CN114639525B - Embedded resistor - Google Patents
Embedded resistor Download PDFInfo
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- CN114639525B CN114639525B CN202210276891.8A CN202210276891A CN114639525B CN 114639525 B CN114639525 B CN 114639525B CN 202210276891 A CN202210276891 A CN 202210276891A CN 114639525 B CN114639525 B CN 114639525B
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- resistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
- H01C3/14—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element being formed in two or more coils or loops continuously wound as a spiral, helical or toroidal winding
- H01C3/20—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element being formed in two or more coils or loops continuously wound as a spiral, helical or toroidal winding wound on cylindrical or prismatic base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
- H01C13/02—Structural combinations of resistors
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- Microelectronics & Electronic Packaging (AREA)
- Details Of Resistors (AREA)
Abstract
The invention discloses an embedded resistor, which comprises a shell and three resistor components; the resistance component comprises a resistance wire, a ceramic rod and a ribbed iron rod. According to the invention, the resistance wire is wound on the ceramic rod in an embedded manner, and compared with the resistance wire directly wound on the ceramic rod, the contact area of the resistance wire and the ceramic rod is obviously increased, the contact area is increased, the volume of the ceramic rod is reduced, and the cost is saved; in addition, the ribbed iron rod is embedded in the ceramic rod, so that the heat exchange area and the heat conductivity are increased, the heat conduction quantity is increased, the transient heat conduction speed is accelerated, and the heat conduction to the inside of the ceramic rod is promoted; the quartz sand is filled in the shell, and because the heat conductivity coefficient of the quartz sand is small, the heat conduction process in the resistor is dominant in a long time, so that the speed of reaching a melting point when the resistor is short-circuited is directly slowed down by strengthening internal heat conduction, and the normal working time of the resistor is prolonged.
Description
Technical Field
The invention relates to the field of heat dissipation of electronic equipment, in particular to an embedded resistor.
Background
Since the 21 st century, the electronic industry in China developed rapidly. The electronic industry is growing day by day and is developing towards scale under the guidance of new technology. The integration degree and packaging density of electronic chips are continuously improved, which inevitably leads to the rapid increase of the total power and heat generation of electronic devices per unit volume. Heat dissipation issues are one of the major resistances limiting its development.
The heat dissipation technology in the electronic communication industry is mainly based on natural convection heat dissipation and forced convection heat dissipation. Common forced convection heat dissipation includes liquid cooling and heat pipe heat dissipation. The heat dissipation technology based on natural convection heat transfer has the advantages of high reliability, no maintenance, no noise, low energy consumption, low manufacturing cost and the like because mechanical moving parts such as a fan, a water pump and the like are not needed, so that the natural convection heat dissipation is widely applied to the fields of heat release, photovoltaic power generation, LED illumination, security and protection and solar energy of communication base stations and electronic circuit equipment. The performance of natural convection heat dissipation is very important for electronic equipment adopting natural cooling, and even becomes one of bottleneck factors restricting the improvement of the equipment performance in certain occasions, so that the strengthening of natural convection heat transfer is very important.
In some transient change occasions, the internal temperature of the electronic equipment rises sharply, but due to the limitation of the heat conductivity coefficient of the internal material, heat cannot be effectively transferred to the outside, so that the external temperature of the electronic equipment does not rise greatly, the natural convection heat exchange effect formed by the change of air density caused by the temperature change is very weak, and in addition, the radiation heat exchange quantity of the electronic equipment to the outside is very small due to the very small temperature difference, so that the equipment cannot effectively dissipate heat. Therefore, a good method for optimizing the heat dissipation capability from the internal optimization structure of the electronic device is considered.
In addition, generally, the resistance wire is directly wound on the ceramic rod, so that the contact area between the ceramic rod and the resistance wire ring column is small in section, the heat exchange amount is small, and the heat dissipation effect of the whole resistor is poor.
Disclosure of Invention
The present invention is directed to provide an embedded resistor, which addresses the drawbacks of the prior art.
