity:

the PCB is mounted into the cavity of the first partial structure by a mounting member.

7. The method of claim 2, wherein the liquid material is a liquid material sensitive to ultraviolet light, and wherein after filling the cavity of the first substructure to which the PCB is mounted with the liquid material, further comprising:

and irradiating the liquid material with ultraviolet light within a preset time period to cure the liquid material.

8. The method of claim 2, wherein the filling of the cavity with the liquid material to which the first partial structure of the PCB is mounted comprises:

detecting whether the liquid material is consistent with the height of the top of the side wall of the concave cavity or not through a second sensor in the process of filling the liquid material;

and stopping filling the liquid material if the liquid material is consistent with the height of the top of the side wall of the concave cavity.

9. The method of any of claims 1-3, wherein the electronic device comprises an electronic tag.

10. An apparatus for manufacturing an electronic device, the apparatus comprising:

11. An apparatus for manufacturing an electronic device, the apparatus comprising a processor and a memory for storing a computer program operable on the processor;

the processor, when executing the computer program stored in the memory, performs the steps of the method of any of claims 1 to 9.

12. A computer-readable storage medium, on which a computer program is stored which is executed by a processor for implementing the steps of the method of any one of claims 1 to 9.

13. An electronic device, characterized in that the electronic device comprises: a Printed Circuit Board (PCB) and a housing; wherein the content of the first and second substances,

the housing comprises a first partial structure and a second partial structure;