CN107894293A - A kind of highly sensitive flexible passive wireless pressure sensor - Google Patents
A kind of highly sensitive flexible passive wireless pressure sensor Download PDFInfo
- Publication number
- CN107894293A CN107894293A CN201711096376.7A CN201711096376A CN107894293A CN 107894293 A CN107894293 A CN 107894293A CN 201711096376 A CN201711096376 A CN 201711096376A CN 107894293 A CN107894293 A CN 107894293A
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- Prior art keywords
- layer
- dielectric layer
- pressure sensor
- coil electrode
- electrode
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
- G01L1/148—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors using semiconductive material, e.g. silicon
Abstract
The invention discloses a kind of highly sensitive flexible passive wireless pressure sensor, including two coil electrodes, dielectric layer and the encapsulated layer outside coil electrode, coil electrode, dielectric layer and encapsulated layer between coil electrode are made of the macromolecule polymer material of insulation flexible；Described coil electrode is the spiral inductance with plate electrode, and plane-parallel capacitor is formed between upper lower plate electrode, and LC resonance circuits are formed with inductance in parallel；Described dielectric layer is provided with corresponding bulge-structure through microprocessor.And the preparation method for disclosing the sensor.Compared with prior art, the present invention provide it is a kind of be fabricated from a flexible material, be simple in construction, the pressure sensor that sensitivity and reliability are high.
Description
Technical field
The present invention relates to art of pressure sensors, more particularly to a kind of highly sensitive flexible passive wireless pressure sensing
Device.
Background technology
With the fast development of medical treatment ＆ health industry, people couple and the flexibility of wearable electronic product propose with comfortableness
Higher and higher requirement.
Existing pressure sensor in the market, mostly with silicon or ceramics for substrate, hardness is very high, suitable for traditional
The electronic product of mobile phone, automobile, do not adapt to but meet requirement of the medical treatment ＆ health market to flexibility and comfortableness.It is a small number of flexible
Pressure sensor, but circuit is needed to connect mostly, it is extremely inconvenient under many application scenarios.
Wireless senser is broadly divided into following two：One kind is that radiofrequency signal is received and dispatched by antenna, and it is existed using electromagnetic wave
Transmitting-receiving in space carrys out transmission signal, and its transmission range is longer, but must carry power supply, and development is restricted, and because of its circuit
It is complicated to be difficult to make Grazing condition sensor.Another kind is inductance near-field coupling, and this method generally utilizes LC parallel resonances
Loop, changed using sensitization capacitance with external parameter, the resonant frequency of resonant tank changes, straight by extraneous reading coil
Connect and measure resonant frequency and can obtain parameter to be measured.Compared with the former, LC formulas wireless senser without power supply, service life not by
Limitation, while simple in construction, strong adaptability, can be designed to flexible or non-flexible device according to demand, fully meet different rings
The demand in border.
The content of the invention
Goal of the invention：In view of the shortcomings of the prior art with defect, present invention offer one kind is fabricated from a flexible material, structure letter
Single, sensitivity and the high pressure sensor of reliability and preparation method thereof.
Technical scheme：A kind of highly sensitive flexible passive wireless pressure sensor of the present invention, it is characterised in that：Including
Two coil electrodes, dielectric layer and the encapsulated layer outside coil electrode, coil electrode, medium between coil electrode
Layer is made with encapsulated layer of the macromolecule polymer material of insulation flexible；Described coil electrode is the spiral shell with plate electrode
Inductance is revolved, plane-parallel capacitor is formed between upper lower plate electrode, LC resonance circuits are formed with inductance in parallel；Described dielectric layer
Inner surface is provided with corresponding bulge-structure through microprocessor.
Wherein, described dielectric layer includes corresponding two layers up and down, and its inner surface bulge-structure Jing Guo microprocessor is opposite
Fitting.The bulge-structure that microprocessor is set in dielectric layer respective layer is the pyramid array of micro-meter scale；Described pyramid is convex
The size for playing structure is 10-100um.
Wherein, described encapsulated layer thickness is 10-100um.