The invention adopts the following technical scheme for solving the technical problems:
an embedded resistor comprises a shell and first to third resistor components;
the first resistor assembly, the second resistor assembly and the third resistor assembly are identical in structure and respectively comprise a resistance wire, a ceramic rod and a ribbed iron rod, wherein the ceramic rod is a hollow cylinder, a spiral annular groove is formed in the outer wall of the ceramic rod, the diameter of the annular groove is equal to that of the resistance wire, and the depth of the annular groove is equal to the radius of the resistance wire; the resistance wire is uniformly and spirally wound on the ceramic rod along the annular groove in an embedded mode; the ribbed iron rod comprises an iron rod and a plurality of annular ribs uniformly arranged on the iron rod, the ribbed iron rod is arranged in the ceramic rod, the iron rod and the ceramic rod are coaxial, and each annular rib is abutted against the inner wall of the ceramic rod;
the shell is a hollow cuboid with an opening at the upper end and is made of aluminum, the inner wall of the bottom wall of the shell is provided with a ceramic plate, and the inner walls of the four side walls of the shell are provided with mica sheets;
the first resistor assembly, the second resistor assembly, the third resistor assembly and the fourth resistor assembly are arranged in the shell in parallel, quartz sand is filled among the first resistor assembly, the third resistor assembly, the ceramic sheets on the bottom wall of the shell and the mica sheets on the inner walls of the four side walls of the shell, and the quartz sand completely covers the first resistor assembly, the second resistor assembly and the third resistor assembly;
resistance wires of the first to third resistance components are connected in series in sequence;
the upper end of the shell is sealed by glue, and the glue is attached to quartz sand to prevent the quartz sand in the shell from leaking.
As a further optimization scheme of the embedded resistor, resistance wires of the first resistor assembly, the second resistor assembly and the third resistor assembly are all made of nichrome wires.
As a further optimized solution of the embedded resistor of the present invention, the ceramic sheets of the first to third resistor assemblies are made of 95 porcelain as a molding material.
As a further optimization scheme of the embedded resistor, the glue adopts white organic silicon pouring glue with the heat conductivity coefficient of 0.299W/(m.K) and is used for preventing quartz sand from leaking and conducting heat.
As a further optimization scheme of the embedded resistor, the heat dissipation fins are arranged on the outer wall of the shell and used for increasing the heat exchange area during steady-state heat conduction so as to increase the heat exchange amount.
As a further preferable aspect of the in-cell resistor of the present invention, the cross-sectional shape of the annular rib on the ribbed iron bar of the first to third resistance elements is a regular triangle.
Compared with the prior art, the invention adopting the technical scheme has the following technical effects:
the invention discloses an embedded resistor and a working method thereof, and compared with an external winding structure, the embedded structure can increase the contact area of a resistance wire and a ceramic rod, and in addition, an iron rod with ribs is embedded into the ceramic rod, so that the contact area and the heat conductivity are increased, the heat exchange quantity is increased, the heat dissipation efficiency is effectively improved, and the normal working time of a high-power electronic element is obviously prolonged.
Drawings
FIG. 1 is a schematic diagram of an internal structure of an embedded resistor according to the present invention;
FIG. 2 is a schematic diagram showing the relative positions of the glue, the quartz sand and the ceramic wafer in the present invention;
FIG. 3 is a schematic diagram of the structure of the ceramic rods in the first resistor assembly of the present invention;
FIG. 4 is a schematic structural diagram of a comparison between an annular groove on a ceramic rod and a resistance wire in a resistance assembly in the first resistance assembly according to the present invention;
FIG. 5 is a schematic view of the structure of the ribbed iron bars of the first to third resistor assemblies of the present invention;
FIG. 6 is a schematic illustration of the mating of ribbed iron and ceramic rods in first through third resistor assemblies of the present invention;
fig. 7 is a front view of a ribbed iron bar of a first resistance assembly of the present invention.
In the figure, 1-shell, 2-glue, 3-quartz sand, 4-ceramic plate, 5-mica plate, 6-ceramic rod of first resistance component, 7-ceramic rod of second resistance component, 8-ceramic rod of third resistance component, 9-resistance wire of first resistance component, 10-resistance wire of second resistance component, 11-resistance wire of third resistance component, 12-annular groove on ceramic rod of first resistance component, 13-ribbed iron rod of first resistance component, 14-ribbed iron rod of second resistance component, and 15-ribbed iron rod of third resistance component.
Detailed Description
The technical scheme of the invention is further explained in detail by combining the attached drawings:
the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, components are exaggerated for clarity.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components and/or sections, these elements, components and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, and/or section from another. Thus, a first element, component, and/or section discussed below could be termed a second element, component, or section without departing from the teachings of the present invention.
As shown in fig. 1, the present invention discloses an embedded resistor, which includes a housing, and first to third resistor elements;
the first resistor assembly, the second resistor assembly and the third resistor assembly have the same structure and respectively comprise a resistance wire, a ceramic rod and an iron rod with a rib, wherein the ceramic rod is a hollow cylinder, the outer wall of the ceramic rod is provided with a spiral annular groove, the diameter of the annular groove is equal to that of the resistance wire, and the depth of the annular groove is equal to the radius of the resistance wire, as shown in fig. 3 and 4; the resistance wire is uniformly and spirally wound on the ceramic rod along the annular groove in an embedded mode; the ribbed iron rod comprises an iron rod and a plurality of annular ribs uniformly arranged on the iron rod, as shown in fig. 5, the ribbed iron rod is arranged in the ceramic rod, the iron rod and the ceramic rod are coaxial, and each annular rib is abutted against the inner wall of the ceramic rod, as shown in fig. 6;
the shell is a hollow cuboid with an opening at the upper end and is made of aluminum, the inner wall of the bottom wall of the shell is provided with a ceramic plate, and the inner walls of the four side walls of the shell are provided with mica sheets;
the first resistor assembly, the second resistor assembly, the third resistor assembly and the fourth resistor assembly are arranged in the shell in parallel, quartz sand is filled among the first resistor assembly, the third resistor assembly, the ceramic plates on the bottom wall of the shell and the mica plates on the inner walls of the four side walls of the shell, and the quartz sand completely covers the first resistor assembly, the second resistor assembly and the third resistor assembly;
resistance wires of the first to third resistance components are connected in series in sequence;
the upper end of the shell is sealed by glue, and the glue is attached to quartz sand to prevent the quartz sand in the shell from leaking out, as shown in fig. 2.
Resistance wires of the first resistance assembly, the second resistance assembly and the third resistance assembly are all made of nichrome wires.
The ceramic plates of the first resistor assembly, the second resistor assembly and the third resistor assembly are made of 95 porcelain serving as a forming material.
The glue adopts white organic silicon pouring sealant with the heat conductivity coefficient of 0.299W/(m.K) and is used for preventing quartz sand from leaking and conducting heat.
And the outer wall of the shell is provided with radiating fins for increasing the heat exchange area during steady-state heat conduction so as to increase the heat exchange amount.
The cross-sectional shape of the annular rib on the ribbed iron bar of the first to third resistance components is a regular triangle, as shown in fig. 7.
In the first to third resistance components, the resistance wire is a nichrome wire, has a high melting point and a high thermal conductivity coefficient, the melting point is 1400 ℃, and the temperature rise caused by the sharp increase of voltage during the short circuit of the resistance can be effectively prevented, so that the normal working time of the resistor is prolonged; the ceramic rod has high melting point, good physical and chemical stability at high temperature above 2000 ℃, and large specific heat capacity of about 837J/(kg.K), can effectively store heat during transient heat conduction, and prolongs the normal working time of the resistor; compared with the iron bar without ribs, the iron bar with ribs increases the heat exchange area, reduces the using amount of the iron bar, saves the cost, strengthens transient heat conduction, and ensures that the equipment can continue to carry out natural convection heat dissipation.
The resistance wires of the first to third resistance components are uniformly and spirally wound in the annular groove of the ceramic rod in an embedded mode, compared with the resistance wires which are directly wound on the ceramic rod, the contact heat exchange area is greatly increased, the heat conduction speed in transient change is increased, the heat conduction to the inside of the ceramic rod is promoted, the speed of reaching a melting point when the resistor is short-circuited is slowed down, and the normal working time of the resistor is prolonged.
In the invention, the ceramic plate in the shell is insulated, the mica plate is insulated and heat-resistant, and the quartz sand is an insulating material with low heat conductivity coefficient; the aluminium system material that the casing adopted can give out the heat radiation to the external world during high temperature for effective heat dissipation, and the radiating fin on the casing outer wall then helps dispel the heat sooner.
When the resistor works, if the resistor is short-circuited, the resistor voltage is rapidly increased to 750V, so that the resistance heating power is rapidly increased, and the resistance power density is rapidly increased; because the heat conductivity coefficient of the quartz sand filled in the resistor is small, the heat conduction process in the resistor is dominant in a long time, namely, the heat in the resistor is difficult to be conducted to the outside in a short time, and the total heat transfer characteristic of the resistor can be accurately represented by calculating the transient heat conduction characteristic in the resistor; ordinary resistance wire direct winding can be regarded as the area of contact of resistance wire and ceramic rod very little on the ceramic rod, and embedded resistance and ceramic rod surface fully contact, has increased area of contact, has increased the heat transfer volume, and the inside ribbed iron bar of high coefficient of thermal conductivity that imbeds of ceramic rod in addition, and the heat can spread into the inside of ceramic rod better to the normal operating time of resistor has been prolonged.