A kind of making step of highly sensitive flexible passive wireless pressure sensor is as follows：
(1) one piece of silicon chip is taken, bulge-structure groove array, its spacing 10- are gone out by anisotropic wet etch
100um；
(2) thermoplastic resin solution of pre-coordination is coated to surface of silicon and solidified and dielectric layer, dielectric layer is made
Material includes polydimethylsiloxane, SBS SBS；
(3) coil electrode is printed onto to the upper surface of dielectric layer by printing technology, printing slurry include conductive silver paste,
Copper slurry, carbon slurry；
(4) coating one layer of encapsulating material in coil electrode top and solidifying, coil electrode is covered and made by encapsulating material
Encapsulated layer is made, encapsulation layer material includes Fypro PA, polydimethylsiloxane, s-B-S
Block copolymer SBS；
(5) silicon substrate is removed, removes medium-electrode-encapsulated layer paradigmatic structure；
(6) paradigmatic structure made from two pieces of steps (5) is taken to be aligned and be bonded in opposite directions, wherein the dielectric layer containing bulge-structure
Inside, encapsulated layer is outside；Obtain final pressure sensor.
Operation principle：When inventive sensor is by ambient pressure, the corresponding bulge-structure of dielectric layer inner surface, gold
Word tower array deforms upon, and causes the spacing between two coil electrodes to change, equivalent parallel electric capacity changes therewith, and then causes LC
The resonant frequency of resonant tank shifts；Frequency offset can directly be read by extraneous reading coil, it is not necessary to which lead connects
Connect.
Beneficial effect：Compared with prior art, the present invention has following remarkable advantage：The present invention provides a kind of high sensitivity
Flexible passive wireless pressure sensor, material therefor is all flexible material, passes through the corresponding raised knot of dielectric layer inner surface
The deformation of structure changes electric capacity, suitable for a variety of occasions required to sensor flexibility, such as wound detection, packaging for foodstuff
Deng.There is simple in construction, sensitivity and reliability height, without being the advantages such as readable data by electrical connection, use simultaneously
It is convenient, it is easy to spread.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the process chart of the present invention；
Fig. 3 is the equivalent circuit diagram of the present invention；
1 it is coil electrode in figure, 2 be dielectric layer, 3 be encapsulated layer, 4 is silicon chip.
Embodiment
Below in conjunction with the accompanying drawings and embodiment is further described to technical scheme.
A kind of application method of highly sensitive flexible passive wireless pressure sensor of the present invention is：First to sensor
Demarcated, determine the corresponding relation between sensor pressure and the resonance peak skew of LC resonators., will after the completion of demarcation
Sensor is placed in required application scenarios, such as in human skin, food pack, is measured by reading coil humorous
Vibration frequency varying offset, you can show that its pressure changes.
Embodiment 1：
The pressure sensor of the present embodiment, including two coil electrodes 1, dielectric layer 2 and position between coil electrode 1
Encapsulated layer 3 outside coil electrode 1, the high molecular polymer of coil electrode 1, dielectric layer 2 with encapsulated layer 3 using insulation flexible
Material is made；Coil electrode 1 is the spiral inductance with plate electrode, and plane-parallel capacitor is formed between upper lower plate electrode,
LC resonance circuits are formed with inductance in parallel；Dielectric layer 2 is provided with corresponding pyramid bulge-structure through microprocessor.Wherein, medium
Layer 2 comprising up and down corresponding to two layers, its surface pyramid bulge-structure Jing Guo microprocessor fits together in opposite directions.Pyramid
The size of bulge-structure is 10um.The thickness of encapsulated layer 3 is 10um.The making step of the sensor is as follows：One piece of silicon chip 4 is taken,
Pyramid bulge-structure groove array, its spacing 10um are gone out by anisotropic wet etch；By the thermoplastic of pre-coordination
Property resin solution be coated to surface of silicon and solidify dielectric layer 2 is made, the material of dielectric layer 2 is polydimethylsiloxane；
Coil electrode 1 is printed onto to the upper surface of dielectric layer 2 by printing technology, printing slurry is conductive silver paste；In coil electrode 1
Upper surface is coating one layer of encapsulating material and solidified, and the covering of coil electrode 1 is fabricated to encapsulated layer 3, the material of encapsulated layer 3 by encapsulating material
Expect for Fypro PA；Silicon substrate is removed, removes medium-electrode-encapsulated layer paradigmatic structure；Take and gather made from two pieces of steps 5
Close structure to be aligned and be bonded in opposite directions, wherein including the dielectric layer 2 containing pyramid bulge-structure, encapsulated layer 3 is outside；Obtain most
Whole pressure sensor.
Embodiment 2：
The pressure sensor of the present embodiment, including two coil electrodes 1, dielectric layer 2 and position between coil electrode 1
Encapsulated layer 3 outside coil electrode 1, coil electrode 1, dielectric layer 2 are made with encapsulated layer 3 of rubber；Coil electrode 1 is band
There is the spiral inductance of plate electrode, plane-parallel capacitor is formed between upper lower plate electrode, LC resonance electricity is formed with inductance in parallel
Road；Dielectric layer 2 is provided with corresponding circular protrusions structure through microprocessor.Wherein, dielectric layer 2 is included corresponding two layers up and down, and it is passed through
The surface circular bulge-structure for crossing microprocessor fits together in opposite directions.The size of circle bulge-structure is 100um.The thickness of encapsulated layer 3
For 100um.The making step of the sensor is as follows：One piece of silicon chip 4 is taken, circular protrusions knot is gone out by anisotropic wet etch
Structure groove array, its spacing 100um；The thermoplastic resin solution of pre-coordination is coated to surface of silicon and solidified and is made
Dielectric layer 2, the material of dielectric layer 2 are polydimethylsiloxane；Coil electrode 1 is printed onto by dielectric layer 2 by printing technology
Upper surface, printing slurry is conductive silver paste；Coating one layer of encapsulating material in the upper surface of coil electrode 1 and solidifying, encapsulating
The covering of coil electrode 1 is fabricated to encapsulated layer 3 by material, and the material of encapsulated layer 3 is Fypro PA；Silicon substrate is removed, removes Jie
Matter-electrode-encapsulated layer paradigmatic structure；Paradigmatic structure made from two pieces of steps 5 is taken to be aligned and be bonded in opposite directions, wherein containing circular convex
Including the dielectric layer 2 for playing structure, encapsulated layer 3 is outside；Obtain final pressure sensor.
Embodiment 3：
The pressure sensor of the present embodiment, including two coil electrodes 1, dielectric layer 2 and position between coil electrode 1
Encapsulated layer 3 outside coil electrode 1, coil electrode 1, dielectric layer 2 are adopted made of plastic with encapsulated layer 3；Coil electrode 1 is band
There is the spiral inductance of plate electrode, plane-parallel capacitor is formed between upper lower plate electrode, LC resonance electricity is formed with inductance in parallel
Road；Dielectric layer 2 is provided with corresponding pyramid bulge-structure through microprocessor.Wherein, dielectric layer 2 includes corresponding two layers up and down,
Its surface pyramid bulge-structure Jing Guo microprocessor fits together in opposite directions.The size of pyramid bulge-structure is
20um.The thickness of encapsulated layer 3 is 20um.The making step of the sensor is as follows：One piece of silicon chip 4 is taken, passes through anisotropic wet
Etch pyramid bulge-structure groove array, its spacing 20um；The thermoplastic resin solution of pre-coordination is coated to
Surface of silicon and solidify dielectric layer 2 is made, the material of dielectric layer 2 is polydimethylsiloxane；By printing technology by line
Circle electrode 1 is printed onto the upper surface of dielectric layer 2, and printing slurry is conductive silver paste；In the upper surface of coil electrode 1 in one layer of coating
Encapsulating material simultaneously solidifies, and the covering of coil electrode 1 is fabricated to encapsulated layer 3 by encapsulating material, and the material of encapsulated layer 3 is Fypro
PA；Silicon substrate is removed, removes medium-electrode-encapsulated layer paradigmatic structure；Paradigmatic structure made from two pieces of steps 5 is taken to be aligned in opposite directions
And be bonded, wherein including the dielectric layer 2 containing pyramid bulge-structure, encapsulated layer 3 is outside；Obtain final pressure sensing
Device.
Claims (6)
- A kind of 1. highly sensitive flexible passive wireless pressure sensor, it is characterised in that：Including two coil electrodes (1), position Dielectric layer (2) and the encapsulated layer (3) outside coil electrode (1), coil electrode (1), medium between coil electrode (1) Layer (2) is made with encapsulated layer (3) of the macromolecule polymer material of insulation flexible；Described coil electrode (1) is with flat The spiral inductance of plate electrode, plane-parallel capacitor is formed between upper lower plate electrode, LC resonance circuits are formed with inductance in parallel；Institute Dielectric layer (2) inner surface stated is provided with corresponding bulge-structure through microprocessor.
- 2. highly sensitive flexible passive wireless pressure sensor according to claim 1, it is characterised in that：Described Jie Matter layer (2) include up and down corresponding to two layers, its inner surface bulge-structure Jing Guo microprocessor is bonded in opposite directions.