It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The above-mentioned embodiments, objects, technical solutions and advantages of the present invention are further described in detail, it should be understood that the above-mentioned embodiments are only illustrative of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. An embedded resistor is characterized by comprising a shell and first to third resistor components;
the first resistor assembly, the second resistor assembly and the third resistor assembly are identical in structure and respectively comprise a resistance wire, a ceramic rod and a ribbed iron rod, wherein the ceramic rod is a hollow cylinder, a spiral annular groove is formed in the outer wall of the ceramic rod, the diameter of the annular groove is equal to that of the resistance wire, and the depth of the annular groove is equal to the radius of the resistance wire; the resistance wire is uniformly and spirally wound on the ceramic rod along the annular groove in an embedded mode; the ribbed iron rod comprises an iron rod and a plurality of annular ribs uniformly arranged on the iron rod, the ribbed iron rod is arranged in the ceramic rod, the iron rod and the ceramic rod are coaxial, and each annular rib is abutted against the inner wall of the ceramic rod;
the shell is a hollow cuboid with an opening at the upper end and is made of aluminum, the inner wall of the bottom wall of the shell is provided with a ceramic plate, and the inner walls of the four side walls of the shell are provided with mica sheets;
the first resistor assembly, the second resistor assembly, the third resistor assembly and the fourth resistor assembly are arranged in the shell in parallel, quartz sand is filled among the first resistor assembly, the third resistor assembly, the ceramic sheets on the bottom wall of the shell and the mica sheets on the inner walls of the four side walls of the shell, and the quartz sand completely covers the first resistor assembly, the second resistor assembly and the third resistor assembly;
resistance wires of the first to third resistance components are connected in series in sequence;
the upper end of the shell is sealed by glue, and the glue is attached to quartz sand so as to prevent the quartz sand in the shell from leaking.
2. The in-cell resistor of claim 1 wherein the resistive wires of the first through third resistive components are all nichrome wires.
3. The in-cell resistor of claim 1 wherein the ceramic plates of the first through third resistive elements are formed of 95 ceramic molding material.
4. The in-cell resistor of claim 1, wherein the housing includes heat dissipating fins on an outer wall thereof for increasing a heat exchange area for increasing a heat exchange amount during steady state heat conduction.
5. The in-cell resistor of claim 1 wherein the cross-sectional shape of the annular ribs on the ribbed iron bars of the first through third resistive components is a regular triangle.
6. The embedded resistor of claim 1, wherein the glue is a white silicone potting glue having a thermal conductivity of 0.299W/(m-K).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210276891.8A CN114639525B (en) | 2022-03-21 | 2022-03-21 | Embedded resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210276891.8A CN114639525B (en) | 2022-03-21 | 2022-03-21 | Embedded resistor |
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| Publication Number | Publication Date |
|---|---|
| CN114639525A CN114639525A (en) | 2022-06-17 |
| CN114639525B true CN114639525B (en) | 2022-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210276891.8A Active CN114639525B (en) | 2022-03-21 | 2022-03-21 | Embedded resistor |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3740252A1 (en) * | 1987-11-27 | 1989-06-01 | Asea Brown Boveri | High-power wire resistor |
| CN201364785Y (en) * | 2008-12-10 | 2009-12-16 | 深圳市华力特电气股份有限公司 | Winding-type long-time through-flow resistor |
| CN202662414U (en) * | 2012-05-28 | 2013-01-09 | 珠海德凌电子科技有限公司 | Novel thread resistor |
| CN209912635U (en) * | 2019-06-13 | 2020-01-07 | 深圳意杰（Ebg）电子有限公司 | Vehicle pre-charging resistor with plug-in type terminal and self-heat-dissipation structure |
| CN211604831U (en) * | 2019-12-30 | 2020-09-29 | 广东福德电子有限公司 | High-strength ceramic wire-wound resistor |
-
2022
- 2022-03-21 CN CN202210276891.8A patent/CN114639525B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3740252A1 (en) * | 1987-11-27 | 1989-06-01 | Asea Brown Boveri | High-power wire resistor |
| CN201364785Y (en) * | 2008-12-10 | 2009-12-16 | 深圳市华力特电气股份有限公司 | Winding-type long-time through-flow resistor |
| CN202662414U (en) * | 2012-05-28 | 2013-01-09 | 珠海德凌电子科技有限公司 | Novel thread resistor |
| CN209912635U (en) * | 2019-06-13 | 2020-01-07 | 深圳意杰（Ebg）电子有限公司 | Vehicle pre-charging resistor with plug-in type terminal and self-heat-dissipation structure |
| CN211604831U (en) * | 2019-12-30 | 2020-09-29 | 广东福德电子有限公司 | High-strength ceramic wire-wound resistor |
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| Publication number | Publication date |
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| CN114639525A (en) | 2022-06-17 |
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