- 3. highly sensitive flexible passive wireless pressure sensor according to claim 1 or 2, it is characterised in that：It is described Dielectric layer (2) respective layer on microprocessor set bulge-structure be micro-meter scale pyramid array；Described pyramid is convex The size for playing structure is 10-100um.
- 4. highly sensitive flexible passive wireless pressure sensor according to claim 1, it is characterised in that：Described envelope It is 10-100um to fill layer (3) thickness.
- 5. highly sensitive flexible passive wireless pressure sensor according to claim 1, it is characterised in that：Described system It is as follows to make step：(1) one piece of silicon chip (4) is taken, bulge-structure groove array, its spacing 10- are gone out by anisotropic wet etch 100um；(2) thermoplastic resin solution of pre-coordination is coated to surface of silicon and solidified and dielectric layer (2), dielectric layer is made (2) material includes polydimethylsiloxane, SBS SBS；(3) coil electrode (1) is printed onto to the upper surface of dielectric layer (2) by printing technology, printing slurry includes conductive silver Slurry, copper slurry, carbon slurry；(4) coating one layer of encapsulating material in coil electrode (1) upper surface and solidifying, encapsulating material covers coil electrode (1) Encapsulated layer (3) is fabricated to, encapsulated layer (3) material includes Fypro PA, polydimethylsiloxane, styrene-fourth two Alkene-styrene block copolymer SBS；(5) silicon substrate is removed, removes medium-electrode-encapsulated layer paradigmatic structure；(6) paradigmatic structure made from two pieces of steps (5) is taken to be aligned and be bonded in opposite directions, wherein the dielectric layer (2) containing bulge-structure Inside, encapsulated layer (3) is outside；Obtain final pressure sensor.
- 6. highly sensitive flexible passive wireless pressure sensor according to claim 5, it is characterised in that：Described step Suddenly (1) and (6) relief structure are pyramid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711096376.7A CN107894293A (en) | 2017-11-09 | 2017-11-09 | A kind of highly sensitive flexible passive wireless pressure sensor |
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|---|---|---|---|
| CN201711096376.7A CN107894293A (en) | 2017-11-09 | 2017-11-09 | A kind of highly sensitive flexible passive wireless pressure sensor |
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| CN107894293A true CN107894293A (en) | 2018-04-10 |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108981975A (en) * | 2018-05-23 | 2018-12-11 | 北京航空航天大学 | A kind of pressure sensor and distribution force measuring method |
| CN110260893A (en) * | 2019-06-18 | 2019-09-20 | 广东工业大学 | A kind of preparation method of condenser type flexible sensor |
| CN110285896A (en) * | 2019-07-31 | 2019-09-27 | 南京戎智信息创新研究院有限公司 | A kind of linear response capacitance type pressure sensor based on contact area |
| CN111230928A (en) * | 2020-01-20 | 2020-06-05 | 腾讯科技（深圳）有限公司 | Proximity sensor, electronic skin, manufacturing method and proximity sensing method |
| CN111251326A (en) * | 2020-01-20 | 2020-06-09 | 腾讯科技（深圳）有限公司 | Proximity sensor, electronic skin, manufacturing method and proximity sensing method |
| CN111307341A (en) * | 2020-04-01 | 2020-06-19 | 河北工业大学 | Flexible capacitive pressure sensor |
| CN111380632A (en) * | 2020-02-29 | 2020-07-07 | 天津大学 | Wireless passive flexible pressure sensor based on double-layer asymmetric LC resonance |
| CN112033583A (en) * | 2020-09-10 | 2020-12-04 | 武汉大学 | SiC capacitance pressure sensor with surface array boss structure and preparation method |
| CN112378554A (en) * | 2020-10-26 | 2021-02-19 | 北京机械设备研究所 | Flexible pressure sensor with pressure sensitive structure |
| CN113945305A (en) * | 2021-10-18 | 2022-01-18 | 安徽大学 | Capacitive flexible touch sensor based on hierarchical inclined micro-cylinder structure |
| CN114235226A (en) * | 2021-12-14 | 2022-03-25 | 西安电子科技大学 | Off-electric wireless passive flexible pressure sensor, preparation and application |
| CN114858315A (en) * | 2022-04-08 | 2022-08-05 | 武汉大学 | Pressure sensing electronic skin and manufacturing process thereof |
| US11460362B2 (en) | 2019-07-23 | 2022-10-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Flexible printed pressure transducer with sensor diffusion stack materials and methods incorporating the same |
| CN115886905A (en) * | 2022-11-23 | 2023-04-04 | 哈尔滨医科大学 | Thin flexible pressure sensor, brain clamp plate adaptive pressure monitoring device and small waterproof brain clamp plate system |
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| CN103148977A (en) * | 2013-02-27 | 2013-06-12 | 东南大学 | Flexible-substrate-based passive wireless pressure sensor with self-packaging function |
| CN105865667A (en) * | 2016-05-19 | 2016-08-17 | 北京印刷学院 | Capacitive flexible pressure sensor based on microstructural dielectric layers and preparation method of capacitive flexible pressure sensor |
| CN106197774A (en) * | 2016-07-20 | 2016-12-07 | 上海交通大学 | Flexible piezoresistive tactile sensor array and preparation method thereof |
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| CN103091003A (en) * | 2013-02-27 | 2013-05-08 | 东南大学 | Passive wireless pressure sensor preparation method based on flexible substrate |
| CN103148977A (en) * | 2013-02-27 | 2013-06-12 | 东南大学 | Flexible-substrate-based passive wireless pressure sensor with self-packaging function |
| CN105865667A (en) * | 2016-05-19 | 2016-08-17 | 北京印刷学院 | Capacitive flexible pressure sensor based on microstructural dielectric layers and preparation method of capacitive flexible pressure sensor |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108981975A (en) * | 2018-05-23 | 2018-12-11 | 北京航空航天大学 | A kind of pressure sensor and distribution force measuring method |
| CN110260893B (en) * | 2019-06-18 | 2022-05-10 | 广东工业大学 | Preparation method of capacitive flexible sensor |
| CN110260893A (en) * | 2019-06-18 | 2019-09-20 | 广东工业大学 | A kind of preparation method of condenser type flexible sensor |
| US11460362B2 (en) | 2019-07-23 | 2022-10-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Flexible printed pressure transducer with sensor diffusion stack materials and methods incorporating the same |
| CN110285896A (en) * | 2019-07-31 | 2019-09-27 | 南京戎智信息创新研究院有限公司 | A kind of linear response capacitance type pressure sensor based on contact area |
| CN111251326A (en) * | 2020-01-20 | 2020-06-09 | 腾讯科技（深圳）有限公司 | Proximity sensor, electronic skin, manufacturing method and proximity sensing method |
| CN111230928A (en) * | 2020-01-20 | 2020-06-05 | 腾讯科技（深圳）有限公司 | Proximity sensor, electronic skin, manufacturing method and proximity sensing method |
| CN111380632A (en) * | 2020-02-29 | 2020-07-07 | 天津大学 | Wireless passive flexible pressure sensor based on double-layer asymmetric LC resonance |
| CN111307341A (en) * | 2020-04-01 | 2020-06-19 | 河北工业大学 | Flexible capacitive pressure sensor |
| CN111307341B (en) * | 2020-04-01 | 2021-10-08 | 河北工业大学 | Flexible capacitive pressure sensor |
| CN112033583A (en) * | 2020-09-10 | 2020-12-04 | 武汉大学 | SiC capacitance pressure sensor with surface array boss structure and preparation method |
| CN112378554A (en) * | 2020-10-26 | 2021-02-19 | 北京机械设备研究所 | Flexible pressure sensor with pressure sensitive structure |
| CN113945305A (en) * | 2021-10-18 | 2022-01-18 | 安徽大学 | Capacitive flexible touch sensor based on hierarchical inclined micro-cylinder structure |
| WO2023065540A1 (en) * | 2021-10-18 | 2023-04-27 | 安徽大学 | Capacitive flexible tactile sensor based on graded inclined micro-cylindrical structure |
| CN114235226A (en) * | 2021-12-14 | 2022-03-25 | 西安电子科技大学 | Off-electric wireless passive flexible pressure sensor, preparation and application |
| CN114235226B (en) * | 2021-12-14 | 2023-02-24 | 西安电子科技大学 | Off-electric wireless passive flexible pressure sensor, preparation and application |
| CN114858315A (en) * | 2022-04-08 | 2022-08-05 | 武汉大学 | Pressure sensing electronic skin and manufacturing process thereof |
| CN115886905A (en) * | 2022-11-23 | 2023-04-04 | 哈尔滨医科大学 | Thin flexible pressure sensor, brain clamp plate adaptive pressure monitoring device and small waterproof brain clamp plate system |
| CN115886905B (en) * | 2022-11-23 | 2023-11-10 | 哈尔滨医科大学 | Thin flexible pressure sensor, brain pressure plate fit pressure monitoring device and small waterproof brain pressure plate system |
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